Fire-retardant and heat-insulating formaldehyde-free plywood and preparation method thereof
By combining polyphenol amine-grafted birch plywood with borosilicate hybrid surface modifiers and thermally triggered self-crosslinking adhesives, a multi-layer composite structure is formed, which solves the problems of insufficient flame retardancy and thermal insulation performance of formaldehyde-free plywood, achieves stable interfacial bonding and complex heat transfer paths, and improves the overall performance of the material.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHONGZUO GUANGLIN DIFEN NEW MATERIAL TECH CO LTD
- Filing Date
- 2026-04-10
- Publication Date
- 2026-07-17
AI Technical Summary
Existing formaldehyde-free plywood has shortcomings in flame retardancy and thermal insulation performance. Its interface structure is unstable and heat transfer is singular, making the material easy to burn in hot environments and with poor thermal stability.
A multi-layered composite structure was formed by combining polyphenol amine-grafted birch wood boards with a borosilicate hybrid surface modifier and a heat-triggered self-crosslinking adhesive. This structure includes a polyphenol amine interface layer, a borosilicate hybrid layer, and a polymer network of the heat-triggered self-crosslinking adhesive, which enhances the interfacial bonding stability and the complexity of the heat transfer pathway.
It significantly improves the flame retardant and thermal insulation properties of plywood, stabilizes the interfacial bonding, reduces the release of aldehydes, and improves the structural stability and heat transfer characteristics of the material in thermal environments.
Smart Images
Figure CN122401573A_ABST