Electrolytic copper foil production device with temperature control and copper foil width adjustment function

Abstract

This invention relates to an electrolytic copper foil production apparatus, and more specifically, to an electrolytic copper foil production apparatus having temperature control and copper foil width adjustment functions for minimizing defects and producing high-quality copper foil. The structure of the invention for achieving the aforementioned objective provides an electrolytic copper foil production apparatus having temperature control and copper foil width adjustment functions, characterized in that it comprises: a water tank section containing an electrolyte; a roller section formed inside the water tank section for electroplating copper foil using the electrolyte; a positive electrode section formed inside the water tank section, located below the roller section, and energized by the electrolyte; and a temperature control section formed below the positive electrode section.

Description

Technical Field

[0001] This invention relates to an electrolytic copper foil production apparatus, and more specifically, to an electrolytic copper foil production apparatus having temperature control and copper foil width adjustment functions for minimizing the occurrence of defects and for producing high-quality copper foil. Background Technology

[0002] Electrolytic copper foil is a product made by electroplating copper into a thin foil form. It is primarily used in the manufacture of electronic devices and batteries, particularly as the negative electrode current collector in lithium-ion batteries or a core material in printed circuit boards (PCBs). Electrolytic copper foil is especially valued for its excellent conductivity and the advantage of being thin and having precisely adjustable thickness, making it a crucial material in the high-tech electronic devices and battery industries.

[0003] In the preparation of this electrolytic copper foil, an insoluble electrode is used as the positive electrode. Specifically, the electrode is responsible for the reaction of oxygen during the electrolysis process; it is insoluble in the electrolyte and helps maintain the stability of the reaction. That is, the insoluble electrode allows the electrode to continuously participate in the electrochemical reaction without being consumed, thus enabling the smooth production of electrolytic copper foil.

[0004] However, existing insoluble electrodes have limitations in terms of durability and effectiveness. In particular, during the preparation of electrolytic copper foil, electrode performance directly affects the quality of copper and the effectiveness of the electrochemical reaction; therefore, maintaining high electrode performance is extremely important. However, current electrode performance degrades over time, leading to increased production costs and reduced overall production efficiency.

[0005] Furthermore, in the electrode fabrication process, it is difficult to maintain a uniform thickness during the coating and gold plating of multiple electrodes, resulting in uneven activation of the electrode surface. Consequently, the electrochemical reactivity of the electrode will decrease, leading to uneven electrode performance during the production process.

[0006] Furthermore, the electrochemical reactions occurring during the preparation of electrolytic copper foil involve a complex process where hydrogen is generated at the negative electrode and oxygen at the positive electrode. This reaction can potentially lead to electrode corrosion or malfunction, and may reduce the reliability of the production process. In particular, existing positive electrode materials lack resistance to oxygen generation, resulting in performance degradation over prolonged use.

[0007] Furthermore, the temperature of the electrolyte during the electrolytic copper foil production process affects the gold plating speed and thickness. While higher temperatures increase the gold plating speed, excessively high temperatures can lead to defects. Therefore, the electrolyte temperature should be maintained uniformly at an appropriate level during the electrolytic copper foil production process.

[0008] However, existing electrolytic copper foil preparation techniques have difficulty controlling this temperature, which can lead to defects.

[0009] Existing technical documents

[0010] Korean Patent No. 10-1409750 Summary of the Invention

[0011] The problem the invention aims to solve

[0012] The object of the present invention, which aims to solve the problems described above, is to provide an electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions that minimizes the occurrence of defects and is used to produce high-quality copper foil.

[0013] The technical problems to be solved by this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0014] means for solving problems

[0015] The present invention, for achieving the aforementioned purpose, provides an electrolytic copper foil production apparatus having temperature control and copper foil width adjustment functions, characterized in that it comprises: a water tank section containing an electrolyte; a roller section formed inside the water tank section for electroplating copper foil using the electrolyte; a positive electrode section formed inside the water tank section, located below the roller section, and energized by the electrolyte; and a temperature control section formed below the positive electrode section.

[0016] The present invention is characterized in that the temperature control unit may include: a base plate formed as a curved surface to attach the positive electrode to the upper surface; a pipe formed inside the base plate; a heat medium inlet formed on one side of the pipe; and a heat medium outlet formed on the other side of the pipe, so that the heat medium circulates into the interior of the pipe.

[0017] The present invention is characterized in that the temperature control unit may include: a sensor module for measuring the temperature of the electrolyte; and a control module for controlling the temperature of the heat medium circulating in the pipeline, so that the temperature of the electrolyte measured by the sensor module is maintained at a preset temperature.

[0018] The present invention is characterized in that a pair of temperature control units can be formed separately from each other, so that the electrolyte is supplied between the roller unit and the positive electrode unit through the hollow part formed by the separation between them.

[0019] The feature of this embodiment of the invention is that the roller portion and the positive electrode portion can be separated by a preset distance from each other, so that the electrolyte can flow in.

