A high-precision force-controlled bonding device

Abstract

This invention relates to a high-precision force-controlled bonding device, comprising: a bonding assembly including a mounting base, a first detection element, a first driving element, a movable seat, a connecting shaft, a first elastic mechanism, and an adsorption element; the first driving element is connected to the mounting base, and its output end is elastically connected to the connecting shaft; the connecting shaft passes through the movable seat and is rotatably connected to it; one end of the connecting shaft away from the first driving element is connected to the adsorption element; the first elastic mechanism includes a first spring, through which the connecting shaft passes; the first spring is connected to the mounting base and abuts against the end of the movable seat; the first detection element is connected to the mounting base, and its detection end is connected to the movable seat; the movable seat and the connecting shaft are movable along the axial direction of the connecting shaft; and a driving assembly, the moving end of which is connected to the mounting base. This invention provides a high-precision force-controlled bonding device that can improve the accuracy of bonding force control.

Description

Technical Field

[0001] This invention relates to the field of bonding apparatus technology, and more particularly to a high-precision force-controlled bonding apparatus. Background Technology

[0002] In semiconductor packaging processes, chips need to be picked up from wafers and precisely mounted onto substrates or lead frames. With technological advancements, the size of chips to be mounted is gradually decreasing, packaging density is increasing, and there is a demand for handling ultra-thin chips. Therefore, bonding devices require high-precision bonding force control. Existing bonding devices use linear guides as force transmission guiding mechanisms; that is, a linear guide is installed between the force sensor and the nozzle to transmit force from the nozzle to the force sensor. However, the linear guides used for force transmission suffer from static friction and stick-slip effects with uncertain direction and magnitude. In micro-force measurements, this generates significant noise and hysteresis, severely interfering with accurate force sensing and leading to reduced precision in bonding force control. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a high-precision force-controlled bonding device that can improve the accuracy of bonding force control.

[0004] To solve the above-mentioned technical problems, the present invention provides a high-precision force-controlled bonding device, comprising: a bonding assembly including a mounting base, a first detection element, a first driving element, a movable seat, a connecting shaft, a first elastic mechanism, and an adsorption element; the first driving element is connected to the mounting base, and the output end of the first driving element is elastically connected to the connecting shaft; the connecting shaft passes through the movable seat and is rotatably connected to the movable seat; the end of the connecting shaft away from the first driving element is connected to the adsorption element; the first elastic mechanism includes a first spring sheet; the connecting shaft passes through the first spring sheet; the first spring sheet is connected to the mounting base and abuts against the end of the movable seat; the first detection element is connected to the mounting base, and the detection end of the first detection element is connected to the movable seat; the movable seat and the connecting shaft are movable along the axial direction of the connecting shaft; and a driving assembly, the moving end of which is connected to the mounting base.

[0005] In one embodiment of the present invention, the first elastic mechanism further includes a first pressure plate and a first pressure block. The first pressure plate is located at the edge of the first spring piece and connected to the mounting base. The edge of the first spring piece is located between the first pressure plate and the mounting base. The first pressure block is connected to the side of the first spring piece away from the movable seat.

[0006] In one embodiment of the present invention, the first spring sheet has a first opening circumferentially arranged with the center line of the first spring sheet as the axis.

[0007] In one embodiment of the present invention, the bonding assembly further includes a second elastic mechanism, the second elastic mechanism including a second pressure plate, a second spring sheet, a second pressure block and a connecting seat, the second pressure plate being located at the edge of the second spring sheet and connected to the connecting seat, the edge of the second spring sheet being located between the second pressure plate and the connecting seat, the connecting seat having a clearance cavity and being connected to the output end of the first driving member, the second pressure block being connected to the side of the second spring sheet away from the connecting seat, and the second pressure block being connected to the connecting shaft.

[0008] In one embodiment of the present invention, the mounting base is provided with a receiving space, the second elastic mechanism, the first elastic mechanism and the movable seat are all located in the receiving space, and the detection end of the first detection element is connected to the movable seat through a first connecting plate, the first connecting plate penetrating through the side wall of the mounting base.

