Integrated flexible plate manufacturing method for defogging of intelligent camera, flexible plate and application

Abstract

The application discloses a kind of integrated flexible plate manufacturing methods of intelligent camera defogging, flexible plate is double-sided flexible plate, according to design data processing, including, lead-through end and working end, the first face of working end is distributed with heating coil circuit, the second face is distributed with heat monitoring circuit, lead-through end is distributed with lead-through circuit, lead-through circuit connects heating coil circuit, heat monitoring circuit is welded with thermistor;By designing one side resistance heating coil circuit, one side thermistor flexible plate structure, realize the high integration and cooperation of defogging and temperature control function, two-sided partition layout is not only efficient use of the limited installation space of camera, avoid the problem of crowded line caused by single side layout, but also through physical isolation to develop the distance between heating element and monitoring element, effectively avoid the false alarm caused by heat conduction temperature monitoring, ensure that defogging system fast response force and long-term reliable operation force, provide key guarantee for the stability of intelligent visual perception system.

Description

Technical Field

[0001] This invention relates to the fields of circuit board processing and application, and more particularly to an integrated flexible board manufacturing method for defogging smart cameras, as well as a flexible board and its application. Background Technology

[0002] Visual perception systems in fields such as intelligent connected vehicles, smart video cameras, and intelligent sensing cameras are the core devices for driving safety, precise monitoring, and visual analysis. As a sensing component, the camera needs to continuously output clear images under complex conditions such as rain, low temperature, and high humidity. The imaging accuracy of the camera determines the reliability of core functions such as road condition recognition, obstacle detection, visual image analysis, and dynamic analysis.

[0003] However, the temperature difference between the inside of the camera and the outside environment can easily cause water vapor in the air to condense and form water mist, causing the camera to fog up. This not only causes the image to be blurry and lose details, but may also cause problems such as target recognition delay and misjudgment, which may induce uncertainties in perception feedback and even cause safety hazards.

[0004] Current mainstream defogging solutions in the industry have significant limitations: (1) Natural drying: It depends on environmental conditions and is slow to take effect in high humidity and low temperature environments, and cannot meet the needs of real-time defogging; (2) Desiccant dehumidification: Due to the limited adsorption capacity, it needs to be replaced regularly after saturation, resulting in high maintenance costs and difficulty in evenly distributing it in the enclosed space of the camera, thus limiting the dehumidification range; (3) External air conditioning drying: It requires an additional air duct structure, which not only occupies a lot of space and has poor adaptability, but also has the problem of low heat transfer efficiency. It cannot quickly and accurately act on the water mist inside the camera, and temperature fluctuations may affect the stability and service life of the camera's electronic components.

[0005] Based on the above background and problems, there is a need to provide a novel integrated flexible plate manufacturing method for defogging smart cameras, the flexible plate itself, and its applications. Summary of the Invention

[0006] This invention aims to solve the problems of poor defogging capability in existing smart cameras, leading to low observation and perception accuracy. It provides an integrated flexible plate manufacturing method for defogging smart cameras. The flexible plate is processed according to design data and is a double-sided flexible plate. The design data includes: the double-sided flexible plate has a conductive end and a working end; the first side of the working end of the double-sided flexible plate has heating coil lines, and the second side has thermal monitoring lines; the conductive end has conductive lines; wherein the conductive lines connect to the heating coil lines, and the conductive lines and the heating coil lines overlap at the junction of the conductive end and the working end; the thermal monitoring lines are welded with thermistors.

[0007] Furthermore, the manufacturing method includes the following steps: Step S10: Fabricate a double-sided flexible copper-clad board according to the design data, fabricate a first circuit pattern on the first side to form the heating coil circuit, and form a single-sided circuit board from the whole board. Step S20: Fabricate a second circuit pattern on the second side of the single-sided circuit board to form the conductive circuit and the thermal monitoring circuit, and form the circuit board from the whole board; Step S30: Drill through holes in the overlapping areas of the circuit board, take anti-electroplating dry film to make a dry film pattern corresponding to the through holes, then electroplat and remove the film, the through holes form through holes, and the whole board forms a through hole board; Take the cover film, make it into a windowed cover film, then attach it to both sides of the through-hole plate, and then weld the thermistor to form the flexible plate.

