Wafer detection drying platform
By using two insulating bearing plates on the wafer detection and drying platform, the pollution problem during the transport process is solved, and the accuracy of the detection results and the cleanliness of the equipment are ensured.
Patent Information
- Application Number
- CN202420906495.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-28
AI Technical Summary
During the wafer production process, the transport mechanism is prone to contamination when transferring the unset ink dot from the test bench to the drying bench, resulting in inaccurate detection marking results of the next wafer.
A wafer detection and drying platform is designed, using two adjacent and insulated bearing plates, which are used for wafer detection and detonation drying, and transfer wafers from one bearing plate to another after detonation. Dry on the board to avoid contamination during transportation.
It effectively avoids the risk of ink spots being contaminated by the transporting mechanism when transporting wafers, and ensures the accuracy of detection marks and the cleanliness of the equipment.
Smart Images
Figure CN222298453U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, relates to a wafer inspection and drying platform. Background Art
[0002] In the wafer manufacturing process, it is necessary to perform performance tests on the wafers and mark defective chips on the wafers, and then dry the ink dots on the wafers after marking.
[0003] The relevant equipment generally includes a wafer test bench and a drying bench. The test bench is used to detect defective chips on the wafer, and the drying bench is used to dry the ink dots on the defective chips. At the same time, in order to avoid the influence of high temperature on the test bench during the drying of the dotted wafer, the wafer is generally transferred to the drying bench for drying through a transfer mechanism after the dot is applied. However, in the aforementioned process, since there are unsolidified ink dots on the wafer, when there are many ink dots, the transfer mechanism is prone to pick up the unsolidified ink dots, causing contamination of the transfer mechanism. When the transfer mechanism transfers the next wafer, the stained ink dots on it are prone to be stained on the next wafer, making the detection and marking results of the wafer inaccurate. Summary of the invention
[0004] The purpose of the embodiments of the present application is to provide a wafer inspection and drying platform to solve the technical problem in the prior art that the transport mechanism is easily contaminated during wafer transport.
[0005] To achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide a wafer inspection and drying platform, which includes:
[0006] Drying components, conveying components and carrying platforms;
[0007] The drying assembly is arranged at one end of the conveying assembly, and the drying assembly comprises a drying chamber and a heat source arranged in the drying chamber;
[0008] The carrying platform is arranged on the conveying component, and the conveying component is used to convey the carrying platform to the drying chamber; the carrying platform includes two adjacent and insulated carrying plates, one of which is used to carry wafers for inspection, and the other is used to carry wafers for dot marking and drying.
[0009] Optionally, the conveying assembly is a linear moving mechanism, a slide is slidably arranged on the linear moving mechanism, and the carrying platform is fixedly arranged on the slide.
[0010] Optionally, the carrier plate for carrying wafers for testing is arranged on the top of the slide, and the carrier plate for carrying wafers for dotting and drying is arranged on one side of the slide.
[0011] Optionally, the two carrying plates are fixedly arranged at the same horizontal height with a gap between them; and vacuum adsorption holes are arranged on the two carrying plates.
[0012] Optionally, one of the supporting plates is provided with a plurality of concentrically arranged annular adsorption grooves, and the other supporting plate is provided with an adjustment groove in a radial direction, and an adjustment block is slidably arranged in the adjustment groove.
[0013] Optionally, the drying component further includes a lifting mechanism, and the drying chamber and the heat source are both arranged on the lifting mechanism.
[0014] Optionally, the drying assembly includes a drying platform and a cover body, and the heat source is fixedly arranged on the cover body; the drying platform and the cover body are independently arranged on the lifting mechanism so as to be able to be lifted and lowered independently, and the drying platform and the cover body are closed to each other to form the drying chamber.
[0015] Optionally, the heat source is a hot air device, and the blowing direction of the hot air device is from top to bottom.
[0016] The wafer inspection and drying platform provided in the embodiment of the present application has at least the following beneficial effects:
[0017] The wafer inspection is completed by one carrier plate, and the wafer dotting and drying is completed by another carrier plate, and the two carrier plates are adjacent and insulated. After the wafer inspection is completed and before dotting, it is first transferred from one carrier plate to another carrier plate, and then carried by the other carrier plate for dotting and ink dot drying. In this way, the problem of easy contamination of the transportation mechanism caused by transporting the wafer after dotting can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0019] Figure 1 A three-dimensional diagram of a wafer inspection and drying platform in some embodiments of the present application;
[0020] Figure 2 This is a front view of a wafer inspection and drying platform in some embodiments of the present application. DETAILED DESCRIPTION
[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.
[0022] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0023] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.
[0024] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.
[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.
[0027] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.
[0028] Please also read Figure 1 to Figure 2 , the wafer inspection and drying platform 140 provided in the embodiment of the present application is now described.
[0029] It can be understood that the wafer inspection and drying platform 140 provided in the embodiment of the present application is used on a wafer testing machine, specifically for wafer testing, dot marking, marking point drying and other process steps.