[0020] The present invention may include: an electrolyte supply section for supplying electrolyte to the interior of the water tank section; and an electrolyte discharge section formed on the side of the water tank section for discharging electrolyte overflowing from the water tank section to the outside.

[0021] The present invention is characterized in that the electrolyte discharge section may include: a discharge body formed around the outer side of the water tank for containing electrolyte overflowing from the water tank; and an electrolyte discharge port formed at the lower part of the discharge body.

[0022] A feature of this embodiment of the invention is that it may further include a winding section, which transfers the copper foil generated from the roller section to the core section and winds it thereon.

[0023] The present invention is characterized in that the roller portion may include: a roller body, which is cylindrical and rotates in one direction; a rotation shaft that passes through the center of the roller body; and a negative electrode material formed along the outer peripheral surface of the roller body.

[0024] The feature of this embodiment of the invention is that the positive electrode portion can be an insoluble electrode formed by coating a positive electrode material solution onto a titanium electrode substrate.

[0025] The effects of the invention

[0026] The advantages of the present invention having the structure described above are as follows: the quality of the copper foil can be maintained uniformly, and the copper foil is produced by uniformly controlling the temperature of the electrolyte.

[0027] Furthermore, according to the present invention, the rate and efficiency of the electrochemical reaction can be improved by using an insoluble titanium substrate coated with a platinum compound. The insoluble titanium substrate can increase the copper plating rate during the electrolytic copper foil production process, thereby improving productivity.

[0028] Furthermore, according to the present invention, iridium oxide, which is resistant to oxygen generation, can be coated onto the positive electrode to minimize electrode corrosion or performance degradation. The iridium oxide can ensure electrode stability during the preparation of electrolytic copper foil for long-term use.

[0029] Furthermore, according to the present invention, the quality of the produced electrolytic copper foil is improved by the higher reactivity and stability of the insoluble electrode. High-quality copper foil increases its applicability in the electronic equipment and battery industries and helps to maximize the performance of the final product.

[0030] Furthermore, according to the present invention, in addition to the production of electrolytic copper foil, it can also be applied to various fields such as brine electrolysis, wastewater treatment, and electrochemical cleaning. This versatility can enhance the commercialization potential of the technology and promote its use in multiple industries.

[0031] The effects of this invention are not limited to those described herein, and should be understood to include all effects that can be inferred from the structure of the invention as described in the detailed description of the invention or the claims. Attached Figure Description

[0032] Figure 1 This is an illustrative diagram of an electrolytic copper foil production apparatus according to an embodiment of the present invention.

[0033] Figure 2 This is a perspective view of an electrolytic copper foil production apparatus according to an embodiment of the present invention.

[0034] Figure 3 This is an example diagram of a temperature control unit according to an embodiment of the present invention.

[0035] Figure 4 This is a perspective view of a positive electrode portion having an isolation membrane formed according to an embodiment of the present invention.

[0036] Figure 5 This is a step illustration of a method for preparing an insoluble electrode for preparing electrolytic copper foil according to an embodiment of the present invention.

[0037] Figure 6 This is a flowchart illustrating a method for preparing an insoluble electrode for preparing electrolytic copper foil according to an embodiment of the present invention.

[0038] Figure 7 This is a flowchart of the steps for pre-processing an electrode substrate according to an embodiment of the present invention.

[0039] Figure 8 A flowchart illustrating the steps for preparing a coating solution for applying a pretreated electrode substrate according to an embodiment of the present invention.

[0040] Figure 9 This is a flowchart of the steps for preparing an insoluble electrode by coating an electrode substrate with the coating solution prepared according to an embodiment of the present invention.

[0041] Figure 10 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons (SE) and backscattered electrons (BSE) were taken at 200x magnification using a scanning electron microscope.

[0042] Figure 11 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 500x magnification using a scanning electron microscope.

[0043] Figure 12To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 2000x magnification using a scanning electron microscope.

[0044] Figure 13 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 10,000x magnification using a scanning electron microscope.

[0045] Figure 14 A chart showing the elements on the surface of the insoluble substrate of the present invention for qualitative or quantitative analysis using an energy dispersive spectroscopy (EDS) instrument.

[0046] Figure 15 Images of the elemental composition of the insoluble substrate of the present invention were taken using a scanning electron microscope at 5000x magnification.

[0047] Figure 16 Images were taken to confirm the molecular and crystalline structures of the mixture of the insoluble substrate of the present invention.

[0048] Figure 17 and Figure 18 Images were taken to confirm the molecular and crystalline structures of iridium and tantalum when mixed together.

[0049] Figures 19 to 21 To capture images of an insoluble substrate using an X-ray photoelectron spectrometer.

[0050] Figure 22 This is a table used to illustrate the effect of pretreatment on the electrode substrate.

[0051] Figure 23 This is a table used to illustrate the effect of the coating solution on the electrode substrate.