[0009] In one embodiment of the present invention, the side wall of the movable seat is connected to a connector, the movable seat is provided with a first channel, the connecting shaft is provided with a second channel along the axial direction, the connector communicates with the first channel, the first channel communicates with the second channel, the second channel extends to the end of the connecting shaft connected to the adsorption member, and the second channel communicates with the adsorption member.

[0010] In one embodiment of the present invention, the driving assembly includes a support base, a second driving member, and a movable plate. The second driving member is connected to the support base, the output end of the second driving member is connected to the movable plate, the movable plate is slidably connected to the support base, and the movable plate is connected to the mounting base.

[0011] In one embodiment of the present invention, the driving component further includes an elastic element connected to the support base, and the movable end of the elastic element is connected to the movable plate through a second connecting plate.

[0012] In one embodiment of the present invention, the driving component further includes a second detection element, the reading part of the second detection element being connected to the movable plate via a connecting frame, and the sensing part of the second detection element being connected to the support base and extending along the moving path of the movable plate.

[0013] In one embodiment of the present invention, the driving assembly further includes a first baffle and a second baffle, the first baffle being connected to the support base and located at the end of the moving path of the movable plate, and the second baffle being connected to the support base and abutting against the second driving member.

[0014] The technical solution of the present invention has the following advantages compared with the prior art:

[0015] The high-precision force-controlled bonding device of this invention utilizes a first elastic mechanism where a first spring abuts against the end of a movable seat, and the first spring is connected to a mounting base. During the upward movement of the movable seat, the position where the first spring abuts against the movable seat deforms, guiding the movable seat, reducing motion stiffness, and maintaining constraint stiffness in both horizontal and rotational degrees of freedom. This avoids the frictional interference of linear guides in existing bonding devices, enabling direct and accurate measurement of the bonding force at the adsorption end of the adsorption component, and improving the accuracy of bonding force control. Compared to linear guides, the first elastic mechanism has a smaller overall volume and weight, resulting in a smaller overall weight and volume of the bonding assembly. This reduces the inertia of the bonding assembly during movement, allowing for higher acceleration and speed, and enabling high-speed operation of the bonding assembly. Attached Figure Description

[0016] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of a high-precision force-controlled bonding device according to the present invention;

[0018] Figure 2 This is a schematic diagram of the bonding component;

[0019] Figure 3 yes Figure 2 A sectional view;

[0020] Figure 4 yes Figure 2 Partial structural diagram;

[0021] Figure 5 This is a schematic diagram of the assembly structure of the movable seat and the connecting shaft;

[0022] Figure 6 This is a schematic diagram of the second elastic mechanism;

[0023] Figure 7 yes Figure 6 A schematic diagram of the exploded structure;

[0024] Figure 8 This is a schematic diagram of the first elastic mechanism;

[0025] Figure 9 yes Figure 8 A schematic diagram of the exploded structure;

[0026] Figure 10 This is a schematic diagram of the driver component;

[0027] Figure 11 yes Figure 10A structural diagram from another angle;

[0028] Figure 12 yes Figure 10 Partial structural diagram;

[0029] Figure 13 yes Figure 12 A partial structural diagram.

