Heat spreader with distributed heat dissipation function

Abstract

The application discloses a heat-dissipating function's heat-distributing plate and relates to the field of heat-distributing plates, which comprises a first heat-conducting plate, a liquid-absorbing core and a liquid inlet pipe, the first heat-conducting plate is hollow and used for storing cooling liquid, one side of the hollow structure is an evaporation area and the other side is a condensation area, the liquid-absorbing core is arranged on the inner wall of the first heat-conducting plate and located in the evaporation area and the condensation area, the steam flow space is formed between the two liquid-absorbing cores, the liquid inlet pipe is arranged on the side wall of the first heat-conducting plate and connected with the hollow structure of the first heat-conducting plate, a plurality of flow guides are arranged on the side of the first heat-conducting plate away from the evaporation area, the distance between the adjacent flow guides forms the air guide channel which is distributed along the circumference of the first heat-conducting plate and used for air circulation. The air guide channel is arranged on the side wall of the first heat-conducting plate, and the flow guides and the flow channel are cooperatively designed, so that the cold air can be efficiently introduced and accelerated to flow, and the external forced circulation is realized.

Description

Technical Field

[0001] This invention relates to the field of vapor chambers, and more particularly to vapor chambers with distributed heat dissipation functions. Background Technology

[0002] A vapor chamber heat exchanger, also known as a vacuum chamber heat exchanger, is a high-efficiency heat dissipation element based on phase change heat transfer technology. Its core structure is a vacuum chamber with micro-capillary structures on its inner wall, typically made of copper. During operation, the working fluid (such as water) inside the chamber is heated and evaporates. The gaseous working fluid rapidly diffuses to the condensation area, releasing heat, and then flows back to the heat source through capillary action, forming a circulation system suitable for space-constrained electronic devices such as smartphones, laptops, and industrial equipment.

[0003] However, relying solely on a vapor chamber can only achieve rapid lateral heat dissipation. If the external heat dissipation fin structure is not designed properly, the overall heat dissipation capacity will still be limited, affecting system stability and lifespan. Currently, most mainstream vapor chamber heat dissipation modules use vertical extruded aluminum fins or stamped fins. Existing heat dissipation fins are mostly uniformly arranged and have a constant cross-section design, lacking matching and optimization of heat flow distribution characteristics, resulting in low material utilization and limited improvement in heat dissipation efficiency.

[0004] Therefore, there is an urgent need for a vapor chamber with distributed heat dissipation function that can actively guide and efficiently organize airflow, enhance boundary layer disturbance, improve overall heat exchange performance, and at the same time take into account structural compactness, lightweight and process feasibility. Summary of the Invention

[0005] To overcome the shortcomings of existing heat dissipation fins, which are mostly uniformly arranged and have a constant cross-section, and lack matching and optimization of heat flow distribution characteristics, resulting in low material utilization and limited improvement in heat dissipation efficiency, this invention provides a vapor chamber with distributed heat dissipation function.

[0006] The vapor chamber with distributed heat dissipation function includes a first heat-conducting plate, a liquid-absorbing core, and a liquid inlet pipe. The first heat-conducting plate has a hollow structure for storing coolant. One side of the hollow structure is an evaporation zone, and the other side is a condensation zone. The liquid-absorbing core is located on the inner wall of the first heat-conducting plate in the evaporation and condensation zones, and a vapor flow space is formed between the two liquid-absorbing cores. The liquid inlet pipe is located on the side wall of the first heat-conducting plate and is connected to the hollow structure of the first heat-conducting plate. Multiple flow guides are arranged circumferentially on the side of the first heat-conducting plate away from the evaporation zone. The spacing between adjacent flow guides forms an air guide channel distributed circumferentially along the first heat-conducting plate for air circulation. A second heat-conducting plate is located on the side of the flow guides away from the first heat-conducting plate. An air outlet is located in the middle of the second heat-conducting plate and is connected to the air guide channel, so that external low-temperature air can enter the air guide channel from the periphery of the vapor chamber and be discharged through the air outlet, forming a forced convection cooling path.