[0052] Figure 24 This table illustrates the effects of drying and heat treatment on the electrode substrate. Detailed Implementation

[0053] The most preferred embodiment of the present invention is characterized by comprising: a water tank portion containing an electrolyte; a roller portion formed inside the water tank portion for electroplating copper foil using the electrolyte; a positive electrode portion formed inside the water tank portion and located below the roller portion, and energized by the electrolyte; and a temperature control portion formed below the positive electrode portion.

[0054] The present invention will now be described with reference to the accompanying drawings. However, the present invention can be embodied in many different forms, and is therefore not limited to the embodiments described herein. Furthermore, in the drawings, parts unrelated to the description have been omitted for the purpose of clearly illustrating the present invention, and similar reference numerals have been used for similar parts throughout the specification.

[0055] Throughout this specification, when a part is "connected (joined, contacted, combined)" with other parts, this includes both "direct connection" and "indirect connection" with other components in between. Furthermore, when a part "includes" other structural elements, unless specifically stated otherwise, it means that other structural elements may also be included, not that other structural elements are excluded.

[0056] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Unless explicitly stated in the context, singular expressions include plural expressions. In this specification, terms such as "comprising" or "having" are used to specify the presence of features, numbers, steps, actions, structural elements, components, or combinations thereof described in the specification, and do not exclude the presence or additional possibilities of one or more other features, numbers, steps, actions, structural elements, components, or combinations thereof.

[0057] Furthermore, the terms "...part", "...unit", "...module" and other similar terms used in the instruction manual refer to a unit that performs at least one function or action, which can be implemented through hardware or software or a combination of hardware and software.

[0058] Furthermore, in this specification, when a step is located "before" or "after" other steps, this is not only the case where one step has a direct time series relationship with another step, but also includes the same rights as the case where there is an indirect time series relationship, wherein the time series order of the two steps, such as the mixed steps following each step, can be changed.

[0059] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0060] Figure 1 This is an illustrative diagram of an electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to an embodiment of the present invention. Figure 2 This is a perspective view of an electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to an embodiment of the present invention. Figure 3 This is an example diagram of a temperature control unit according to an embodiment of the present invention.

[0061] Reference Figures 1 to 3An electrolytic copper foil production apparatus 100 with temperature control and copper foil width adjustment functions may include a water tank section 110, a roller section 120, a positive electrode section 130, a temperature control section 140, an electrolyte supply section 150, an electrolyte discharge section 160, and a winding section 170.

[0062] The water tank 110 can internally contain the electrolyte 1.

[0063] The electrolyte 1 can be a copper sulfate solution.

[0064] The roller portion 120 can be formed inside the water tank portion, and copper foil 2 can be electroplated using the electrolyte 1.

[0065] The roller section 120 may include a roller body 121, a rotating shaft 122, and a negative electrode material 123.

[0066] The roller body 121 can be cylindrical and can be configured to perform electroplating on the outer circumferential surface of the roller. The roller body 121 ensures that the electroplated copper foil 2 is kept constant, and the copper foil 2 can be continuously formed as the roller rotates.

[0067] The rotating shaft 122 can be configured to pass through the center of the roller body 121 so that the roller body 121 can rotate.

[0068] The rotating shaft 122 can be connected to the drum body 121 to rotate, thereby the drum body 121 can continuously perform copper foil electroplating process.

[0069] The negative electrode material 123 can be formed along the outer peripheral surface of the roller body 121 and can serve as the negative electrode for electroplating copper foil.

[0070] The negative electrode material 123 can react with the electrolyte 1 to form copper foil 2, and the copper foil 2 can be formed to a specified thickness according to the rotation of the roller body 121.

[0071] The roller portion 120 formed as described above can be electrically moved from the negative electrode to the positive electrode in the electrolyte by current guidance, so that the copper foil 2 can be electroplated on the roller portion 120.

[0072] The positive electrode portion 130 may be formed in the lower part of the roller portion 120, and may have a curvature corresponding to the curvature of the roller portion 120. Furthermore, the upper surface of the positive electrode portion 130 may be spaced apart from the outer peripheral surface of the roller portion 120 by a predetermined interval.

[0073] Furthermore, the positive electrode portion 130 can be formed in pairs, and the roller portion 120 and the positive electrode portion 130 can be separated from each other so that the electrolyte 1 can flow between the roller portion 120 and the positive electrode portion 130.

[0074] The positive electrode portion 130 formed as described above can be used to supply current, and copper foil can be electroplated by the interaction of the electrolyte 1 with the negative electrode material 123 of the roller portion 120.

[0075] The positive electrode portion 130 can be an insoluble electrode 20 prepared by coating an electrode substrate 10 made of titanium material with a coating solution containing iridium.

[0076] The temperature control unit 140 can be formed in a pair at the lower part of the positive electrode unit 130, and may include a base plate 141, a pipe 142, a heat medium inlet 143, a heat medium outlet 144, a sensor module 145, and a control module 146.

[0077] The base plate 141 can be formed as a curved surface with a curvature corresponding to the positive electrode portion 130, so that the positive electrode portion 130 can be attached to the upper surface.

