A method for prolonging the service life of a ceramic nozzle for wire bonding

Abstract

The application provides a method for prolonging the service life of a ceramic nozzle for wire bonding, comprising the following steps: S1. multiplexing opportunity confirmation; S2. multiplexing rotation angle confirmation; S3. formulating a ceramic nozzle multiplexing parameter query table and inputting the ceramic nozzle multiplexing parameter query table into the control program of a wire bonding device; S4. recording the cumulative bonding point number of the ceramic nozzle in real time through the wire bonding device, and comparing the cumulative bonding point number with the multiplexing point position threshold value in the query table in real time to determine whether the cumulative bonding point number reaches the multiplexing point position threshold value; S5. when the cumulative bonding point number reaches the multiplexing point position threshold value, rotating the ceramic nozzle around its vertical central axis by the multiplexing rotation angle specified in the query table; and S6. cyclic multiplexing steps: returning to execute steps S4 and S5 until the multiplexing times of the whole ceramic nozzle are exhausted. The method is safe, environmentally friendly, convenient, fast and highly automated, can significantly prolong the service life of the ceramic nozzle, reduce the packaging consumable cost, and eliminate the safety hazards and environmental pollution problems caused by chemical cleaning.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser and integrated circuit packaging technology, and more specifically, to a method for extending the service life of ceramic nozzles used in wire bonding. Background Technology

[0002] In the manufacturing process of semiconductor lasers and integrated circuit packaging, ceramic nozzles are one of the most consumed core consumables in bonding equipment. Ceramic nozzles have a fixed service life and need to be replaced once they reach the rated number of bonding cycles. Since a bonding machine needs to bond millions of solder joints per day under full load, the replacement frequency of ceramic nozzles is extremely high, making consumable costs a significant expense for packaging companies.

[0003] To reduce overall costs, the common practice in the industry is to use a mixed acid (sulfuric acid + phosphoric acid + hydrochloric acid) to chemically clean ceramic nozzles that have reached the end of their service life before reuse. This method works by using the acid to chemically react with the metal residues on the surface of the ceramic nozzle, dissolving or peeling them off, in order to restore the bonding performance of the ceramic nozzle.

[0004] However, chemical cleaning and reuse methods have the following significant drawbacks: 1. Risk of hydrofluoric acid generation: If the acid solution contains fluorine impurities, it will react to generate hydrofluoric acid, which will severely corrode the ceramic body and cause it to be scrapped. Moreover, its toxicity and penetrating power are extremely strong, posing a great safety hazard.

[0005] 2. Thermal stress damage: Ceramic has poor thermal conductivity. Improper cleaning heat release and temperature control can easily generate thermal stress, causing microcracks at the tip, which can reduce fatigue life by 30%-50%.

[0006] 3. Acidic residual corrosion: When rinsing is not thorough, residual acid ions will form a galvanic cell effect, continuously corroding the inner wall, worsening the roughness, and affecting the spraying accuracy.

[0007] 4. Cleaning blind spots: It is basically ineffective against organic matter such as grease and adhesives, as well as non-metallic particles, and may even carbonize pollutants, forming charred substances that are more difficult to remove.

[0008] 5. Environmental impact and high costs: Waste acid is a hazardous waste, and the treatment cost can be as high as several thousand yuan per ton. In addition, enterprises have to bear a heavy burden of compliance management.

[0009] 6. Poor process reproducibility: The effect is highly dependent on multiple variables such as concentration and temperature, and the degree of contamination is difficult to unify, resulting in the inability to guarantee the consistency of cleaning between batches.

[0010] In summary, there is an urgent need to develop a safe, pollution-free, low-risk method for reusing ceramic nozzles that reduces human intervention, in order to solve the aforementioned problems in existing technologies. Summary of the Invention

[0011] The technical problem to be solved by this invention is to provide a method for extending the service life of ceramic nozzles used in wire bonding, overcoming the safety hazards and environmental pollution problems caused by existing chemical cleaning methods. This invention's method does not use mixed acid chemical cleaning; it is safe, environmentally friendly, convenient, fast, and highly automated, significantly extending the service life of ceramic nozzles, reducing packaging consumable costs, and eliminating the safety hazards and environmental pollution problems caused by chemical cleaning.

