A method, apparatus, and medium for constructing a flexible electrostatically actuated electric field sensor array

Abstract

The application discloses a kind of electrostatic force driven flexible electric field sensor array construction method, equipment and medium, comprising: integrating microelectrode structure on flexible substrate, utilizing electric field effect to generate electrostatic force drive micro mechanical unit response, obtain flexible micro electric field sensor;Multiple flexible micro electric field sensors are arranged in the form of array in GIS bus cavity, and optimization arrangement;After sensor array arrangement, the measurement error under different installation positions and angles is analyzed, error model is established and is compensated, through the reasonable distribution of sensor array, the spatial full coverage of electric field distribution is realized, and in combination with error modeling and real-time compensation mechanism, the data instability problem caused by manufacturing deviation, environmental noise and installation position difference is effectively solved;In the process of array data fusion, adaptive weighting and iterative optimization algorithm are introduced, so that the output result not only has high spatial resolution, but also can remain stable and reliable in long-term operation.

Description

Technical Field

[0001] This invention relates to the field of intelligent sensing technology, specifically to a method, device, and medium for constructing a flexible electric field sensor array driven by electrostatic force. Background Technology

[0002] In ultra-high voltage (UHV) power transmission systems, the GIS busbar, as the core insulation and transmission unit, directly affects the safe operation and overall lifespan of the equipment due to its electric field distribution. The interior of the GIS busbar is typically situated in a high-voltage, high-electric-field-strength, and complex electromagnetic environment. Uneven local electric field distribution can lead to high-field-strength regions on the conductor surface or within the insulating medium. Over time, the busbar cavity may experience electric field distortion due to various factors, such as the deposition and migration of impurity particles, aging and degradation of the insulating medium, micro-defects on the conductor surface, stress concentration during mechanical installation, and even dielectric damage caused by micro-vibrations or residual partial discharges generated during operation. These factors combined can cause localized distortions in the electric field distribution, inducing abnormal electric field strength. When the local field strength exceeds the insulation withstand limit of the material, partial discharge is easily triggered, potentially evolving into electrical tree development and insulation breakdown. In severe cases, this can lead to GIS explosions, jeopardizing the stable operation of the power grid. Therefore, real-time monitoring, anomaly identification, and early warning of the electric field distribution of the GIS busbar are not only of significant theoretical research value but also possess irreplaceable safety assurance significance in engineering practice.

[0003] Currently, electric field detection mainly relies on rigid sensing probes or external monitoring devices. However, these methods have significant limitations in practical applications: First, rigid probes are generally large and rigid, making it difficult to achieve close fit on the complex three-dimensional curved surfaces inside GIS busbars, thus limiting the measurement coverage, especially in critical insulation gaps and narrow areas where effective placement is challenging. Second, traditional electric field detectors have limited sensitivity and signal-to-noise ratio, resulting in insufficient response to weak electric field disturbances caused by early defects, often failing to identify defects in their nascent stages. Third, existing detection methods mostly use data from single points or a small number of sampling points, resulting in low spatial resolution and difficulty in fully reconstructing the overall electric field distribution of the busbar, leading to low accuracy in identifying local distortions. Furthermore, most existing methods lack a robust measurement error modeling and compensation mechanism, making them highly susceptible to factors such as installation location, angle, and external interference, resulting in poor stability and repeatability of the detection results, thereby reducing the reliability of monitoring data in actual operation and maintenance.

[0004] In recent years, with the rapid development of flexible electronic devices, nanomaterials, and microelectromechanical systems (MEMS) technologies, miniaturized electric field sensors based on flexible substrates have begun to be gradually applied to measurements in complex structural environments. These flexible sensors, with their excellent bending adaptability and large-area bonding capabilities, possess the potential to achieve high-resolution electric field sensing within limited spaces. However, existing flexible sensors still have shortcomings in structural optimization, signal amplification and anti-interference capabilities, error compensation methods, and array arrangement strategies. For example, while some flexible sensors have miniaturization advantages, their electrode design and electrostatic response linearity are not yet perfected, limiting measurement accuracy. Furthermore, most research remains at the single-point measurement level, and a systematic array arrangement scheme covering a large area of ​​GIS busbars has not yet been developed. In addition, real-time data processing and feedback mechanisms have not been established, lacking a closed-loop detection method from sensor fabrication, array arrangement, error modeling to real-time compensation and monitoring feedback, severely restricting their promotion and engineering application in complex working conditions of UHV GIS sites. Summary of the Invention

[0005] This invention proposes a method, device, and medium for constructing an electrostatically driven flexible electric field sensor array to solve the problems mentioned in the background.

