Circuit board and display device

Abstract

A circuit board and a display device. The circuit board comprises a base layer, a wiring layer located on one side of the base layer; the wiring layer comprises a plurality of signal lines, the plurality of signal lines are arranged along a first direction and extend along a second direction, the first direction and the second direction intersect; the signal lines comprise a wiring portion, a transition portion and a connecting portion, and are sequentially arranged along the second direction; the signal lines comprise a first signal line, a second signal line and a third signal line, the first signal line and the second signal line are adjacent, and the signal sizes of the first signal line and the second signal line are the same and the phases are opposite; a first shielding layer is located on a side of the wiring layer away from the base layer; the first shielding layer covers the wiring portion and part of the transition portion, the first shielding layer and the connecting portion do not overlap in the orthographic projection on the base layer; a first edge of the first shielding layer located in the region of the transition portion comprises a straight line segment and an arc line segment, the straight line segment is at least perpendicular to and intersects the orthographic projection of the first signal line and the second signal line on the base layer; the arc line segment intersects the orthographic projection of at least part of the third signal line on the base layer.

Description

Technical Field

[0001] This disclosure pertains to the field of display technology, specifically relating to a circuit board and a display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) displays have attracted widespread attention due to their advantages such as self-illumination, low power consumption, thinness, flexibility, vibrant colors, high contrast, and fast response speed. Summary of the Invention

[0003] In a first aspect, embodiments of this disclosure provide a circuit board, wherein the circuit board includes a base layer.

[0004] The wiring layer is located on one side of the base layer;

[0005] The routing layer includes multiple signal lines, which are arranged along a first direction and extend along a second direction, wherein the first direction and the second direction intersect.

[0006] The signal line includes a trace portion, a transition portion, and a connecting portion, which are arranged sequentially along the second direction and are electrically connected in sequence.

[0007] The signal lines include a first signal line, a second signal line, and a third signal line. The first signal line and the second signal line are adjacent to each other, and their signal magnitudes are the same but their phases are opposite.

[0008] A first shielding layer is located on the side of the wiring layer opposite to the base layer; the first shielding layer covers the wiring portion and extends to cover a portion of the transition portion; the orthographic projections of the first shielding layer and the connection portion on the base layer do not overlap.

[0009] The first edge of the first shielding layer located in the area where the transition portion is located includes a straight segment and an arc segment. The straight segment is at least perpendicular to and intersects the orthographic projections of the first signal line and the second signal line on the base layer. The arc segment intersects at least a portion of the orthographic projections of the third signal line on the base layer.

[0010] In some embodiments, the number of the first signal line, the second signal line, and the third signal line are each multiple;

[0011] The adjacent first signal line and second signal line form a first group.

[0012] A third signal line is distributed between any two adjacent pairs of the first group along the first direction.

[0013] The first group and the third signal line located between adjacent first groups are arranged alternately along the first direction to form a second group;

[0014] The straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of the second group onto the base layer.

[0015] In some embodiments, the second group has multiple third signal lines distributed on opposite sides along the first direction.

[0016] The arc segment includes two wavy segments. One wavy segment intersects the orthographic projection of multiple third signal lines located on one side of the second group on the base layer, and the other wavy segment intersects the orthographic projection of multiple third signal lines located on the other side of the second group on the base layer.

[0017] The wavy line segment and the straight line segment are connected sequentially along the first direction.

[0018] In some embodiments, the second group has multiple third signal lines distributed along one side of the first direction.

[0019] The arc segment includes a wavy segment, which intersects with the orthographic projection of multiple third signal lines located on one side of the second group onto the base layer.

[0020] The wavy line segment is connected to the straight line segment along the first direction.

[0021] In some embodiments, the number of the second group is at least two, and multiple third signal lines are distributed between any two adjacent second groups.

[0022] The third signal lines located between two adjacent second groups constitute a third group.

[0023] The number of the straight segments is at least two, and one of the straight segments corresponds to and intersects the orthographic projection of the extension direction of the second group on the base layer;

[0024] The arc segment includes at least one wavy segment, and one of the wavy segments corresponds to the orthographic projection of the extension direction of the third group onto the base layer;

[0025] The straight line segment and the wavy line segment are connected sequentially along the first direction.

[0026] In some embodiments, the connection point between the straight line segment and the wavy line segment is arc-shaped.

[0027] In some embodiments, the first direction is perpendicular to the second direction, and the wave segment oscillates along the second direction.

[0028] The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction.

[0029] The orthographic projection of the straight line segment in the second direction lies within the range of the wave segment along the second direction and the range of the wave segment along the second direction at a first distance above and below.

[0030] The distance between the top of the straight line segment and the peak of the wave crest is greater than or equal to 0 and less than or equal to twice the first distance;

[0031] The distance between the straight line segment and the bottom of the trough is greater than or equal to 0 and less than or equal to twice the first distance;

[0032] The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

[0033] In some embodiments, the first direction is perpendicular to the second direction, and the wave segment oscillates along the second direction.

[0034] The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction.

[0035] The straight line segment includes a first straight line segment and a second straight line segment.

[0036] The first straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of one of the two adjacent second groups on the base layer, and the second straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of the other of the two adjacent second groups on the base layer.

[0037] The first line segment and the second line segment are not on the same line, and the first line segment and the second line segment are parallel to each other.

[0038] In some embodiments, the length of the first straight line segment is less than the orthographic projection length of the wavy line segment in the first direction.