[0030] Explanation of reference numerals in the accompanying drawings: 1. Bonding assembly; 2. Mounting bracket; 3. Drive assembly; 11. Mounting base; 12. First drive component; 13. First detection component; 14. Adsorption component; 15. Second elastic mechanism; 16. Movable seat; 17. First elastic mechanism; 18. Connecting shaft; 31. Support base; 32. Second connecting plate; 33. Guide component; 34. Movable plate; 35. Elastic component; 36. Second detection component; 37. Second drive component; 111. Mounting part; 112. Adjusting screw; 113. Locking nut; 114. Cover plate; 121. Drive shaft; 131. First connecting plate; 151, connecting seat; 152, second pressure plate; 153, second pressure block; 154, second spring; 155, clearance cavity; 156, second opening; 161, connector; 171, first pressure plate; 172, first spring; 173, first pressure block; 174, first opening; 181, second channel; 182, first connecting part; 183, bearing; 184, bushing; 311, first baffle; 312, clearance opening; 341, third connecting plate; 342, second connecting part; 361, connecting frame; 362, sensing part; 371, second baffle. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0032] Reference Figures 1 to 8As shown, a high-precision force-controlled bonding device of the present invention includes: a bonding assembly 1, comprising a mounting base 11, a first detection element 13, a first driving element 12, a movable seat 16, a connecting shaft 18, a first elastic mechanism 17, and an adsorption element 14. The first driving element 12 is connected to the mounting base 11, and the output end of the first driving element 12 is elastically connected to the connecting shaft 18. The connecting shaft 18 passes through the movable seat 16 and is rotatably connected to the movable seat 16. The end of the connecting shaft 18 away from the first driving element 12 is connected to the adsorption element 14. The first elastic mechanism 17 includes a first spring piece 172, through which the connecting shaft 18 passes. The first spring piece 172 is connected to the mounting base 11 and abuts against the end of the movable seat 16. The first detection element 13 is connected to the mounting base 11, and the detection end of the first detection element 13 is connected to the movable seat 16. The movable seat 16 and the connecting shaft 18 are capable of moving along the axial direction of the connecting shaft 18. The driving assembly 3 has a moving end connected to the mounting base 11.

[0033] This embodiment provides a high-precision force-controlled bonding device. The driving component 3 can drive the bonding component 1 to rise and fall. During the chip picking operation, the driving component 3 first drives the bonding component 1 to fall. When the adsorption end of the adsorption member 14 contacts the chip, the movable seat 16 applies pressure to the first spring 172, causing the first spring 172 to deform. The first detection member 13 detects the pressure applied to the adsorption end of the adsorption member 14. When the detection value reaches the set value, the bonding component 1 stops falling. Then, the adsorption member 14 adsorbs the chip. During the chip mounting operation, the chip is mounted onto the substrate through the combination of the falling of the movable seat 16 and the rotation of the connecting shaft 18 driven by the first driving component 12. The pressure detection process of the adsorption end of the adsorption member 14 is the same as that of the chip picking operation, and will not be described again. By having the first elastic piece 172 in the first elastic mechanism 17 abut against the end of the movable seat 16, and the first elastic piece 172 connected to the mounting base 11, the position where the first elastic piece 172 abuts against the movable seat 16 deforms during the upward movement of the movable seat 16, thereby guiding the movable seat 16, reducing motion stiffness, and maintaining constraint stiffness in both horizontal and rotational degrees of freedom. This avoids frictional interference from linear guide rails in existing bonding devices and improves the accuracy of bonding force control.

[0034] Reference Figures 2 to 5As shown, the bonding assembly 1 includes a mounting base 11, a first detection element 13, a first driving element 12, a movable seat 16, a connecting shaft 18, a first elastic mechanism 17, and an adsorption element 14. The first driving element 12 is a rotary driving element, connected to the top of the mounting base 11. The mounting base 11 has a receiving space. The first driving element 12 includes a rotatable driving shaft 121, which can be considered as the output end of the first driving element 12, and extends into the receiving space. The bottom end of the mounting base 11 is connected to a cover plate 114 for sealing the opening of the receiving space, and the connecting shaft 18 passes through the cover plate 114.