[0006] To achieve the above objectives, the present invention employs the following technical solution: A method for constructing an electrostatically driven flexible electric field sensor array according to the present invention includes the following steps: S1. A flexible micro-electrode structure is integrated on a flexible substrate, and the electrostatic force generated by the electric field is used to drive the micromechanical unit response to obtain a flexible micro electric field sensor. S2. Multiple flexible micro electric field sensors are arranged in an array within the GIS busbar cavity, and the arrangement is optimized; S3. After the sensor array is arranged, the measurement errors under different installation positions and angles are analyzed, an error model is established, and compensation is performed.

[0007] Preferably, step S1 includes the following steps: S11. Select a flexible insulating substrate material and form a micro-electrode pattern on the substrate; S12, The sensor is in an external electric field When the time is right, a potential difference is formed between the microelectrodes. Electrostatic force between electrodes It can be expressed by the following formula:

[0008] in, This refers to the capacitance between the electrodes. This refers to the relative displacement between the electrodes; With electric field strength Proportional; S13. Electrodes connected to flexible cantilever beams, diaphragms, or thin-film structures, which generate displacement Δ after being subjected to electrostatic force. The displacement is proportional to the square of the applied voltage, as shown in the following formula:

[0009] in, The equivalent elastic constant of the microstructure; S14. Displacement causes a change in capacitance; the capacitance expression is:

[0010] in, This represents the effective facing area of ​​the electrodes. This represents the initial spacing between the electrodes; Displacement caused by electrostatic force; is the dielectric constant.

[0011] Preferably, step S2 includes the following steps: S21. Based on the busbar cavity geometry and measurement requirements, select the array layout form, and for each layout form, define the array unit positions. , , ),in, =1,2, ; S22. The impact of different spacings on measurement resolution and sensitivity is analyzed through finite element simulation; the layout is optimized to ensure that the sensors cover the main electric field region within the bus cavity, while avoiding mutual obstruction or interference; array spacing... Should meet:

[0012] Where R is the radius of the busbar; Optimize the coefficients for array coverage; Optimize spacing opt :

[0013] in, To achieve the optimal array spacing; This represents the actual spacing between the arrays. The array spacing is The electric field matrix or vector measured at that time; This represents the actual electric field distribution of the busbar; RMSE is the root mean square error function, which quantifies the deviation between the measured value and the true value. S23. Embed the array into the inner wall of the busbar, calibrate each array unit, and record the installation angle. and relative position , , ; During installation, the fit between the electrode plane and the busbar surface should be considered, and the installation angle is denoted as [missing information]. , , ,in: For the sensor plane around Pitch angle deviation of the shaft; To bypass Roll angle deviation of the shaft; This represents the azimuth deviation around the Z-axis; The effect of installation angle deviation on measured values:

[0014] in, For the first The electric field strength measured by a single sensor; For the first The actual electric field strength at each sensor location; , For the first The sensor may have an angle deviation in two-dimensional or three-dimensional installation. Additional errors caused by micromechanical differences, circuit noise, environmental interference, etc. Reduce errors by optimizing the installation angle:

[0015] in, This is the optimal combination of three-dimensional installation angle deviations for the i-th sensor, which is the optimal solution for the deviation angle between the actual installation direction and the ideal direction of the sensor. For the first The measurement error of a sensor, that is, the deviation between the electric field value measured by the sensor and the true electric field value, is... ,and This indicates finding the measurement error. Minimal installation angle combination; S24. All array units simultaneously acquire electric field signals to achieve multi-point synchronous measurement; the signals are aggregated to the data processing module via a bus. A single sensor unit synchronously acquires electric field signals. The data is aggregated into a two-dimensional or pseudo-three-dimensional electric field distribution map by the data processing module.

[0016] in, A vector or matrix consisting of the measurements of all cells in the array; This represents the total number of array sensor units; , For the first Measurement values ​​from each sensor; Generating a continuous electric field distribution using interpolation methods:

[0017] in, For a continuous spatial electric field generated by interpolation; Interp( ) is the interpolation function; , , The three-dimensional coordinates of any point in the busbar cavity; This is the measurement matrix acquired by the array; S25. Installation at different positions or angles may introduce measurement errors; an error model is established through simulation or experimentation, and a compensation algorithm is used to correct the array measurement data.

[0018] Preferably, the compensation algorithm is as follows: An error model is established for the array output signal: The error is correlated with the array position, angle, and spacing as follows:

[0019] in, For the first Individual sensor measurement error; For the first Installation coordinates of each sensor For the first Three-dimensional installation angle deviation of each sensor; ( ) is the error function.