[0008] Furthermore, the double-sided flexible copper-clad laminate is formed as follows: Step S110: Take the original double-sided flexible copper-clad laminate, etch the copper layer on the first side to expose the insulating dielectric layer, and form a single-sided copper-clad laminate from the whole board. Step S120: Take constantan copper foil, stack it with a single-sided copper-clad laminate and press them together to form a double-sided flexible copper-clad laminate, wherein the constantan copper foil is stacked on the insulating dielectric layer.

[0009] Furthermore, forming the single-sided circuit board includes, after forming the heating coil circuit, performing an AOI scan on the heating coil circuit to detect the resistance value of the heating coil circuit; If the resistance value is too small, the etching parameters for making the first circuit pattern are adjusted, and rework etching is performed. If the resistance value is too high, check for issues such as over-etching, missing lines, or thin lines, and adjust the etching parameters for creating the first circuit pattern to provide a basis for the subsequent fabrication of other single-sided circuit boards. At the same time, scrap the single-sided circuit boards with excessive resistance values.

[0010] Furthermore, forming the single-sided circuit board includes the second circuit pattern including a first pad pattern and a second pad pattern, wherein the first pad pattern and the second pad pattern are disposed on the conductive line and electrically connected to the thermistor.

[0011] Further, forming the circuit board includes: Step S210: Apply a first dry film to the first side of the double-sided flexible copper-clad laminate and apply a second dry film to the second side. Expose and develop in sequence. The first dry film forms a first dry film pattern corresponding to the heating coil circuit. The second dry film forms a second dry film pattern that completely covers the second side. Then, etch and remove the film in sequence. The heating coil circuit is formed on the first side. The whole board is formed into a single-sided circuit board. Step S220: A third dry film is attached to the first side of the single-sided circuit board, and a fourth dry film is attached to the second side. The boards are then exposed and developed sequentially. The third dry film forms a pattern that completely covers the first side. The fourth dry film forms a pattern corresponding to the conductive lines and the thermal monitoring lines. Then, the boards are etched and stripped sequentially. The conductive lines and the thermal monitoring lines are formed on the second side. The entire board is then formed into the circuit board.

[0012] The present invention also provides a flexible board, which is manufactured using the above-described manufacturing method; the flexible board includes a first pin, a second pin, a third pin, and a fourth pin, one end of the first pin and one end of the fourth pin are respectively connected to the heating coil circuit, and one end of the second pin and one end of the third pin are both connected to the thermal monitoring circuit.

[0013] The present invention also provides an application of a flexible board, which is applied to a smart camera for defogging the camera: the application includes: soldering the first pin, the second pin, the third pin and the fourth pin to the control motherboard, and using an adhesive layer to attach one side of the heating coil circuit of the flexible board to the camera, thereby realizing the assembly of the flexible board.

[0014] Furthermore, the control motherboard energizes the heating coil circuit, which generates heat to remove water vapor from inside the camera.

[0015] Furthermore, the thermistor monitors the ambient temperature inside the camera. When the temperature exceeds a set standard, it sends feedback to the control motherboard, which then disconnects the power supply to the heating coil circuit.

[0016] The main beneficial effects of this technical solution include: (1) By designing an integrated flexible board structure with a resistance heating coil circuit on one side and a thermistor on the other side, the high integration and synergy of defogging and temperature control functions can be achieved. The double-sided partition layout not only makes efficient use of the limited installation space of the camera and avoids the problem of line congestion caused by single-sided layout, but also increases the distance between the heating element and the monitoring element through physical isolation, effectively avoiding false temperature monitoring alarms caused by heat conduction. (2) Using constantan foil to replace the pure copper layer on the first side. Constantan (Cu55Ni45) has low resistivity temperature coefficient and medium high resistivity characteristics. Its resistance value is not easy to drift with the fluctuation of ambient temperature, ensuring stable heating power and providing core support for efficient defogging. (3) The process of first fabricating the resistance heating coil circuit on one side of the constantan copper layer, then performing AOI scanning inspection and resistance measurement, and then fabricating the conductive circuit and thermal monitoring circuit on the (ordinary) copper layer side is adopted. This process achieves a dual improvement in processing accuracy and product yield. The step-by-step fabrication allows for targeted adjustment of etching parameters for circuits of different materials, avoiding parameter conflicts during synchronous processing, and ensuring accurate resistance of the constantan heating circuit and efficient conduction of the ordinary copper layer circuit.

