Long-lasting antistatic abs material and its manufacturing method
By using PEG-b-PS block copolymers and polymer-assisted conductive fillers in ABS materials to form microphase separation and physical entanglement, the long-term effectiveness and compatibility issues of existing antistatic ABS materials are solved, achieving stable antistatic effects and maintenance of mechanical properties in high-end cleanroom applications such as photomask protective films and protective boxes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHAOXING XINLIAN SEMICON TECH CO LTD
- Filing Date
- 2026-06-12
- Publication Date
- 2026-07-17
AI Technical Summary
Existing antistatic ABS materials cannot simultaneously meet the comprehensive requirements of long-term stability, good compatibility with ABS matrix, minimal impact on mechanical properties, and achieving ideal electrical properties with low addition amounts. Especially in high-end cleanroom applications such as photomask protective film and protective box, the adsorption of particles or the precipitation of antistatic agents caused by static electricity are serious pollutants.
By using PEG-b-PS block copolymer as an antistatic modifier and combining it with polymer-assisted conductive filler, a durable conductive path is established in ABS through the formation of microphase separation and physical entanglement, avoiding the need for additional antistatic coating, thus achieving long-lasting antistatic effect and low damage to mechanical properties.
It achieves long-lasting antistatic properties of ABS material with low addition amount. The antistatic function will not be lost due to friction or cleaning. It is suitable for high-end cleanroom scenarios such as photomask protective film and protective box, and maintains the electrical and mechanical properties of the material.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of polymer composite materials technology, specifically providing a long-lasting antistatic ABS material and its manufacturing method. Background Technology
[0002] ABS resin (acrylonitrile-butadiene-styrene copolymer) is widely used in consumer electronics, home appliances, automotive interiors, industrial parts, and precision component packaging due to its excellent mechanical properties, processing performance, and surface gloss. However, ABS resin has high insulation properties, and its inherent surface resistivity is typically as high as 10⁻⁶. 15 Ω / □ or higher. During processes such as friction, peeling, or induction, its surface readily accumulates static charge.
[0003] The accumulation of static charge can lead to a series of serious problems: First, static electricity attracts dust from the air, causing dirt to accumulate on the product's appearance, especially noticeable in high-gloss or transparent components. Second, in the packaging and use of precision electronic components (such as chips and sensors), electrostatic discharge (ESD) can instantly break down or damage components, causing decreased reliability or functional failure. Finally, under certain conditions, static sparks can even trigger flammable and explosive accidents. Of particular concern is the extremely high cleanliness requirements for pellicles and their protective cases in the semiconductor and photolithography fields. Traditional ABS pellicle protective cases easily generate and accumulate large amounts of static charge due to friction between the upper and lower covers during opening, closing, or transportation. These static charges strongly attract submicron particles (microparticles) from the environment and may transfer them to the surface of the pellicle. Once the pellicle is contaminated with microparticles, it can lead to pattern defects, reduced yield, or even the scrapping of the entire photomask during photolithography exposure, severely impacting the product yield and functional integrity of semiconductor manufacturing. Therefore, such high-precision applications place stringent requirements on the antistatic properties of protective box materials, requiring them to be long-term, stable, and non-degradable.
[0004] To reduce the surface resistance of ABS materials and eliminate the hazards of static electricity, the industry has developed various antistatic technologies. These mainly include the following categories:
[0005] 1. Surface-coated antistatic agent: A hydrophilic antistatic layer is formed on the surface of ABS products by spraying or impregnation. The antistatic effect of this method depends on the relative humidity of the environment, and the coating adhesion is limited. It is easily degraded by wiping, friction, or abrasion during use, and is considered a "temporary" antistatic method.
[0006] 2. Added low-molecular-weight antistatic agents: These are low-molecular-weight antistatic agents such as fatty acid esters, ethoxylated alkylamines, and quaternary ammonium salts directly incorporated into the ABS matrix. Their mechanism of action relies on the migration of antistatic agent molecules to the surface of the product, forming an adsorbed water film to dissipate static charge. However, these antistatic agents have poor compatibility with the ABS matrix, leading to excessive migration to the surface or volatilization. With prolonged use or environmental aging, the antistatic agent will continuously leach out, causing a rapid decline in antistatic effect and a short lifespan. Furthermore, excessive addition may affect the mechanical properties of the material and even cause blooming, damaging the appearance.