[0007] As an improvement to the above scheme, multiple guide elements with circumferential spacing are arranged radially with an inclination along the center direction of the first heat-conducting plate.

[0008] As an improvement to the above scheme, the flow guide structure is thick in the middle and gradually tapers towards both ends, with an elongated rhomboid or spindle-shaped cross-section to guide the airflow to converge along the flow path.

[0009] As an improvement to the above solution, heat dissipation grooves are symmetrically arranged on both sides of the flow guide along the length axis. The thick part in the middle of the side of the flow guide is an inclined surface. This inclined surface is arranged opposite to the inclined surface of the adjacent flow guide, and together they form a V-shaped narrowing flow path. Inside the flow guide, a through flow channel is arranged along the air flow direction, and multiple heat dissipation fins are arranged in the flow channel.

[0010] As an improvement to the above solution, the heat sink has a solid structure and its outer contour is a double cone with opposite directions.

[0011] As an improvement to the above solution, it also includes connecting columns. The hollow structure of the first heat-conducting plate is provided with multiple connecting columns to prevent the upper and lower walls from deforming or collapsing when subjected to pressure or heat.

[0012] As an improvement to the above solution, the second heat-conducting plate is fixedly connected to the first heat-conducting plate by bolts.

[0013] As an improvement to the above solution, it also includes a first flow guide frame, which is fixedly connected between the first heat-conducting plate and the second heat-conducting plate. The first flow guide frame has a first flow guiding surface arranged in the middle along the central circumference to guide the airflow at the air outlet upward.

[0014] As an improvement to the above solution, the first flow guide is in the shape of a cross and is horizontally fixed between the first heat-conducting plate and the second heat-conducting plate. The cross extension of the first flow guide divides the space between the first heat-conducting plate and the second heat-conducting plate into four independent flow areas. The extension guides the low-temperature air of each independent area to the air outlet of the first heat-conducting plate.

[0015] As an improvement to the above solution, a connecting plate is also included. The connecting plate is fixedly connected to the side wall of the first heat-conducting plate. The corner of the connecting plate is provided with connecting holes for installation. The connecting plate is fixedly connected to a second flow guide. The side wall of the second flow guide is provided with an air inlet, and a second flow guide surface is provided on one side of the air inlet.

[0016] Compared with the prior art, the present invention has the following advantages: by setting an air guide channel on the side wall of the first heat conduction plate and combining the coordinated design of the guide component and the flow channel, the present invention achieves efficient introduction and accelerated flow of cold air, realizing external forced circulation.

[0017] With the structure of the air guide, when low-temperature air enters the air guide channel, part of it flows along the outer contour of the first heat conduction plate. When it passes through the constriction area of ​​the inclined surface, the flow cross-sectional area gradually decreases. According to the principle of fluid continuity, the airflow velocity increases significantly, forming a high-speed jet at the constriction, thereby greatly enhancing the convective heat transfer effect between the air and the heat dissipation surface. The other part of the low-temperature air enters the internal flow channel through the air guide, flows through the heat sink, and is discharged at high speed from a narrow opening on one side, further enhancing the local airflow disturbance and heat transfer efficiency.

[0018] The airflow guide adopts a cross-shaped structure, which serves as a mechanical support to prevent the heat conduction plate from deforming, and also divides the airflow into symmetrical channels to achieve uniform airflow. The heat dissipation grooves on its surface and the internal heat dissipation fins further increase the heat exchange area, realizing a multi-functional integration of "support + airflow guidance + heat dissipation".

[0019] The inclined air inlet design of the air guide channel allows low-temperature air to enter smoothly at a small angle of attack, avoiding the airflow from directly impacting the vertical sidewall and generating vortices, thus ensuring the stability of airflow circulation and air intake efficiency. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is a three-dimensional structural diagram of part of the present invention.