[0012] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: The method for extending the service life of ceramic nozzles for wire bonding according to the present invention includes the following steps: S1. Reuse timing confirmation: Based on the wire diameter of the alloy wire to be bonded, confirm the reuse point threshold of the ceramic nozzle corresponding to that wire diameter. The reuse point threshold is the cumulative number of consecutive bonding operations performed by the ceramic nozzle in its original working position. S2. Reuse rotation angle confirmation: Based on the wire diameter of the alloy wire to be bonded, determine the width of the second solder joint, and combine this with the outer radius of the ceramic nozzle end face to obtain the reuse rotation angle of the ceramic nozzle corresponding to the wire diameter. S3. Based on the correspondence between reuse timing and reuse rotation angle, formulate a ceramic nozzle reuse parameter lookup table and enter the formulated ceramic nozzle reuse parameter lookup table into the control program of the wire bonding equipment. S4. Record the ceramic nozzle reuse parameter lookup table in real time through the wire bonding equipment. The cumulative number of bonding points of the nozzle is compared in real time with the reuse point threshold in the nozzle reuse parameter lookup table to determine whether the cumulative number of bonding points of the nozzle has reached the reuse point threshold; S5. When the cumulative number of bonding points of the nozzle reaches the reuse point threshold, the nozzle is rotated around its vertical central axis by the reuse rotation angle specified in the nozzle reuse parameter lookup table, so that the unused area on the bottom end face of the nozzle that is not covered by metal residue is rotated to the second solder point bonding station. The second solder point bonding station is a processing position with a fixed spatial position. The nozzle performs the bonding operation of the second solder point at the second solder point bonding station; and S6. Cyclic reuse step: return to execute steps S4 and S5 until the number of reuses of the nozzle around its entire circumference is exhausted.

[0013] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, in step S1, the reuse point threshold is 400,000 times for ceramic nozzles for 25μm gold wires; 300,000 times for ceramic nozzles for 50μm gold wires; 200,000 times for ceramic nozzles for 75μm gold wires; and 150,000 times for ceramic nozzles for 100μm gold wires.

[0014] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, in step S1, the method for obtaining the reuse point threshold includes: selecting at least 5 groups of ceramic nozzles within the range of ±50,000 times of the rated reuse point threshold to conduct gold ball thrust tests after wire bonding, and verifying and adjusting the reuse point threshold based on the measured data so that the reuse timing meets the accuracy requirements.

[0015] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, in step S2, the reuse rotation angle is 45° for ceramic nozzles for 25μm gold wires; 60° for ceramic nozzles for 50μm gold wires; 90° for ceramic nozzles for 75μm gold wires; and 120° for ceramic nozzles for 100μm gold wires.

[0016] Optionally, in the above method for extending the service life of ceramic tips for wire bonding, in step S2, the width of the second solder joint is three times the diameter of the gold wire, and the reuse rotation angle is taken as the smallest integer angle that is greater than or equal to the theoretical residual central angle θ and divisible by 360°. The formula for calculating the theoretical residual central angle θ is as follows: θ = 2 × arcsin(W / 2R), Where W is the width of the second weld point and R is the outer radius of the ceramic nozzle end face.

[0017] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, in step S3, the parameters of the ceramic nozzle reuse parameter lookup table include the gold wire type, ceramic nozzle orifice diameter, reuse point threshold, reuse rotation angle, number of reuses per circumference, and total theoretical life.

[0018] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, in step S5, when the cumulative number of bonding points of the ceramic nozzle reaches the corresponding reuse point threshold in the ceramic nozzle reuse parameter lookup table, the wire bonding equipment automatically issues an alarm and suspends operation, and prompts the ceramic nozzle to be rotated.

[0019] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, when the wire bonding equipment automatically issues an alarm and stops operating, the wire bonding equipment automatically rotates the ceramic nozzle according to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table, the equipment automatically resets and continues to operate, and at the same time, the cumulative number of bonding points is cleared to zero or marked as a new service cycle.

[0020] Optionally, in the above method for extending the service life of ceramic nozzles for wire bonding, after the wire bonding equipment automatically issues an alarm and stops operating, the operator manually rotates the ceramic nozzle to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: 1) Significantly extended lifespan of ceramic tips: By reusing ceramic tips through directional rotation, the total lifespan of ceramic tips for 50μm gold wire is extended from 300,000 cycles to 1.8 million cycles, and the total lifespan of ceramic tips for 25μm gold wire is extended from 400,000 cycles to 3.2 million cycles, with a lifespan extension of 6-8 times.