[0078] The pipes 142 can be formed inside the base plate 141 and can extend in a zigzag pattern along the length or width of the base plate 141. In this case, the balanced spacing of the pipes 142 in the length or width direction is constant, thereby enabling uniform heat exchange.

[0079] Furthermore, the heat medium can flow inside the pipe 142. Moreover, the heat medium can move along the pipe 142 and exchange heat with the electrolyte.

[0080] On the other hand, multiple heat exchange fins can also be formed on the lower surface of the base plate 141. The heat exchange fins formed as described above can increase the contact area between the electrolyte 1 and the temperature control unit 140, thereby enabling the heat transferred through the pipe 142 to achieve heat exchange more rapidly and uniformly.

[0081] The heat medium inlet 143 may be formed on one side of the pipe 142, so that the heat medium flows into the pipe 142.

[0082] The heat medium outlet 144 can be formed on the other side of the pipe 142, and can discharge the heat medium that has completed heat exchange with the pipe 142.

[0083] After the heat medium discharged through the heat medium outlet 144 is heated or cooled to reach a preset temperature, it can flow into the pipe 142 through the heat medium inlet 143 and circulate.

[0084] The sensor module 145 can be used to measure the temperature of the electrolyte in real time. The sensor module 145 can provide the control module 146 with data related to the measured temperature change.

[0085] The control module 146 can control the temperature of the heat medium circulating in the pipeline 142 based on the temperature data measured by the sensor module 145, so that the temperature of the electrolyte 1 is maintained at a preset temperature.

[0086] As an example, the temperature of the electrolyte 1 can be controlled between 49.5 degrees and 50.5 degrees.

[0087] The pair of temperature control units 140 can be spaced apart from each other, and the electrolyte 1 can be supplied between the roller unit 120 and the positive electrode unit 130 through the hollow portion formed by the spaced-apart parts.

[0088] The electrolyte supply unit 150 can be connected to the electrolyte tank and is used to supply the electrolyte 1 into the interior of the water tank 110. The electrolyte supply unit 150 can be formed in the lower part of the water tank 110 and is used to supply electrolyte between the roller part 120 and the positive electrode part 130 inside the water tank 110.

[0089] The electrolyte discharge section 160 may be formed on the side of the water tank section 110, and may discharge the electrolyte 1 that overflows from the water tank section 110 to the outside.

[0090] The electrolyte discharge section 160 may include a discharge body 161 and an electrolyte discharge outlet 162.

[0091] The discharge body 161 may be formed around the outside of the water tank 110 and may contain the electrolyte 1 overflowing to the outside of the water tank 110.

[0092] The electrolyte outlet 162 may be formed at the lower part of the discharge body 161, so that the electrolyte 1 contained in the discharge body 161 can be discharged into the electrolyte tank.

[0093] In this case, the electrolyte tank may also be configured to pretreat the discharged electrolyte by filtering and cooling it for recycling.

[0094] The winding section 170 can transfer and wind the copper foil 2 generated in the roller section 120 towards the core. The copper foil 2 generated in the roller section 120 can be stably transferred by the winding section 170, and in this process, it can be wound while maintaining a specified tension to prevent damage to the copper foil.

[0095] On the other hand, a winding control system can also be added to the winding section 170. When the winding section 170 winds the copper foil, the winding control system can maintain a constant tension on the copper foil. In particular, the winding control system can measure the thickness and condition of the copper foil 2 in real time and adjust the automatic winding speed. The winding control system formed above can prevent damage to the copper foil 2 and improve production efficiency.

[0096] The electrolytic copper foil production apparatus 100, as described above, with temperature control and copper foil width adjustment functions, can uniformly control the temperature of the electrolyte 1 and uniformly maintain the quality of the produced copper foil 2.

[0097] Figure 4 This is a perspective view of a positive electrode portion having an isolation membrane formed according to an embodiment of the present invention.

[0098] On the other hand, refer to Figure 4 A separator 180 may be attached to the positive electrode portion 130.

[0099] Specifically, the length of the previously formed copper foil 2 can be easily adjusted, but a separate device is required when the width of the copper foil 2 needs to be adjusted.

[0100] However, according to the present invention, such as Figure 4 As shown, an insulating film 180 can be attached to the side of the positive electrode portion 130 so that the positive electrode portion 130 is exposed with the same width as the copper foil 2 to be generated.

[0101] As described above, the positive electrode portion 130, which is partially blocked by the isolation membrane 180, can generate copper foil 2 through an electrical reaction based solely on the exposed area.

[0102] Alternatively, the positive electrode portion 130 may be composed of multiple positive electrode segments (not shown) divided along the width direction, which may be combined into a modular form.

[0103] The positive electrode portion 130 formed as described above can be controlled to activate only the electrode of the positive electrode segment corresponding to the width of the copper foil 2 to be prepared.