[0017] (4) The flexible plate is integrated into the camera module to realize the heating and defogging in the area closest to the camera inside the camera. This provides the most efficient and direct heating and defogging process and effect in both time and space, effectively supporting the perception efficiency and realism of the smart camera. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the circuit design of the flexible board of the present invention; Figure 2 This is a circuit layout diagram of the first side of the flexible board of the present invention; Figure 3 This is a circuit layout diagram of the second side of the flexible board of the present invention; Figure 4 This is a circuit layout diagram of the first and second sides of the flexible board of the present invention; Figure 5 This is a circuit layout diagram of the working end of the flexible board of the present invention; Figure 6 This is a process flow diagram of an embodiment of the present invention; Figure 7 for Figure 4Schematic diagram of the AA section structure; Figure 8 These are physical images of the first and second sides of the flexible plate according to an embodiment of the present invention.

[0020] Explanation of reference numerals: 10, Flexible board; 100, Working end; 1010, Heating coil circuit; 1020, Thermal monitoring circuit; 1030, First cover film; 1040, Second cover film; 1050, Insulating dielectric layer; 1060, First pad pattern; 1070, Second pad pattern; 200, Conducting end; 2010, First pin; 2020, Second pin; 2030, Third pin; 2040, Fourth pin; 2050, Conducting circuit; CD, Overlapping area; 300, Thermistor.

[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0026] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0027] Please see Figures 1 to 5 , Figure 1 This is a circuit design schematic diagram of the flexible board of the present invention. Figure 2 This is the circuit layout of the first side of the flexible board of the present invention. Figure 3 This is the circuit layout of the second side of the flexible board of the present invention. Figure 4 This is a circuit layout diagram of the first and second sides of the flexible board of the present invention. Figure 5 This is a circuit layout diagram of the working end of the flexible board of the present invention.

[0028] This invention provides a method for manufacturing an integrated flexible plate for defogging in smart cameras, based on... Figure 1 The circuit design principle shown is followed by wiring to form... Figure 2 , Figure 3 and Figure 4 Route layout ( Figure 4 for Figure 2 and Figure 3 (A combined diagram of the double-sided circuit layout) and generate design data to provide a basis for the processing of flexible boards.

[0029] The flexible board 10 is processed according to the design data. The flexible board 10 is a double-sided flexible board. The design data includes: the double-sided flexible board includes a conductive end 200 and a working end 100; the first side of the working end 100 of the double-sided flexible board has a heating coil circuit 1010 distributed, and the second side has a thermal monitoring circuit 1020 distributed. The conductive end 200 has a conductive circuit 2050 distributed. The conductive circuit 2050 is connected to the heating coil circuit 1010, and the conductive circuit 2050 and the heating coil circuit 1010 overlap at the junction of the conductive end 200 and the working end 100 to form an overlapping area CD. The thermal monitoring circuit 1020 is welded with a thermistor 300.

[0030] This embodiment designs the circuit board as a double-sided structure, with the heating coil line 1010 and the thermal monitoring line 1020 arranged on the front and back sides of the working end 100, respectively. This double-sided partitioned layout makes full use of the limited space and avoids the line congestion caused by single-sided layout. On the other hand, the insulating dielectric layer 1050 isolates and increases the distance between the heating element and the monitoring element, effectively reducing the interference of heat conduction on the thermal monitoring line 1020 and ensuring the accuracy of temperature detection.

[0031] Furthermore, the design overlaps part of the conductive line 2050 with the heating coil line 1010 and connects them through a through hole (not shown in the attached figure), which shortens the current conduction path, reduces line loss, and ensures the power supply stability of the heating coil. At the same time, the overlapping design enhances the mechanical strength of the line connection position and reduces the risk of detachment due to long-term use.

[0032] The welded thermistor 300 can capture the internal ambient temperature of the camera in real time, forming a closed-loop control with the heating coil circuit 1010. It can quickly generate heat through the heating coil to achieve efficient defogging when water mist is generated, ensuring the clarity of the camera image. It can also promptly feed back a signal to the control system to disconnect the heating circuit when the temperature exceeds the set standard, thus avoiding damage to camera components caused by thermal runaway. It balances defogging efficiency and safety, solving the drawback of traditional defogging solutions that lack temperature control.