[0020] Preferably, step S3 includes the following steps: S31. Identify the sources of measurement error and calculate the total error. The formula for calculating the total error is as follows:

[0021] in, This is due to installation position deviation; This is due to the installation angle deviation; The elastic constant of the micromechanical structure; For circuit noise and environmental interference; S32. Measure the electric field strength for each sensor unit in the array. ,i With real electric field ,i The error between them can be expressed as: Considering installation angle deviation :

[0022] in, Other errors; The upper bound of the total error for the entire array can be expressed as:

[0023] in, This represents the total number of array cells; S33. Use finite element simulation to simulate the electric field measurement results under different installation deviations and obtain the error distribution. ( , , , ); The simulation results were verified through actual experimental measurements, and the error function was fitted.

[0024] in, This is the fitting error function; These are the sensor position coordinates; This is due to the installation angle deviation; S34. Output signal for each sensor. Application error compensation:

[0025] in, The output electric field strength (V / m) after compensation; Original measurement value (V / m); This is the fitting error function.

[0026] Preferably, step S3 further includes the following step: S35, raw signals acquired by the array sensor Apply the compensation formula in real time.

[0027] Preferably, step S35 includes the following steps: The compensated array signal is spatially interpolated and filtered to generate a continuous two-dimensional or three-dimensional electric field distribution map inside the bus cavity. At each monitoring time point, the system determines whether the local electric field exceeds the preset threshold E. th If the value exceeds the limit, an abnormal alarm will be generated. If an abnormal electric field area is detected, the data processing module immediately generates an alarm message and transmits it to the monitoring system through the communication interface; If the electric field value does not exceed the threshold, the system continues to collect and compensate in a loop, forming a continuous and real-time monitoring and correction mechanism; Set the cycle period Δ With data buffering mechanisms; The data processing module can also store historical electric field data in a database for trend analysis and predictive maintenance.

[0028] Preferably, the preset threshold E th Determine by one of the following three methods: a) Calculate the maximum electric field intensity of the busbar under normal operating conditions using finite element simulation. Take the warning threshold ,in For safety factor; b) Refer to the standard for the limit value of the design field strength of GIS insulation, denoted as Take the warning threshold ; c) If the system has been running for a period of time, calculate the average electric field at each measuring point under normal operating conditions. At the same time, statistical standard deviation Take the warning threshold .

[0029] In another aspect, the present invention also discloses a computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the steps of the method described above.

[0030] In another aspect, the present invention also discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the steps of the method described above.

[0031] As can be seen from the above technical solution, the present invention provides a method for constructing a flexible electric field sensor array driven by electrostatic force. Compared with the prior art, the present invention has the following advantages: 1. This invention fully utilizes flexible substrate materials and microstructure design to give the sensor high physical flexibility and deformability, enabling it to fit snugly into complex three-dimensional curved surfaces and narrow spaces within GIS systems. This feature not only significantly improves the coverage of electric field measurements but also effectively avoids the measurement blind zone problem caused by the inability of traditional rigid probes to achieve complete fit. Simultaneously, the mechanical stability and high-voltage resistance of the flexible substrate ensure long-term reliable operation of the sensor in ultra-high voltage environments, thereby greatly improving the comprehensiveness and stability of the measurements.

[0032] 2. This invention achieves a significant improvement in sensitivity and signal-to-noise ratio through electrode structure optimization and driving method improvement. Compared with traditional electric field detectors, this invention can respond to extremely weak electric field disturbances, and is especially suitable for capturing and identifying early defect features, thereby making the monitoring of electric field distortion more proactive and precise. This high-sensitivity detection capability not only improves the accuracy of detection, but also extends the early warning time window of the equipment, providing operators with ample opportunities for maintenance and intervention.

[0033] 3. This invention achieves full spatial coverage of electric field distribution through the rational distribution of sensor arrays, and effectively solves the problem of data instability caused by manufacturing deviations, environmental noise and differences in installation location by combining error modeling and real-time compensation mechanisms. In the process of array data fusion, this invention introduces adaptive weighting and iterative optimization algorithms, so that the output results not only have high spatial resolution, but also remain stable and reliable during long-term operation.