[0104] As an example, the total width of the positive electrode portion 130 is 1m. When the width of the copper foil 2 to be prepared is 80cm, the electrodes of the positive electrode segments on both sides are inactive. Only the electrodes of the positive electrode segments 40cm apart from the center are activated to prepare the copper foil 2.

[0105] The present invention, as described above, has the following advantages: it flexibly addresses the width of the copper foil 2 required by customers and reduces equipment costs.

[0106] Hereinafter, with reference to the following figures, the method for preparing the insoluble electrode 20 constituting the positive electrode portion 130 will be described.

[0107] Figure 5 This is a step-by-step illustration of a method for preparing an insoluble electrode for electrolytic copper foil according to an embodiment of the present invention. Figure 6 This is a flowchart illustrating a method for preparing an insoluble electrode for preparing electrolytic copper foil according to an embodiment of the present invention.

[0108] Reference Figure 5 and Figure 6 The method for manufacturing an insoluble electrode for preparing electrolytic copper foil may include: step S10, pretreating an electrode substrate; step S20, preparing a coating solution for coating the pretreated electrode substrate; and step S30, coating the electrode substrate with the prepared coating solution to prepare an insoluble electrode.

[0109] Figure 7 This is a flowchart of the steps for pre-processing an electrode substrate according to an embodiment of the present invention.

[0110] Reference Figure 7 The pretreatment step S10 for the electrode substrate may include: step S11, performing a sandblasting process on the electrode substrate to generate uneven portions; step S12, performing a first cleaning on the electrode substrate with the uneven portions generated; step S13, etching the cleaned electrode substrate; step S14, performing a second cleaning on the etched electrode substrate; and step S15, drying the electrode substrate after the second cleaning.

[0111] First, in step S11, where the electrode substrate is sandblasted to create the uneven surface, the electrode substrate 10 can be made of titanium. For example, the electrode substrate 10 can be made of ASME B265-Gr.l.

[0112] Furthermore, the unevenness 20 can be generated on the electrode substrate 10 by a sandblasting process. In this case, the sandblasting process can be performed using alumina abrasive. Moreover, by setting the brown alumina particle size to #80, #100, and #150, a uniform roughness within the error range of 8 to 15 Ra can be provided for each substrate.

[0113] Next, in step S12, which is the first cleaning of the electrode substrate with the uneven parts, the electrode substrate 10 can be cleaned by high-pressure water and ultrasonic cleaning.

[0114] In this case, during the ultrasonic cleaning, the electrode substrate 10 is immersed in a cleaning solution diluted with alkaline detergent and hot water, and then cleaned at a frequency of 30 to 40 kHz for 30 to 60 minutes.

[0115] Furthermore, the cleaning solution can be prepared by diluting an alkaline cleaning agent with hot water at a ratio of 1:30.

[0116] This first cleaning can remove the aluminum oxide that has penetrated during the sandblasting process of the electrode substrate 10.

[0117] Next, in step S13, the electrode substrate 10 can be etched after etching the cleaned electrode substrate.

[0118] In particular, in order to generate the pattern and structure of the electrode substrate 10, the etching chamber should maintain appropriate temperature, chemical concentration, and pressure to achieve uniform and accurate etching.

[0119] Therefore, the electrode substrate 10 can be etched for 10 to 25 minutes at a concentration of 25 to 30% in an etching solution containing oxalic acid, hydrochloric acid (HCl) or sulfuric acid (H2SO4) within a temperature range of 30 to 80 degrees Celsius.

[0120] In this case, the titanium surface may melt if the etching time is too long. Therefore, the chemical reaction is guided between 10 and 25 minutes to obtain an appropriate roughness, while uniform roughness can be obtained within an error range of 8 to 15 Ra.

[0121] As described above, the electrode substrate subjected to acid etching can be given additional minor roughness based on the roughness formed by sandblasting, thereby increasing the contact area between the electrode substrate and the coating.

[0122] Next, in step S14, the etched electrode substrate is cleaned a second time by high-pressure water cleaning and ultrasonic cleaning.

[0123] In this case, during the ultrasonic cleaning, the electrode substrate 10 is immersed in a cleaning solution diluted with alkaline detergent and hot water, and then cleaned at a frequency of 30 to 40 kHz for 30 to 60 minutes.

[0124] Furthermore, the cleaning solution can be prepared by diluting an alkaline cleaning agent with hot water at a ratio of 1:30.

[0125] Ultrasonic cleaning, which can be performed using a cleaning solution containing alkaline detergent, can dissolve and remove contaminants.

[0126] Next, in step S15, the electrode substrate 10 that has undergone the second cleaning can be completely dried. Specifically, the electrode substrate 10 that has undergone the second cleaning can be completely dried in an oven at a temperature of 70 to 150 degrees Celsius for at least 20 minutes.

[0127] Figure 8A flowchart illustrating the steps for preparing a coating solution for applying a pretreated electrode substrate according to an embodiment of the present invention.