[0039] And / or, the length of the second straight line segment is less than the orthographic projection length of the wavy line segment in the first direction;

[0040] The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the fluctuation range of the wave segment along the second direction;

[0041] The distance between the first line segment and the second line segment is greater than 0 and less than or equal to 1 / 2 of the first distance;

[0042] The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

[0043] In some embodiments, the length of the first straight line segment is equal to the orthographic projection length of the wavy line segment in the first direction.

[0044] And / or, the length of the second straight line segment is equal to the orthographic projection length of the wavy line segment in the first direction;

[0045] The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the fluctuation range of the wave segment along the second direction;

[0046] The distance between the first line segment and the second line segment is greater than 0 and less than or equal to the first distance;

[0047] The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

[0048] In some embodiments, the length of the first straight line segment is greater than the orthographic projection length of the wavy line segment in the first direction.

[0049] And / or, the length of the second straight line segment is greater than the orthographic projection length of the wavy line segment in the first direction;

[0050] The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the range of the wave segment along the second direction and the range of the wave segment along the second direction at a first distance above and below;

[0051] The distance between the first line segment and the second line segment is greater than 0 and less than or equal to 3 times the first distance;

[0052] The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

[0053] In some embodiments, the first direction is perpendicular to the second direction; the wave segment oscillates along the second direction.

[0054] The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction.

[0055] The multiple wave peaks have the same height, the multiple wave troughs have the same depth, and the height of the wave peaks and the depth of the wave troughs are the same.

[0056] In some embodiments, the peaks and troughs have the same maximum width along the first direction.

[0057] The maximum width of the wave crest along the first direction is 1 / 6 to 1 / 5 of the width of the base layer region where the transition portion is located along the first direction.

[0058] In some embodiments, the height of the crest is 1 / 2 to 1 of the maximum width of the crest along the first direction.

[0059] In some embodiments, the shape of the wavy line segment includes a sine wave shape.

[0060] In some embodiments, the arc segment includes multiple circular arc sub-segments.

[0061] The multiple arc segments are connected sequentially, and the connection position of any two arc segments forms an arc shape.

[0062] In some embodiments, the first direction is perpendicular to the second direction.

[0063] The arc segment includes a wavy segment that undulates along the second direction.

[0064] The straight line segment is parallel to the boundary line between the transition section and the wiring section, and the distance between the straight line segment and the boundary line between the transition section and the wiring section is greater than or equal to 0 and less than or equal to the extension length of the transition section along the second direction;

[0065] The extension length of the transition section along the second direction is equal to the maximum fluctuation amplitude of the wave segment along the second direction.

[0066] Alternatively, the length of the transition portion along the second direction is equal to three times the maximum fluctuation amplitude of the wave segment along the second direction.

[0067] In some embodiments, the extension length of the transition portion along the second direction is less than or equal to the extension length of the connecting portion along the second direction.

[0068] The extension length of the connecting portion along the second direction is less than the extension length of the wiring portion along the second direction.

[0069] In some embodiments, a second shielding layer is further included, located on the side of the base layer opposite to the wiring layer.

[0070] The orthographic projection of the second shielding layer on the base layer covers the orthographic projection of the wiring portion on the base layer, and the orthographic projection of the second shielding layer on the base layer also extends to cover the orthographic projection of the transition portion on the base layer. The orthographic projections of the second shielding layer and the connection portion on the base layer do not overlap.

[0071] The second edge of the second shielding layer located in the area where the transition portion is located includes a straight portion and an arc portion. The straight portion is at least perpendicular to and intersects the orthographic projections of the first signal line and the second signal line on the substrate. The arc portion intersects at least a portion of the orthographic projections of the third signal line on the substrate.

[0072] In some embodiments, the orthographic projections of the straight section and the straight segment onto the base layer coincide.

[0073] The curved portion and the curved segment have their orthographic projections on the base layer coincide.

[0074] Secondly, embodiments of this disclosure also provide a display device, which includes a display module and a main circuit board, and further includes the aforementioned circuit board.

[0075] The end of the trace portion of the circuit board that is away from the transition portion is bound to the display module, and the end of the connection portion that is away from the transition portion is bound to the main circuit board.

[0076] The circuit board provided in this embodiment ensures that the first shielding layer covers the MIPI differential signal line formed by the first signal line and the second signal line with the same coverage length by making the straight segment of the first edge of the first shielding layer perpendicular to and intersecting the orthographic projection of the first signal line and the second signal line on the substrate. This avoids problems such as discontinuity, signal distortion, and packet loss in the MIPI signal during communication and ensures signal stability in the MIPI differential signal line. At the same time, by making the arc segment intersect with the orthographic projection of at least part of the third signal line on the substrate, the bending stress on the first edge of the first shielding layer can be dispersed when bending in the transition area, thereby improving the fracture resistance of the first edge of the first shielding layer.

[0077] The embodiments of this disclosure, by employing the circuit board described in the above embodiments, can improve the electromagnetic interference resistance and fracture resistance of the display device, thereby enhancing the quality of the display device. Attached Figure Description

[0078] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0079] Figure 1a This is a top view of a flexible printed circuit board connected to a display panel in related technologies.

[0080] Figure 1b for Figure 1aAn enlarged schematic diagram of part A in the middle.

[0081] Figure 2 This is a schematic diagram of the data loss waveform in MIPI differential pairs.