[0034] 4. This invention, through its data processing module, can compensate and correct the electric field signals collected by sensors in real time, and quickly identify and locate abnormal areas. When an abnormal local electric field strength is detected, the system immediately generates an early warning signal and transmits it to the monitoring center to guide maintenance personnel in targeted handling. If no abnormality is detected, the system continues to monitor and compensate, forming a stable closed-loop monitoring and feedback mechanism. In this way, this invention can not only achieve real-time electric field distortion detection, but also issue early warnings before potential defects develop into serious faults, thereby significantly improving the operational safety and maintenance efficiency of power equipment. Attached Figure Description

[0035] Figure 1 This is a flowchart illustrating a method for constructing an electrostatically driven flexible electric field sensor array according to the present invention.

[0036] Figure 2 The figure shows the simulation verification results of the sensor unit displacement and electric field response in this invention.

[0037] Figure 3 This is a diagram showing the relationship between array spacing and error in this invention.

[0038] Figure 4 This is a heat map showing the coverage of the hybrid array in this invention.

[0039] Figure 5 This is a 3D diagram showing the position and measurement values ​​of the hybrid array unit in this invention.

[0040] Figure 6 This is a graph showing the error fitting curve in this invention.

[0041] Figure 7 This demonstrates the error compensation effect in this invention.

[0042] Figure 8 This is a thermal diagram of the electric field after compensation in this invention.

[0043] Figure 9 This is a three-dimensional distribution diagram of the sensor position and the compensated electric field in this invention.

[0044] Figure 10 This is a top-view two-dimensional distribution diagram of the sensor position and the compensated electric field in this invention. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0046] like Figure 1 As shown, this embodiment of a method for constructing an electrostatically driven flexible electric field sensor array includes the following steps: S1. A flexible micro-electrode structure is integrated on a flexible substrate, and the electrostatic force generated by the electric field is used to drive the micromechanical unit response to obtain a flexible micro electric field sensor. S2. Multiple flexible micro electric field sensors are arranged in an array within the GIS busbar cavity, and the arrangement is optimized; S3. After the sensor array is arranged, the measurement errors under different installation positions and angles are analyzed, an error model is established, and compensation is performed.

[0047] Furthermore, S1 includes the following steps: S11. Select a flexible insulating substrate material and form a micro-electrode pattern on the substrate; S12, The sensor is in an external electric field When the time is right, a potential difference is formed between the microelectrodes. Electrostatic force between electrodes It can be expressed by the following formula:

[0048] in, This refers to the capacitance between the electrodes. This refers to the relative displacement between the electrodes; With electric field strength Proportional; S13. Electrodes connected to flexible cantilever beams, diaphragms, or thin-film structures, which generate displacement Δ after being subjected to electrostatic force. The displacement is proportional to the square of the applied voltage, as shown in the following formula:

[0049] in, The equivalent elastic constant of the microstructure; S14. Displacement causes a change in capacitance; the capacitance expression is:

[0050] in, This represents the effective facing area of ​​the electrodes. This represents the initial spacing between the electrodes; Displacement caused by electrostatic force; is the dielectric constant.

[0051] Furthermore, S2 includes the following steps: S21. Based on the busbar cavity geometry and measurement requirements, select the array layout form, and for each layout form, define the array unit positions. , , ),in, =1,2, ; The layout is as follows: Matrix type: Uniformly arranged along the longitudinal and transverse directions of the busbar, suitable for two-dimensional electric field distribution measurement; Circular / Arc-shaped: Arranged along the circumference or arc of the generatrix, suitable for detecting circular electric fields or local distortions; Hybrid type: Combining matrix and ring types to improve coverage and spatial resolution.

[0052] S22. The impact of different spacings on measurement resolution and sensitivity is analyzed through finite element simulation; the layout is optimized to ensure that the sensors cover the main electric field region within the bus cavity, while avoiding mutual obstruction or interference; array spacing... Should meet:

[0053] Where R is the radius of the busbar; Optimize the coefficients for array coverage; Optimize spacing opt :

[0054] in, To achieve the optimal array spacing; This represents the actual spacing between the arrays. The array spacing is The electric field matrix or vector (V / m) measured at that time; The actual electric field distribution of the busbar (V / m); RMSE is the root mean square error function, which quantifies the deviation between the measured value and the true value. S23. Embed the array into the inner wall of the busbar, calibrate each array unit, and record the installation angle. and relative position , , ; During installation, the fit between the electrode plane and the busbar surface should be considered, and the installation angle is denoted as [missing information]. , , ,in: For the sensor plane around Pitch angle deviation of the shaft (in radians or degrees); To bypass Roll angle deviation of the shaft; This is the azimuth deviation around the Z-axis (i.e., the in-plane rotation angle). The effect of installation angle deviation on measured values:

[0055] in, For the first The electric field strength (V / m) measured by each sensor; For the first The actual electric field strength (V / m) at each sensor location; , For the first The sensor has an angular deviation (in radians or degrees) in two or three dimensions. This refers to the additional error (V / m) caused by micromechanical differences, circuit noise, environmental interference, etc.