[0007] 3. Conductive Filler-Filled Type: Conductive fillers such as conductive carbon black, carbon nanotubes (CNTs), graphene, or metal powders are added to ABS. While this method provides durable, moisture-independent antistatic effects, it typically requires high filler content (e.g., conductive carbon black content often exceeds 15 wt%) to construct an effective conductive network. High filler content not only significantly reduces the impact toughness and processing flowability of ABS but also leads to increased material density, limiting the application of light-colored products and increasing costs. Furthermore, nanofillers (such as CNTs) are difficult to disperse and prone to agglomeration, placing stringent requirements on processing techniques.
[0008] 4. Conductive polymer blend type: ABS is blended with intrinsically conductive polymers such as polyaniline and polythiophene. Although the amount of conductive polymer added is relatively low, its compatibility with the ABS matrix is generally poor, making it difficult to disperse uniformly. In addition, conductive polymers are expensive and have limited thermal stability, and are prone to decomposition or decreased activity at the typical processing temperature of ABS.
[0009] In summary, existing antistatic technologies share a common bottleneck: they cannot simultaneously meet the comprehensive requirements of long-lasting effectiveness, good compatibility with the ABS matrix, minimal impact on mechanical properties, and stable antistatic effect with low addition amounts. Especially in high-end cleanroom applications such as photomask protective films and protective boxes, any particle adsorption or antistatic agent leaching contamination caused by static electricity directly threatens product yield, and existing antistatic technologies are insufficient to address these challenges.
[0010] Therefore, there is an urgent need to develop an antistatic ABS material that can achieve long-term stability, has minimal impact on the original mechanical strength of ABS, and can achieve ideal electrical properties at a low addition amount. Summary of the Invention
[0011] To address the aforementioned problems, this invention provides a long-lasting antistatic ABS material and its manufacturing method. The specific technical solution is as follows:
[0012] A long-lasting antistatic ABS material comprises the following raw materials in parts by weight: 100 parts ABS resin, 3-5 parts antistatic modifier, 1 part UV stabilizer, 1.5 parts polymer-assisted conductive filler, and 0.2 parts antioxidant; wherein the antistatic modifier is a PEG-b-PS block copolymer.
[0013] In this approach, PEG-b-PS block copolymers are used as antistatic modifiers. Unlike traditional techniques that rely on small molecule additives to improve the antistatic properties of ABS, this method uses high molecular weight block copolymers for antistatic purposes. By utilizing the hydrophilic PEG segments and hydrophobic PS segments in the PEG-b-PS block copolymer, a durable conductive pathway is formed in the ABS. Furthermore, the PS segments are physically entangled with the ABS molecular chains, while the PEG segments, combined with the polymer-assisted conductive filler, conduct electricity independently. This breaks the conventional wisdom that high molecular weight block copolymers cannot perform antistatic purposes due to their weak migration ability. The resulting ABS material has a durable antistatic effect without affecting the mechanical properties and appearance of the ABS.
[0014] If the average molecular weight of the PEG segments is too low, the PEG segments will be short, and the copolymer will not be able to form continuous conductive channels, resulting in isolated spherical dispersions and affecting the antistatic properties of the finished product. Conversely, if the average molecular weight of the PEG segments is too high, the PEG segments will be too long. Due to the poor compatibility of PEG segments with ABS, macroscopic phase separation is likely to occur, affecting the mechanical properties of the finished product. Preferably, in the PEG-b-PS block copolymer, the average molecular weight of the PEG segments, Mn, is 1000 g / mol.
[0015] In this scheme, by precisely controlling the average molecular weight of PEG segments Mn=1000 g / mol, the resulting product has good mechanical properties and good antistatic ability.
[0016] Furthermore, if the PS segments are too short, the copolymer cannot effectively anchor to the SAN in ABS, causing the copolymer to migrate to the surface of the finished product, resulting in poor abrasion resistance. Conversely, if the PS segments are too long, it will inhibit the microphase separation of PEG in the copolymer. Preferably, in the PEG-b-PS block copolymer, the PS unit repeat number Mn=3000. By precisely controlling the PS unit repeat number, the PS segments can be fully physically entangled with ABS, ensuring reliable anchoring without affecting the microphase separation of PEG segments.