[0022] 2) Completely eliminate safety hazards: The mixed acid chemical cleaning process has been completely abandoned, fundamentally eliminating safety hazards such as the risk of hydrofluoric acid generation, thermal stress damage, and acidic residual corrosion.

[0023] 3) Zero pollution and environmental compliance: It does not generate any hazardous waste such as waste acid, eliminating the high cost of waste liquid treatment and the heavy burden of environmental compliance.

[0024] 4) The method is simple and the cost is extremely low: the reuse can be completed with just a simple rotation operation, without the need for special equipment and chemical reagents, and the reuse cost is almost zero.

[0025] 5) High bonding quality stability: After each reuse, a brand new, unused area without metal residue is used for bonding, and the bonding quality can be restored to a level close to that of a new ceramic tip, with excellent batch-to-batch consistency.

[0026] 6) High level of intelligence: By inputting the reuse parameter query table into the equipment program, the reuse timing can be automatically determined and the reuse angle can be automatically prompted, which greatly reduces the reliance on human experience and is suitable for standardized promotion in large-scale mass production lines. Attached Figure Description

[0027] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below.

[0028] Figure 1 This is a schematic diagram of the method flow of the present invention; Figure 2 This is a schematic diagram of the structure of a porcelain nozzle; Figure 3 These are enlarged cross-sectional views (A) of the bottom part of the ceramic nozzle and enlarged views (B) of the second solder joint after gold wire bonding. Figure 4 This is a schematic diagram showing the width of the second weld point of the ceramic nozzle and its relationship with the theoretical residual central angle; Figure 5 This is a schematic diagram showing the relationship between the reuse rotation angle and the number of full-circumference reuses for ceramic nozzles with gold wire diameters of 50μm and 25μm. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0030] This invention provides a method for extending the service life of ceramic nozzles used in wire bonding, comprising: S1. confirming the reuse timing; S2. confirming the reuse rotation angle; S3. creating a ceramic nozzle reuse parameter lookup table and entering the table into the control program of the wire bonding equipment; S4. recording the cumulative number of bonding points of the ceramic nozzle in real time through the wire bonding equipment and comparing it with the reuse point threshold in the lookup table in real time to determine whether the cumulative number of bonding points has reached the reuse point threshold; S5. when the cumulative number of bonding points reaches the reuse point threshold, rotating the ceramic nozzle around its vertical central axis by the reuse rotation angle specified in the lookup table; and S6. cyclic reuse steps: returning to steps S4 and S5 until the ceramic nozzle's total number of reuses is exhausted. This invention overcomes the problem of asymmetric metal residue on the end face of the ceramic nozzle caused by the tangent of the second solder joint, without using mixed acid chemical cleaning. The method is safe, environmentally friendly, convenient, fast, and highly automated, significantly extending the service life of the ceramic nozzle, reducing packaging consumable costs, and eliminating the safety hazards and environmental pollution problems caused by chemical cleaning.

[0031] like Figure 1 As shown, the method for extending the service life of ceramic tips for wire bonding according to the present invention includes the following steps: S1. Reuse Timing Confirmation: Based on the wire diameter of the bonding wire, confirm the reuse point threshold of the ceramic nozzle corresponding to that wire diameter. The reuse point threshold is the cumulative number of times the ceramic nozzle performs its first continuous bonding in its original working position.

[0032] Different wire diameters of gold wire result in varying degrees of metal residue on the ceramic tip face; therefore, the timing of reuse must be determined based on the specific gold wire type. When determining the reuse point, at least five ceramic tips can be selected near the rated life (rated reuse point threshold) (e.g., within ±50,000 cycles) for gold ball thrust testing after wire bonding. The measured data can be used to verify and fine-tune the reuse point threshold, ensuring that the reuse timing is scientifically accurate and meets precision requirements.

[0033] For ceramic tips using 25μm gold wire: the reuse point threshold (i.e., the cumulative number of bonding points of the ceramic tip) is 400,000 cycles. Because the 25μm gold wire has a finer diameter, the rate of metal residue on the ceramic tip end face is relatively slower, thus allowing for a longer initial service life.

[0034] For ceramic tips used with 50μm gold wire: the reuse threshold is 300,000 cycles. After reaching this threshold, the metal residue on the bottom end face of the ceramic tip in the pressing tail and tangential directions reaches a critical level that affects the bonding quality, requiring rotational reuse.

[0035] For ceramic tips using 75μm gold wire: the reuse point threshold is 200,000 times.

[0036] For ceramic nozzles used with 100μm gold wire: the reuse point threshold is 150,000 times.