[0128] Reference Figure 8 Step S20, which involves preparing an insoluble electrode by coating an electrode substrate with the prepared coating solution, may include: step S21, mixing two or more elements from the platinum group elements, namely iridium oxide (Ir), ruthenium chloride (Ru), platinum (Pt) and tantalum chloride (Ta), to form a mixture; step S22, stirring the mixture with alcohol to dissolve the elements; and step S23, irradiating the dissolved elements with ultrasound to prepare the coating solution.

[0129] First, in step S21, which involves mixing two or more elements selected from iridium oxide (Ir), ruthenium chloride (Ru), platinum (Pt), and tantalum chloride (Ta) to form a mixture, two or more elements selected from iridium oxide (Ir), ruthenium chloride (Ru), platinum (Pt), and tantalum chloride (Ta) can be mixed to form a mixture within the platinum group elements.

[0130] Iridium is used for the following purposes: when preparing electrodes using iridium chloride (IrCl3, IrCl4, IrCl5) and iridium oxide (IrO2, IrO3, IrO5), a mixture of two or more of tantalum chloride (TaCl2, TaCl3, TaCl4, TaCl5), tantalum oxide (TaO2, TaO3, TaO4, TaO5), and ruthenium chloride (Ru) is used to extend the electrode life in corrosive environments.

[0131] Iridium chloride (IrCl3, IrCl4, IrCl5) has a strong ability to withstand corrosive environments and high electrochemical reactivity, thus exhibiting characteristics of oxygen generation and low voltage. Therefore, it can be expected to react directly and indirectly with pollutants.

[0132] Next, in step S22, the mixture is stirred with alcohol to dissolve the element.

[0133] Moreover, as an example, iridium, which serves as the main catalyst in the coating solution, and tantalum, which serves as the binder, can be dissolved in alcohol in weight ratios of 70:30, 60:40, and 50:50.

[0134] In this case, the mixture is exchanged with the alcohol at a temperature of 30–50°C and at 260–550 RPM for 2–4 hours and dissolved therein.

[0135] Furthermore, the alcohol may be composed of one or more of isopropanol, chlorine, butanol, and ethanol.

[0136] Furthermore, when the viscosity of the mixed metal oxide coating liquid used in this invention is high, although the coating force is excellent, the bonding strength of the surface area of ​​the pre-processed electrode substrate 10 is low. When the viscosity of the coating liquid is low, the coating will have a smudging problem. Therefore, the coating liquid can be made to have an optimal viscosity of 5000 to 8000 cps (centipoise).

[0137] Next, in step S23, which involves irradiating the dissolved elements with ultrasound to prepare the coating solution, each dissolved element is irradiated with ultrasound at a frequency of 20 kHz to 50 kHz by ultrasound dispersion and repeated pressurization and depressurization to allow the elements to undergo particle dispersion, cell disruption, particle pulverization and homogenization steps.

[0138] In this case, the service life and usage conditions can be determined by irradiation time, interval and frequency based on the solution composition, and the particle size can be made into nano-sized and sub-nano-sized ultra-small sizes.

[0139] Furthermore, in step S23, which involves irradiating the dissolved element with ultrasound to prepare the coating solution, the dissolved element can be irradiated with ultrasound at a frequency of 20-50 kHz 2-5 times over a period of 20-60 minutes to prepare the coating solution.

[0140] Figure 9 This is a flowchart of the steps for preparing an insoluble electrode by coating an electrode substrate with the coating solution prepared according to an embodiment of the present invention.

[0141] Reference Figure 9 Step S30, which involves preparing an insoluble electrode by coating an electrode substrate with the prepared coating solution, may include: step S31, coating the pretreated electrode substrate with the coating solution; step S32, drying the electrode substrate coated with the coating solution; step S33, heat-treating the dried electrode substrate; step S34, sequentially and repeatedly performing the steps of coating the coating solution, drying the electrode substrate, and heat-treating until a coating of a predetermined thickness is formed; and step S35, when a coating of the predetermined thickness is formed, performing a thermoplastic process to prepare the insoluble electrode.

[0142] First, in step S31, when applying a coating solution to the pretreated electrode substrate, the pretreated electrode substrate 10 may be coated with a coating solution prepared by the method.

[0143] In this case, the coating method can be spraying, brushing, rolling, dipping, etc.

[0144] Spraying involves spraying the coating liquid onto the electrode substrate 10 in nano-sized particles through a spray nozzle to achieve a constant and stable coating on the surface. This method results in less solution loss and is suitable for mass production, making it a more economical approach.

[0145] Brush coating, which involves applying a coating liquid to the electrode substrate 10 using a brush, is a relatively simple and cost-effective method. However, in order to obtain the required quality and depending on the desired product, there are certain requirements regarding the material of the brush and the skill level of the operator.

[0146] Roller coating, as a method of applying a solution to an electrode substrate 10 by means of a roller, is a relatively simple and cost-effective method. However, depending on the required quality and the specific product, it will require certain materials for the roller and a high level of skill from the operators.