[0017] Preferably, the polymer-assisted conductive filler is polypyrrole or polyaniline powder.
[0018] In this scheme, polyaniline or polypyrrole are both polar conductive polymers. When they are directly mixed with non-polar ABS, they will agglomerate severely and fail to form a conductive network. However, since the PEG segments of PEG-b-PS form the above-mentioned interface layer, they can be selectively attracted to the above-mentioned PEG interface layer and spontaneously spread, connect and overlap along the interface layer. Finally, a continuous or semi-continuous conductive pathway network is formed inside the SAN continuous phase of ABS resin, which gives ABS excellent antistatic ability.
[0019] Preferably, the UV-resistant agent is zinc oxide nanoparticles.
[0020] Preferably, the antioxidant is BHT. BHT(C 15 H 24 O) can act as an anti-thermal and oxygen aging agent to ensure the stability of ABS materials during the melt processing.
[0021] Preferably, the preparation is carried out by the following method: after mixing and stirring the antistatic modifier, anti-UV agent, and polymer auxiliary conductive filler, the mixture is added together with ABS resin into a twin-screw extruder for extrusion granulation; wherein the temperature of the entire twin-screw extruder is 190℃~230℃.
[0022] A method for manufacturing a long-lasting antistatic ABS material involves mixing PEG-b-PS block copolymer, UV stabilizer, and polymer-assisted conductive filler in a specific ratio, then adding them together with ABS resin into a twin-screw extruder for granulation.
[0023] Preferably, the temperature of the twin-screw extruder during operation is 190℃~230℃.
[0024] The beneficial effects of this invention are:
[0025] This invention uses PEG-b-PS block copolymer as an antistatic modifier, which differs from traditional techniques that rely on small molecule additives to improve the antistatic properties of ABS. It uses a small amount of high molecular weight block copolymer for antistatic purposes. By utilizing the hydrophilic PEG segments and hydrophobic PS segments in the PEG-b-PS block copolymer, a durable conductive pathway is formed in the ABS. Furthermore, the PS segments are physically entangled with the ABS molecular chains, while the PEG segments, combined with the polymer-assisted conductive filler, conduct electricity independently. This breaks the conventional wisdom that high molecular weight block copolymers cannot provide antistatic properties due to their weak migration ability. The resulting ABS material can achieve long-lasting antistatic effects (resistance to migration, wiping, and aging), low damage to mechanical properties, and high appearance retention without the need for an additional antistatic coating layer. It is especially suitable for high-end cleanroom scenarios such as photomask protective films and protective boxes. Detailed Implementation
[0026] The technical solution of the present invention will be clearly and completely explained through the specific implementation of the embodiments of the present invention.
[0027] This invention provides a long-lasting antistatic ABS material, comprising the following raw materials in parts by weight:
[0028] The mixture contains 100 parts ABS resin, 3-5 parts antistatic modifier, 1 part UV stabilizer, 1.5 parts polymer-assisted conductive filler, and 0.2 parts antioxidant; the antistatic modifier is a PEG-b-PS block copolymer.
[0029] Specifically, the polymer-assisted conductive filler is polypyrrole or polyaniline powder, the UV stabilizer is zinc oxide nanoparticles, and the antioxidant is BHT.
[0030] Among them, PEG-b-PS block copolymer (polyethylene glycol-block polystyrene copolymer) is used as an antistatic modifier. This block structure can form hydrophilic-hydrophobic water areas with microphase separation in the ABS matrix, so that the material can establish a stable and dispersed low-resistance pathway on the material surface without the use of highly migratory antistatic agents.