[0037] S2. Confirmation of reuse rotation angle (reuse position selection): Determine the width of the second solder joint based on the wire diameter of the alloy wire to be bonded, and obtain the reuse rotation angle of the ceramic nozzle corresponding to that wire diameter by combining the outer radius of the ceramic nozzle end face.

[0038] Different types of gold wire, due to their varying wire diameters, result in differences in the size and degree of asymmetric metal residue on the ceramic tip end face, thus requiring different optimal reuse rotation angles. The "reuse rotation angle" refers to the angle at which the ceramic tip is rotated around its vertical central axis after the cumulative bonding count reaches the reuse point threshold. After rotating the ceramic tip around its vertical central axis to this reuse rotation angle, the unused area on the bottom end face of the ceramic tip, where no metal residue has formed, is rotated to the fishtailing and tangential bonding stations. This unused area bears the subsequent fishtailing and tangential stress, restoring the bonding quality to near the level of a new ceramic tip.

[0039] Asymmetric metal residue is typically caused by the tangent of the second solder joint, and the wire diameter is the benchmark for determining the solder joint size. The width of the second solder joint is usually required to be 1.2 to 5 times the wire diameter, while in common processes, the width ranges from 2.8 to 3.4 times the wire diameter, preferably 3 times. This reflects the result of controlled plastic deformation of the wire under ultrasonic and pressure conditions.

[0040] Preferably, based on the width range of the second solder joint being 3 times the diameter of the gold wire, the theoretical residual central angle of the ceramic nozzle corresponding to each gold wire of different diameters is first determined. Then, the rotation angle is reused to take the smallest integer angle that is greater than or equal to the theoretical residual central angle θ and can be divided by 360°, so as to ensure that the adjacent two working surfaces are completely separated and the residual areas do not overlap.

[0041] Porcelain tip and below it respectively as follows Figure 2 and Figure 3 As shown in Figure A, the bottom end face of the ceramic nozzle is not a solid disc, but includes a central through hole and a second welding point after the ceramic nozzle and gold wire are bonded together. Figure 3 As shown in B in the diagram.

[0042] A schematic diagram of the theoretical residual central angle θ is shown below. Figure 4 As shown, the formula for calculating the theoretical residual central angle θ is as follows: θ = 2 × arcsin(W / 2R), Wherein, W is the width of the second solder joint, R is the outer radius of the ceramic nozzle end face, and the width of the second solder joint W ranges from 2.8 times to 3.4 times the diameter of the gold wire (2R), preferably 3 times.

[0043] When the width W of the second solder joint is three times the diameter of the gold wire (2R), the reuse rotation angle of each ceramic nozzle is as follows: For a 25μm gold wire using a 38JG ceramic tip with a diameter T of 200µm, and the width of the second solder joint being three times the wire diameter (125µm), the theoretical residual central angle θ = 2 × arcsin(0.625) ≈ 44°. The wire is reused once every 45° rotation (reuse rotation angle is 45°), and can be reused 8 times in a full circumference (360° ÷ 45° = 8 times). The relationship between the reuse rotation angle and the number of reuses in a full circumference is as follows: Figure 5 As shown in B in the diagram.

[0044] For a 50μm gold wire using a 68MN ceramic tip with a diameter T of 300µm, and the width of the second solder joint being three times the wire diameter (150µm), the theoretical residual central angle θ = 2 × arcsin(0.5) ≈ 60° is calculated. The wire is rotated and reused once every 60° (reuse rotation angle is 60°), resulting in a total of 6 reuses (360° ÷ 60° = 6 times). The relationship between the reuse rotation angle and the total number of reuses is as follows: Figure 5 As shown in A in the diagram.

[0045] For a 75μm gold wire using a 100RV ceramic tip with a diameter T of 360um, the width of the second solder joint is 3 times the wire diameter, which is 225um. At this time, the theoretical residual central angle θ = 2 × arcsin(0.625) ≈ 78°. It can be reused once every 90° rotation (the reuse rotation angle is 90°), and can be reused 4 times in the whole circle (360° ÷ 90° = 4 times).

[0046] A 127SW ceramic tip is used for 100μm gold wire with a diameter T of 410µm. The width of the second solder joint is three times the wire diameter, which is 300µm. At this point, the theoretical residual central angle θ = 2. arcsin(0.7317)≈94°, which can be reused once every 120° rotation (the reuse rotation angle is 120°), and can be reused 3 times in the whole circle (360°÷120°=3 times).