[0147] Dip coating is a method in which an electrode substrate is placed in a coating solution to form a precursor layer on the material surface, and then cured at an appropriate temperature to obtain a coating film. This method is used for relatively small products. Compared with spray coating, the surface is more uniform and the loss of coating solution can be reduced, making it an economical method.

[0148] In step S31, when applying a coating liquid to the pretreated electrode substrate, the prepared coating liquid can be applied or sprayed onto the surface of the pretreated electrode substrate 10 using one of the methods described herein.

[0149] In this case, when the application solution is applied once, 2g / m³ can be formed. 2 The thickness is above.

[0150] Next, in step S32, the electrode substrate coated with the coating liquid is dried. The electrode substrate 10 coated or sprayed with the coating liquid can then be dried. In this case, the drying temperature can be 60–90°C, and the drying time can be 10–20 minutes.

[0151] Next, in step S33, the dried electrode substrate 10 is heat-treated at a temperature range of 400 to 650 degrees Celsius.

[0152] Next, in step S34, which involves repeatedly performing the steps of applying the coating liquid, drying the electrode substrate, and performing heat treatment until a coating of a predetermined thickness is formed, the steps of applying the coating liquid to the pretreated electrode substrate (S31), drying the electrode substrate coated with the coating liquid (S32), and heat treating the dried electrode substrate (S33) can be repeated 5 to 10 times until a coating of a predetermined thickness is formed.

[0153] In this case, the preset final coating thickness can be set to the range of 3 to 6 μm.

[0154] Next, in step S35, when a coating of a preset thickness is formed, a thermoplastic process is performed to prepare an insoluble electrode. When the preset final coating thickness is met, the coating liquid application, drying, and heat treatment processes on the electrode substrate 10 can be stopped, and a final thermoplastic process is performed to prepare the insoluble electrode 20.

[0155] In this case, the thermoplastic process can be performed for 30 to 90 minutes within a temperature range of 550°C to 850°C.

[0156] The lifetime of the insoluble electrode 20 formed in this way can be determined by the following method.

[0157] First, test pieces measuring 25mm horizontally and 25mm vertically were prepared. The electrolytic cell solution was set to a sulfuric acid concentration below 22%, a test piece spacing of 20mm, a current density below 700 ASD, an operating temperature below 90℃, and a voltage below 10V to determine the lifetime of the insoluble electrode 20. The lifetime test continued until a sharp reaction appeared on the voltage graph; when a sharp reaction occurred, the lifetime was considered to have ended.

[0158] Figure 10 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons (SE) and backscattered electrons (BSE) were taken at 200x magnification using a scanning electron microscope.

[0159] Figure 11 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 500x magnification using a scanning electron microscope.

[0160] Figure 12 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 2000x magnification using a scanning electron microscope.

[0161] Figure 13 To confirm the microstructure and elemental composition of the insoluble substrate of the present invention, images of secondary electrons and backscattered electrons were taken at 10,000x magnification using a scanning electron microscope.

[0162] Reference Figures 10 to 13The microstructure and composition of the sample surface were confirmed using scanning electron microscopy. The analysis was performed under the following conditions: Acc. Voltage: 3 kV, Current: 1.6 nA, and Magnification: 200x / 500x / 2000x / 5000x / 10000x. Under these conditions, different morphologies could be identified in each region at 2000x and 10000x magnification.

[0163] Figure 14 A chart showing the elements on the surface of the insoluble substrate of the present invention, used for qualitative or quantitative analysis using an energy dispersive spectroscopy (EDS) instrument.

[0164] Reference Figure 14 The elemental composition of the material surface was qualitatively and quantitatively analyzed using energy dispersive spectroscopy. The analytical conditions were: surface analysis and depth profile, etching time: 5 seconds / 5 times.

[0165] Figure 15 Images were taken using a scanning electron microscope at 5000x magnification to confirm the elemental composition of the insoluble substrate of the present invention. Figure 16 Images were taken to confirm the molecular and crystalline structures of the mixture of the insoluble substrate of the present invention.

[0166] Figure 17 and Figure 18 Images were taken to confirm the molecular and crystalline structures of iridium and tantalum when mixed together.

[0167] Reference Figures 15 to 18 To confirm the molecular and crystalline structure of the mixture of iridium and tantalum, measurements were taken on 2400g paper and 2400g slides. The analytical conditions were: laser: 532nm, exposure time: 0.3s, number of accumulations: 10, accumulation cycle: 1s, and ND filter: 10%.

[0168] Figures 19 to 21 To capture images of an insoluble substrate using an X-ray photoelectron spectrometer.

[0169] Reference Figures 19 to 21An X-ray photoelectron spectroscope (XPS) can identify the composition and chemical bonding state of a sample surface by measuring the energy of photoelectrons released when X-rays are incident on the sample surface, and can also be used to determine the depth profile of each element.

[0170] The analysis conditions were surface analysis and depth profile, and etching time: 5 seconds / 5 times.

[0171] Figure 22 The table shows the effect of pretreatment on the electrode substrate. Figure 23 This table illustrates the effect of the coating solution on the electrode substrate. Figure 24 This table illustrates the effects of drying and heat treatment on the electrode substrate.