[0035] Reference Figure 6 and Figure 7As shown, the output end of the first driving member 12 is elastically connected to the connecting shaft 18. Specifically, the bonding assembly 1 further includes a second elastic mechanism 15, which is connected between the output end of the first driving member 12 and the connecting shaft 18, and is located within the receiving space. The second elastic mechanism 15 includes a second pressure plate 152, a second spring piece 154, a second pressure block 153, and a connecting seat 151. The radial cross-section of the second pressure plate 152 is annular, and the second pressure plate 152 is located at the edge of the second spring piece 154 and connected to the edge of the connecting seat 151 by screws. The screws pass through the second spring piece 154, and the edge of the second spring piece 154 is clamped between the second pressure plate 152 and the connecting seat 151, thereby fixing the second spring piece 154. The second spring sheet 154 has a second opening 156 circumferentially arranged around its center line. The second opening 156 is semi-circular, and the ends of two opposite second openings 156 are spaced a certain distance apart. This allows the second spring sheet 154 to maintain its elasticity while preventing it from breaking in the middle. In this embodiment, two sets of opposite second openings 156 with different radii are provided. The position of the second opening 156 on the second spring sheet 154 is within the enclosure of the second pressure plate 152, that is, the second opening 156 is not located between the second pressure plate 152 and the connecting seat 151. The connecting seat 151 has a relief cavity 155 corresponding to the middle position of the second spring sheet 154, and the relief cavity 155 corresponds to the inner ring of the second pressure plate 152. The relief cavity 155 provides space for the second spring sheet 154 to elastically deform, preventing the second spring sheet 154 from interfering with the connecting seat 151 after deformation. The connecting seat 151 is connected to the output end of the first driving member 12, that is, the end of the connecting seat 151 away from the second spring 154 is connected to the end of the drive shaft 121 of the first driving member 12. The second pressure block 153 is connected to the side of the second spring 154 away from the connecting seat 151, and the connection position of the second pressure block 153 and the second spring 154 is within the enclosure of the inner ring second opening 156, that is, the second pressure block 153 does not cover the second opening 156. The side of the second pressure block 153 away from the second spring 154 is connected to the end of the connecting shaft 18. Through the setting of the second elastic mechanism 15, the distance between the connecting shaft 18 and the drive shaft 121 can be changed, and the connecting shaft 18 can be raised and lowered along the axial direction of the connecting shaft 18, avoiding interference between the connecting shaft 18 and the drive shaft 121. During the rotation of the second elastic mechanism 15, the edge position and the center position of the second spring 154 will produce slight deformation, thereby reducing the over-constraint effect caused by the non-collinearity of the rotation axis of the drive shaft 121 and the rotation axis of the connecting shaft 18.

[0036] Reference Figure 3 and Figure 5As shown, the connecting shaft 18 is located within the accommodating space of the mounting base 11. The connecting shaft 18 passes through the movable base 16 along its centerline and is rotatably connected to it. Specifically, a bearing 183 is provided between the connecting shaft 18 and the movable base 16. The inner ring of the bearing 183 is fitted onto the connecting shaft 18, and the outer ring of the bearing 183 is connected to the movable base 16, thereby allowing the connecting shaft 18 and the movable base 16 to rotate relative to each other. A bushing 184 is fitted onto the connecting shaft 18, and the bushing 184 abuts against the far end of the bearing 183, thereby fixing the bearing 183 and preventing it from shifting.

[0037] The end of the connecting shaft 18 away from the first driving member 12 is connected to the adsorption member 14. Specifically, the end of the connecting shaft 18 is provided with a first connecting part 182, and the adsorption member 14 is connected to the first connecting part 182.

[0038] Reference Figure 3 and Figure 4 As shown, the side wall of the movable seat 16 is connected to a connector 161, and the movable seat 16 has a first channel arranged radially along the movable seat 16. The connecting shaft 18 has a second channel 181 arranged axially along the connecting shaft 18. The connector 161 communicates with the first channel, and the first channel communicates with the second channel 181. The second channel 181 extends to the end of the connecting shaft 18 that is connected to the adsorption member 14, and the second channel 181 communicates with the adsorption member 14. When the connector 161 is connected to an external air source, the adsorption end of the adsorption member 14 can generate a negative pressure, thereby adsorbing the chip.

