Flexible inner layer circuit board integrated punching calibration device

Abstract

The present application relates to the technical field of circuit board manufacturing, in particular to a flexible inner layer circuit board integrated punching calibration device, which comprises a mainframe, a punching device installed on the mainframe and used for punching the inner layer circuit board, and a feeding device installed on the mainframe and used for feeding the inner layer circuit board to the punching device; further comprising a detection device installed on the mainframe and used for detecting the hole position of the inner layer circuit board after the punching operation; the detection device comprises a detection platform for bearing the inner layer circuit board, a CCD detection mechanism for visually detecting the inner layer circuit board borne on the detection platform, and a detection execution mechanism for driving the CCD detection mechanism to move along the X-axis and Y-axis. Once the inner layer circuit board has a hole position deviation, it can be captured and corrected before the next inner layer circuit board punching instruction is issued, thus eliminating the detection lag from the root cause, compressing the detection response time to the inter-sheet level, reducing the generation of waste products, and further saving raw materials and working hours.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to an integrated punching and calibration device for flexible inner layer circuit boards. Background Technology

[0002] In the relevant technical field, the punching process in the manufacturing process of inner layer flexible circuit boards is a key step that determines the alignment accuracy of subsequent multilayer boards. Due to the thin, light, easily deformable, and non-rigid characteristics of the inner layer flexible circuit board material, it is very easy for positional deviations to occur during the feeding, positioning, and punching processes due to vacuum adsorption force, uneven tension of the feeding rollers, or thermal expansion of the equipment. Ultimately, this leads to changes in the punching position accuracy of the inner layer flexible circuit board, resulting in a low punching yield.

[0003] In order to control the punching accuracy, the industry generally adopts offline sampling inspection. For example, every 30 minutes or every 50 pieces, the operator takes a plate from the production line and sends it to the quality inspection room for high-precision measurement using a 2D imaging instrument. If punching misalignment is found, the position of the punching machine fixture or coordinate parameters are manually adjusted according to the measurement results.

[0004] However, this offline sampling detection method has the following drawbacks: Firstly, there is a long time window from sampling and measurement to feedback and adjustment. During this period, the punch press is often already out of control and continuing to produce. By the time the problem is discovered, dozens or even hundreds of defective products have usually been generated, resulting in a huge waste of raw materials and labor time. Secondly, random sampling can only represent the state at a specific point in time and cannot cover the entire process. Equipment may experience sudden drift between two random samplings (such as tool wear or temperature changes), causing all products not sampled to fail, resulting in an excessively high failure rate. Thirdly, relying on manual operation of two-dimensional instruments and manual adjustment not only introduces human reading errors, but also results in slow adjustment response speed, which limits the efficiency of production operations.

[0005] Therefore, a new technical solution needs to be researched to address the above problems. Summary of the Invention

[0006] In view of this, the present invention addresses the deficiencies of the prior art, and its main objective is to provide an integrated punching and calibration device for flexible inner layer circuit boards. This device effectively solves the technical defect in the prior art where punching equipment for inner layer flexible circuit boards cannot control the punching accuracy in real time, thereby improving the production yield and efficiency of inner layer flexible circuit boards.

[0007] This invention provides an integrated punching and calibration device for flexible inner layer circuit boards, including a main frame, a punching device mounted on the main frame for punching the inner layer circuit boards, and a feeding device mounted on the frame for feeding the inner layer circuit boards into the punching device. It also includes a detection device mounted on the frame and used to detect the hole positions of the inner circuit boards after drilling. The inspection device includes an inspection platform for carrying an inner circuit board, a CCD inspection mechanism for visually inspecting the inner circuit board carried on the inspection platform, and an inspection execution mechanism for driving the CCD inspection mechanism to move along the X-axis and Y-axis.

[0008] As a preferred option, the CCD testing organization includes at least a first testing organization, a second testing organization, a third testing organization, and a fourth testing organization; The testing execution mechanism includes a first execution mechanism, a second execution mechanism, a third execution mechanism, and a fourth execution mechanism; The first and second detection mechanisms are spaced apart to the left and right. The first actuator can move the first detection mechanism left and right along the X-axis, and the second actuator can move the second detection mechanism left and right along the X-axis. The distance between the third and fourth testing mechanisms is set so that the third actuator can move back and forth along the Y-axis, and the fourth actuator can move back and forth along the Y-axis.

[0009] As a preferred embodiment, the first, second, third, and fourth actuators have identical structures; The first executive agency includes The first guide rail is mounted on the main unit frame and located above the testing platform; The first slider is movably mounted on the first guide rail; The first movable base is fixedly installed on the first slider, and the CCD detection mechanism is installed on the first movable base; The first motor is connected to the first movable seat via a transmission.

[0010] As a preferred option, the first testing institution, the second testing institution, the third testing institution, and the fourth testing institution have the same structure; The first testing mechanism includes a CCD camera fixedly mounted on a first movable base and capable of acquiring images toward the testing platform, and a supplementary light assembly fixedly mounted on the first movable base and located below the CCD camera.

[0011] As a preferred option, it also includes a control system that can input and save the ideal centroid, the ideal coordinates of the Mark point, and the ideal punching coordinates; The actual coordinates of the Mark on the inner circuit board are scanned by a CCD detection mechanism, and the difference between the ideal centroid and the actual centroid is calculated by the control system to obtain the actual parking position of the inner circuit board. The actual punching positions of the inner circuit board are scanned by a CCD detection mechanism to obtain the actual punching coordinates. The control system calculates the difference between the ideal punching coordinates and the actual punching coordinates and issues instructions for correction.

