A damper hinge assembly device and an assembly control method thereof

Abstract

The present application relates to a kind of buffer hinge assembly device and its assembly control method, belong to buffer hinge technical field, step one: in the control system of assembly equipment, the fixed time period that buffer piece contacts hinge before buffer piece completes assembly is defined as contact time;Step two: pressure sensor is arranged in the press head of assembly equipment, and make pressure sensor and control module electrically connected;Step three: start buffer hinge assembly, when program time and contact time period coincide, prepare to execute the process that buffer piece is installed on hinge, execute step four;Step four: pressure sensor real-time monitoring pressure of press head to buffer piece, and upload to control module, control module judges whether pressure exceeds pressure threshold range, and when exceeding threshold range, adjust the output of press head, when buffer piece is installed, return step three.

Description

Technical Field

[0001] This invention belongs to the field of buffer hinge technology, specifically relating to a buffer hinge assembly device and its assembly control method. Background Technology

[0002] A buffer hinge is a hinge device that achieves slow closing through hydraulic technology. The device consists of a hinge body and a buffer that slows down the opening and closing action of the hinge. It is mainly used for the connection of cabinet doors in furniture such as wardrobes or cabinets, so that the cabinet door begins to close slowly on its own when it is open at a certain angle, reducing impact force, ensuring smooth movement, and reducing noise.

[0003] In existing assembly processes, the hinge base is commonly formed by directly stamping or bending both ends to create a wrap-around fixation for the buffer cylinder. Because the buffer cylinder itself lacks high strength and rigidity, it is highly susceptible to deformation, displacement, or even breakage during stamping or bending due to localized stress concentration or mechanical extrusion, severely impacting product yield and the consistency of buffering performance. To address this, Chinese patent CN121468431A discloses a buffer hinge assembly device, including a sliding mechanism, a clamping assembly, and a forming part. A sliding member is slidably connected to the sliding mechanism, and the clamping assembly is connected to the top end face of the sliding member. The clamping end of the clamping assembly is detachably connected to two inclined and symmetrically arranged buffers. The two buffer plates are used to clamp the buffer cylinder. The bottom end face of the sliding member is vertically connected to two symmetrically arranged pressure columns. The forming part is located on the lower outer side of the pressure columns. By introducing flexible buffer plates into the clamping assembly and precisely embedding them between the buffer cylinder and the hinge base limiting part during the stamping and bending stage, direct rigid contact between the metal and the soft cylinder is avoided, significantly reducing the risk of deformation, cracking or performance degradation caused by extrusion and impact. As an energy-absorbing medium, the buffer plate effectively absorbs the instantaneous impact energy during bending and forming, improving the assembly quality of the hinge.

[0004] However, the above solutions mainly focus on how to precisely machine the hinge after pressing the buffer into it. When the buffer is mechanically pressed into the hinge, uneven force can easily damage the structure of the buffer, leading to jamming or oil leakage. If manual assembly is used, the quality is highly dependent on human feel. If this effect is to be achieved automatically, the installation force needs to be monitored in real time. Therefore, a buffer hinge assembly device and its assembly control method are needed to reduce the probability of damage during the assembly of the buffer and to precisely control the installation force. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, this invention provides a buffer hinge assembly device and its assembly control method, which features reduced probability of breakage during buffer assembly and precise control of installation force.

[0006] The objective of this invention can be achieved through the following technical solutions: A buffer hinge assembly device and its assembly control method include the following steps: Step 1: In the control system of the assembly equipment, the fixed time period from before the buffer component contacts the hinge to the completion of the buffer component assembly is defined as the contact time; Step 2: Install a pressure sensor on the pressing head of the assembly equipment and electrically connect the pressure sensor to the control module; Step 3: Begin assembling the buffer hinge. When the program time coincides with the contact time period, and the process of installing the buffer onto the hinge is about to begin, proceed to Step 4. Step 4: The pressure sensor monitors the pressure of the pressing head on the buffer in real time and uploads the data to the control module. The control module determines whether the pressure exceeds the pressure threshold range and adjusts the output force of the pressing head if it exceeds the threshold range. After the buffer is installed, return to Step 3.

[0007] As a preferred technical solution of the present invention, step one further includes: the control module pre-inputs a pressure threshold range [Y1, Y2], and step four further includes: the pressure sensor monitors the pressure Y of the pressing head on the buffer in real time and uploads it to the control module, and the control module instructs the output force of the pressing head to be adjusted to T1 times the standard pressure value Y0, where T1=1+[(Y1+Y2) / 2-Y] / Y0.

[0008] As a preferred technical solution of the present invention, it further includes step five: the control module determines the deviation between the position of the buffer component after assembly and the standard position through the monitoring module, and determines whether the deviation is greater than the threshold. When the determination result is yes, the control module shortens the contact time and instructs the pressure sensor to increase the sampling frequency.

