Epoxy resin-based membrane material for semiconductor packaging and preparation method of epoxy resin-based membrane material

By using a star-shaped hybrid epoxy modifier and 1,1,1-tris(4-hydroxyphenyl)ethane as the core framework, and introducing organosilicon and phosphorus-based flame retardant units, the problems of insufficient thermal expansion, heat resistance and flame retardancy of epoxy resin-based laminated films are solved, thereby improving the stability and safety of high-frequency and high-power semiconductor packaging.

CN122445307APending Publication Date: 2026-07-24SHANGHAI JINGSHEN NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202610923151.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-25
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing epoxy resin-based laminated films suffer from problems such as thermal expansion, insufficient heat resistance, poor flame retardancy, and poor dielectric properties in high-frequency and high-power semiconductor packaging, which affect the stability and safety of devices.

Method used

A star-shaped hybrid epoxy modifier is used, with 1,1,1-tris(4-hydroxyphenyl)ethane as the core. Phosphorus-based flame retardant units are introduced through organosilicon units and orthogonal active bridging molecules to form a three-dimensional structure. Combined with silicon, nitrogen and phosphorus elements, the thermal stability and flame retardancy of the material are optimized, and the coefficient of thermal expansion is reduced.

Benefits of technology

It significantly improves the flame retardancy and thermal stability of the packaging material, reduces the coefficient of thermal expansion, improves dielectric properties, and enhances the reliability and safety of semiconductor packaging.

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Abstract

The invention belongs to the technical field of adhesives, and particularly relates to an epoxy resin-based membrane material for semiconductor packaging and a preparation method of the epoxy resin-based membrane material. Comprising the following raw materials in parts by weight: 100 parts of epoxy resin, 200-300 parts of filler, 40-60 parts of a curing agent, 10-30 parts of a modifier, 0.5-1.5 parts of a curing accelerator, 0.5-1 part of a flatting agent, 0.5-1 part of a defoaming agent and 100-150 parts of a solvent. The modifier provided by the invention takes 1, 1, 1-tri (4-hydroxyphenyl) ethane as a rigid core and is matched with silicon, nitrogen and phosphorus elements, so that the material is endowed with excellent flame retardance and thermal stability, and the thermal expansion coefficient of the packaging material is remarkably reduced.
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