[0012] As a preferred embodiment, the drilling device includes The first substrate is fixedly mounted on the main unit frame; The lower punching die base is detachably mounted on the upper surface of the first substrate. The upper surface of the lower punching die base is provided with multiple lower punching die cores, and the upper surface of the lower punching die cores is provided with punching recesses for punching needles to be inserted. The upper punching die base can be installed on the top of the lower punching die base in a vertically movable manner. The bottom of the upper punching die base is provided with multiple upper punching die cores, and the lower surface of the upper punching die cores is provided with punching needles. A punching auxiliary plate, driven by an auxiliary cylinder, is installed between the lower punching die base and the upper punching die base in a vertically movable manner. After the inner circuit board is fed into the drilling device from the feeding device, the drilling auxiliary plate can be driven by the auxiliary cylinder to move down and clamp the inner circuit board; by moving the upper drilling die base down relative to the lower drilling die base, the drilling needle and the drilling recess are used to drill holes in the inner circuit board.

[0013] As a preferred embodiment, a detection transfer device is provided between the drilling device and the detection device, the detection transfer device including... The first material transfer guide rail extends to the left and right and is fixedly installed on the main frame. The first material transfer guide rail can extend to the punching device and the detection device. The first transfer seat is slidably mounted on the first transfer guide rail. The first transfer seat is equipped with a first transfer cylinder, and the telescopic rod of the first transfer cylinder is equipped with a first suction cup assembly. The second transfer seat is slidably mounted on the first transfer guide rail and spaced apart from the first transfer seat. The second transfer seat is equipped with a second transfer cylinder, and the telescopic rod of the second transfer cylinder is equipped with a second suction cup assembly. The first transfer belt is rotatably mounted on the first transfer guide rail and connected to the first transfer seat and the second transfer seat; The first material transfer actuator motor is connected to the first material transfer belt and drives the first material transfer belt to rotate; When the first transfer seat moves to the right to the feeding device, the second transfer seat moves to the right to the punching device simultaneously; when the first transfer seat moves from the feeding device to the left to the punching device, the second transfer seat moves to the left to the detection device simultaneously.

[0014] As a preferred embodiment, the feeding device includes an air flotation support platform, a position adjustment component located above the air flotation support platform, and multiple feeding conveyor rollers located on the right side of the air flotation support platform. A feeding and transferring device is provided between the air flotation support platform and the feeding conveyor rollers. The feeding and transferring device includes... The first feeding guide rail extends to the left and right and is fixedly installed on the main frame. The first feeding guide rail can extend to the air flotation support platform and the feeding conveyor roller. The first feeding seat is slidably mounted on the first feeding guide rail; the first feeding moving seat is equipped with a first feeding cylinder, and the telescopic rod of the first feeding cylinder is equipped with a third suction cup assembly. The first feeding actuator motor is connected to the first feeding seat in a transmission connection. When the first feeding motor rotates, it can move back and forth between the air-float support platform and the feeding conveyor roller, transferring the inner circuit board of the feeding conveyor roller from the feeding conveyor roller to the air-float support platform.

[0015] As a preferred embodiment, the position adjustment component includes First crossbeam; Two first adjustment mechanisms are set with a front-to-back spacing; the first adjustment mechanism includes a first adjustment cylinder installed on the first crossbeam and a first adjustment plate installed on the telescopic rod of the first adjustment cylinder; Two second adjustment mechanisms are spaced apart and located to the right of the first adjustment mechanism; the second adjustment mechanism includes an adjustment actuator mounted on the first crossbeam, a second adjustment cylinder mounted on the adjustment actuator, and a second adjustment plate mounted on the telescopic rod of the second adjustment cylinder; The third adjustment mechanism is located to the right of the second adjustment mechanism; the third adjustment mechanism includes a third adjustment cylinder mounted on the first crossbeam and a third adjustment plate mounted on the telescopic rod of the third adjustment cylinder.

[0016] As a preferred embodiment, the regulating actuator includes Adjust the actuator guide rail and fix it to the first crossbeam; The adjustable movable seat is slidably mounted on the adjustment actuator guide rail; Adjust the actuator motor, fix it to the first crossbeam, and adjust the moving seat to move back and forth in conjunction with it; The second adjusting cylinder is installed on the adjusting moving seat, which is equipped with a CCD positioning camera. The CCD positioning camera can obtain the position of the inner circuit board of the air-bearing support platform.