[0009] As a preferred technical solution of the present invention, step five further includes: the control module determines the deviation value P between the position of the buffer component after assembly and the standard position through the monitoring module, the control module shortens the contact time to 1 / T2 times the original time, and instructs the sampling frequency of the pressure sensor to increase by T2 times, where T2=P / P0×d, and P0 is the deviation threshold.

[0010] As a preferred technical solution of the present invention, it also includes step six: the operator manually monitors whether the buffer component is leaking or deformed.

[0011] As a preferred embodiment of the present invention, step six further includes: when manual monitoring detects leakage or deformation of the buffer component, the control module records the contact time, pressure curve, and position deviation data of the assembly.

[0012] As a preferred embodiment of the present invention, step one further includes: the operator pre-setting the standard pressure value Y0 and the deviation threshold P0 according to the process requirements.

[0013] As a preferred embodiment of the present invention, step one further includes: the operator inputting the standard pressure value Y0 and the deviation threshold P0 into the control module.

[0014] The beneficial effects of this invention are as follows: (1) By defining the contact time as a fixed period from before the buffer contacts the hinge to the completion of the buffer assembly, and by performing pressure detection-based feedback and adjustment during the contact time, the pressure can be adjusted in time when it is too high or too low during the installation process. At the same time, by limiting the detection period to a fixed period from before the contact occurs to the completion of the buffer assembly, invalid sampling and misjudgment during the non-contact stage are avoided, and the accuracy of the data collection is improved. (2) By setting the control module to monitor the deviation between the position of the buffer after assembly and the standard position, and when the deviation exceeds the preset threshold, the contact time is shortened and the sampling frequency is increased. Thus, when the previous batch quality is poor and there is a probability that the pressure detection accuracy is insufficient, the proportion of the non-contact stage time is further shortened and the sampling frequency is increased. When no abnormality occurs normally, the sampling frequency is reduced, the life of the pressure sensor is extended, and the overall load of the system is reduced. Attached Figure Description

[0015] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the steps of the present invention. Detailed Implementation

[0017] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided.

[0018] Please see Figure 1 A buffer hinge assembly device and its assembly control method, comprising the following steps: Step 1: In the control system of the assembly equipment, the fixed time period from before the buffer component contacts the hinge to the completion of the buffer component assembly is defined as the contact time; Specifically, the assembly equipment includes a feeding device, a stamping device, and a press-fitting actuator for pressing the buffer into the hinge mounting position. The press-fitting actuator includes a press-fitting head, which integrates a pressure sensor. The assembly equipment is pre-written with a time-varying driver program that specifies a step to be performed within a certain time period, for example: 0:01~0:05, performing material handling; When needed, the control module reads the current running time within the program. When the running time coincides with the contact time period, the control module instructs the sensing module to start. Step 2: Install a pressure sensor on the pressing head of the assembly equipment and electrically connect the pressure sensor to the control module; Step 3: Begin assembling the buffer hinge. When the program time coincides with the contact time period, and the process of installing the buffer onto the hinge is about to begin, proceed to Step 4. Step 4: The pressure sensor monitors the pressure of the pressing head on the buffer in real time and uploads the data to the control module. The control module determines whether the pressure exceeds the pressure threshold range and adjusts the output force of the pressing head if it exceeds the threshold range. After the buffer is installed, return to Step 3.

[0019] Specifically, step one also includes: the control module pre-inputs a pressure threshold range [Y1, Y2], and step four also includes: the pressure sensor monitors the pressure Y of the pressing head on the buffer in real time and uploads it to the control module, and the control module instructs the output force of the pressing head to be adjusted to T1 times the standard pressure value Y0, where T1=1+[(Y1+Y2) / 2-Y] / Y0; (Y1+Y2) / 2 is the median of the range. When Y∈[Y1,Y2], T1=1, that is, the standard output is maintained. Y0 is the pre-input standard pressure value. Y1 and Y2 are the pre-input lower and upper limits of the pressure threshold, and satisfy Y1<Y2. Y1 and Y2 are set by the operator according to the process requirements and then input into the control module in step one. In this embodiment, Y1 is not less than 0.8Y0, and Y2 is not greater than 1.2Y0; When the value of Y is large and significantly exceeds Y2, it means that the pressure on the current pressing head is large. If the assembly is still carried out under large pressure, there is a probability of damaging the buffer. At this time, T1<1, the output of the pressing head is reduced, and T1 decreases linearly with the increase of Y to ensure that the output attenuation strictly corresponds to the degree of over-limit. When Y < Y1, T1 > 1, the output force of the press head is increased to T1 times to compensate for insufficient pre-pressure caused by poor contact or excessive initial gap. By defining the contact time as a fixed period from before the buffer contacts the hinge until the buffer is fully assembled, and by performing pressure-based feedback and adjustments during the contact time, timely adjustments can be made during installation if the pressure is too high or too low. At the same time, by limiting the detection period to a fixed period from before contact occurs until the buffer is fully assembled, invalid sampling and misjudgment during the non-contact phase are avoided, thus improving the accuracy of data collection.