[0030] It can be understood that the wafer inspection and drying platform 140 provided in the embodiment of the present application includes a drying component 100 , a conveying component 200 and a carrying platform 300 .
[0031] Specifically, the transmission component 200 is a linear transmission device, such as a linear motor, a screw ball module, etc. The drying component 100 is arranged at one end of the transmission component 200, and includes a drying chamber 110 and a heat source 120 arranged in the drying chamber 110. It can be understood that on the test machine, generally, a testing station, a marking station and a drying station are arranged on the moving path transmitted by the transmission component 200.
[0032] It should be understood that the drying chamber 110 is a sealed cavity to avoid the problem of low drying efficiency caused by heat loss during wafer mark drying. In some embodiments, the heat source 120 can be a hot air blowing device, an infrared heating device, an electric heating device, etc., but is not limited thereto.
[0033] The carrying platform 300 is disposed on the conveying assembly 200, and the conveying assembly 200 is used to drive the carrying platform 300 to move between the testing station, the marking station and the drying station, so as to perform processes such as wafer testing, marking and marking drying.
[0034] Specifically, the carrier platform 300 includes two adjacent and insulated carrier plates, namely a first carrier plate 310 and a second carrier plate 320. The first carrier plate 310 is used to carry wafers for testing, and the first carrier plate 310 is provided with test components; the second carrier plate 320 is used to carry wafers for dot marking and drying the marked points. It should be understood that when the conveying assembly 200 conveys the carrier platform 300 to the drying station, only the second carrier plate 320 is located in the drying chamber 110. Furthermore, the second carrier plate 320 is made of a material with good thermal insulation performance to avoid the heat from the second carrier plate 320 to the first carrier plate 310 when the second carrier plate 320 is heated in the drying chamber 110, thereby causing damage to the test components on the first carrier plate 310.
[0035] Specifically, the wafer inspection and drying platform 140 of the embodiment of the present application has the following operation process:
[0036] The transfer mechanism (not shown in the figure) on the test machine transfers the wafer to the first carrier plate 310, and the transmission component 200 drives the carrier platform 300 to move to the test station, and the test mechanism (not shown in the figure) tests the wafer; after the test, the transfer mechanism on the test machine transfers the wafer from the first carrier plate 310 to the second carrier plate 320, and the transmission component 200 drives the carrier platform 300 to move to the dotting station, and the dotting mechanism marks the unqualified chips on the wafer; then, the transmission component 200 drives the carrier platform 300 to move to the second carrier plate 320 to enter the drying station, and the drying component 100 heats and dries the marked points on the wafer.
[0037] In summary, the wafer inspection and drying platform 140 of the embodiment of the present application is configured with a first carrier plate 310 and a second carrier plate 320 on the carrier platform 300. The first carrier plate 310 is used to carry wafer testing, and the second carrier plate 320 is used to carry wafer dotting and drying. The wafer can be sent to the drying station without further transportation after dotting and marking, thereby avoiding contamination caused by ink spots on the transport mechanism when transporting the wafer.
[0038] In some embodiments, the transmission component 200 is a linear moving mechanism. More specifically, the transmission component 200 is a screw ball module. A slide 210 is provided on the nut of the screw ball module, and the supporting platform 300 is fixedly provided on the slide 210 .
[0039] Furthermore, in some embodiments, a carrier plate for carrying wafers for testing (i.e., the aforementioned first carrier plate 310) is disposed on the top of the slide 210, and a carrier plate for carrying wafers for dotting and drying (i.e., the aforementioned second carrier plate 320) is disposed on one side of the slide 210. By disposing the second carrier plate 320 on one side of the first carrier plate 310 and staggered above the slide 210, when the conveying assembly 200 conveys the second carrier plate 320 to the drying chamber 110 for heating and drying, the first carrier plate 310 can be kept at a relatively long distance from the drying chamber 110, thereby avoiding the influence of high temperature.
[0040] Further, on the basis of the above embodiments, the first carrier plate 310 and the second carrier plate 320 are fixedly arranged at the same level with a gap between them. By arranging the first carrier plate 310 and the second carrier plate 320 at the same level, it is convenient for the transfer mechanism to transfer the wafers after inspection; and the first carrier plate 310 and the second carrier plate 320 are arranged with a gap between them, so that when the second carrier plate 320 carries the wafers for heating and drying in the drying chamber 110, the heat can be blocked to the greatest extent from being transferred to the first carrier plate 310.
[0041] Furthermore, vacuum adsorption holes 322 are provided on the first carrier plate 310 and the second carrier plate 320, and the first carrier plate 310 and the second carrier plate 320 are both connected to an external vacuum generating device. By providing the adsorption holes 322, the wafer can be well fixed during the detection, marking and drying processes.