[0082] Figure 3a This is a top view of the structure of a circuit board according to an embodiment of this disclosure.

[0083] Figure 3b for Figure 3a Enlarged diagram of part B.

[0084] Figure 3c For along Figure 3b A structural sectional view along the CC' section line.

[0085] Figure 4a This is a top view of the structure of another circuit board in an embodiment of this disclosure.

[0086] Figure 4b for Figure 4a An enlarged schematic diagram of section G in the middle.

[0087] Figure 5a This is a top view of the structure of another circuit board in an embodiment of this disclosure.

[0088] Figure 5b for Figure 5a Enlarged schematic diagram of section H in the middle.

[0089] Figure 6 This is a schematic diagram showing the connection positions of straight line segments and wavy line segments in an embodiment of this disclosure.

[0090] Figure 7a This is a schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure.

[0091] Figure 7b This is another schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure.

[0092] Figure 7c This is another schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure.

[0093] Figure 8 This is another schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure. Detailed Implementation

[0094] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the circuit board and display device provided in the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0095] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0096] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas, but are not intended to be limiting.

[0097] In related technologies, refer to Figure 1a This is a top view schematic diagram of a flexible printed circuit board connected to a display panel in related technologies; Figure 1b for Figure 1a Enlarged schematic diagram of part A; Currently, the outer layer of the FPC (Flexible Printed Circuit Board 6) of OLED screens is covered with an EMI (Electromagnetic Interference) shielding film 7 to prevent external electromagnetic interference. The FPC includes a main body 61 and a connector 62 disposed at one end of the main body 61. The main body 61 is used for bonding and connecting to the OLED display panel 5, and the connector 62 is used for bonding and connecting to the motherboard. The EMI shielding film 7 covers the main body 61 of the FPC, but does not cover the connector 62, so that the connector 62 is exposed for bonding and connecting to the motherboard. The coverage boundary Q of the EMI shielding film 7 is located at the neck position of the connector 62 (i.e., the connection position between the connector 62 and the main body 61).

[0098] To avoid stress concentration and breakage of the EMI shielding film 7 during bending, the coverage boundary Q of the EMI shielding film 7 located at the neck position is currently wavy to disperse the bending stress on the coverage boundary Q of the EMI shielding film 7 during bending at the neck position.

[0099] At the neck of connector 62, due to the different coverage lengths of the EMI shielding film 7 with the wavy coverage boundary Q on the same group of MIPI differential signal lines (serial communication interface, mainly used in mobile devices and embedded systems, where there are two signal lines in the same group of MIPI differential signal lines, and the signals in the two signal lines in the same group are of the same magnitude but opposite in phase) 8, the MIPI signal in the MIPI differential signal line 8 is discontinuous during communication. Especially in environments with strong electronic interference, this can easily cause problems such as partial signal distortion and packet loss in the MIPI data packets. (Refer to...) Figure 2 This is a schematic diagram of the data loss waveform in MIPI differential pairs.

[0100] To address the problems in the related art, in a first aspect, embodiments of this disclosure provide a circuit board, with reference to... Figure 3a This is a top view of the structure of a circuit board in an embodiment of this disclosure; Figure 3b for Figure 3a Enlarged schematic diagram of part B in the middle; Figure 3c For along Figure 3b A cross-sectional view of the structure along the CC' section line; wherein, the circuit board includes a base layer 1 and a wiring layer 2 located on one side of the base layer 1; the wiring layer 2 includes multiple signal lines, which are arranged along a first direction X and extend along a second direction Y, with the first direction X and the second direction Y intersecting; each signal line includes a wiring portion 21, a transition portion 22, and a connecting portion 23, which are arranged sequentially along the second direction Y and electrically connected sequentially; the signal lines include a first signal line 201, a second signal line 202, and a third signal line 203, with the first signal line 201 and the second signal line 202 adjacent to each other. The signals are of the same magnitude but opposite phase; the first shielding layer 3 is located on the side of the wiring layer 2 away from the base layer 1; the first shielding layer 3 covers the wiring portion 21, and the first shielding layer 3 also extends to cover the transition portion 22, the orthographic projections of the first shielding layer 3 and the connecting portion 23 on the base layer 1 do not overlap; the first edge S of the first shielding layer 3 located in the area where the transition portion 22 is located includes a straight segment 31 and an arc segment 32, the straight segment 31 is at least perpendicular to and intersects the orthographic projections of the first signal line 201 and the second signal line 202 on the base layer 1; the arc segment 32 intersects the orthographic projection of at least a portion of the third signal line 203 on the base layer 1.

[0101] The circuit board is a flexible circuit board, which enables the bonding connection between the display panel (such as an OLED display panel) 5 and the motherboard. The first shielding layer 3 provides electromagnetic shielding for the wiring layer 2, preventing signals in the wiring layer 2 from being affected by external electromagnetic interference. An adjacent first signal line 201 and a second signal line 202 can form a set of MIPI differential signal lines. The third signal line 203 can be a power signal line such as AVDD or DVDD, or other system signal lines that enable communication between the display panel and the motherboard.