[0020] In actual production, the quality observation results of the finished product are often used to feed back to the production section for adjustment. When the position of the buffer component after assembly deviates significantly from the standard position, it means that the assembly is not in place. The incomplete assembly may be due to the pressure head not accurately collecting the feedback force. In this case, it is necessary to improve the response sensitivity and data density of the pressure sensor. To this end, step five is also included: the control module uses the monitoring module to determine the deviation between the position of the assembled buffer and the standard position, and determines whether the deviation is greater than the threshold. When the determination result is yes, the control module shortens the contact time and instructs the pressure sensor to increase the sampling frequency. Specifically, the control module determines the deviation value P between the position of the buffer component after assembly and the standard position through the monitoring module. The control module shortens the contact time to 1 / T2 times the preset contact time and instructs the pressure sensor to increase the sampling frequency to T2 times the standard sampling frequency, where T2=P / P0×d, P0 is the deviation threshold, the standard sampling frequency is preset by the operator and input into the control module, and the control module instructs the pressure sensor to operate according to the current required sampling frequency. When P is large, causing T2 to be greater than 1, the contact time is shortened and the sampling frequency is increased to compress the invalid sampling interval; at the same time, the density of pressure data points per unit time is increased to enhance the ability to capture transient pressure changes. When P is small, there is no need to increase the sampling frequency too much. When T2 < 1, the contact time is moderately extended to enhance the coverage of the pressure stabilization zone. By setting the control module and monitoring module to determine the deviation between the position of the buffer component after assembly and the standard position, and when the deviation exceeds the preset threshold, the contact time is shortened and the sampling frequency is increased. In cases where the quality of previous batches is poor and there is a probability that the pressure detection accuracy is insufficient, the non-contact stage time is further shortened and the sampling frequency is increased. In normal cases where no abnormalities occur, the sampling frequency is reduced, thus extending the life of the pressure sensor and reducing the overall system load.

[0021] Although a dynamic sampling frequency adjustment mechanism is introduced to form a closed-loop feedback control loop, there is still a probability that the buffer component will be damaged during the pressing process due to factors such as material batch differences. Therefore, step six is ​​also included: the operator manually monitors whether the buffer component is leaking or deformed. In step six, when leakage or deformation is detected, feedback needs to be sent to the production section for further improvement. Therefore, step six also includes: when manual monitoring detects leakage or deformation in the buffer component, the control module records the contact time, pressure curve, and position deviation data of this assembly.

[0022] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A buffer hinge assembly device and its assembly control method, characterized in that: Includes the following steps: Step 1: In the control system of the assembly equipment, the fixed time period from before the buffer component contacts the hinge to the completion of the buffer component assembly is defined as the contact time; Step 2: Install a pressure sensor on the pressing head of the assembly equipment and electrically connect the pressure sensor to the control module; Step 3: Begin assembling the buffer hinge. When the program time coincides with the contact time period, and the process of installing the buffer onto the hinge is about to begin, proceed to Step 4. Step 4: The pressure sensor monitors the pressure of the pressing head on the buffer in real time and uploads the data to the control module. The control module determines whether the pressure exceeds the pressure threshold range and adjusts the output force of the pressing head if it exceeds the threshold range. After the buffer is installed, return to Step 3.

2. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: Step one further includes: the control module pre-inputs a pressure threshold range [Y1, Y2], and step four further includes: the pressure sensor monitors the pressure Y of the pressing head on the buffer in real time and uploads it to the control module, and the control module instructs the output force of the pressing head to be adjusted to T1 times the standard pressure value Y0, where T1=1+[(Y1+Y2) / 2-Y] / Y0.

3. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: The fifth step involves the control module using the monitoring module to determine the deviation between the assembled position of the buffer component and the standard position, and to determine whether the deviation is greater than a threshold. If the determination result is yes, the control module will shorten the contact time and instruct the pressure sensor to increase the sampling frequency.

4. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: Step five further includes: the control module determines the deviation value P between the position of the buffer component after assembly and the standard position through the monitoring module, the control module shortens the contact time to 1 / T2 times the preset contact time, and instructs the sampling frequency of the pressure sensor to increase by T2 times, where T2=P / P0×d, and P0 is the deviation threshold.

5. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: It also includes step six: the operator manually monitors the buffer components for leakage or deformation.

6. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: Step six also includes: when manual monitoring detects leakage or deformation of the buffer component, the control module records the contact time, pressure curve, and position deviation data of this assembly.

7. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: Step one also includes: the operator pre-setting the standard pressure value Y0 and the deviation threshold P0 according to the process requirements.

8. The buffer hinge assembly device and its assembly control method according to claim 1, characterized in that: Step one also includes: the operator inputting the standard pressure value Y0 and the deviation threshold P0 into the control module.

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