[0017] The beneficial effects of the integrated punching and calibration equipment for flexible inner layer circuit boards provided by this invention are as follows: Firstly, by setting a detection device downstream of the punching device, the hole position detection of the inner layer circuit board after punching can be performed in real time, eliminating the need for manual interval sampling and inspection, thereby eliminating the production gap between sampling, measurement and feedback adjustment; once a hole position deviation occurs in the inner layer circuit board, it can be captured and corrected before the punching command for the next inner layer circuit board is issued, eliminating the detection lag from the root, compressing the detection response time to the inter-piece level, greatly reducing the generation of scrap, and further saving raw materials and labor time; Secondly, the use of inter-chip level inspection can cover the entire process of inner circuit board inspection. The hole position accuracy of each inner circuit board can be controlled, which can avoid the occurrence of missed inspection and realize the closed-loop control of punching accuracy throughout the entire process. Thirdly, after the inner circuit board is tested, the test data obtained by the testing device does not need to be manually transferred. The control system automatically calculates the difference between the ideal and actual coordinates and issues correction instructions, eliminating the errors and inefficiencies caused by manual intervention, thereby further improving the production yield and production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the integrated punching and calibration device for flexible inner layer circuit boards provided in the embodiments of this application; Figure 2 yes Figure 1 A partial top view of the integrated punching calibration device for flexible inner layer circuit boards shown. Figure 3 yes Figure 1 A three-dimensional structural diagram of the punching device, detection device, and detection transfer device of the integrated punching and calibration equipment for flexible inner layer circuit boards is shown. Figure 3A yes Figure 3 A partial enlarged view at point A of the punching device, detection device, and detection transfer device of the integrated punching and calibration equipment for flexible inner layer circuit boards shown in the figure; Figure 4 yes Figure 3 A three-dimensional structural diagram of the detection and transfer device in the punching device, detection device, and detection transfer device of the integrated punching and calibration equipment for flexible inner layer circuit boards shown; Figure 5 yes Figure 1 A three-dimensional structural diagram of the feeding device of the integrated punching and calibration equipment for flexible inner layer circuit boards is shown. Figure 6 yes Figure 5 Another perspective three-dimensional structural diagram of the loading device of the integrated punching and calibration equipment for flexible inner layer circuit boards; Figure 7 yes Figure 1 An exploded three-dimensional view of the punching device in the integrated punching and calibration equipment for flexible inner layer circuit boards. Figure 8 yes Figure 7 The diagram shows a partial exploded three-dimensional structure of the punching device in the integrated punching and calibration equipment for flexible inner layer circuit boards.

[0020] The following are the labeling elements in the figure: 100. Integrated punching and calibration equipment for flexible inner layer circuit boards; 10. Main unit rack; 20. Drilling device; 21. First substrate; 22. Lower drilling die holder; 221. Clearance groove; 23. Lower drilling die core; 231. Drilling recess; 24. Upper drilling die holder; 25. Upper drilling die core; 251. Drilling pin; 26. Drilling auxiliary plate; 261. Auxiliary cylinder; 30. Feeding device; 31. Air-floating support platform; 32. Feeding conveyor roller; 33. Feeding transfer device; 331. First feeding guide rail; 332. First feeding seat; 333. First feeding cylinder; 334. Third suction cup assembly; 335. First feeding actuator motor; 34. Position adjustment assembly; 341. First crossbeam; 342. First adjustment mechanism; 3421. First adjustment cylinder; 3422. First adjustment plate; 343. Second adjustment mechanism; 3431. Adjustment actuator; 3432. Second adjustment cylinder; 3433. Second adjustment plate; 3434. Adjustment actuator guide rail; 3435. Adjustment moving seat; 3436. Adjustment actuator motor; 3437. CCD positioning camera; 344. Third adjustment mechanism; 3441. Third adjustment cylinder; 3442. Third adjustment plate; 40. Detection device; 41. Detection platform; 42. CCD detection mechanism; 4201. First detection mechanism; 4202. Second detection mechanism; 4203. Third detection mechanism; 4204. Fourth detection mechanism; 421. CCD camera; 422. Fill light assembly; 43. Detection execution mechanism; 4301. First execution mechanism; 4302. Second execution mechanism; 4303. Third execution mechanism; 4304. Fourth execution mechanism; 431. First guide rail; 432. First slider; 433. First moving base; 434. First motor; 50. Detection and transfer device; 51. First transfer guide rail; 52. First transfer seat; 521. First transfer cylinder; 522. First suction cup assembly; 53. Second transfer seat; 531. Second transfer cylinder; 532. Second suction cup assembly; 54. First transfer belt; 55. First transfer actuator motor; 200. Inner circuit board. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0023] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0027] Please refer to the following: Figures 1 to 8 The integrated punching and calibration equipment 100 for flexible inner layer circuit boards provided in this application embodiment will now be described. The integrated punching and calibration equipment 100 for flexible inner layer circuit boards includes a main frame 10, a punching device 20, a feeding device 30, and a testing device 40.

[0028] The drilling device 20, the feeding device 30, and the detection device 40 are all installed on the main frame 10. The drilling device 20 is located at the center of the main frame 10; the detection device 40 is located to the left of the drilling device 20, i.e., downstream; and the feeding device 30 is located to the right of the drilling device 20, i.e., upstream. The feeding device 30 can connect to the previous manufacturing station to input the inner layer circuit board 200 from the previous manufacturing station into the drilling device 20; while the detection device 40 can continue to connect downstream to the next manufacturing station or a storage device. In other words, the feeding device 30 is used to input the inner layer circuit board 200 into the drilling device 20, the drilling device 20 is used to perform drilling operations on the inner layer circuit board 200, and the detection device 40 is used to detect the hole positions of the inner layer circuit board 200 after the drilling operation. The inspection device 40 includes an inspection platform 41 for carrying an inner circuit board, a CCD inspection mechanism 42 for visual inspection of the inner circuit board carried on the inspection platform 41, and an inspection execution mechanism 43 for driving the CCD inspection mechanism 42 to move along the X-axis and Y-axis.