[0022] Figure 3 This is a three-dimensional structural cross-sectional view of the present invention.

[0023] Figure 4 This is a three-dimensional structural diagram of the first heat-conducting plate and bolts of the present invention.

[0024] Figure 5 This is a three-dimensional structural diagram of the flow guide of the present invention.

[0025] Figure 6 This is a three-dimensional structural diagram of the first heat-conducting plate and the first flow guide frame of the present invention.

[0026] Figure 7 This is a three-dimensional structural diagram of the connecting plate and the second drainage frame of the present invention.

[0027] In the attached figures: 101_first heat-conducting plate, 102_liquid suction core, 103_connecting column, 1031_liquid inlet pipe, 104_flow guide, 1041_heat dissipation groove, 1042_inclined surface, 1043_flow channel, 1044_heat sink, 105_second heat-conducting plate, 106_air guide channel, 107_air outlet, 108_bolt, 201_first flow guide frame, 202_first flow guide surface, 301_connecting plate, 302_second flow guide frame, 303_connecting hole, 304_air inlet, 305_second flow guide surface. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1: A vapor chamber with distributed heat dissipation function, such as Figures 1-5 As shown, the device includes a first heat-conducting plate 101, a liquid-absorbing core 102, and a liquid-inlet pipe 1031. The first heat-conducting plate 101 is made of pure copper (T2 copper) and has a vacuum-sealed hollow structure inside for storing coolant. One side of the hollow structure is the evaporation zone, which is in direct contact with the heat source zone, and the other side is the condensation zone. The liquid-absorbing core 102 is located on the inner wall of the first heat-conducting plate 101 in the evaporation and condensation zones. It has a copper powder sintered porous structure and is uniformly attached to the inner wall of the evaporation and condensation zones. A vapor flow space is formed between the two liquid-absorbing cores 102. The liquid-inlet pipe 1031 is located on the side wall of the first heat-conducting plate 101 and is connected to the hollow structure of the first heat-conducting plate 101. On the side of the first heat-conducting plate 101 away from the evaporation zone, multiple flow guides 104 are arranged circumferentially. The flow guides 104 are thick in the middle and gradually taper towards both ends. Their cross-sections are elongated rhomboid or spindle-shaped to guide the airflow to converge and accelerate the flow along the flow path. Multiple circumferentially spaced air guides 104 are arranged radially at an inclination along the center of the first heat-conducting plate 101. The spacing between adjacent air guides 104 forms air guide channels 106 distributed circumferentially along the first heat-conducting plate 101 for air circulation. A second heat-conducting plate 105 is provided on the side of the air guide 104 away from the first heat-conducting plate 101. The second heat-conducting plate 105 is square, and its size and shape are the same as those of the first heat-conducting plate 101. Both are made of copper to increase thermal conductivity. The second heat-conducting plate 105 is fixedly connected to the first heat-conducting plate 101 by bolts 108. An air outlet 107 is provided in the middle of the second heat-conducting plate 105. The air outlet 107 is square in shape, but can also be extended to be circular, polygonal, or triangular. The air outlet 107 is connected to the air guide channel 106, so that external low-temperature air can enter the air guide channel 106 from the periphery of the heat spreader and be discharged through the air outlet 107, forming a forced convection cooling path.

[0030] The flow guide 104 has heat dissipation grooves 1041 symmetrically arranged on both sides along its length axis. The heat dissipation grooves 1041 are multiple transverse grooves arranged transversely along the outer contour of the flow guide 104. The thick part in the middle of the side of the flow guide 104 is an inclined surface 1042. The inclined surface 1042 is arranged opposite to the inclined surface 1042 of the adjacent flow guide 104, forming a V-shaped narrowing flow path. Inside the flow guide 104, a through flow channel 1043 is arranged along the air flow direction. Five heat dissipation fins 1044 are arranged in the flow channel 1043. The number of heat dissipation fins 1044 can be appropriately increased or decreased according to the size of the heat dissipation fins 1044. The heat dissipation fins 1044 are solid structures, and their outer contours are double cones with opposite directions. The cone tips of the heat dissipation fins 1044 face the inlet and outlet of the flow channel 1043, respectively, to enhance the heat exchange efficiency between the airflow and the structural components.