[0039] Reference Figure 8 and Figure 9As shown, the first elastic mechanism 17 is located within the receiving space of the mounting base 11. The first elastic mechanism 17 includes a first spring piece 172, through which a connecting shaft 18 passes. The first spring piece 172 is connected to the mounting base 11 and abuts against the end of the movable seat 16. Specifically, the first elastic mechanism 17 also includes a first pressure plate 171 and a first pressure block 173. The radial cross-section of the first pressure plate 171 is annular, and the first pressure plate 171 is located at the edge of the first spring piece 172 and connected to the side wall of the receiving space of the mounting base 11 by screws. The screws pass through the first spring piece 172, and the edge of the first spring piece 172 is clamped between the first pressure plate 171 and the mounting base 11, thereby fixing the first spring piece 172. The end dimension of the movable seat 16 is smaller than the inner ring dimension of the first pressure plate 171, thereby avoiding interference between the movable seat 16 and the first pressure plate 171 during lifting and lowering. The first spring piece 172 has a first opening 174 circumferentially arranged around its center line. The first opening 174 is semi-circular. The arrangement and number of the first openings 174 on the first spring piece 172 are the same as the second openings 156 on the second spring piece 154, and will not be described again. The first pressing block 173 is connected to the side of the first spring piece 172 away from the movable seat 16. Specifically, the connection position between the first pressing block 173 and the first spring piece 172 is within the area surrounded by the inner ring first opening 174, that is, the first pressing block 173 does not cover the first opening 174. The connecting shaft 18 passes through the first pressing block 173 and the first spring piece 172 along the center line of the first pressing block 173. The first pressure block 173 allows the first spring piece 172 to abut against the end of the movable seat 16, thereby ensuring that the edge and center of the first spring piece 172 are subjected to uniform force. At the same time, the connecting shaft 18 passing through the first pressure block 173 and the first spring piece 172 can guide the deformation direction of the first spring piece 172.

[0040] The mounting base 11 is connected to two first elastic mechanisms 17, which are located at the top and bottom of the movable base 16, respectively, and the first spring pieces 172 in the first elastic mechanisms 17 abut against the ends of the movable base 16. The first elastic mechanism 17 located at the bottom of the movable base 16 is located between the movable base 16 and the first connecting portion 182 of the connecting shaft 18.

[0041] Reference Figure 2 and Figure 3As shown, the first detection element 13 can be considered as a force sensor connected to the controller. The first detection element 13 is connected to the mounting base 11. Specifically, the top of the mounting base 11 has a circumferentially oriented and protruding mounting portion 111. The end of the first detection element 13 is connected to the bottom side of the mounting portion 111, and the detection end of the first detection element 13 is located at the end of the first detection element 13 away from the mounting portion 111. The detection end of the first detection element 13 is connected to the movable seat 16. Specifically, the detection end of the first detection element 13 is connected to the movable seat 16 through a first connecting plate 131. The first connecting plate 131 penetrates the side wall of the mounting base 11, allowing the first connecting plate 131 to connect with the movable seat 16 within the accommodating space. When the adsorption end of the adsorption element 14 abuts against the chip, the movable seat 16 and the connecting shaft 18 can move axially along the connecting shaft 18. At this time, the first detection element 13 detects the pressure applied to the adsorption end.

[0042] Reference Figure 10 and Figure 11 As shown, the drive assembly 3 includes a support base 31, a second drive member 37, and a movable plate 34. The second drive member 37 can be considered as a linear motor. The second drive member 37 is connected to the support base 31, and its output end is connected to the movable plate 34. The movable plate 34 is slidably connected to the support base 31. Specifically, the support base 31 is connected to two guide members 33 arranged vertically. The guide members 33 can be considered as double-slider linear guides. The movable plate 34 is connected to the guide members 33, thereby allowing the movable plate 34 to be slidably connected to the support base 31. The guide members 33 can guide the movement of the movable plate 34. The movable plate 34 is also connected to a third connecting plate 341, which is located between the two guide members 33. The support base 31 has a clearance opening 312 corresponding to the movement path of the movable plate 34. The third connecting plate 341 passes through the clearance opening 312 and can move along the clearance opening 312. The stator of the second drive member 37 is connected to one side of the support base 31, and the mover of the second drive member 37 is connected to the third connecting plate 341, so that the second drive member 37 can drive the movable plate 34 to rise and fall.