[0047] S3. Based on the correspondence between reuse timing and reuse rotation angle, formulate a ceramic nozzle reuse parameter lookup table and enter the formulated ceramic nozzle reuse parameter lookup table into the control program of the wire bonding equipment.

[0048] The parameters in the ceramic nozzle reuse parameter lookup table (see Table 1) include the gold wire type, ceramic nozzle orifice diameter, initial service life threshold (reuse point threshold), reuse rotation angle, number of reuses per circumference, and total theoretical life.

[0049] Table 1: Ceramic Tip Reuse Parameter Lookup Table Note: In the table, "Initial Service Life Threshold" refers to the cumulative number of consecutive bonding operations of the ceramic nozzle in its original working position; "Reuse Rotation Angle" refers to the angle at which the ceramic nozzle is rotated around its vertical central axis after the cumulative number of bonding operations reaches the reuse threshold; "Number of Reusable Circumferences" = 360° ÷ Reuse Rotation Angle; "Total Theoretical Life" = Initial Service Life Threshold × Number of Reusable Circumferences.

[0050] S4. The cumulative number of bonding points of the ceramic nozzle is recorded in real time by the wire bonding device and compared in real time with the reuse point threshold in the ceramic nozzle reuse parameter lookup table to determine whether the cumulative number of bonding points of the ceramic nozzle has reached the reuse point threshold.

[0051] S5. When the cumulative number of bonding points of the ceramic nozzle reaches the reuse point threshold, the ceramic nozzle is rotated around its vertical central axis by the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table, so that the unused area on the bottom end face of the ceramic nozzle that is not covered by metal residue is rotated to the second solder point bonding station. The second solder point bonding station is a processing position with a fixed spatial position. The ceramic nozzle performs the bonding operation of the second solder point at this station, and completes the application of the normal pressure of the second solder point and the tangential pulling operation. The local sector on the end face of the ceramic nozzle that coincides with the space of this station is the area that actually bears the pressure of the fish tail and the tangential stress. Subsequent metal residue also accumulates in this sector.

[0052] In this step, when the cumulative number of bonding points of the ceramic nozzle reaches the corresponding reuse point threshold in the ceramic nozzle reuse parameter lookup table, the wire bonding equipment will automatically issue an alarm and pause operation, prompting the ceramic nozzle to be rotated at the angle specified in the reuse parameter lookup table before continuing operation.

[0053] The operation of rotating the ceramic nozzle around its vertical central axis by the rotation reuse angle can be performed by selecting automatic or manual mode.

[0054] Automatic mode: When the cumulative number of bonding points of the ceramic nozzle reaches the corresponding reuse point threshold in the ceramic nozzle reuse parameter lookup table, the wire bonding equipment will automatically issue an alarm and pause operation. Loosen the ceramic nozzle fastening screw, and the wire bonding equipment will automatically rotate the ceramic nozzle according to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table, and then tighten the ceramic nozzle again. Subsequently, the equipment will automatically reset and continue to operate, while resetting the cumulative number of bonding points to zero or marking it as a new usage cycle.

[0055] Manual mode: According to the alarm prompts of the wire bonding equipment, after the equipment is paused, the operator should loosen the ceramic nozzle fastening screw, manually rotate the ceramic nozzle to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table, and then tighten the ceramic nozzle again to achieve reuse.

[0056] After each reuse rotation into position, an unused area on the bottom end face of the ceramic nozzle that is not covered by metal residue rotates to the working position for pressing the fish tail and tangencing, so that the area can bear the subsequent stress of pressing the fish tail and tangencing.

[0057] S6. Reuse Step: Return to steps S4 and S5 until the ceramic nozzle has been used up for all possible reuses.

[0058] The method of this invention adopts a differentiated reuse strategy. Based on the difference in the rate of metal residue caused by different gold wire diameters (such as 50μm and 25μm) on the ceramic nozzle end face, different reuse point thresholds (300,000 times / 400,000 times) are set to achieve precise reuse management.

[0059] This invention adopts the angle-wire diameter matching principle. Based on the width of the metal residue area (i.e. the width of the second welding point) corresponding to different gold wire models, different reuse rotation angles (such as 60° and 45°) are determined to ensure that after each rotation, the new working area on the circumference of the ceramic nozzle that has not been contaminated is precisely cut into the work station, so that the area on the circumference of the ceramic nozzle that has not formed metal residue is maximized.