[0031] like Figure 3 As shown, it also includes connecting columns 103. Multiple connecting columns 103 are fixedly connected inside the hollow structure of the first heat-conducting plate 101. The multiple connecting columns 103 are evenly distributed inside the hollow structure to strengthen the connection strength of the hollow structure of the first heat-conducting plate 101 and prevent the upper and lower walls from deforming or collapsing when subjected to pressure or heat. The connecting columns 103 are made of die-cast cylindrical material, which ensures structural rigidity and does not affect the flow of working fluid.

[0032] First, a first heat-conducting plate 101 is fixedly installed at the heat source of the device (e.g., CPU), and a second heat-conducting plate 105 is fixed at the air intake of the air-cooled radiator to complete the assembly. When the device is running, the high temperature generated by the heat source is transferred to the hollow evaporation zone through the first heat-conducting plate 101. The coolant in the evaporation zone absorbs heat and undergoes a phase change, changing from liquid to gas (vapor). This process absorbs a large amount of latent heat of vaporization, achieving efficient heat absorption. When the liquid becomes gas, its volume expands rapidly, causing the local pressure in the evaporation zone to increase, thereby guiding the vapor through the flow space to the relatively low-pressure condensation zone. After the gas reaches the condensation zone, it begins to diffuse, rapidly transferring heat to the entire condensation zone. When the vapor encounters the low-temperature surface of the condensation zone, it begins to release vapor heat and condenses back into liquid. The liquid continuously replenishes the evaporation zone through the capillary pressure formed by the microporous structure of the liquid suction core 102, maintaining the circulation.

[0033] As the condensation zone of the first heat-conducting plate 101 releases heat, the heat is rapidly transferred through its surface to the guide member 104 and the heat sink 1044. Subsequently, the heat is transferred through the guide member 104 to the second heat-conducting plate 105, increasing the heat dissipation area of ​​the condensation zone of the first heat-conducting plate 101. Then, the air-cooled radiator is activated, drawing out the high-temperature air accumulated on the first heat-conducting plate 101 and the second heat-conducting plate 105. Simultaneously, a negative pressure zone is locally generated on the first heat-conducting plate 101 and the second heat-conducting plate 105. Then, the surrounding low-temperature air flows through the air guide channel 106 on the side wall of the first heat-conducting plate 101 to replenish the negative pressure zone. When the low-temperature air flows through the air guide channel 106, some of it passes through the outer contour of the first heat-conducting plate 101. As it passes through the narrowing of the inclined surface 1042, the flow cross-sectional area gradually decreases, according to the fluid flow... Following the principle of continuity, the airflow velocity increases accordingly, forming a high-speed airflow in the constricted area, thereby enhancing convective heat transfer between the airflow and the heat dissipation surface. At the same time, the heat dissipation groove 1041 increases the contact area with the low-temperature air, while another part of the low-temperature air enters the flow channel 1043 through the guide 104, and then flows out from the narrow opening on the other side of the flow channel 1043 after passing through the heat sink 1044. During this process, the heat sink 1044 and the flow channel 1043 significantly increase the heat dissipation area of ​​the guide 104 and improve the heat dissipation efficiency of the guide 104. Subsequently, the airflow velocity is increased through the narrow opening on one side of the flow channel 1043, thereby accelerating the flow velocity of the low-temperature air inside the entire air guide channel 106, forming a highly efficient forced convective heat transfer. Finally, the high-temperature gas is quickly discharged by the air-cooled radiator through the outlet 107.