[0102] In this embodiment, by making the straight segment 31 of the first edge S of the first shielding layer 3 perpendicular to and intersecting the orthographic projections of the first signal line 201 and the second signal line 202 on the base layer 1, it can be ensured that the first shielding layer 3 covers the MIPI differential signal line formed by the first signal line 201 and the second signal line 202 with the same length, thereby avoiding problems such as discontinuity, signal distortion, and packet loss in the MIPI signal during communication and ensuring the stability of the signal in the MIPI differential signal line; at the same time, by making the arc segment 32 intersect with the orthographic projection of at least part of the third signal line 203 on the base layer 1, the bending stress on the first edge S of the first shielding layer 3 located in the area of ​​the transition part 22 can be dispersed when bending in the area of ​​the transition part 22, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0103] In some embodiments, there are multiple first signal lines 201, second signal lines 202, and third signal lines 203; adjacent first signal lines 201 and second signal lines 202 constitute a first group D; a third signal line 203 is distributed between any two adjacent first groups D along the first direction X; the first groups D and the third signal lines 203 located between adjacent first groups D are arranged alternately along the first direction X to form a second group E; the straight line segment 31 is perpendicular to and intersects the orthographic projection of the extension direction of the second group E on the base layer 1.

[0104] The third signal line 203 between adjacent first groups D can shield the signals of two adjacent first groups D, further improving or avoiding signal interference between adjacent first groups D. By making the straight line segment 31 perpendicular to and intersecting the orthographic projection of the extension direction of the second group E on the base layer 1, it can be ensured that the first shielding layer 3 covers the same length of MIPI differential signal lines of multiple first groups D, thereby avoiding problems such as discontinuity, signal distortion, and packet loss in the MIPI signal lines during communication.

[0105] In some embodiments, refer to Figure 3a and Figure 3b The second group E has multiple third signal lines 203 distributed on opposite sides along the first direction X. The arc segment 32 includes two wavy segments. One wavy segment intersects the orthographic projection of the multiple third signal lines 203 on one side of the second group E onto the base layer 1, and the other wavy segment intersects the orthographic projection of the multiple third signal lines 203 on the other side of the second group E onto the base layer 1. The wavy segments and straight segments 31 are connected sequentially along the first direction X.

[0106] The second group E is distributed in the middle area of ​​multiple third signal lines 203 on both sides of the first direction X. The wavy line segment of the first edge S of the first shielding layer 3 can disperse the bending stress on the first edge S of the first shielding layer 3 located in the transition part 22 when it is bent, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0107] In some embodiments, refer to Figure 4a This is a top view of another circuit board structure in an embodiment of this disclosure; Figure 4b for Figure 4a Enlarged schematic diagram of part G in the middle; multiple third signal lines 203 are distributed on one side of the second group E along the first direction X. The arc segment 32 includes a wavy line segment. The wavy line segment intersects the orthographic projection of the multiple third signal lines 203 located on one side of the second group E on the base layer 1. The wavy line segment is connected to the straight line segment 31 along the first direction X.

[0108] The second group E is distributed on one side of the region of multiple third signal lines 203 along the first direction X. The wavy line segment of the first edge S of the first shielding layer 3 can disperse the bending stress on the first edge S of the first shielding layer 3 located in the region of the transition 22 when it is bent, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0109] In some embodiments, refer to Figure 5a This is a top view of another circuit board structure in an embodiment of this disclosure; Figure 5b for Figure 5a Enlarged schematic diagram of part H; the number of second groups E is at least two, and multiple third signal lines 203 are distributed between any two adjacent second groups E. The multiple third signal lines 203 located between two adjacent second groups E constitute the third group F. The number of straight line segments 31 is at least two. One straight line segment 31 corresponds to the orthographic projection of the extension direction of one second group E on the base layer 1 perpendicular to and intersects it. The arc segment 32 includes at least one wavy line segment. One wavy line segment corresponds to the orthographic projection of the extension direction of one third group F on the base layer 1. The straight line segment 31 and the wavy line segment are connected sequentially along the first direction X.

[0110] The third group F is distributed in the region between adjacent second groups E along the first direction X. By making a straight line segment 31 perpendicular to and intersecting the orthographic projection of the extension direction of a second group E on the base layer 1, it can be ensured that the first shielding layer 3 covers the same length of MIPI differential signal lines of multiple first groups D, thereby avoiding problems such as discontinuity, signal distortion, and packet loss in the MIPI signals during communication. By making a wavy line segment intersect the orthographic projection of the extension direction of a third group F on the base layer 1, the bending stress on the first edge S of the first shielding layer 3 located in the transition section 22 region can be dispersed when bending in the transition section 22 region, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0111] In some embodiments, the connection point between the straight segment 31 and the wavy segment is arc-shaped. This arrangement avoids stress concentration at the connection point between the straight segment 31 and the wavy segment, thereby dispersing the bending stress at the connection point when bending in the area where the transition portion 22 is located, and improving the fracture resistance of the connection point between the straight segment 31 and the wavy segment.

[0112] In some embodiments, refer to Figure 6 This is a schematic diagram showing the connection position of the straight line segment and the wavy line segment in this embodiment of the present disclosure; the first direction X is perpendicular to the second direction Y, the wavy line segment fluctuates along the second direction Y, the wavy line segment includes multiple wave peaks P and multiple wave troughs O, the wave peaks P and wave troughs O are arranged alternately along the first direction X; the orthographic projection of the straight line segment 31 on the second direction Y is located within the fluctuation range of the wavy line segment along the second direction Y and within the range of the fluctuation range along the second direction Y by a first distance h; the distance between the straight line segment 31 and the peak of the wave peak P is greater than or equal to 0 and less than or equal to twice the first distance h; the distance between the straight line segment 31 and the bottom of the wave trough O is greater than or equal to 0 and less than or equal to twice the first distance h; the first distance h is the maximum distance between the peak of the wave peak P and the bottom of the wave trough O along the second direction Y.