[0033] Please see Figure 6 and Figure 7 , Figure 6 This is a process flow diagram of an embodiment of the present invention; Figure 7 for Figure 4 A schematic diagram of the AA section structure.

[0034] Furthermore, the manufacturing method includes the following steps: Step S10: Fabricate a double-sided flexible copper-clad board according to the design data, and fabricate the first circuit pattern on its first side to form the heating coil circuit 1010. The entire board is then formed into a single-sided circuit board. Step S20: Create a second circuit pattern on the second side of the single-sided circuit board to form a conductive line 2050 and a thermal monitoring line 1020, and form the circuit board from the whole board. Step S30: Drill through holes in the overlapping areas of the circuit board, take the anti-electroplating dry film to make a dry film pattern corresponding to the through holes, then electroplat, remove the film, and the through holes form conductive holes. The whole board forms a conductive hole board; take the cover film and make a windowed cover film (including the first cover film 1030 and the second cover film 1040), then attach it to both sides of the conductive hole board, and then weld the thermistor 300 to form a flexible board 10.

[0035] Because the heating coil circuit requires neat lines and consistent resistance to achieve uniform heating, the requirements for the smoothness of the etched line edges and the control of line width tolerance are higher. The second-side conductive lines and thermal monitoring lines 1020 focus on conduction efficiency and signal stability, and the etching must take into account the integrity of the lines.

[0036] Therefore, this embodiment is designed for step-by-step etching of differentiated circuits on both sides, which allows for independent adjustment of key parameters such as exposure energy, etching time, and chemical spraying pressure, thereby achieving differentiated etching processing and ensuring that both types of circuits can meet the design performance requirements.

[0037] Then, an anti-electroplating dry film is used to open windows at the through-hole location, and electroplating is performed to form a "dot plating" process for the through-hole, creating a through-hole. The drilling position can be accurately located based on the complete circuit layout, ensuring that the through-hole and the overlapping area of ​​the through end 200 and the working end 100 are accurately connected, ensuring reliable connection of the circuits on both sides.

[0038] It is worth noting that, under the condition that the external voltage and circuit remain unchanged, the heating coil circuit 1010 heats up by relying on the circuit resistance to achieve the temperature rise process (Q=I²Rt). Therefore, since ordinary copper layer is used as the resistive heating coil circuit, the resistance of ordinary copper layer is relatively small, so the circuit needs to be made thinner or longer to increase the resistance.

[0039] Optionally, the double-sided flexible copper-clad laminate is formed as follows: Step S110: Take the original double-sided flexible copper-clad laminate, etch the copper layer on the first side to expose the insulating dielectric layer 1050, and form a single-sided copper-clad laminate from the whole board. Step S120: Take constantan copper foil, stack it with a single-sided copper-clad laminate and press it together to form a double-sided flexible copper-clad laminate, wherein the constantan copper foil faces the insulating dielectric layer 1050.

[0040] When manufacturing double-sided flexible copper-clad laminates, the second single-sided flexible copper-clad laminate is first etched into a single-sided copper-clad laminate. The exposed insulating dielectric layer 1050 has greater surface activity after etching, and can form a stronger interlayer bond when pressed with constantan copper foil.

[0041] On the one hand, the low resistivity temperature coefficient of constantan copper foil makes its resistance less prone to drift with ambient temperature fluctuations, which can ensure the stable heating power of the heating coil circuit 1010 and avoid the dredging effect from fluctuating. On the other hand, the moderate and stable high resistivity of constantan copper foil can effectively avoid the complex and high-risk processes required by conventional ordinary copper layers, such as reducing the line width (which may result in thin etching lines or difficulties in process capability) and extending the line length (which may result in difficulties in distributing too many lines due to the small board area) to meet the heating requirements.

[0042] It is worth noting that in step S30, the via is fabricated separately without surface electroplating, and the circuit characteristics of the constantan copper layer are matched to avoid problems such as the resistance value being affected after the constantan copper layer is electroplated with pure copper.

[0043] Furthermore, forming a single-sided circuit board includes forming the heating coil line 1010, performing an AOI scan on the heating coil line 1010 to detect its resistance value; if the resistance value is too low, adjusting the etching parameters for forming the first line pattern and performing rework etching; if the resistance value is too high, checking for over-etching, line gaps, or thin lines (i.e., over-etching causing the lines to be too thin), and adjusting the etching parameters for forming the first line pattern to provide a basis for the subsequent fabrication of other single-sided circuit boards, while scrapping single-sided circuit boards with excessively high resistance values.