[0034] Example 2: Based on Example 1, such as Figure 1 , Figure 2 and Figure 6 As shown, it also includes a first flow guide 201, which is fixedly connected between the first heat conduction plate 101 and the second heat conduction plate 105. The first flow guide 201 has a first flow guide surface 202 arranged in the middle along the central circumference to guide the airflow located at the air outlet 107 upward.

[0035] like Figure 2 and Figure 6 As shown, the first air diversion frame 201 is in the shape of a cross and is horizontally fixed between the first heat-conducting plate 101 and the second heat-conducting plate 105. The length of its extension is equal to the diagonal length of the first heat-conducting plate 101. The cross extension of the first air diversion frame 201 divides the space between the first heat-conducting plate 101 and the second heat-conducting plate 105 into four independent triangular flow areas. Its extension guides the low-temperature air in each independent area to the air outlet 107 of the first heat-conducting plate 101, thereby regulating and guiding the flow path of the low-temperature air.

[0036] To prevent low-temperature air from turbulently flowing through the air guide channel 106 and affecting heat dissipation efficiency, the first air guide frame 201 is fixed between the first heat-conducting plate 101 and the second heat-conducting plate 105 by bolts 108. The first air guide frame 201 is cross-shaped and extends outward. The extension of the air guide frame divides the space between them into four symmetrical and independent flow areas. When the low-temperature air passes through the air guide channel 106, it is guided by the first air guide frame 201 and gathers towards the center of the first heat dissipation plate. Finally, the high-temperature air after heat exchange is discharged through the air outlet 107 through the first guide surface 202 of the air guide frame. On the other hand, fixing the first air guide frame between the first heat-conducting plate 101 and the second heat-conducting plate 105 provides effective support and prevents the first heat-conducting plate 101 and the second heat-conducting plate 105 from deforming.

[0037] Example 3: Based on Example 2, such as Figure 1 ,and Figure 7 As shown, it also includes a connecting plate 301, which is fixedly connected to the side wall of the first heat-conducting plate 101. The corners of the connecting plate 301 are provided with connecting holes 303 for installation. The four corners are chamfered and burrs are removed. The upper part of the connecting plate 301 is fixedly connected to a second flow guide 302. The four sides of the second flow guide 302 are provided with air inlets 304. A second flow guide surface 305 is provided on one side of the air inlet 304.

[0038] To smoothly guide the low-temperature air into the air guide channel 106 and prevent the low-temperature air from impacting the vertical sidewall of the first heat-conducting plate 101 and causing eddies when it flows into the air guide channel 106, multiple air inlets 304 are provided on the sidewalls around the second air guide frame 302. The shape and size of the air inlets 304 match the inlet of the air guide channel 106. The second guide surface 305 is a beveled cut. When the low-temperature air enters the air inlet 304, the airflow enters at a small angle of attack, so that the low-temperature air can smoothly transition and improve the stability of the flow. On the one hand, the first heat-conducting plate 101 is connected through the connecting plate 301 to increase the heat dissipation area of ​​the first heat-conducting plate 101. On the other hand, the first heat-conducting plate 101 can be fixed at the heat source of the equipment.

[0039] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made to the invention without departing from the principles and spirit of the invention as defined by the claims. Therefore, the detailed description of the embodiments in this disclosure is for illustrative purposes only and is not intended to limit the invention; rather, the scope of protection is defined by the content of the claims.