[0113] The amplitude of the undulations at different positions of the wavy line segment can be the same or different, and the wavy line segment is arc-shaped at any position. This configuration can disperse the bending stress on the entire first edge S of the first shielding layer 3 located in the transition section 22 region when bending, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0114] In some embodiments, refer to Figure 7a This is a schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure; Figure 7b This is another schematic diagram of the first edge of the first shielding layer in an embodiment of this disclosure; Figure 7cThis is another schematic diagram of the first edge of the first shielding layer in this embodiment; wherein, the first direction X is perpendicular to the second direction Y, the wavy line segment undulates along the second direction Y, the wavy line segment includes multiple wave crests P and multiple wave troughs O, the wave crests P and wave troughs O are arranged alternately along the first direction X; the straight line segment 31 includes a first straight line segment 311 and a second straight line segment 312, the first straight line segment 311 is perpendicular to and intersects the orthographic projection of the extension direction of one of the two adjacent second groups E on the base layer 1, the second straight line segment 312 is perpendicular to and intersects the orthographic projection of the extension direction of the other of the two adjacent second groups E on the base layer 1; the first straight line segment 311 and the second straight line segment 312 are not on the same straight line, and the first straight line segment 311 and the second straight line segment 312 are parallel to each other.

[0115] In this context, the extension direction of the second group E is the second direction Y. When the distribution width of the second group E along the first direction X is large, the proportion of the length of the straight segment 31 of the first edge S of the first shielding layer 3 located in the transition region 22 increases, while the proportion of the length of the wavy segment decreases, which easily leads to a weakening of the ability of the wavy segment to disperse bending stress. By making the first straight segment 311 and the second straight segment 312 not on the same straight line, and by creating a gradient difference L between the first straight segment 311 and the second straight segment 312 in the second direction Y, the stress concentration of the first straight segment 311 and the second straight segment 312 can be avoided on the same straight line. At the same time, the bending stress experienced by the first straight segment 311 and the second straight segment 312 can be transferred to the connection position with the wavy segment, thereby reducing stress concentration and improving the fracture resistance of the first edge S of the first shielding layer 3.

[0116] In some embodiments, refer to Figure 7a The length of the first straight line segment 311 is less than the orthographic projection length of the wavy line segment in the first direction X, and / or the length of the second straight line segment 312 is less than the orthographic projection length of the wavy line segment in the first direction X; the orthographic projections of the first straight line segment 311 and the second straight line segment 312 in the second direction Y are located within the fluctuation range of the wavy line segment along the second direction Y; the distance between the first straight line segment 311 and the second straight line segment 312 is greater than 0 and less than or equal to 1 / 2 of the first distance h; the first distance h is the maximum distance along the second direction Y between the peak of the wave crest P and the trough of the wave trough O.

[0117] Wherein, the gradient difference L formed by the first straight line segment 311 and the second straight line segment 312 in the second direction Y is greater than 0 and less than or equal to 1 / 2 of the first distance h. With this setting, when the length of the first straight line segment 311 and / or the second straight line segment 312 is less than the orthogonal projection length of the wavy line segment in the first direction X, the stress of the first straight line segment 311 and the second straight line segment 312 is prevented from being concentrated on the same straight line. At the same time, the bending stress of the first straight line segment 311 and the second straight line segment 312 is transferred to the connection position with the wavy line segment, thereby reducing the stress concentration phenomenon and improving the fracture resistance of the first edge S of the first shielding layer 3.

[0118] In some embodiments, refer to Figure 7b The length of the first straight line segment 311 is equal to the orthographic projection length of the wavy line segment in the first direction X, and / or the length of the second straight line segment 312 is equal to the orthographic projection length of the wavy line segment in the first direction X; the orthographic projections of the first straight line segment 311 and the second straight line segment 312 in the second direction Y are located within the fluctuation range of the wavy line segment along the second direction Y; the distance between the first straight line segment 311 and the second straight line segment 312 is greater than 0 and less than or equal to the first distance h; the first distance h is the maximum distance along the second direction Y between the peak of the wave crest P and the trough of the wave trough O.

[0119] Wherein, the gradient difference L formed by the first straight line segment 311 and the second straight line segment 312 in the second direction Y is greater than 0 and less than or equal to the first distance h. With this setting, when the length of the first straight line segment 311 and / or the second straight line segment 312 is equal to the orthogonal projection length of the wavy line segment in the first direction X, the stress of the first straight line segment 311 and the second straight line segment 312 is prevented from being concentrated on the same straight line. At the same time, the bending stress of the first straight line segment 311 and the second straight line segment 312 is transferred to the connection position with the wavy line segment, thereby reducing the stress concentration phenomenon and improving the fracture resistance of the first edge S of the first shielding layer 3.

[0120] In some embodiments, refer to Figure 7c The length of the first straight line segment 311 is greater than the orthographic projection length of the wavy line segment in the first direction X, and / or the length of the second straight line segment 312 is greater than the orthographic projection length of the wavy line segment in the first direction X; the orthographic projections of the first straight line segment 311 and the second straight line segment 312 in the second direction Y are located within the fluctuation range of the wavy line segment along the second direction Y and within the fluctuation range within a first distance h along the second direction Y; the distance between the first straight line segment 311 and the second straight line segment 312 is greater than 0 and less than or equal to 3 times the first distance h; the first distance h is the maximum distance along the second direction Y between the peak of the wave crest P and the trough of the wave trough O.