[0056] Errors can be reduced by optimizing the installation angle: (7) in, This is the optimal combination of three-dimensional installation angle deviations for the i-th sensor, which is the optimal solution for the deviation angle between the actual installation direction and the ideal direction of the sensor. For the first The measurement error (V / m) of a sensor is the deviation between the electric field value measured by the sensor and the actual electric field value. ,and This indicates finding the measurement error. The minimum combination of installation angles; that is, optimizing the installation angles to make the first Each sensor measures the value closest to the true value; S24. All array units simultaneously acquire electric field signals to achieve multi-point synchronous measurement; the signals are aggregated to the data processing module via a bus; two-dimensional or pseudo-three-dimensional electric field distribution maps can be generated in real time to achieve global monitoring and local distortion detection; A single sensor unit synchronously acquires electric field signals. The data is aggregated into a two-dimensional or pseudo-three-dimensional electric field distribution map by the data processing module. (8) in, A vector or matrix consisting of the measurements of all cells in the array; This represents the total number of array sensor units; , For the first The measurement values ​​of each sensor.

[0057] Generating a continuous electric field distribution using interpolation methods: (9) in, The continuous spatial electric field (V / m) generated by interpolation; Interp( ) is the interpolation function (such as bilinear, cubic spline, or radial basis function interpolation); , , The three-dimensional coordinates of any point in the busbar cavity; This is the measurement matrix acquired by the array; S25. Installation at different positions or angles may introduce measurement errors; establish an error model through simulation or experiment, and combine it with the compensation algorithm in step 3 to correct the array measurement data.

[0058] Furthermore, the compensation algorithm is as follows: An error model is established for the array output signal: The error is correlated with the array position, angle, and spacing, providing input for the compensation algorithm in step 3: (8) in, For the first Individual sensor measurement error (V / m); For the first Installation coordinates of each sensor For the first Three-dimensional installation angle deviation of each sensor; ( ) is the error function, obtained through simulation or experimental fitting.

[0059] Furthermore, S3 includes the following steps: S31. Identify the sources of measurement error and calculate the total error. The formula for calculating the total error is as follows:

[0060] in, This is due to installation position deviation; This is due to the installation angle deviation; The elastic constant of the micromechanical structure; For circuit noise and environmental interference; S32. Measure the electric field strength for each sensor unit in the array. ,i With real electric field ,i The error between them can be expressed as: If installation angle deviation is taken into account : (10) in, Other errors (such as microstructure differences, noise); The upper bound of the total error for the entire array can be expressed as: (11) in, This represents the total number of array cells; S33. Use finite element analysis (FEA) to simulate the electric field measurement results under different installation deviations and obtain the error distribution. ( , , , ); The simulation results were verified through actual experimental measurements, and the error function was fitted. (12) in, This is the fitting error function; These are the sensor position coordinates; This is due to the installation angle deviation; S34. Output signal for each sensor. Application error compensation: (13) in, The output electric field strength (V / m) after compensation; Original measurement value (V / m); This is the fitting error function.

[0061] Furthermore, S3 also includes the following steps: S35, raw signals acquired by the array sensor Apply the compensation formula in real time.

[0062] Furthermore, S35 includes the following steps: The compensated array signal is spatially interpolated and filtered to generate a continuous two-dimensional or three-dimensional electric field distribution map inside the bus cavity. At each monitoring time point, the system determines whether the local electric field exceeds the preset threshold E. th If the value exceeds the limit, an abnormal alarm will be generated. If an abnormal electric field area is detected, the data processing module immediately generates an alarm message and transmits it to the monitoring system through the communication interface, so that maintenance personnel can respond in a timely manner. If the electric field value does not exceed the threshold, the system continues to collect and compensate in a loop, forming a continuous and real-time monitoring and correction mechanism to ensure that the electric field distribution can be continuously monitored during the operation of the busbar. The system allows setting the cycle period Δ A data buffering mechanism is included to ensure low-latency processing and real-time feedback even under high-frequency sampling. The data processing module can also store historical electric field data in a database for trend analysis and predictive maintenance, providing decision support for the long-term safe operation of the busbar.