[0031] Since ABS resin is a heterogeneous system composed of styrene-acrylonitrile copolymer (SAN) as the continuous phase and polybutadiene rubber as the dispersed phase, and the block copolymer PEG-b-PS used in this invention is an amphiphilic block copolymer composed of polyethylene glycol segments and polystyrene segments, the SAN copolymer contains styrene units with the same structure as the PS segments. There is no strong repulsion between the two, allowing for sufficient segmental interpenetration. Therefore, the polystyrene (PS) segments have good compatibility with the styrene-acrylonitrile copolymer (SAN) continuous phase in the ABS matrix. Thus, during the melt blending process, the PS segments in PEG-b-PS can spontaneously anchor and embed into the SAN continuous phase of ABS. Meanwhile, the polyethylene glycol (PEG) segments are polar hydrophilic segments with poor compatibility with the hydrophobic ABS matrix, and therefore cannot enter the SAN phase, but instead extend outward from the SAN phase surface. Consequently, at the interface between the SAN continuous phase and the surrounding medium, the PEG segments form a polar, continuously distributed interfacial layer. This interface layer serves as a platform for the subsequent orderly attachment of conductive polymers, providing spatial and chemical affinity sites for the self-assembly of conductive networks.
[0032] Polyaniline or polypyrrole, which are high-molecular-weight conductive fillers added to ABS materials, are polar conductive polymers. When they are directly mixed with non-polar ABS, they will agglomerate severely and fail to form a conductive network. However, since the PEG segments of PEG-b-PS form the above-mentioned interface layer, they can be selectively attracted to the above-mentioned PEG interface layer and spontaneously spread, connect and overlap along the interface layer, eventually forming a continuous or semi-continuous conductive pathway network inside the SAN continuous phase of ABS resin.
[0033] The resulting ABS material has its antistatic components uniformly dispersed within the ABS, forming a micron to nanometer-scale network structure that is tightly bonded and will not detach due to friction or cleaning. The antistatic function exists not only on the surface but also within the material, extending its effective time. The embedded PEG-b-PS copolymer can migrate to the surface to replenish the depleted antistatic layer, maintaining a surface resistivity of 10. 9 Ω-10 11 Within the Ω range, it achieves long-term antistatic effects. Furthermore, it is insensitive to changes in humidity and temperature, allowing for long-term use in semiconductor factories or warehouses; compared to surface-coated types, it also eliminates the need for periodic application of antistatic agents.
[0034] Example 1:
[0035] This embodiment prepares the aforementioned long-lasting antistatic ABS material by using 100 parts of ABS resin (Chimei PA-757, commercially available), 3 parts of PEG-b-PS copolymer, 1 part of zinc oxide nanoparticles as an anti-UV agent, 1.5 parts of polyaniline powder as a polymer-assisted conductive filler, and 0.2 parts of antioxidant BHT. In each PEG-b-PS copolymer molecule, the average molecular weight (Mn) of the PEG segment is 1000 g / mol; the average molecular weight (Mn) of the PEG segment in each PEG-b-PS copolymer molecule is 3000 g / mol.
[0036] In preparation, zinc oxide nanoparticles, polyaniline powder, PEG-b-PS copolymer, and BHT are first premixed using a high-speed mixer to prevent agglomeration. Then, this mixture is added to a twin-screw extruder along with ABS resin. The entire temperature range of the twin-screw extruder is 190-230℃, and the screw speed is 300 rpm. In this example, 200℃ is selected. The ABS resin melts into a viscous flow state, while simultaneously dispersing and uniformly incorporating all additives into the melt. The mixture is extruded through a die into a noodle-like shape, cooled, and then cut into small cylindrical granules, completing the preparation of the long-lasting antistatic ABS material.
[0037] In this embodiment, the material is heated and softened by an injection molding machine in a downstream factory and then injected into a mold to produce the final product.
[0038] Comparative Example 1:
[0039] This comparative example uses an existing process to prepare a traditional migration-type antistatic ABS material. This process is a classic modified plastic prepared using the "blending-precipitation" principle. The antistatic agent used is sodium alkyl sulfonate (such as Ciba 190) or ethoxylated alkylamine (such as Shanghai Huawen G32). The traditional migration-type antistatic ABS material in this comparative example uses sodium alkyl sulfonate as the antistatic agent, and is also obtained by extrusion using a traditional twin-screw extruder.
[0040] Verification Example 1:
[0041] The ABS materials of Example 1 and Comparative Example 1 were prepared into a standard sample of 100×100×3mm and a cantilever beam sample of 63.5×12.7×3.2mm (V-shaped notch, notch depth 2.54mm) to verify basic properties such as surface resistivity and notched impact strength.
[0042] The surface resistivity (Ω / □) was tested according to ASTM D257-07. The test conditions were: ring electrode, applied voltage of DC 100V, charging time of 60 seconds, environment of 23±1℃, 50±5%RH, ≥24 hours.