[0121] Wherein, the gradient difference L formed by the first straight line segment 311 and the second straight line segment 312 in the second direction Y is greater than 0 and less than or equal to 3 times the first distance h. With this setting, when the length of the first straight line segment 311 and / or the second straight line segment 312 is greater than the orthogonal projection length of the wavy line segment in the first direction X, the stress of the first straight line segment 311 and the second straight line segment 312 is prevented from being concentrated on the same straight line. At the same time, the bending stress of the first straight line segment 311 and the second straight line segment 312 is transferred to the connection position with the wavy line segment, thereby reducing the stress concentration phenomenon and improving the fracture resistance of the first edge S of the first shielding layer 3.

[0122] In some embodiments, refer to Figure 8 This is another schematic diagram of the first edge of the first shielding layer in this embodiment; the first direction X is perpendicular to the second direction Y; the wavy line segment undulates along the second direction Y, and the wavy line segment includes multiple wave peaks P and multiple wave troughs O, with the wave peaks P and wave troughs O arranged alternately along the first direction X; the height h1 of the multiple wave peaks P is the same, the depth h2 of the multiple wave troughs O is the same, and the height h1 of the wave peaks P and the depth h2 of the wave troughs O are the same. This configuration can uniformly distribute the bending stress on the first edge S of the first shielding layer 3, improving the fracture resistance of the first edge S of the first shielding layer 3.

[0123] In some embodiments, refer to Figure 8 The maximum width m of the peak P and the trough O along the first direction X is the same. The maximum width m of the peak P along the first direction X is 1 / 6 to 1 / 5 of the width M of the base layer 1 region where the transition part 22 is located along the first direction X.

[0124] In some embodiments, refer to Figure 8 The height h1 of the wave crest P is 1 / 2 to 1 of the maximum width m of the wave crest P along the first direction X.

[0125] Figure 8 The wavy line segment structure ensures that the wavy line segment is sufficient to disperse the bending stress on the first edge S of the first shielding layer 3, thereby improving the fracture resistance of the first edge S of the first shielding layer 3.

[0126] In some embodiments, the shape of the wavy line segment includes a sine wave shape.

[0127] In some embodiments, the arc segment 32 includes multiple circular arc sub-segments, which are connected sequentially, and the connection position of any two circular arc segments is in the shape of a circular arc.

[0128] This design avoids stress concentration at the connection points of the arc sub-segments, thereby better dispersing the bending stress at the connection points of the arc sub-segments. At the same time, the arc-shaped arc segment 32 can better disperse the bending stress of the first edge S of the first shielding layer 3, improving the fracture resistance of the first edge S of the first shielding layer 3.

[0129] In some embodiments, refer to Figure 3b , Figure 4b as well as Figure 5b The first direction X is perpendicular to the second direction Y. The arc segment 32 includes a wavy segment that undulates along the second direction Y. The straight segment 31 is parallel to the boundary line Z of the transition section 22 and the wiring section 21. The distance between the straight segment 31 and the boundary line Z of the transition section 22 and the wiring section 21 is greater than or equal to 0 and less than or equal to the extension length of the transition section 22 along the second direction Y. The extension length of the transition section 22 along the second direction Y is equal to the maximum fluctuation amplitude of the wavy segment along the second direction Y. Alternatively, the extension length of the transition section 22 along the second direction Y is equal to 3 times the maximum fluctuation amplitude of the wavy segment along the second direction Y.

[0130] The maximum fluctuation amplitude of the wave segment is the first distance h. The extension length of the transition section 22 along the second direction Y is actually the distribution length of the first edge S of the first shielding layer 3 along the second direction Y.

[0131] In some embodiments, the extension length of the transition portion 22 along the second direction Y is less than or equal to the extension length of the connecting portion 23 along the second direction Y, and the extension length of the connecting portion 23 along the second direction Y is less than the extension length of the wiring portion 21 along the second direction Y.

[0132] In the display product, the connecting part 23 is used to bond and connect with the motherboard, and the transition part 22 will be subjected to bending stress during the bonding and connection process.

[0133] In some embodiments, refer to Figure 3c The circuit board also includes a second shielding layer 4, located on the side of the base layer 1 away from the trace layer 2. The orthographic projection of the second shielding layer 4 on the base layer 1 covers the orthographic projection of the trace portion 21 on the base layer 1. The orthographic projection of the second shielding layer 4 on the base layer 1 also extends to cover the orthographic projection of the transition portion 22 on the base layer 1. The orthographic projections of the second shielding layer 4 and the connection portion 23 on the base layer 1 do not overlap. The second edge of the second shielding layer 4 located in the area where the transition portion 22 is located includes a straight portion and an arc portion (not shown in the figure). The straight portion is at least perpendicular to and intersects the orthographic projections of the first signal line 201 and the second signal line 202 on the base layer 1. The arc portion intersects at least a portion of the orthographic projection of the third signal line 203 on the base layer 1.

[0134] The first shielding layer 3 and the second shielding layer 4 can form double-sided electromagnetic shielding for the wiring layer 2, preventing the signals in the wiring layer 2 from being affected by external electromagnetic interference.

