A process for surface nickel plating of HVLP copper foil
By using HVLP spraying technology and vacuum heat treatment to form a dense nickel plating layer, the problems of high porosity and insufficient adhesion in the HVLP copper foil nickel plating process are solved, achieving low-energy consumption and environmentally friendly nickel plating treatment, and reducing heavy metal wastewater pollution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGXI XINBORUI TECH CO LTD
- Filing Date
- 2026-06-02
- Publication Date
- 2026-07-17
AI Technical Summary
The existing HVLP copper foil nickel plating process suffers from high plating porosity, insufficient adhesion, easy corrosion and signal attenuation, and heavy metal wastewater pollution caused by the use of cyanide/acidic electrolytes.
HVLP spraying technology is used to form a nickel plating layer on the surface of copper foil using a nano-nickel powder suspension. High-purity nitrogen is used as the carrier gas through the HVLP spray gun, and the gas pressure and flow rate are controlled. After spraying, vacuum heat treatment is performed to form a dense nickel plating layer, avoiding the use of cyanide-containing or acidic electrolytes.
It reduces coating porosity, improves adhesion, avoids corrosion and signal attenuation, reduces heavy metal wastewater generation, and features simple process equipment and low energy consumption.
Smart Images
Figure CN122406207A_ABST