[0063] Furthermore, the preset threshold E th Determine by one of the following three methods: a) Simulation-based: The maximum electric field intensity of the busbar under normal operating conditions is calculated using finite element simulation. Take the warning threshold ,in For safety margin, it is usually taken as 1.2 to 1.5; b) Based on standards: Referencing international standard IEC 62271 The limit value for the design field strength of GIS insulation is specified in 203 or the national standard GB / T 7674, and is denoted as... Take the warning threshold ; c) Based on historical data: If the system has been running for a period of time, calculate the average electric field at each measuring point under normal operating conditions, and record it as... At the same time, the standard deviation is calculated and denoted as . Take the warning threshold .

[0064] like Figure 2 As shown in the figure, this figure verifies the core mechanism by which the sensor unit in this invention achieves a linear response of displacement to the square of the electric field through electrostatic force driving.

[0065] like Figure 3 As shown in the figure, this diagram compares the spacing-measurement error relationship of three types of arrays: matrix, ring, and hybrid, and finds the optimal spacing, that is, the spacing with the smallest error.

[0066] Horizontal axis: array spacing d, unit: m, which is the distance between sensor units.

[0067] Vertical axis: RMSE, root mean square error, unit: kV / m, which measures the deviation between the measured electric field value and the true electric field value. The smaller the value, the higher the measurement accuracy.

[0068] The physical meaning of the three curves: Red (matrix type): Matrix array, with RMSE variations uniformly arranged longitudinally and laterally along the generatrix. The error is smallest when the spacing is 0.04m, but the overall curve fluctuates greatly, and the spacing is more sensitive to the influence of longitudinal or lateral cover density.

[0069] Blue (ring): RMSE variation of the ring array distributed across three cross-sections along the circumference of the generatrix. The error is minimized when the diameter is 0.05m, and the fluctuation of the curve reflects the influence of the circumferential sampling density on the error.

[0070] Green (Hybrid): RMSE variation of a hybrid array, a combination of matrix and ring layouts. The error is smallest and the curve is the smoothest when the value is 0.03, indicating that the hybrid type combines the advantages of both layouts, resulting in higher measurement accuracy and better stability.

[0071] like Figure 4 As shown, the coordinate axes: the horizontal axis X and the vertical axis Y represent the cross-sectional coordinates of the GIS busbar at a height of z=1.0 m, in meters. Color meaning: the color bars on the right represent the electric field intensity; blue = low electric field, red = high electric field. The dark blue area in the center of the image corresponds to the conductor of the GIS, where a 500kV high voltage is applied. The surrounding area, transitioning from red to yellow to blue, represents the electric field distribution within the insulating gas. The color gradually decreases from the conductor outwards, consistent with the electric field law of a coaxial cylinder, where E is positively correlated with 1 / r, where r is the distance to the axis. The heatmap covers the entire cross-section without any blank areas, indicating that the hybrid array can comprehensively monitor the electric field of this cross-section without any measurement blind spots.

[0072] like Figure 5 As shown, the coordinate axes—X (horizontal axis), Y (vertical axis), and Z (vertical axis)—represent the three-dimensional spatial coordinates around the GIS busbar, in meters (m). Each point represents the position of a sensor unit. The color bars on the right side of the figure represent the electric field strength measured by the sensor; blue = low electric field, red = high electric field. The sensors are arranged in a matrix, with a hybrid layout of longitudinal arrangement along the Z direction and circular distribution along the XY plane. This layout covers both the length and circumferential directions of the busbar. The color distribution of the measured values ​​conforms to theoretical laws, with red near the conductor and blue further away. This indicates that the array unit is reasonably positioned and can comprehensively monitor the electric field in the three-dimensional space around the busbar, making the measurement data valid.

[0073] like Figure 6 As shown, the horizontal axis represents the installation angle deviation. This simulates the angle error during sensor installation. Vertical axis: Error, unit: kV / m; In the diagram, blue dots (actual error): deviations due to installation angle. The fluctuations are obvious, reflecting the influence of the installation angle on the measurement error; Red line (fitting error): The systematic error trend caused by the installation angle is extracted by linear fitting. Although it does not coincide with every blue point, it can define the main range of the error and provide a predictable error model for subsequent compensation. The simulation system displays: "Number of data points for fitting: 36; Method 1: Direct matrix solution; Fitting successful! Coefficients: a=-61016.521853, b=4154.070439, c=2149.429696, d=-33.016918", which indicates that the systematic error caused by the installation angle deviation can be successfully modeled.

[0074] like Figure 7 As shown, the horizontal axis represents the sensor unit number, indicating different monitoring locations; Vertical axis: Error, unit kV / m, measures the deviation between the measured electric field and the actual electric field; Red dot (actual error): Before compensation, the error fluctuates greatly, ranging from approximately -40 to 10 kV / m, reflecting a significant deviation in the original measurement.