[0043] Reference Figure 1 and Figure 2 As shown, the movable plate 34 is connected to the mounting base 11. Specifically, the movable plate 34 is connected to the mounting bracket 2. The mounting part 111 of the mounting base 11 is connected to two adjusting screws 112 and locking nuts 113 that cooperate with the adjusting screws 112. The adjusting screws 112 pass through the mounting bracket 2 and the mounting part 111. The locking nuts 113 are connected to the adjusting screws 112, so that the mounting bracket 2 is connected to the mounting base 11. By adjusting the locking nuts 113, the bonding assembly 1 can be leveled.

[0044] Reference Figures 10 to 13As shown, the drive assembly 3 also includes a first baffle 311 and a second baffle 371. The two first baffles 311 are connected to the support base 31 and located at both ends of the moving path of the movable plate 34, that is, the first baffles 311 correspond to the two ends of the guide member 33. The first baffles 311 are used to limit the extreme moving positions of the movable plate 34. The second baffle 371 is connected to the support base 31 and abuts against the second drive member 37. The second baffle 371 is used to fix the stator of the second drive member 37 to prevent the second drive member 37 from shaking during operation due to loose screws or other reasons.

[0045] The drive assembly 3 also includes an elastic element 35, which can be considered a magnetic spring. The elastic element 35 is connected to the support base 31, and the movable end of the elastic element 35 is connected to the movable plate 34 via the second connecting plate 32. Specifically, the stator of the elastic element 35 is connected to the support base 31, and the mover of the elastic element 35 is connected to the second connecting plate 32. The movable plate 34 is provided with a second connecting portion 342 extending towards the second connecting plate 32. The second connecting plate 32 is connected to the second connecting portion 342. The elastic force generated by the elastic element 35 counteracts the gravity that the movable plate 34 needs to overcome during movement. Through the arrangement of the elastic element 35 and the second drive element 37, the overall structure of the drive assembly 3 is compact, enabling stable and elongated movement, and it has strong applicability to different scenarios.

[0046] The drive assembly 3 also includes a second detection element 36, which can be considered as a linear displacement sensor connected to the controller. The reading part of the second detection element 36 is connected to the movable plate 34 via a connecting frame 361, and the sensing part 362 of the second detection element 36 is connected to the support base 31 and extends along the moving path of the movable plate 34. Specifically, the reading part of the second detection element 36 can be considered as a reading head, which is connected to the connecting frame 361, and the connecting frame 361 is connected to the second connecting part 342. The sensing part 362 can be considered as a grating ruler, and the extension path of the sensing part 362 is parallel to the moving path of the movable plate 34. The reading end of the reading part faces the sensing part 362, thereby accurately feeding back the moving distance of the movable plate 34.

[0047] In use, the drive component 3 can drive the bonding component 1 to rise and fall. During the chip removal operation, the second drive component 37 first drives the bonding component 1 to fall. When the adsorption end of the adsorption member 14 contacts the chip, the movable seat 16 rises within the receiving space, and the first spring 172 protrudes and deforms. The first detection component 13 detects the pressure applied to the adsorption end of the adsorption member 14. When the detection value reaches the set value, the bonding component 1 stops falling, and then the adsorption member 14 adsorbs the chip until the chip removal is completed. During the chip mounting operation, the second drive component 37 drives the movable seat 16 to fall, and the first drive component 12 drives the connecting shaft 18 to rotate through the second elastic mechanism 15 until the chip is mounted onto the substrate. The pressure detection process of the adsorption end of the adsorption member 14 is the same as that of the chip removal operation, and will not be described again.