[0043] The notched impact strength is tested according to ASTM D256-10, with the following test conditions: impact energy of 2.75J or 5.5J and impact velocity of 3.46m / s.
[0044] The experimental verification results of the ABS material in Experimental Example 1, the traditional migratory antistatic ABS material in Comparative Example 1, and the unmodified ordinary ABS material are shown in the table below:
[0045]
[0046] The table above clearly shows that traditional transfer-type antistatic ABS exhibits a significant increase in surface resistivity and fails after hundreds of rubs. In contrast, the ABS material using PEG-b-PS copolymer as an antistatic modifier provided by this invention maintains a good surface resistivity after hundreds of rubs, and its notched impact strength, tensile strength, and flexural modulus are almost identical to those of pure ABS material. It is not weakened by the addition of other additives, nor is it limited to producing only dark-colored ABS materials due to the influence of carbon black or fillers. Therefore, this invention, using PEG-b-PS embedded ABS, can maintain a long-lasting antistatic effect in a dry environment by preserving a hydrophilic surface. The conductive polymer polyaniline dispersed on the ABS surface conducts electricity and can quickly release static electricity, making it suitable for applications requiring high conductivity rates, such as photomask boxes.
[0047] Verification Example 2:
[0048] For PEG-b-PS copolymers, copolymers with different molecular weights of PEG and PS segments miscible with ABS resin will result in ABS finished materials with different properties. Theoretically, if the PEG segments are too short, they cannot form continuous conductive channels and will disperse as isolated spheres, affecting the antistatic ability of the finished product; while if the PEG segments are too long, due to the poor compatibility between PEG segments and ABS, macroscopic phase separation is likely to occur, leading to changes in the mechanical properties of the finished product. If the PS segments are too short, they cannot effectively anchor with SAN in ABS, causing the copolymer to migrate to the surface of the finished product, resulting in poor abrasion resistance; while if the PS segments are too long, they will inhibit the microphase separation of PEG. Therefore, it is necessary to determine the molecular weight of the PEG-b-PS used in Example 1 to achieve the optimal performance of the ABS material. To this end, an experiment was designed to verify the effect of the molecular weight of each segment in the PEG-b-PS of Example 1 on the finished ABS material.
[0049] Since the molecular weight of the PEG segment has little effect on the PS segment, this verification example first verifies the optimal molecular weight of the PS segment.
[0050] Materials prepared: Same as in Experiment 1, 100 parts ABS resin (Chimei PA-757, commercially available), 1 part zinc oxide nanoparticles, 1.5 parts polyaniline powder, and 0.2 parts BHT.
[0051] It is also necessary to prepare three portions of each of several groups of PEG-b-PS copolymers with different molecular contents. In each group of PEG-b-PS copolymers, the Mn of PEG is fixed at 1000 (g / mol), and the Mn of PS in each group are 1000, 2000, 3000, 4000, and 5000 (g / mol), respectively, and are labeled as PS-1, PS-2, PS-3, PS-4, and PS-5.
[0052] Preparation steps and conditions: Same as in the example, a twin-screw extruder was used at a speed of 300 rpm and a processing temperature of 190℃-230℃.
[0053] Performance test conditions: 23℃, 50%RH conditioned for 24 hours.
[0054] The testing standard is the ASTM standard.
[0055] The test results are shown in the table below:
[0056]
[0057] As can be clearly seen from the table above, when the Mn of PS is 3000 (g / mol), the PS segments can be fully physically entangled with ABS, anchored firmly, and the finished product has the best performance.
[0058] Verification Example 3:
[0059] This validation example verifies the optimal molecular weight of the PEG segment. After confirming that the optimal Mn of PS is 3000 (g / mol), the following raw materials were prepared, similar to Validation Example 2: 100 parts ABS resin (Chimei PA-757, commercially available), 1 part zinc oxide nanoparticles, 1.5 parts polyaniline powder, and 0.2 parts BHT. Three portions of each of several groups of PEG-b-PS copolymers with different molecular weights were prepared. In each group of PEG-b-PS copolymers, the Mn of PS was fixed at 3000 (g / mol), and the Mn of PS in each group were 500, 750, 875, 1000, 1250, 1500, and 2000 (g / mol), respectively, and labeled as PEG-1, PEG-2, PEG-3, PEG-4, PEG-5, PEG-6, and PEG-7.