[0075] Green dot (error after compensation): The error after compensation is significantly narrowed and closer to the 0 error line, proving that the error compensation algorithm is effective and can greatly correct measurement deviations.

[0076] Overall, the maximum error fluctuation before compensation was 12.5~34 kV / m, while the maximum error after compensation was only 11.66 kV / m; maximum error The decrease reached 47.73%, and the simulation results showed that the number of valid data points was 36 / 36, indicating that all sensor data were reliable.

[0077] like Figure 8 As shown, the horizontal axis X and the vertical axis Y represent the cross-sectional coordinates of the GIS busbar, in meters (m). Color bar: Compensated electric field strength, range 0 ~ 3 kV / m; The central dark area corresponds to the GIS conductor (under high voltage), and the surrounding color gradient conforms to the electric field law of a coaxial cylinder. The electric field strength is inversely proportional to the distance from the axis, and E is positively correlated with 1 / r. The red dashed line (the boundary of the distorted area) clearly marks the range of electric field distortion, verifying the function of electric field distortion monitoring and compensation-based distribution optimization. Specifically, the distorted spatial area is 1.6488 m³, and the maximum electric field strength is 3.09 MV / m. This proves that the electric field distortion monitoring function is effective—it can accurately identify areas of abnormal electric field and provide a basis for GIS insulation defect assessment through numerical quantification. Excessively strong distorted electric field may indicate insulation aging / fault.

[0078] Furthermore, simulation data revealed 624 distorted grid points corresponding to the area enclosed by the red boundary in this figure, quantifying the fine range of distortion.

[0079] like Figure 9 and Figure 10 As shown, the coordinate axes are: horizontal axis X, vertical axis Y, and vertical axis Z, which are three-dimensional spatial coordinates, in meters; the color of the point represents the compensated electric field value, and the color bar ranges from 0 to 0.7. Sensors are distributed in a three-dimensional space around the GIS busbar. The electric field values ​​(colors) at different locations conform to the theoretical law: the electric field is high near the conductor and low at a distance. This indicates that the three-dimensional measurement data of the sensors after compensation is effective and can fully reflect the electric field distribution around the busbar.

[0080] In another aspect, the present invention also discloses a computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the steps of the method described above.

[0081] In another aspect, the present invention also discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the steps of the method described above.

[0082] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk), etc.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0084] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0085] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for constructing an electrostatically driven flexible electric field sensor array, characterized in that, Includes the following steps: S1. A flexible micro-electrode structure is integrated on a flexible substrate, and the electrostatic force generated by the electric field is used to drive the micromechanical unit response to obtain a flexible micro electric field sensor. S2. Arrange multiple flexible micro electric field sensors in an array within the GIS busbar cavity, and optimize the arrangement; S3. After the sensor array is arranged, the measurement errors under different installation positions and angles are analyzed, an error model is established, and compensation is performed.

2. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 1, characterized in that: S1 includes the following steps: S11. Select a flexible insulating substrate material and form a micro-electrode pattern on the substrate; S12, The sensor is in an external electric field When the time is right, a potential difference is formed between the microelectrodes. Electrostatic force between electrodes It can be expressed by the following formula: in, This refers to the capacitance between the electrodes. This refers to the relative displacement between the electrodes; With electric field strength Proportional; S13. Electrodes connected to flexible cantilever beams, diaphragms, or thin-film structures, which generate displacement Δ after being subjected to electrostatic force. The displacement is proportional to the square of the applied voltage, as shown in the following formula: in, The equivalent elastic constant of the microstructure; S14. Displacement causes a change in capacitance; the capacitance expression is: in, This represents the effective facing area of ​​the electrodes; This represents the initial spacing between the electrodes; Displacement caused by electrostatic force; is the dielectric constant.

3. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 2, characterized in that: S2 includes the following steps: S21. Based on the busbar cavity geometry and measurement requirements, select the array layout form, and for each layout form, define the array unit positions. , , ),in, =1,2, ; S22. Analyze the impact of different spacings on measurement resolution and sensitivity through finite element simulation; optimize the layout to ensure the sensor covers the main electric field region within the busbar cavity, and adjust the array spacing. Should meet: Where R is the radius of the busbar; Optimize the coefficients for array coverage; Optimize spacing opt : in, To achieve the optimal array spacing; This represents the actual spacing between the arrays. The array spacing is The electric field matrix or vector measured at that time; This represents the actual electric field distribution of the busbar; RMSE is the root mean square error function, which quantifies the deviation between the measured value and the true value. S23. Embed the array into the inner wall of the busbar, calibrate each array unit, and record the installation angle. and relative position , , ; During installation, the fit between the electrode plane and the busbar surface should be considered, and the installation angle is denoted as [missing information]. , , ,in: For the sensor plane around Pitch angle deviation of the shaft; To bypass Roll angle deviation of the shaft; This represents the azimuth deviation around the Z-axis; The effect of installation angle deviation on measured values: in, For the first The electric field strength measured by a single sensor; For the first The actual electric field strength at each sensor location; , For the first The sensor may have an angle deviation in two-dimensional or three-dimensional installation. Additional errors caused by micromechanical differences, circuit noise, and environmental interference; Reduce errors by optimizing the installation angle: in, This is the optimal combination of three-dimensional mounting angle deviations for the i-th sensor; For the first The measurement error of a sensor, that is, the deviation between the electric field value measured by the sensor and the actual electric field value, is... ,and This indicates finding the measurement error. Minimal installation angle combination; S24. All array units simultaneously acquire electric field signals and perform multi-point synchronous measurements. A single sensor unit synchronously acquires electric field signals Forming two-dimensional or pseudo-three-dimensional electric field distribution maps: in, A vector or matrix consisting of the measurements of all cells in the array; This represents the total number of array sensor units; , For the first The measured values ​​of each sensor; Generating a continuous electric field distribution using interpolation methods: in, For a continuous spatial electric field generated by interpolation; Interp( ) is the interpolation function; , , The three-dimensional coordinates of any point in the busbar cavity; This is the measurement matrix acquired by the array; S25. Installation at different positions or angles may introduce measurement errors; an error model is established through simulation or experimentation, and a compensation algorithm is used to correct the array measurement data.

4. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 3, characterized in that: The compensation algorithm is as follows: An error model is established for the array output signal: The error is correlated with the array position, angle, and spacing as follows: in, For the first Individual sensor measurement error; For the first Installation coordinates of each sensor For the first Three-dimensional installation angle deviation of each sensor; ( ) is the error function.

5. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 4, characterized in that: S3 includes the following steps: S31. Identify the sources of measurement error and calculate the total error. The formula for calculating the total error is as follows: in, This is due to installation position deviation; This is due to the installation angle deviation; The elastic constant of the micromechanical structure; For circuit noise and environmental interference; S32. Measure the electric field strength for each sensor unit in the array. ,i With real electric field ,i The error between them can be expressed as: Considering installation angle deviation : in, Other errors; The upper bound of the total error for the entire array can be expressed as: in, This represents the total number of array cells; S33. Use finite element simulation to simulate the electric field measurement results under different installation deviations and obtain the error distribution. ( , , , ); The simulation results were verified through actual experimental measurements, and the error function was fitted. in, This is the fitting error function; These are the sensor position coordinates; This is due to the installation angle deviation; S34. Output signal for each sensor. Application error compensation: in, The output electric field strength after compensation; These are the original measured values; This is the fitting error function.

6. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 5, characterized in that: S3 further includes the following steps: S35, raw signals acquired by the array sensor Apply the compensation formula in real time.

7. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 6, characterized in that: S35 includes the following steps: The compensated array signal is spatially interpolated and filtered to generate a continuous two-dimensional or three-dimensional electric field distribution map inside the bus cavity. At each monitoring time point, the system determines whether the local electric field exceeds the preset threshold E. th If the value exceeds the limit, an abnormal alarm will be generated. If an abnormal electric field area is detected, an alarm message is immediately generated and transmitted to the monitoring system via the communication interface; If the electric field value does not exceed the threshold, the system continues to collect and compensate in a loop, forming a continuous and real-time monitoring and correction mechanism; Set the cycle period Δ With a data buffering mechanism, historical electric field data is stored in a database for trend analysis and predictive maintenance.

8. The method for constructing an electrostatically driven flexible electric field sensor array according to claim 7, characterized in that: The preset threshold E th Determined by one of the following methods: The maximum electric field intensity of the busbar under normal operating conditions was calculated using finite element simulation. Take the warning threshold ,in For safety factor; The limit value for the design field strength of GIS insulation, as specified in the reference standard, is denoted as... Take the warning threshold ; If it has been running for a period of time, calculate the average value of the electric field at each measuring point under normal operating conditions. At the same time, statistical standard deviation Take the warning threshold .

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it causes the processor to perform the steps of the method as described in any one of claims 1 to 8.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the computer program is executed by the processor, it causes the processor to perform the steps of the method as described in any one of claims 1 to 8.

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