[0029] Specifically, the CCD inspection mechanism 42 includes at least a first inspection mechanism 4201, a second inspection mechanism 4202, a third inspection mechanism 4203, and a fourth inspection mechanism 4204; the inspection execution mechanism 43 includes a first execution mechanism 4301, a second execution mechanism 4302, a third execution mechanism 4303, and a fourth execution mechanism 4304; the first inspection mechanism 4201 and the second inspection mechanism 4202 are spaced left and right, and the first execution mechanism 4301 can move left and right along the X-axis in conjunction with the first inspection mechanism 4201, and the second execution mechanism 4302 can move left and right along the X-axis in conjunction with the second inspection mechanism 4202; the third inspection mechanism 4203 and the fourth inspection mechanism 4204 are spaced front and back, and the third execution mechanism 4303 can move back and forth along the Y-axis in conjunction with the third inspection mechanism 4203, and the fourth execution mechanism 4304 can move back and forth along the Y-axis in conjunction with the fourth inspection mechanism 4204.

[0030] Continuing from above, the first actuator 4301, the second actuator 4302, the third actuator 4303, and the fourth actuator 4304 have the same structure; the first actuator 4301 includes a first guide rail 431, a first movable seat 433, and a first motor 434. The first guide rail 431 is mounted on the main frame 10 and located above the detection platform 41. The first slider 432 is movably mounted on the first guide rail 431. The first movable seat 433 is fixedly mounted on the first slider 432. The CCD detection mechanism 42 is mounted on the first movable seat 433. The first motor 434 is connected to the first movable seat 433 in a transmission connection.

[0031] For example, the first movable seat 433 is provided with a transmission nut, and the shaft of the first motor 434 is equipped with a transmission screw. The transmission screw and the transmission nut are screwed together. The first movable seat 433 moves by rotating the shaft of the first motor 434. This is a conventional design method for non-standard automated equipment, and will not be described in detail here.

[0032] It should be noted that the first actuator 4301, the second actuator 4302, the third actuator 4303 and the fourth actuator 4304 are installed on the crossbeam and are positioned on the testing platform 41; that is, the testing work is to take CCD pictures of the inner circuit board supported on the testing platform 41 from top to bottom.

[0033] Furthermore, the first detection mechanism 4201, the second detection mechanism 4202, the third detection mechanism 4203 and the fourth detection mechanism 4204 have the same structure; the first detection mechanism 4201 includes a CCD camera 421 fixedly installed on the first movable base 433 and capable of acquiring images toward the detection platform 41, and a fill light assembly 422 fixedly installed on the first movable base 433 and located below the CCD camera 421.

[0034] In some embodiments, the system further includes a control system capable of inputting and storing the ideal centroid, the ideal coordinates of the Mark point, and the ideal punching coordinates; scanning the actual Mark coordinates of the inner circuit board using the CCD detection mechanism 42, and calculating the difference between the ideal centroid and the actual centroid to obtain the actual parking position of the inner circuit board; scanning the actual punching position of the inner circuit board using the CCD detection mechanism 42 to obtain the actual punching coordinates, and calculating the difference between the ideal punching coordinates and the actual punching coordinates, and issuing instructions for correction.

[0035] It should be noted that the integrated punching and calibration equipment 100 for flexible inner layer circuit boards has a control panel, which can display data and allow operators to debug and input data. The control system acquires the raw data of the inner layer circuit board carried on the testing platform 41 through the first testing mechanism 4201, the second testing mechanism 4202, the third testing mechanism 4203, and the fourth testing mechanism 4204. The data is processed through an algorithm model to convert the physical coordinates into control commands that the equipment can execute, thereby adjusting the punching operation of the inner layer circuit board in real time.

[0036] The specific calibration method for the inner layer circuit board includes the following steps: Step 1: The first detection mechanism 4201, the second detection mechanism 4202, the third detection mechanism 4203 and the fourth detection mechanism 4204 scan and obtain the actual coordinates of the Mark points of the inner circuit board; using the ideal coordinates of the four Mark points and the actual coordinates of the Mark points recorded by the control system, the actual parking position of the inner circuit board on the detection platform 41 is calculated. Step 1.1: The control system calculates the geometric centers of the ideal and actual coordinates of Mark point, i.e., the ideal centroid and the actual centroid. The specific calculation formula is as follows: ; Step 1.2, decentralization: the coordinates are converted into vectors relative to the centroid, retaining only shape and orientation features. The specific calculation formula is as follows: Step 1.3: Fit the vector field using the least squares method to solve for the optimal rotation angle. Step 1.4: Calculate the difference between the ideal centroid and the actual centroid to obtain the coordinate system offset. The specific calculation formula is as follows: Step 2: After eliminating the global rigid body error, analyze the remaining deviations and identify the non-rigid deformation of the flexible plate.

[0037] Step 2.1: The control system substitutes the preset ideal punching coordinates into the rigid body transformation matrix to obtain the predicted position. The specific calculation formula is as follows: ; Step 2.2: The control system calculates the difference between the measured position and the predicted position. It should be noted here that... It is the first The ideal coordinates of each Mark point; It is the first The actual coordinates of each Mark point; It is the centroid of the ideal coordinate system; It is the actual centroid of the coordinate system; It is a decentralized ideal vector; It is a decentralized actual vector; It is the global rotation compensation angle; It is the global translation compensation amount; It is the first Ideal coordinates for each punch; It is the first The actual coordinates of each punch; It is the predicted location of the punch; It is a local deformation residual.