[0060] Preparation steps and conditions: Same as in the example, a twin-screw extruder was used at a speed of 300 rpm and a processing temperature of 190℃-230℃.
[0061] Performance test conditions: 23℃, 50%RH conditioned for 24 hours.
[0062] The testing standard is the ASTM standard.
[0063] The test results are shown in the table below:
[0064]
[0065] The table above clearly shows that when the Mn of PEG is 1000 (g / mol), it has excellent antistatic properties and good mechanical properties.
[0066] The following conclusions are drawn from verification examples two and three.
[0067] The effect of PEG segment molecular weight:
[0068] When Mn in the PEG segment is less than 800 g / mol (PEG-1, PEG-2), the surface resistivity is greater than 10. 11 Ω / □, which cannot meet the antistatic requirements; when Mn in the PEG segment > 1200 g / mol (PEG-5 to PEG-7), the impact strength retention rate is < 80%, and the mechanical properties are severely degraded. Only when Mn in the PEG segment ≈ 1000 g / mol can a surface resistivity of 10 Ω / □ be achieved simultaneously. 9 -10 11 The balance between Ω / □ (antistatic grade) and impact strength retention rate >90%.
[0069] The influence of PS segment molecular weight:
[0070] When the Mn in the PS segment is less than 2000 g / mol (PS-1, PS-2), the wiping resistance is poor, and the resistance increases significantly after 100 wiping cycles (PS-1 increases by 18.9 times), with migration precipitates appearing on the surface. When the Mn in the PS segment is greater than 4000 g / mol (PS-5), the antistatic effect decreases and processing becomes difficult. Only when the Mn in the PS segment is approximately 3000 g / mol can permanent anchoring, wiping resistance, and non-inhibition of PEG microphase separation be achieved.
[0071] Therefore, the PEG / PS ratio of 1000 / 3000 ≈ 0.33 in this invention is exactly within the ideal range for forming layered or bicontinuous microphase structures. The defined PEG Mn = 1000 g / mol and PS Mn = 3000 g / mol are key requirements for achieving optimal antistatic performance, long-term stability and mechanical property retention.
[0072] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention.
Claims
1. A long-lasting antistatic ABS material, characterized in that, The following ingredients are included in parts by weight: The mixture contains 100 parts ABS resin, 3-5 parts antistatic modifier, 1 part UV stabilizer, 1.5 parts polymer-assisted conductive filler, and 0.2 parts antioxidant; the antistatic modifier is a PEG-b-PS block copolymer.
2. The long-lasting antistatic ABS material according to claim 1, characterized in that, In the PEG-b-PS block copolymer, the average molecular weight of the PEG segments, Mn, is 1000 g / mol.
3. The long-lasting antistatic ABS material according to claim 1, characterized in that, In the PEG-b-PS block copolymer, the PS unit repeat number Mn = 3000 g / mol.
4. The long-lasting antistatic ABS material according to claim 1, characterized in that, The polymer-assisted conductive filler is made of polypyrrole or polyaniline powder.
5. The long-lasting antistatic ABS material according to claim 1, characterized in that, The UV protectant is zinc oxide nanoparticles.
6. The long-lasting antistatic ABS material according to claim 1, characterized in that, The antioxidant is BHT.
7. The long-lasting antistatic ABS material according to claim 1, characterized in that, The following method is used to prepare the product: antistatic modifier, anti-UV agent, and polymer-assisted conductive filler are mixed and stirred evenly, and then added together with ABS resin into a twin-screw extruder for extrusion granulation; wherein the temperature of the entire twin-screw extruder is 190℃~230℃.
8. A method for manufacturing a long-lasting antistatic ABS material, characterized in that, The PEG-b-PS block copolymer, UV stabilizer, and polymer-assisted conductive filler are mixed and stirred in a certain proportion, and then added together with ABS resin into a twin-screw extruder for extrusion granulation.
9. A method for manufacturing a long-lasting antistatic ABS material according to claim 8, characterized in that, The twin-screw extruder operates at a temperature of 190℃~230℃ throughout its working range.