Resin composition and article made using the same
By using a resin composition with a specific composition, including a vinyl resin, polymer A, and a divinylbenzene-styrene-ethylene terpolymer, the performance problems of circuit board materials in terms of dielectric loss, reliability, thermal expansion rate, and water absorption rate have been solved, and high-performance circuit boards have been prepared.
Patent Information
- Application Number
- CN202510114116.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-01-10
- Filing Date
- 2025-01-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing materials cannot meet the performance requirements of circuit boards, especially the comprehensive performance requirements in terms of dielectric loss, reliability, thermal expansion rate and water absorption rate.
A resin composition comprising 70 parts by weight of a vinyl resin, 3 to 45 parts by weight of polymer A and 5 to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, the specific compound structure of which is represented by formula (1) to formula (6), is used to prepare prepreg, resin film, laminate or printed circuit board.
It improves the dielectric loss, reliability, thermal expansion rate and water absorption rate of the circuit board, meeting the comprehensive requirements of high-performance substrates.
Smart Images
Figure FT_1 
Figure FT_2 
Figure FT_3