[0042] In some specific embodiments, the first carrier plate 310 is provided with a plurality of concentrically arranged annular adsorption grooves 311, so that the annular adsorption grooves 311 of different diameters can adsorb and fix wafers of different diameters. For the second carrier plate 320, the adsorption hole 322 thereon is arranged at the center point of the wafer, and at the same time, an adjustment groove 321 is arranged along the radial direction of the adsorption hole 322, and the adjustment groove 321 is arranged along a circumferential array. An adjustment block (not shown in the figure) is slidably arranged in the adjustment groove 321, and each adjustment block slides to the same radial position in each adjustment groove 321 at the same time, so that the size of the wafer that can be adsorbed by the second carrier plate 320 can be changed, thereby achieving adsorption and fixation of wafers of different sizes.
[0043] On the basis of the above embodiments, the drying assembly 100 further includes a lifting mechanism 130, and the drying chamber 110 and the heat source 120 are both arranged on the lifting mechanism 130. By arranging the lifting mechanism 130, when the second carrying plate 320 is close to the drying chamber 110, the lifting mechanism 130 drives the drying assembly 100 to rise and fall so that the second carrying plate 320 can smoothly enter and exit, thereby facilitating the operation.
[0044] More specifically, the drying assembly 100 includes a drying platform 140 and a cover 150, and the heat source 120 is fixedly arranged on the cover 150. The drying platform 140 and the cover 150 are independently arranged on the lifting mechanism 130 so as to be independently lifted and lowered, and it should be understood that the drying platform 140 and the cover 150 are close to each other to form a drying chamber 110. That is, the drying platform 140 is arranged on the first lifting mechanism 131, and the cover 150 and the heat source 120 are arranged on the second lifting mechanism 132, and the first lifting mechanism 131 and the second lifting mechanism 132 can both be cylinder and slide rail assemblies.
[0045] When the second carrier plate 320 needs to enter and exit the drying chamber 110, the drying platform 140 and the cover body 150 are driven by the first lifting mechanism 131 and the second lifting mechanism 132 respectively to move away from each other, and the opening gap between the two gradually becomes larger, thereby providing sufficient space for the second carrier plate 320 to enter and exit; when the second carrier plate 320 is completely located in the drying station, the drying platform 140 and the cover body 150 are driven by the first lifting mechanism 131 and the second lifting mechanism 132 respectively to move closer to each other, and the opening gap between the two gradually becomes smaller until it is completely closed to form a drying chamber 110, thereby providing a closed space for heating and drying of the wafers.
[0046] Furthermore, the heat source 120 is a hot air device, specifically, the hot air device includes a blower mechanism and an electric heating mechanism, and the hot air device blows air from top to bottom. By arranging the heat source 120 in this way, the hot air device blows hot air directly toward the side of the wafer where the wafer is marked, so that the heating and drying efficiency of the wafer is higher, the heat loss of the hot air is smaller, and the drying operation time can be shortened to improve the drying efficiency.
[0047] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A wafer inspection and drying platform, used for carrying and drying wafers that have been inspected and dotted, characterized in that: include: Drying components, conveying components and carrying platforms; The drying assembly is arranged at one end of the conveying assembly, and the drying assembly comprises a drying chamber and a heat source arranged in the drying chamber; The carrying platform is arranged on the conveying component, and the conveying component is used to convey the carrying platform to the drying chamber; the carrying platform includes two adjacent and insulated carrying plates, one of which is used to carry wafers for inspection, and the other is used to carry wafers for dot marking and drying.
2. The wafer inspection and drying platform according to claim 1, characterized in that: The transmission component is a linear moving mechanism, a slide is slidably arranged on the linear moving mechanism, and the bearing platform is fixedly arranged on the slide.
3. The wafer inspection and drying platform according to claim 2, characterized in that: The carrier plate used for carrying wafers for testing is arranged on the top of the slide, and the carrier plate used for carrying wafers for dotting and drying is arranged on one side of the slide.
4. The wafer inspection and drying platform according to any one of claims 1 to 3, characterized in that: The two bearing plates are fixedly arranged at the same horizontal height with a gap between them; and vacuum adsorption holes are arranged on the two bearing plates.
5. The wafer inspection and drying platform according to claim 4, characterized in that: One of the bearing plates is provided with a plurality of concentrically arranged annular adsorption grooves, and the other bearing plate is provided with an adjustment groove in a radial direction, in which an adjustment block is slidably arranged.
6. The wafer inspection and drying platform according to any one of claims 1 to 3, characterized in that: The drying component further comprises a lifting mechanism, and the drying chamber and the heat source are both arranged on the lifting mechanism.
7. The wafer inspection and drying platform according to claim 6, characterized in that: The drying assembly includes a drying platform and a cover body, the heat source is fixedly arranged on the cover body; the drying platform and the cover body are independently arranged on the lifting mechanism so as to be able to be lifted and lowered independently, and the drying platform and the cover body are closed to each other to form the drying chamber.
8. The wafer inspection and drying platform according to claim 6, characterized in that: The heat source is a hot air device, and the blowing direction of the hot air device is from top to bottom.