[0044] The process involves first fabricating the heating coil circuit 1010 on the constantan copper layer side, then performing AOI scanning and resistance measurement, and finally fabricating the conductive circuit 2050 and thermal monitoring circuit 1020 on the ordinary copper layer side.

[0045] From a circuit fabrication perspective, constantan, being a copper-nickel alloy, has drastically different requirements for etching sensitivity and resistance stability compared to pure copper. Step-by-step fabrication avoids conflicts in process parameters when processing circuits on both sides simultaneously, preventing interference from pure copper circuit processing on the resistance of the constantan heating coil circuitry and ensuring the stability of the heating core's performance. From the perspective of circuit testing, the heating coil circuit 1010 is first fabricated, which can provide solid support for the flexible board 10, effectively avoiding problems such as missed detection of circuit defects and resistance detection errors caused by board deformation during AOI scanning and resistance measurement, and improving the accuracy of test results.

[0046] Furthermore, the supporting function can further reduce the difficulty of rework. If the resistance value is found to be too low and rework etching is required, the entire copper layer can also provide better support for the board during the rework process, reducing the risk of circuit deformation and damage during the rework process, ensuring the resistance accuracy and structural integrity of the heating coil circuit 1010, and ensuring the efficient and stable implementation of the camera's defogging function.

[0047] Optionally, the first pad pattern 1060 and the second pad pattern 1070 are disposed on the conductive line 2050 and electrically connected to the thermistor 300.

[0048] After the flexible board 10 is fabricated, the thermistor 300 forms a complete current loop through the conductive line 2050, which is "control motherboard → conductive line 2050 → pad pattern (a pad pattern composed of the first pad pattern 1060 and the second pad pattern 1070) → thermistor 300 → control motherboard". This provides a core guarantee for the coordinated realization of defogging and temperature control functions. It ensures that the current of the control motherboard can be stably transmitted to the heating coil to achieve defogging, and also allows the temperature signal detected by the thermistor 300 to be accurately fed back through the loop.

[0049] Furthermore, forming the circuit board includes: Step S210: Apply a first dry film to the first side of the double-sided flexible copper-clad laminate and apply a second dry film to the second side. Expose and develop in sequence. The first dry film forms a first dry film pattern corresponding to the heating coil circuit 1010. The second dry film forms a second dry film pattern that completely covers the second side. Then, etch and remove the film in sequence. The heating coil circuit 1010 is formed on the first side, and the whole board is formed into a single-sided circuit board.

[0050] Step S220: Apply a third dry film to the first side of the single-sided circuit board and apply a fourth dry film to the second side. Expose and develop in sequence. The third dry film forms a pattern that completely covers the first side. The fourth dry film forms a pattern corresponding to the conductive lines and thermal monitoring lines 1020. Then, etch and remove the film in sequence. The conductive lines and thermal monitoring lines 1020 are formed on the second side. The entire board is then formed into a circuit board.

[0051] When fabricating the first heating coil circuit 1010, a second dry film is applied to the second side to isolate the etching solution and prevent damage to the copper layer on the unprocessed side. When fabricating the second conductive circuit and thermal monitoring circuit 1020, a third dry film is applied to the first side to fully cover the formed heating coil circuit 1010, completely eliminating problems such as circuit corrosion and resistance drift caused by solution penetration and residue in subsequent etching processes. This ensures the structural integrity and performance stability of both types of circuits. For the different characteristics of the first side constantan material heating coil circuit 1010 (requiring high resistance stability) and the second side ordinary copper material conductive and thermal monitoring circuit 1020 (requiring high conductivity), parameters such as exposure energy, etching time, and solution concentration can be adjusted independently to avoid parameter compatibility conflicts during synchronous etching. This ensures that the heating coil circuit 1010 has neat lines and accurate resistance, the conductive circuit has low resistance and smooth flow, and the monitoring circuit has stable signals.

[0052] Please see Figure 8 , Figure 8 These are physical images of the first and second sides of the flexible plate according to an embodiment of the present invention.