[0172] The advantages of the present invention based on the described structure are as follows: the electrochemical reaction rate and efficiency can be improved by using an insoluble titanium substrate coated with a platinum compound. The insoluble titanium substrate can also improve productivity by increasing the copper plating rate during the electrolytic copper foil production process.

[0173] Furthermore, according to the present invention, iridium oxide, which is resistant to oxygen generation, can be coated onto the positive electrode to minimize electrode corrosion or performance degradation. The iridium oxide can ensure electrode stability during the preparation of electrolytic copper foil for long-term use.

[0174] Furthermore, according to the present invention, the quality of the produced electrolytic copper foil is improved by the higher reactivity and stability of the insoluble electrode 20. High-quality copper foil increases its applicability in the electronic equipment and battery industries and helps to maximize the performance of the final product.

[0175] Furthermore, according to the present invention, in addition to the production of electrolytic copper foil, it can also be applied to various fields such as brine electrolysis, wastewater treatment, and electrochemical cleaning. This versatility can enhance the commercialization potential of the technology and promote its use in multiple industries.

[0176] Although the invention has been described with reference to the accompanying drawings, this is merely illustrative. Those skilled in the art can readily implement the invention in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above are illustrative in all respects and are not intended to limit the invention. For example, the structural elements described as a single type can be implemented separately, and similarly, the separately described structural elements can be implemented in a combined form. Furthermore, the described techniques can be performed in a different order than the described methods.

[0177] The embodiments and accompanying drawings described in this specification are merely illustrative of a portion of the technical ideas included in the invention. Therefore, the scope of the invention is defined by the claims described below, the meaning and scope of which, as well as all modifications or variations derived from equivalent concepts, should be included within the scope of the invention.

[0178] Explanation of reference numerals in the attached figures

[0179] 1: Electrolyte

[0180] 2: Copper foil

[0181] 10: Electrode substrate

[0182] 11: Concave and convex parts

[0183] 20: Insoluble electrode

[0184] 100: Electrolytic copper foil production equipment with temperature control and copper foil width adjustment functions

[0185] 110: Sink Department

[0186] 120: Roller section

[0187] 121: Drum body

[0188] 122: Rotation axis

[0189] 123: Anode Materials

[0190] 130: Positive electrode section

[0191] 140: Temperature Control Department

[0192] 141: Base Plate

[0193] 142: Pipeline

[0194] 143: Inlet for heat medium flow

[0195] 144: Heat medium outlet

[0196] 145: Sensor Module

[0197] 146: Control Module

[0198] 150: Electrolyte Supply Department

[0199] 160: Electrolyte discharge section

[0200] 161: Excretion

[0201] 162: Electrolyte discharge port

[0202] 170: Winding section

Claims

1. An electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions, characterized in that, include: The water tank section contains the electrolyte. A roller section is formed inside the water tank section, where copper foil is electroplated using the electrolyte; The positive electrode portion is formed inside the water tank portion and is located at the lower part of the drum portion, where it is energized by the electrolyte. as well as A temperature control section is formed in the lower part of the positive electrode section.

2. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, The temperature control unit includes: The base plate is formed as a curved surface to attach the positive electrode portion to the upper surface; Pipes are formed inside the base plate; A hot medium inlet is formed on one side of the pipe; and A heat medium outlet is formed on the other side of the pipe. This allows the heat medium to circulate inside the pipe.

3. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 2, characterized in that, The temperature control unit includes: A sensor module is used to measure the temperature of the electrolyte; and The control module controls the temperature of the heat medium circulating in the pipeline, so that the temperature of the electrolyte measured by the sensor module is maintained at a preset temperature.

4. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 2, characterized in that, The pair of temperature control units are formed apart from each other, so that the electrolyte is supplied between the drum unit and the positive electrode unit through the hollow part formed apart from each other.

5. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, The roller section and the positive electrode section are separated by a predetermined distance, allowing the electrolyte to flow in.

6. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, include: An electrolyte supply unit is used to supply electrolyte to the interior of the water tank. as well as An electrolyte discharge section is formed on the side of the water tank section for discharging electrolyte that overflows from the water tank section to the outside.

7. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 6, characterized in that, The electrolyte discharge section includes: An outlet body, formed around the outer periphery of the water tank portion, is used to contain electrolyte overflowing from the water tank portion; and An electrolyte outlet is formed at the bottom of the discharge body.

8. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, It also includes a winding section that transfers the copper foil generated from the roller section to the core section and winds it.

9. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, The roller section includes: The drum body is cylindrical and rotates in one direction; A rotating shaft is formed by passing through the center of the roller body; and The negative electrode material is formed along the outer peripheral surface of the roller body.

10. The electrolytic copper foil production apparatus with temperature control and copper foil width adjustment functions according to claim 1, characterized in that, The positive electrode portion is an insoluble electrode formed by coating a positive electrode material solution onto a titanium electrode substrate.

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