[0048] This invention discloses a high-precision force-controlled bonding device. Through the arrangement of a first elastic mechanism 17 in which a first spring piece 172 abuts against the end of a movable seat 16, and simultaneously connecting the first spring piece 172 to a mounting base 11, the position where the first spring piece 172 abuts against the movable seat 16 deforms during the upward movement of the movable seat 16. This guides the movable seat 16, reduces motion stiffness, and maintains constraint stiffness in both horizontal and rotational degrees of freedom. This avoids the frictional interference of linear guides in existing bonding devices, enabling direct and accurate measurement of the bonding force at the adsorption end of the adsorption member 14, and improving the accuracy of bonding force control. Compared to linear guides, the first elastic mechanism 17 has a smaller overall volume and weight, resulting in a smaller overall weight and volume of the bonding assembly 1. This reduces the inertia of the bonding assembly 1 during movement, allowing for higher acceleration and speed, and enabling the bonding assembly 1 to operate at high speeds.

[0049] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A high-precision force-controlled bonding device, characterized in that, include: A bonding assembly includes a mounting base, a first detection element, a first driving element, a movable seat, a connecting shaft, a first elastic mechanism, and an adsorption element. The first driving element is connected to the mounting base, and its output end is elastically connected to the connecting shaft. The connecting shaft passes through the movable seat and is rotatably connected to it. The end of the connecting shaft away from the first driving element is connected to the adsorption element. The first elastic mechanism includes a first spring, which passes through the connecting shaft. The first spring is connected to the mounting base and abuts against the end of the movable seat. The first detection element is connected to the mounting base, and its detection end is connected to the movable seat. The movable seat and the connecting shaft are movable along the axial direction of the connecting shaft. A driving component, the movable end of which is connected to the mounting base.

2. The high-precision force-controlled bonding device according to claim 1, characterized in that: The first elastic mechanism further includes a first pressure plate and a first pressure block. The first pressure plate is located at the edge of the first spring piece and connected to the mounting base. The edge of the first spring piece is located between the first pressure plate and the mounting base. The first pressure block is connected to the side of the first spring piece away from the movable base.

3. The high-precision force-controlled bonding device according to claim 1, characterized in that: The first spring has a first opening along the circumferential direction with the center line of the first spring as the axis.

4. The high-precision force-controlled bonding device according to claim 1, characterized in that: The bonding assembly further includes a second elastic mechanism, which includes a second pressure plate, a second spring, a second pressure block, and a connecting seat. The second pressure plate is located at the edge of the second spring and connected to the connecting seat. The edge of the second spring is located between the second pressure plate and the connecting seat. The connecting seat has a clearance cavity and is connected to the output end of the first driving member. The second pressure block is connected to the side of the second spring away from the connecting seat and is connected to the connecting shaft.

5. The high-precision force-controlled bonding device according to claim 4, characterized in that: The mounting base has a receiving space, and the second elastic mechanism, the first elastic mechanism, and the movable seat are all located in the receiving space. The detection end of the first detection element is connected to the movable seat through a first connecting plate, and the first connecting plate penetrates the side wall of the mounting base.

6. The high-precision force-controlled bonding device according to claim 1, characterized in that: The movable seat has a connector on its side wall. The movable seat has a first channel. The connecting shaft has a second channel along the axial direction. The connector communicates with the first channel. The first channel communicates with the second channel. The second channel extends to the end of the connecting shaft that is connected to the adsorption element. The second channel communicates with the adsorption element.

7. The high-precision force-controlled bonding device according to claim 1, characterized in that: The drive assembly includes a support base, a second drive member, and a movable plate. The second drive member is connected to the support base, and the output end of the second drive member is connected to the movable plate. The movable plate is slidably connected to the support base and is also connected to the mounting base.

8. The high-precision force-controlled bonding device according to claim 7, characterized in that: The drive assembly also includes an elastic element, which is connected to the support base, and the movable end of the elastic element is connected to the movable plate through a second connecting plate.

9. The high-precision force-controlled bonding device according to claim 7, characterized in that: The drive assembly further includes a second detection element, the reading part of which is connected to the movable plate via a connecting frame, and the sensing part of which is connected to the support base and extends along the moving path of the movable plate.

10. The high-precision force-controlled bonding device according to claim 7, characterized in that: The drive assembly further includes a first baffle and a second baffle. The first baffle is connected to the support base and located at the end of the moving path of the movable plate, and the second baffle is connected to the support base and abuts against the second drive member.

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