[0053] This embodiment also provides a flexible plate 10, which is manufactured using the above-described manufacturing method. The flexible plate 10 includes a first pin 2010, a second pin 2020, a third pin 2030, and a fourth pin 2040. One end of the first pin 2010 and one end of the fourth pin 2040 are respectively connected to the heating coil circuit 1010, and one end of the second pin 2020 and one end of the third pin 2030 are both connected to the thermal monitoring circuit 1020.

[0054] This embodiment also provides an application of the flexible board 10, which is applied to a smart camera to remove fog from the camera. The application assembly of the flexible board 10 includes: soldering the other end of the first pin 2010, the other end of the second pin 2020, the other end of the third pin 2030 and the other end of the fourth pin 2040 to the control motherboard, and using an adhesive layer to attach one side of the heating coil circuit 1010 of the flexible board 10 to the camera to realize the assembly of the flexible board 10.

[0055] Furthermore, the application scenarios of the flexible board 10 include: controlling the main board to energize the heating coil circuit 1010, the heating coil circuit 1010 generating heat to remove water vapor inside the camera.

[0056] After the control board precisely supplies power to the heating coil circuit 1010, the coil quickly generates heat and transfers it to the camera's interior through a high-temperature resistant adhesive layer. This rapidly evaporates water mist, overcoming the slow-acting drawbacks of traditional natural drying and desiccant dehumidification methods. This ensures the camera maintains clear imaging at all times, providing reliable visual support for intelligent sensing scenarios such as road condition recognition, obstacle detection, surveillance image recognition, and visual image analysis. Simultaneously, the thermistor captures the internal ambient temperature in real time and feeds it back to the control board. The board continuously maintains the power supply based on the temperature data, ensuring consistent defogging effects while preventing repeated condensation of water mist due to excessively low temperatures. This adapts to the continuous use requirements under complex conditions such as rain and high humidity.

[0057] Furthermore, the application safety management scenarios of the flexible board 10 include: monitoring the ambient temperature inside the camera using a thermistor, and when the temperature exceeds the set standard, feeding back to the control motherboard, which then disconnects the power supply to the heating coil circuit 1010.

[0058] When the heating coil continues to operate, causing the internal temperature of the camera to exceed the set standard, the thermistor can quickly detect the temperature anomaly and provide an immediate feedback signal, controlling the mainboard to quickly disconnect the power supply circuit of the heating coil, thus preventing thermal runaway from the root cause. This design not only prevents excessively high temperatures from damaging the camera's lens, electronic components, and other core parts, extending the camera's lifespan, but also avoids safety hazards such as circuit aging and adhesive failure caused by high temperatures. It solves the fatal flaw of traditional defogging solutions lacking temperature control, making the defogging process both efficient and safe, and fully meeting the high reliability requirements of defogging cameras.

[0059] In one embodiment, the power of the heating coil circuit 1010 is 0.5W-1.5W, which can raise the internal temperature of the camera by 5-10°C within 30 seconds, effectively eliminating water vapor; the set temperature standard of the thermistor 300 is 60-80°C.

[0060] Optionally, the adhesive layer is a high-temperature resistant adhesive layer.

[0061] On the one hand, its high-temperature resistance ensures that the adhesive layer will not soften, deform, or lose its adhesiveness under the high-temperature environment generated by the heating coil, maintaining strong adhesion and firmly fixing the flexible board 10 to the camera surface, preventing the circuit board from falling off or shifting during later applications. On the other hand, the stable adhesion ensures a tight fit between the heating coil and the camera, reducing heat loss during heat transfer and allowing the defogging heat to act more efficiently on the water mist, improving defogging efficiency. At the same time, the stability of the high-temperature resistant adhesive layer also extends the overall assembly life of the circuit board, ensuring that the assembly structure remains reliable during long-term, high-frequency defogging use, laying a solid foundation for the continuous and stable operation of the defogging function.

[0062] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the inventive concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing an integrated flexible board for defogging in a smart camera, wherein the flexible board is processed according to design data, and the flexible board is a double-sided flexible board, characterized in that: The design data includes: The double-sided flexible plate includes a conductive end and a working end; The first side of the working end of the double-sided flexible plate is provided with heating coil circuits, the second side is provided with thermal monitoring circuits, and the conducting end is provided with conducting circuits. The conductive line is connected to the heating coil line, and the conductive line and the heating coil line overlap at the junction of the conductive end and the working end. The thermal monitoring line is welded with a thermistor.