[0038] For example, a set of measurement data from production is provided to illustrate this: Center of mass: , Rotation angle: calculated from the covariance matrix. .

[0039] Translation amount: Taking punch number 1 as an example, the predicted position Actual measurement residual .

[0040] The control system automatically executes the following command: G10 L2 P1 X0.190 Y-0.167 R0.186, correcting the position of the inner layer circuit board input from the feeding device 30 to the drilling device 20. This ensures that the Mark point position of the inner layer circuit board meets the design requirements after it is input into the drilling device 20, thereby ensuring that the distance between the Mark point position and the hole position meets the design requirements. This improves the yield of the inner layer circuit board during subsequent lamination and significantly reduces the scrap rate.

[0041] In some embodiments, the drilling device 20 includes a first substrate 21, a lower drilling die holder 22, an upper drilling die holder 24, and a drilling auxiliary plate 26; the first substrate 21 is fixedly mounted on the main frame 10, the lower drilling die holder 22 is detachably mounted on the upper surface of the first substrate 21, the upper surface of the lower drilling die holder 22 is provided with a plurality of lower drilling die cores 23, and the upper surface of the lower drilling die cores 23 is provided with a drilling recess 231 for the insertion of a drilling needle 251; the upper drilling die holder 24 is movably mounted on the top of the lower drilling die holder 22, and the bottom of the upper drilling die holder 24 is provided with a... There are multiple upper punching die cores 25, and the lower surface of the upper punching die core 25 is provided with punching needles 251; the punching auxiliary plate 26 is driven by the auxiliary cylinder 261 to move up and down and is installed between the lower punching die base 22 and the upper punching die base 24; when the inner layer circuit board is fed into the punching device 20 from the feeding device 30, the punching auxiliary plate 26 can be driven by the auxiliary cylinder 261 to move down and clamp the inner layer circuit board; by moving the upper punching die base 24 down relative to the lower punching die base 22, the punching needles 251 and the punching recesses 231 are used to punch holes in the inner layer circuit board.

[0042] It should be noted that the punching auxiliary plate 26 is provided with a clearance through its upper and lower surfaces, so that the upper punching die 25 and the lower punching die 23 can pass through the clearance to make contact and complete the punching operation.

[0043] Specifically, the first substrate 21 is equipped with a clamping cylinder. After the lower punching die 22 is installed on the upper surface of the first substrate 21, the clamping cylinder can clamp and fix the lower punching die 22. The upper punching die 24 needs to be installed on the telescopic rod of the pressing cylinder. The pressing cylinder drives the upper punching die 24 to move up and down relative to the lower punching die 22, thereby completing the punching operation of the inner layer circuit board. When the inner layer circuit board is fed into the upper surface of the lower punching die 23, the auxiliary cylinder 261 drives the punching auxiliary plate 26 to move down to clamp the inner layer circuit board, and then the upper punching die 24 moves down to complete the punching operation of the inner layer circuit board. This structure can ensure that the inner layer circuit board will not be misaligned during the punching operation.

[0044] It should be noted that the lower punching mold base 22 is provided with left and right extending clearance grooves 221, and similarly, the detection platform 41 is also provided with left and right extending clearance grooves 221, and the air flotation support platform 31 is provided with left and right extending clearance grooves 221; with this structure, the first suction cup assembly 522 can enter the feeding device 30 and the punching device 20 without interference, and the second suction cup assembly 532 can enter the punching device 20 and the detection device 40 without interference.

[0045] More specifically, a detection and transfer device 50 is provided between the drilling device 20 and the detection device 40. The detection and transfer device 50 includes a first transfer guide rail 51, a first transfer seat 52, a second transfer seat 53, a first transfer belt 54, and a first transfer actuator motor 55. The first transfer guide rail 51 extends laterally and is fixedly mounted on the main frame 10, and can extend to the drilling device 20 and the detection device 40. The first transfer seat 52 is slidably mounted on the first transfer guide rail 51, and is equipped with a first transfer cylinder 521. The telescopic rod of the first transfer cylinder 521 is equipped with a first suction cup assembly 522. The second transfer seat 53 is slidably mounted on the first transfer guide rail 51 and is spaced laterally from the first transfer seat 52. The second transfer seat 53 is equipped with a second transfer cylinder 531, and the telescopic rod of the second transfer cylinder 531 is equipped with a second suction cup assembly 532. The first transfer belt 54 is rotatably mounted on the first transfer guide rail 51 and connected to the first transfer seat 52 and the second transfer seat 53. The first transfer actuator motor 55 is connected to the first transfer belt 54 and drives the first transfer belt 54 to rotate. When the first transfer seat 52 moves to the right to the feeding device 30, the second transfer seat 53 moves to the right to the punching device 20 simultaneously; when the first transfer seat 52 moves from the feeding device 30 to the left to the punching device 20, the second transfer seat 53 moves to the left to the detection device 40 simultaneously.

[0046] In other words, when the first transfer seat 52 moves to the loading device 30 and the first suction cup assembly 522 picks up the inner circuit board of the loading device 30, the second transfer seat 53 simultaneously moves to the drilling device 20 and the second suction cup assembly 532 picks up the inner circuit board of the drilling device 20. When the first transfer seat 52 moves toward the drilling device 20, transferring the inner circuit board of the loading device 30 to the drilling device 20, the second transfer seat 53 simultaneously moves toward the detection device 40, transferring the inner circuit board of the drilling device 20 onto the detection platform 41.