Claims

1. A heat spreader with distributed heat dissipation function, comprising a first heat-conducting plate (101), a liquid-absorbing core (102), and a liquid inlet pipe (1031), wherein the first heat-conducting plate (101) has a hollow structure for storing coolant, with one side of the hollow structure being an evaporation zone and the other side being a condensation zone, the liquid-absorbing core (102) being disposed on the inner wall of the first heat-conducting plate (101) in the evaporation zone and the condensation zone, and a vapor flow space being formed between the two liquid-absorbing cores (102), and the liquid inlet pipe (1031) being disposed on the side wall of the first heat-conducting plate (101) and connected to the hollow structure of the first heat-conducting plate (101), characterized in that: The first heat-conducting plate (101) has multiple flow guides (104) arranged circumferentially on the side away from the evaporation zone. The spacing between adjacent flow guides (104) forms an air guide channel (106) distributed circumferentially along the first heat-conducting plate (101) for air circulation. The flow guide (104) is provided with a second heat-conducting plate (105) on the side away from the first heat-conducting plate (101). An air outlet (107) is provided in the middle of the second heat-conducting plate (105). The air outlet (107) is connected to the air guide channel (106), so that the external low-temperature air can enter the air guide channel (106) from the periphery of the heat spreader and be discharged through the air outlet (107), forming a forced convection cooling path.

2. The vapor chamber with distributed heat dissipation function as described in claim 1, characterized in that: Multiple flow guides (104) with circumferential spacing are arranged radially at an inclination along the center direction of the first heat-conducting plate (101).

3. The vapor chamber with distributed heat dissipation function as described in claim 1 or 2, characterized in that: The flow guide (104) has a structure that is thick in the middle and gradually tapers towards both ends. Its cross-section is an elongated rhombus or spindle shape to guide the airflow to converge along the flow path.

4. The vapor chamber with distributed heat dissipation function as described in claim 3, characterized in that: The flow guide (104) has heat dissipation grooves (1041) symmetrically arranged on both sides along the length axis. The middle thick part of the side of the flow guide (104) is an inclined surface (1042). The inclined surface (1042) is arranged opposite to the inclined surface (1042) of the adjacent flow guide (104) to form a V-shaped narrow flow path. Inside the flow guide (104), a through flow channel (1043) is arranged along the air flow direction. Multiple heat dissipation fins (1044) are arranged in the flow channel (1043).

5. The vapor chamber with distributed heat dissipation function as described in claim 4, characterized in that: The heat sink (1044) is a solid structure with an outer contour of a double cone in opposite directions.

6. The vapor chamber with distributed heat dissipation function as described in claim 1, characterized in that: It also includes connecting columns (103). The hollow structure of the first heat-conducting plate (101) is provided with multiple connecting columns (103) to prevent the upper and lower walls from deforming or collapsing when subjected to pressure or heat.

7. The vapor chamber with distributed heat dissipation function as described in claim 1, characterized in that: The second heat-conducting plate (105) is fixedly connected to the first heat-conducting plate (101) by bolts (108).

8. The vapor chamber with distributed heat dissipation function as described in claim 7, characterized in that: It also includes a first flow guide (201), which is fixedly connected between the first heat conduction plate (101) and the second heat conduction plate (105). The first flow guide (201) has a first flow guide surface (202) arranged in the middle along the central circumference to guide the airflow located at the air outlet (107) upward.

9. The vapor chamber with distributed heat dissipation function as described in claim 8, characterized in that: The first flow guide (201) is in the shape of a cross and is horizontally fixed between the first heat-conducting plate (101) and the second heat-conducting plate (105). The cross extension of the first flow guide (201) divides the space between the first heat-conducting plate (101) and the second heat-conducting plate (105) into four independent flow areas. Its extension guides the low-temperature air of each independent area to the air outlet (107) of the first heat-conducting plate (101).

10. The vapor chamber with distributed heat dissipation function as described in claim 1, characterized in that: It also includes a connecting plate (301), which is fixedly connected to the side wall of the first heat-conducting plate (101). The corner of the connecting plate (301) is provided with a connecting hole (303) for installation. The connecting plate (301) is fixedly connected to a second flow guide (302). The side wall of the second flow guide (302) is provided with an air inlet (304) in the circumferential direction. A second flow guide surface (305) is provided on one side of the air inlet (304).

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