2. The manufacturing method as described in claim 1, characterized in that, The manufacturing method includes the following steps: Step S10: Fabricate a double-sided flexible copper-clad board according to the design data, fabricate a first circuit pattern on the first side to form the heating coil circuit, and form a single-sided circuit board from the whole board. Step S20: Fabricate a second circuit pattern on the second side of the single-sided circuit board to form the conductive circuit and the thermal monitoring circuit, and form the circuit board from the whole board; Step S30: Drill through holes in the overlapping areas of the circuit board, take anti-electroplating dry film to make a dry film pattern corresponding to the through holes, then electroplat and remove the film, the through holes form through holes, and the whole board forms a through hole board; Take the cover film, make it into a windowed cover film, then attach it to both sides of the through-hole plate, and then weld the thermistor to form the flexible plate.

3. The manufacturing method as described in claim 2, characterized in that, The double-sided flexible copper-clad laminate is formed as follows: Step S110: Take the original double-sided flexible copper-clad laminate, etch the copper layer on the first side to expose the insulating dielectric layer, and form a single-sided copper-clad laminate from the whole board. Step S120: Take constantan copper foil, stack it with a single-sided copper-clad laminate and press it together to form a double-sided flexible copper-clad laminate, wherein the constantan copper foil is stacked on the insulating dielectric layer.

4. The manufacturing method as described in claim 2 or 3, characterized in that, Forming the single-sided circuit board includes, after forming the heating coil circuit, performing an AOI scan on the heating coil circuit to detect the resistance value of the heating coil circuit; If the resistance value is too small, the etching parameters for making the first circuit pattern are adjusted, and rework etching is performed. If the resistance value is too high, check for issues such as over-etching, missing lines, or thin lines, and adjust the etching parameters for creating the first circuit pattern to provide a basis for the subsequent fabrication of other single-sided circuit boards. At the same time, scrap the single-sided circuit boards with excessive resistance values.

5. The manufacturing method as described in claim 2, characterized in that, The formation of the single-sided circuit board includes the second circuit pattern including a first pad pattern and a second pad pattern, wherein the first pad pattern and the second pad pattern are disposed on the conductive line and electrically connected to the thermistor.

6. The manufacturing method as described in claim 2, characterized in that, The circuit board comprises: Step S210: Apply a first dry film to the first side of the double-sided flexible copper-clad laminate and apply a second dry film to the second side. Expose and develop in sequence. The first dry film forms a first dry film pattern corresponding to the heating coil circuit. The second dry film forms a second dry film pattern that completely covers the second side. Then, etch and remove the film in sequence. The heating coil circuit is formed on the first side. The whole board is formed into a single-sided circuit board. Step S220: A third dry film is attached to the first side of the single-sided circuit board, and a fourth dry film is attached to the second side. The boards are then exposed and developed sequentially. The third dry film forms a pattern that completely covers the first side. The fourth dry film forms a pattern corresponding to the conductive lines and the thermal monitoring lines. Then, the boards are etched and stripped sequentially. The conductive lines and the thermal monitoring lines are formed on the second side. The entire board is then formed into the circuit board.

7. A flexible board, characterized in that, The flexible plate is manufactured using the manufacturing method according to any one of claims 1 to 6; the flexible plate includes: a first pin, a second pin, a third pin, and a fourth pin, one end of the first pin and one end of the fourth pin are respectively connected to the heating coil circuit, and one end of the second pin and one end of the third pin are both connected to the thermal monitoring circuit.

8. An application of a flexible board, characterized in that, The flexible plate described in claim 7 is applied to a smart camera to remove fog from the camera: The applications include: The first pin, the second pin, the third pin, and the fourth pin are all soldered to the control motherboard. One side of the heating coil circuit of the flexible board is attached to the camera using an adhesive layer to achieve the assembly of the flexible board.

9. The application of the flexible plate as described in claim 8, characterized in that, The applications include: The control board powers the heating coil circuit, which generates heat to remove water vapor from inside the camera.

10. The application of the flexible plate as described in claim 9, characterized in that, The applications include: The thermistor monitors the ambient temperature inside the camera. When the temperature exceeds the set standard, it sends feedback to the control motherboard, which then disconnects the power to the heating coil circuit.

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