[0047] Preferably, the detection and transfer device 50 has two components with a front-to-back spacing, and the first transfer seat 52 and the second transfer seat 53 of the two detection and transfer devices 50 move synchronously. With this structure, the first suction cup assembly 522 has two components with a front-to-back spacing, and the second suction cup assembly 532 has two components with a front-to-back spacing. By adsorbing the inner circuit board through the two first suction cup assemblies 522, it can be ensured that the inner circuit board that has been positioned will not be misaligned during the transfer process, thereby ensuring that the inner circuit board can be drilled with the four Mark points as a reference during the drilling operation.

[0048] In other embodiments, the feeding device 30 includes an air flotation support platform 31, a position adjustment component 34 disposed above the air flotation support platform 31, and a plurality of feeding conveying rollers 32 disposed on the right side of the air flotation support platform 31; a feeding transfer device 33 is provided between the air flotation support platform 31 and the feeding conveying rollers 32, the feeding transfer device 33 including a first feeding guide rail 331, a first feeding seat 332, a first feeding execution cylinder, and a first feeding execution motor 335; the first feeding guide rail 331 extends left and right and is fixedly mounted on the main frame 10, and the first feeding guide rail 331 can extend to the air flotation support platform 31. The platform 31 and the feeding conveyor roller 32 are included; the first feeding seat 332 is slidably mounted on the first feeding guide rail 331; the first feeding moving seat is provided with a first feeding cylinder 333, and the telescopic rod of the first feeding cylinder 333 is provided with a third suction cup assembly 334; the first feeding execution motor 335 is connected to the first feeding seat 332 for transmission. When the first feeding execution motor 335 rotates, it can move the first feeding seat 332 back and forth between the air-floating support platform 31 and the feeding conveyor roller 32, transferring the inner circuit board of the feeding conveyor roller 32 from the feeding conveyor roller 32 to the air-floating support platform 31.

[0049] It should be noted that the surface of the air-floating support platform 31 has multiple air holes. An external gas generator provides airflow to it, so that the inner circuit board is suspended on the air-floating support platform. The inner circuit board does not rest against the surface of the air-floating support platform by gravity. This structure can ensure that the inner circuit board will not be scratched when it is loaded.

[0050] Specifically, the position adjustment assembly 34 includes a first crossbeam 341, two first adjustment mechanisms 342, two second adjustment mechanisms 343, and a third adjustment mechanism 344; the two first adjustment mechanisms 342 are spaced apart front to back, and each first adjustment mechanism 342 includes a first adjustment cylinder 3421 mounted on the first crossbeam 341 and a first adjustment plate 3422 mounted on a telescopic rod of the first adjustment cylinder 3421; the two second adjustment mechanisms 343 are spaced apart front to back and located to the right of the first adjustment mechanism 342. The second adjustment mechanism 343 includes an adjustment actuator 3431 mounted on the first crossbeam 341, a second adjustment cylinder 3432 mounted on the adjustment actuator 3431, and a second adjustment plate 3433 mounted on the telescopic rod of the second adjustment cylinder 3432; the third adjustment mechanism 344 is located on the right side of the second adjustment mechanism 343; the third adjustment mechanism 344 includes a third adjustment cylinder 3441 mounted on the first crossbeam 341 and a third adjustment plate 3442 mounted on the telescopic rod of the third adjustment cylinder 3441.

[0051] More specifically, the adjustment actuator 3431 includes an adjustment execution guide rail 3434, an adjustment moving seat 3435, and an adjustment execution motor 3436; the adjustment execution guide rail 3434 is fixedly mounted on the first crossbeam 341, the adjustment moving seat 3435 is slidably mounted on the adjustment execution guide rail 3434, and the adjustment execution motor 3436 is fixedly mounted on the first crossbeam 341 and moves back and forth in conjunction with the adjustment moving seat 3435; the second adjustment cylinder 3432 is mounted on the adjustment moving seat 3435, and the adjustment moving seat 3435 is equipped with a CCD positioning camera 3437, which can acquire the position of the inner circuit board of the air-bearing support platform 31.

[0052] The specific process of material loading is as follows: Step 1: Manually adjust the spacing of the first adjustment plates 3422 of the two first adjustment mechanisms 342 so that the inner circuit board can be located between the two adjustment plates after it is supported on the air-float support platform 31. Step 2: Start the feeding and conveying device 33. Move to the right through the first feeding seat 332 and move to the side of the feeding conveying roller 32 in conjunction with the third suction cup assembly 334. Use the third suction cup assembly 334 to adsorb the inner circuit board carried on the feeding conveying roller 32. Step 3: Move the first feeding seat 332 to the left and move it in conjunction with the third suction cup assembly 334 to the air flotation support platform 31, and make the inner circuit board enter between the two first adjustment plates 3422; Step 4: Start the third adjustment mechanism 344. The third adjustment cylinder 3441 drives the third adjustment plate 3442 to move down. Then, the first feeding moving seat cooperates to drive the third suction cup assembly 334 to move left and right, so that the inner circuit board of the third suction cup assembly 334 moves left and right and abuts against the third adjustment plate 3442, thereby adjusting the left and right position of the inner circuit board. Step 5: Start the two second adjustment mechanisms 343 to work, use the second adjustment cylinder 3432 to drive the second adjustment plate 3433 to move down, and use the adjustment actuator 3431 to drive the second adjustment plate 3433 to move back and forth, thereby adjusting the position of the inner circuit board in the front and back direction. Step 6: After the inner circuit board is adjusted to the front, back, left, and right positions, the CCD positioning camera 3437 captures the positions of the four Mark points on the inner circuit board, thereby completing the positioning of the inner circuit board.