[0135] In this embodiment, by making the straight portion of the second edge of the second shielding layer 4 perpendicular to and intersecting the orthographic projections of the first signal line 201 and the second signal line 202 on the base layer 1, it can be ensured that the second shielding layer 4 covers the same length of the MIPI differential signal line formed by the first signal line 201 and the second signal line 202. This avoids problems such as discontinuity, signal distortion, and packet loss in the MIPI signal during communication, ensuring signal stability in the MIPI differential signal line. At the same time, by making the arc portion intersect with the orthographic projections of at least a portion of the third signal line 203 on the base layer 1, the bending stress on the second edge of the second shielding layer 4 can be dispersed when bending in the area where the transition portion 22 is located, thereby improving the fracture resistance of the second edge of the second shielding layer 4.

[0136] In some embodiments, the orthographic projections of the straight portion and the straight segment 31 on the base layer 1 coincide, and the orthographic projections of the curved portion and the curved segment 32 on the base layer 1 coincide. With this configuration, the first shielding layer 3 and the second shielding layer 4 can form better double-sided electromagnetic shielding for the wiring layer 2, preventing signals in the wiring layer 2 from being affected by external electromagnetic interference.

[0137] The circuit board provided in this embodiment ensures that the first shielding layer covers the MIPI differential signal line formed by the first signal line and the second signal line with the same coverage length by making the straight segment of the first edge of the first shielding layer perpendicular to and intersecting the orthographic projection of the first signal line and the second signal line on the substrate. This avoids problems such as discontinuity, signal distortion, and packet loss in the MIPI signal during communication and ensures signal stability in the MIPI differential signal line. At the same time, by making the arc segment intersect with the orthographic projection of at least part of the third signal line on the substrate, the bending stress on the first edge of the first shielding layer can be dispersed when bending in the transition area, thereby improving the fracture resistance of the first edge of the first shielding layer.

[0138] Secondly, embodiments of this disclosure provide a display device, which includes a display module and a main circuit board, and also includes the circuit board in the above embodiments, wherein one end of the trace portion of the circuit board away from the transition portion is bound to the display module, and one end of the connection portion away from the transition portion is bound to the main circuit board.

[0139] The circuit board is a flexible printed circuit board. When the connecting part of the circuit board is bonded to the main circuit board, the transition part will be subjected to bending stress. The main circuit board can provide MIPI differential signals, power signals, and other system signals to the display module through the circuit board.

[0140] By using the circuit board in the above embodiments, the electromagnetic interference resistance and fracture resistance of the display device can be improved, thereby enhancing the quality of the display device.

[0141] The display device provided in this disclosure can be any product or component with display function, such as an OLED panel, OLED TV, OLED billboard, monitor, mobile phone, or navigator.

[0142] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A circuit board, wherein, Including the grassroots level, The wiring layer is located on one side of the base layer; The routing layer includes multiple signal lines, which are arranged along a first direction and extend along a second direction, wherein the first direction and the second direction intersect. The signal line includes a trace portion, a transition portion, and a connecting portion, which are arranged sequentially along the second direction and are electrically connected in sequence. The signal lines include a first signal line, a second signal line, and a third signal line. The first signal line and the second signal line are adjacent to each other, and their signal magnitudes are the same but their phases are opposite. A first shielding layer is located on the side of the wiring layer opposite to the base layer; the first shielding layer covers the wiring portion and extends to cover a portion of the transition portion; the orthographic projections of the first shielding layer and the connection portion on the base layer do not overlap. The first edge of the first shielding layer located in the area where the transition portion is located includes a straight segment and an arc segment. The straight segment is at least perpendicular to and intersects the orthographic projections of the first signal line and the second signal line on the base layer. The arc segment intersects at least a portion of the orthographic projections of the third signal line on the base layer.

2. The circuit board according to claim 1, wherein, The number of the first signal line, the second signal line, and the third signal line are each multiple; The adjacent first signal line and second signal line form a first group. A third signal line is distributed between any two adjacent pairs of the first group along the first direction. The first group and the third signal line located between adjacent first groups are arranged alternately along the first direction to form a second group; The straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of the second group onto the base layer.

3. The circuit board according to claim 2, wherein, The second group has multiple third signal lines distributed on opposite sides along the first direction. The arc segment includes two wavy segments. One wavy segment intersects the orthographic projection of multiple third signal lines located on one side of the second group on the base layer, and the other wavy segment intersects the orthographic projection of multiple third signal lines located on the other side of the second group on the base layer. The wavy line segment and the straight line segment are connected sequentially along the first direction.

4. The circuit board according to claim 2, wherein, The second group has multiple third signal lines distributed along one side of the first direction. The arc segment includes a wavy segment, which intersects with the orthographic projection of multiple third signal lines located on one side of the second group onto the base layer. The wavy line segment is connected to the straight line segment along the first direction.

5. The circuit board according to claim 2, wherein, The second group has at least two members, and multiple third signal lines are distributed between any two adjacent second groups. The third signal lines located between two adjacent second groups constitute a third group. The number of the straight segments is at least two, and one of the straight segments corresponds to and intersects the orthographic projection of the extension direction of the second group on the base layer; The arc segment includes at least one wavy segment, and one of the wavy segments corresponds to the orthographic projection of the extension direction of the third group onto the base layer; The straight line segment and the wavy line segment are connected sequentially along the first direction.

6. The circuit board according to any one of claims 3-5, wherein, The connection point between the straight line segment and the wavy line segment is arc-shaped.