[0060] The method of this invention adopts intelligent reuse driven by lookup table, which solidifies the reuse parameters in the form of lookup table and enters them into the device program, realizing standardized and automated management of reuse timing and reuse angle, and eliminating the subjectivity and uncertainty brought about by traditional manual judgment.

[0061] The above embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and are not intended to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or improve the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in the present invention; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for extending the service life of ceramic nozzles used in wire bonding, characterized in that, Includes the following steps: S1. Reuse Timing Confirmation: Based on the wire diameter of the bonding wire, confirm the reuse point threshold of the ceramic nozzle corresponding to that wire diameter. The reuse point threshold is the cumulative number of times the ceramic nozzle performs its first continuous bonding in its original working position. S2. Reuse rotation angle confirmation: Determine the width of the second solder joint based on the wire diameter of the bonding wire to be bonded, and obtain the reuse rotation angle of the ceramic nozzle corresponding to the wire diameter by combining the outer radius of the ceramic nozzle end face; S3. Based on the correspondence between the reuse timing and the reuse rotation angle, formulate a ceramic nozzle reuse parameter lookup table and enter the formulated ceramic nozzle reuse parameter lookup table into the control program of the wire bonding equipment; S4. The cumulative number of bonding points of the ceramic nozzle is recorded in real time by the wire bonding device and compared in real time with the reuse point threshold in the ceramic nozzle reuse parameter lookup table to determine whether the cumulative number of bonding points of the ceramic nozzle has reached the reuse point threshold. S5. When the cumulative number of bonding points of the ceramic nozzle reaches the reuse point threshold, the ceramic nozzle is rotated around its vertical central axis by the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table, so that the unused area on the bottom end face of the ceramic nozzle that is not covered by metal residue is rotated to the second solder point bonding station. The second solder point bonding station is a processing position with a fixed spatial location, and the ceramic nozzle performs the bonding operation of the second solder point at the second solder point bonding station; and S6. Reuse step: Return to steps S4 and S5 until the ceramic nozzle has been used up for all possible reuses.

2. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S1, the reuse point threshold is 400,000 times for a 25μm gold wire ceramic tip; 300,000 times for a 50μm gold wire ceramic tip; 200,000 times for a 75μm gold wire ceramic tip; and 150,000 times for a 100μm gold wire ceramic tip.

3. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S1, the method for obtaining the reuse point threshold includes: selecting at least 5 groups of ceramic nozzles within the range of ±50,000 times of the rated reuse point threshold to perform gold ball thrust tests after wire bonding, and verifying and adjusting the reuse point threshold based on the measured data so that the reuse timing meets the accuracy requirements.

4. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S2, the reuse rotation angle is 45° for a 25μm gold wire ceramic tip; 60° for a 50μm gold wire ceramic tip; 90° for a 75μm gold wire ceramic tip; and 120° for a 100μm gold wire ceramic tip.

5. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S2, the width of the second solder joint is three times the diameter of the gold wire, and the reuse rotation angle is the smallest integer angle that is greater than or equal to the theoretical residual central angle θ and divisible by 360°. The formula for calculating the theoretical residual central angle θ is as follows: θ = 2 × arcsin(W / 2R), Where W is the width of the second weld point and R is the outer radius of the ceramic nozzle end face.

6. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S3, the parameters in the ceramic nozzle reuse parameter lookup table include the gold wire type, ceramic nozzle orifice diameter, reuse point threshold, reuse rotation angle, number of reuses per circumference, and total theoretical lifespan.

7. The method for extending the service life of ceramic nozzles for wire bonding according to claim 1, characterized in that, In step S5, when the cumulative number of bonding points of the ceramic nozzle reaches the corresponding reuse point threshold in the ceramic nozzle reuse parameter lookup table, the wire bonding device automatically issues an alarm and suspends operation, and prompts the ceramic nozzle to rotate.

8. The method for extending the service life of ceramic nozzles for wire bonding according to claim 7, characterized in that, When the wire bonding device automatically issues an alarm and pauses operation, it automatically rotates the ceramic nozzle according to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table. The device then automatically resets and resumes operation, while resetting the cumulative number of bonding points to zero or marking it as a new usage cycle.

9. The method for extending the service life of ceramic nozzles for wire bonding according to claim 7, characterized in that, When the wire bonding equipment automatically issues an alarm and stops operating, the operator manually rotates the ceramic nozzle to the reuse rotation angle specified in the ceramic nozzle reuse parameter lookup table.

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