[0053] It should be noted that when the inner circuit board is adjusted in the front-back or left-right directions, the third suction cup assembly 334 can selectively adsorb or not adsorb the inner circuit board, thereby ensuring that the inner circuit board can be adjusted into place.

[0054] Understandably, when the detection device 40 detects a hole position deviation in the previous inner layer circuit board, the control system acquires data and sends a command to the loading device 30. The position adjustment component 34 then adjusts the loading position of the inner layer circuit board to correct the deviation. Subsequently, the detection and transfer device 50 moves the inner layer circuit board to the air flotation platform via the first suction cup component 522, and then transfers the positioned inner layer circuit board to the drilling device 20 for further drilling.

[0055] The beneficial effects of the integrated punching and calibration equipment 100 for flexible inner layer circuit boards provided by the present invention are as follows: Firstly, by setting a detection device 40 downstream of the punching device 20, the hole position detection operation of the inner layer circuit board after punching can be performed in real time, eliminating the need for manual interval sampling and inspection, thereby eliminating the production gap between sampling, measurement and feedback adjustment; once a hole position deviation occurs in the inner layer circuit board, it can be captured and corrected before the punching command of the next inner layer circuit board is issued, eliminating the detection lag from the root, compressing the detection response time to the inter-piece level, greatly reducing the generation of scrap, and further saving raw materials and labor time; Secondly, the use of inter-chip level inspection can cover the entire process of inner circuit board inspection. The hole position accuracy of each inner circuit board can be controlled, which can avoid the occurrence of missed inspection and realize the closed-loop control of punching accuracy throughout the entire process. Thirdly, after the inner circuit board is tested, the test data obtained by the testing device 40 does not need to be manually transferred. The control system automatically calculates the difference between the ideal and actual coordinates and issues correction instructions, eliminating the errors and inefficiencies caused by manual intervention, thereby further improving the production yield and production efficiency.

[0056] The above are merely preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. A flexible inner layer circuit board integrated punching and calibration equipment, comprising a main frame (10), a punching device (20) mounted on the main frame (10) for punching the inner layer circuit board, and a feeding device (30) mounted on the frame for feeding the inner layer circuit board into the punching device (20). Its features are, It also includes a detection device (40) mounted on the rack for detecting the hole positions of inner circuit boards after drilling. The inspection device (40) includes an inspection platform (41) for carrying an inner circuit board, a CCD inspection mechanism (42) for visual inspection of the inner circuit board carried on the inspection platform (41), and an inspection execution mechanism (43) for driving the CCD inspection mechanism (42) to move along the X-axis and Y-axis.

2. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 1, characterized in that, The CCD testing organization (42) includes at least the first testing organization (4201), the second testing organization (4202), the third testing organization (4203) and the fourth testing organization (4204); The testing execution mechanism (43) includes a first execution mechanism (4301), a second execution mechanism (4302), a third execution mechanism (4303), and a fourth execution mechanism (4304); The first detection mechanism (4201) and the second detection mechanism (4202) are spaced apart to the left and right. The first execution mechanism (4301) can move left and right along the X-axis in conjunction with the first detection mechanism (4201). The second execution mechanism (4302) can move left and right along the X-axis in conjunction with the second detection mechanism (4202). The distance between the third testing mechanism (4203) and the fourth testing mechanism (4204) is set. The third actuator (4303) can move back and forth along the Y-axis in conjunction with the third testing mechanism (4203). The fourth actuator (4304) can move back and forth along the Y-axis in conjunction with the fourth testing mechanism (4204).

3. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 2, characterized in that, The first executive agency (4301), the second executive agency (4302), the third executive agency (4303), and the fourth executive agency (4304) have the same structure; The first executive agency (4301) includes The first guide rail (431) is mounted on the main frame (10) and located above the testing platform (41); The first slider (432) is movably mounted on the first guide rail (431). The first movable seat (433) is fixedly installed on the first slider (432), and the CCD detection mechanism (42) is installed on the first movable seat (433). The first motor (434) is connected to the first movable seat (433) via a transmission.

4. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 3, characterized in that, The first testing agency (4201), the second testing agency (4202), the third testing agency (4203), and the fourth testing agency (4204) have the same structure; The first detection mechanism (4201) includes a CCD camera (421) fixedly installed on the first movable base (433) and capable of acquiring images toward the detection platform (41), and a fill light assembly (422) fixedly installed on the first movable base (433) and located below the CCD camera (421).

5. The integrated punching and calibration equipment for flexible inner layer circuit boards according to any one of claims 1-4, characterized in that, It also includes a control system, which can input and save the ideal centroid, the ideal coordinates of the Mark point, and the ideal punching coordinates; The actual coordinates of the Mark on the inner circuit board are scanned by the CCD detection mechanism (42), and the difference between the ideal centroid and the actual centroid is calculated by the control system to obtain the actual parking position of the inner circuit board. The actual punching position of the inner circuit board is scanned by the CCD detection mechanism (42) to obtain the actual punching coordinates. The control system calculates the difference between the ideal punching coordinates and the actual punching coordinates and issues instructions to correct it.

6. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 5, characterized in that, The punching device (20) includes The first substrate (21) is fixedly mounted on the main frame (10). The lower punching die holder (22) is detachably mounted on the upper surface of the first substrate (21). The upper surface of the lower punching die holder (22) is provided with a plurality of lower punching die cores (23), and the upper surface of the lower punching die cores (23) is provided with punching recesses (231) for the punching needle (251) to be inserted. The upper punching mold base (24) can be installed on the top of the lower punching mold base (22) in a vertically movable manner. The bottom of the upper punching mold base (24) is provided with multiple upper punching mold cores (25), and the lower surface of the upper punching mold cores (25) is provided with punching needles (251). The punching auxiliary plate (26) is driven by the auxiliary cylinder (261) to be installed between the lower punching die base (22) and the upper punching die base (24) in a vertically movable manner; When the inner circuit board is fed from the feeding device (30) into the drilling device (20), the drilling auxiliary plate (26) can be driven by the auxiliary cylinder (261) to move down and clamp the inner circuit board; by moving the upper drilling die (24) down relative to the lower drilling die (22), the drilling needle (251) and the drilling recess (231) are used to drill holes in the inner circuit board.

7. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 6, characterized in that, A detection transfer device (50) is provided between the drilling device (20) and the detection device (40). The detection transfer device (50) includes... The first material transfer guide rail (51) extends to the left and right and is fixedly installed on the main frame (10). The first material transfer guide rail (51) can extend to the punching device (20) and the detection device (40). The first transfer seat (52) is slidably mounted on the first transfer guide rail (51). The first transfer seat (52) is provided with a first transfer cylinder (521). The telescopic rod of the first transfer cylinder (521) is provided with a first suction cup assembly (522). The second transfer seat (53) is slidably mounted on the first transfer guide rail (51) and spaced apart from the first transfer seat (52) on the left and right. The second transfer seat (53) is equipped with a second transfer cylinder (531), and the telescopic rod of the second transfer cylinder (531) is equipped with a second suction cup assembly (532). The first transfer belt (54) is rotatably mounted on the first transfer guide rail (51) and connected to the first transfer seat (52) and the second transfer seat (53). The first material transfer actuator motor (55) is connected to the first material transfer belt (54) and drives the first material transfer belt (54) to rotate; When the first transfer seat (52) moves to the right to the feeding device (30), the second transfer seat (53) moves to the right to the punching device (20) simultaneously; when the first transfer seat (52) moves from the feeding device (30) to the left to the punching device (20), the second transfer seat (53) moves to the left to the detection device (40) simultaneously.

8. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 1, 6, or 7, characterized in that, The feeding device (30) includes an air flotation support platform (31), a position adjustment component (34) located above the air flotation support platform (31), and multiple feeding conveying rollers (32) located on the right side of the air flotation support platform (31). A feeding and conveying device (33) is provided between the air flotation support platform (31) and the feeding conveying roller (32). The feeding and conveying device (33) includes The first feeding guide rail (331) extends to the left and right and is fixedly installed on the main frame (10). The first feeding guide rail (331) can extend to the air flotation support platform (31) and the feeding conveyor roller (32). The first feeding seat (332) is slidably mounted on the first feeding guide rail (331); the first feeding moving seat is provided with a first feeding cylinder (333), and the telescopic rod of the first feeding cylinder (333) is provided with a third suction cup assembly (334). The first feeding actuator motor (335) is connected to the first feeding base (332) for transmission; When the first feeding execution motor (335) rotates, it can move back and forth between the air flotation support platform (31) and the feeding conveyor roller (32) to transfer the inner circuit board of the feeding conveyor roller (32) from the feeding conveyor roller (32) to the air flotation support platform (31).

9. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 8, characterized in that, The position adjustment component (34) includes First crossbeam (341); Two first adjustment mechanisms (342) are set with a front-to-back spacing; the first adjustment mechanism (342) includes a first adjustment cylinder (3421) installed on the first crossbeam (341) and a first adjustment plate (3422) with a telescopic rod installed on the first adjustment cylinder (3421). Two second adjustment mechanisms (343) are spaced apart and located to the right of the first adjustment mechanism (342); the second adjustment mechanism (343) includes an adjustment actuator (3431) mounted on the first crossbeam (341), a second adjustment cylinder (3432) mounted on the adjustment actuator (3431), and a second adjustment plate (3433) with a telescopic rod mounted on the second adjustment cylinder (3432). The third adjustment mechanism (344) is located to the right of the second adjustment mechanism (343); the third adjustment mechanism (344) includes a third adjustment cylinder (3441) installed on the first crossbeam (341) and a third adjustment plate (3442) installed on the telescopic rod of the third adjustment cylinder (3441).

10. The integrated punching and calibration equipment for flexible inner layer circuit boards according to claim 9, characterized in that, The regulating actuator (3431) includes Adjust the actuator guide rail (3434), which is fixedly mounted on the first crossbeam (341); The adjusting movable seat (3435) is slidably mounted on the adjusting actuator guide rail (3434). Adjust the actuator motor (3436), which is fixedly installed on the first crossbeam (341) and moves the movable seat (3435) back and forth in conjunction with it; The second adjusting cylinder (3432) is installed on the adjusting moving seat (3435), and the adjusting moving seat (3435) is equipped with a CCD positioning camera (3437). The CCD positioning camera (3437) can obtain the position of the inner circuit board of the air-bearing support platform (31).

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