7. The circuit board according to any one of claims 3-5, wherein, The first direction is perpendicular to the second direction, and the wave segment oscillates along the second direction. The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction. The orthographic projection of the straight line segment in the second direction lies within the range of the wave segment along the second direction and the range of the wave segment along the second direction at a first distance above and below. The distance between the top of the straight line segment and the peak of the wave crest is greater than or equal to 0 and less than or equal to twice the first distance; The distance between the straight line segment and the bottom of the trough is greater than or equal to 0 and less than or equal to twice the first distance; The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

8. The circuit board according to claim 5, wherein, The first direction is perpendicular to the second direction, and the wave segment oscillates along the second direction. The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction. The straight line segment includes a first straight line segment and a second straight line segment. The first straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of one of the two adjacent second groups on the base layer, and the second straight line segment is perpendicular to and intersects the orthographic projection of the extension direction of the other of the two adjacent second groups on the base layer. The first line segment and the second line segment are not on the same line, and the first line segment and the second line segment are parallel to each other.

9. The circuit board according to claim 8, wherein, The length of the first straight line segment is less than the orthographic projection length of the wavy line segment in the first direction. And / or, the length of the second straight line segment is less than the orthographic projection length of the wavy line segment in the first direction; The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the fluctuation range of the wave segment along the second direction; The distance between the first line segment and the second line segment is greater than 0 and less than or equal to 1 / 2 of the first distance; The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

10. The circuit board according to claim 8, wherein, The length of the first straight line segment is equal to the orthographic projection length of the wavy line segment in the first direction. And / or, the length of the second straight line segment is equal to the orthographic projection length of the wavy line segment in the first direction; The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the fluctuation range of the wave segment along the second direction; The distance between the first line segment and the second line segment is greater than 0 and less than or equal to the first distance; The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

11. The circuit board according to claim 8, wherein, The length of the first straight line segment is greater than the orthographic projection length of the wavy line segment in the first direction. And / or, the length of the second straight line segment is greater than the orthographic projection length of the wavy line segment in the first direction; The orthographic projections of the first straight line segment and the second straight line segment in the second direction are located within the range of the wave segment along the second direction and the range of the wave segment along the second direction at a first distance above and below; The distance between the first line segment and the second line segment is greater than 0 and less than or equal to 3 times the first distance; The first distance is the maximum distance between the peak of the wave crest and the bottom of the wave trough along the second direction.

12. The circuit board according to any one of claims 3-5, wherein, The first direction is perpendicular to the second direction; the wave segment oscillates along the second direction. The wave segment includes multiple wave peaks and multiple wave troughs, and the wave peaks and the wave troughs are arranged alternately along the first direction. The multiple wave peaks have the same height, the multiple wave troughs have the same depth, and the height of the wave peaks and the depth of the wave troughs are the same.

13. The circuit board according to claim 12, wherein, The peaks and troughs have the same maximum width along the first direction. The maximum width of the wave crest along the first direction is 1 / 6 to 1 / 5 of the width of the base layer region where the transition portion is located along the first direction.

14. The circuit board according to claim 12, wherein, The height of the wave crest is 1 / 2 to 1 / 2 of the maximum width of the wave crest along the first direction.

15. The circuit board according to claim 12, wherein, The shape of the wavy line segment includes a sine wave shape.

16. The circuit board according to claim 1, wherein, The arc segment includes multiple circular arc sub-segments. The multiple arc segments are connected sequentially, and the connection position of any two arc segments forms an arc shape.

17. The circuit board according to claim 1, wherein, The first direction is perpendicular to the second direction. The arc segment includes a wavy segment that undulates along the second direction. The straight line segment is parallel to the boundary line between the transition section and the wiring section, and the distance between the straight line segment and the boundary line between the transition section and the wiring section is greater than or equal to 0 and less than or equal to the extension length of the transition section along the second direction; The extension length of the transition section along the second direction is equal to the maximum fluctuation amplitude of the wave segment along the second direction. Alternatively, the length of the transition portion along the second direction is equal to three times the maximum fluctuation amplitude of the wave segment along the second direction.

18. The circuit board according to claim 17, wherein, The extension length of the transition portion along the second direction is less than or equal to the extension length of the connecting portion along the second direction. The extension length of the connecting portion along the second direction is less than the extension length of the wiring portion along the second direction.

19. The circuit board according to claim 1, wherein, It also includes a second shielding layer, located on the side of the base layer opposite to the wiring layer. The orthographic projection of the second shielding layer on the base layer covers the orthographic projection of the wiring portion on the base layer, and the orthographic projection of the second shielding layer on the base layer also extends to cover the orthographic projection of the transition portion on the base layer. The orthographic projections of the second shielding layer and the connection portion on the base layer do not overlap. The second edge of the second shielding layer located in the area where the transition portion is located includes a straight portion and an arc portion. The straight portion is at least perpendicular to and intersects the orthographic projections of the first signal line and the second signal line on the substrate. The arc portion intersects at least a portion of the orthographic projections of the third signal line on the substrate.

20. The circuit board according to claim 19, wherein, The straight section and the straight segment have their orthographic projections on the base layer coincide. The curved portion and the curved segment have their orthographic projections on the base layer coincide.

21. A display device, wherein, It includes a display module and a main circuit board, and also includes the circuit board according to any one of claims 1-20. The end of the trace portion of the circuit board that is away from the transition portion is bound to the display module, and the end of the connection portion that is away from the transition portion is bound to the main circuit board.

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