Indoor lighting mixed color light source

Abstract

The utility model discloses an indoor lighting mixed color light source which comprises a superconductive aluminum substrate, a plurality of wafers, wall glue and fluorescent powder colloid, a first copper foil circuit and a second copper foil circuit are arranged on the top face and the bottom face of the superconductive aluminum substrate respectively, and the first copper foil circuit and the second copper foil circuit are electrically connected. A boss die bonding area and positive and negative electrode bonding pads are etched on the top surface of the superconducting aluminum substrate. The plurality of wafers adopt an inverted packaging structure, the boss die bonding area is provided with a plurality of die bonding pads, the plurality of die bonding pads are coated with high-thermal-conductivity nano solder paste, and the plurality of wafers are sintered through a vacuum eutectic furnace, so that the plurality of wafers are welded on the plurality of die bonding pads. The periphery of the boss die bonding area is provided with enclosing wall glue which forms a closed ring. And fluorescent powder colloid is uniformly sprayed on the surfaces of the plurality of wafers and an area in a closed ring formed by the enclosing wall glue. The wafers connected to the first copper foil circuit and the second copper foil circuit are coated with fluorescent powder glue of different colors respectively, and the wafers coated with the fluorescent powder glue of different colors are evenly distributed in a crossed and staggered mode to form a uniform mixed-color light source.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light sources, in particular to a color-mixing COB light source for indoor lighting. Background Art

[0002] The existing COB color-mixing light source uses mirrored aluminum as the substrate, and the upright chip is pasted on the substrate. The chips of different light colors are arranged in an array, and the chips and the chips and the bracket are electrically connected by welding gold wires. Generally, the thrust of the gold wire is only 5 grams. When the light source is in use and the driving power supply has a large current, the gold wire is easily burned and melted, resulting in poor contact. When the silicone expands due to heat and contracts due to cold stress, the gold wire is also easily broken, causing the light source to malfunction and damage. When the chips are fixed in an array, the light color effect and light spot of the mixed light are not particularly uniform. In addition, the existing COB light source packaging structure has the problem of chip falling off due to the influence of the use environment. Therefore, it is necessary to further optimize and improve the structure of the COB light source to improve the quality of the light source. Utility Model Content

[0003] In view of this, the utility model proposes a technical solution for a color-mixing light source for indoor lighting. The light source is a COB light source, which solves the problems of uneven color mixing of existing COB light sources and chip shedding due to the influence of the use environment.

[0004] The technical scheme disclosed by the utility model is a mixed-color light source for indoor lighting, comprising a superconducting aluminum substrate, a plurality of chips, a wall glue, and a fluorescent powder colloid. The top surface and the bottom surface of the superconducting aluminum substrate are respectively provided with a first copper foil circuit and a second copper foil circuit, the first copper foil circuit and the second copper foil circuit are electrically connected, and the top surface of the superconducting aluminum substrate is etched with a boss solid crystal area and positive and negative electrode pads; the plurality of chips adopt a flip-chip packaging structure, the boss solid crystal area is provided with a plurality of solid crystal pads, and the plurality of solid crystal pads are coated with a high-thermal-conductivity nano-tin paste, and the plurality of chips are sintered in a vacuum eutectic furnace to realize welding of the plurality of chips on the plurality of solid crystal pads; the periphery of the boss solid crystal area is provided with a wall glue forming a closed circle; the surfaces of the plurality of chips and the area inside the closed circle formed by the wall glue are uniformly sprayed with fluorescent powder colloid.

[0005] Furthermore, the surfaces of the boss crystal fixing area, the positive and negative electrode pads, the first copper foil circuit, and the second copper foil circuit are plated with nickel, palladium, and gold.

[0006] Furthermore, the first copper foil circuit is a twelve-series-eight-parallel circuit structure divided into two paths, one of which is twelve-series-four-parallel and the other is also twelve-series-four-parallel. The chips connected to the two circuits are coated with phosphor glue of different colors, and the chips coated with phosphor glue of different colors are evenly cross-distributed.

[0007] Further, the positive and negative electrode pads include two groups, which are respectively connected to the two circuits. The positive and negative electrode pads are connected to the power supply circuit to realize independent control of the two circuits. The positive and negative electrode pads of the two groups are respectively arranged at the diagonal positions of the superconducting aluminum substrate. The superconducting aluminum substrate is provided with screw holes at the other diagonal position where the positive and negative electrode pads are arranged, and the screw holes are used to fix and install the indoor lighting mixed color light source.

[0008] Furthermore, the size of the superconducting aluminum substrate is 24×24×1.2 mm, and the size of the crystal bonding pad of the boss crystal bonding area (3) is 0.41×0.84 mm.

[0009] Furthermore, the outer diameter of the sealing ring formed by the wall glue is φ21mm, the width of the ring is 0.5-1mm, and the height is 0.5-1mm.

[0010] Furthermore, the first copper foil circuit and the second copper foil circuit are provided with through-hole copper pillars, and the electrical connection between the first copper foil circuit and the second copper foil circuit is achieved through the through-hole copper pillars.

[0011] Furthermore, the power of the single chip is 0.2-1W, and the driving current is 60mA-350mA.

[0012] After adopting the above technical solution, the beneficial effects of the utility model are:

[0013] In the utility model, superconducting aluminum material is used as a substrate, and the flip chip is fixed on the superconducting aluminum substrate by high thermal conductivity nano-tin paste, so that the heat on the chip can be quickly transferred to the superconducting aluminum substrate through the nano-tin paste, and then quickly transferred to the radiator through the superconducting aluminum substrate. A double-layer copper foil circuit is designed, and the first copper foil circuit of the upper layer and the second copper foil circuit of the lower layer are electrically connected through a through-hole copper column, replacing the traditional process of using jumpers, which is beneficial to the stability of circuit connection. Through the high thermal conductivity nano-tin paste eutectic method, the flip chip and the superconducting aluminum substrate are tightly combined together, and the chip will not fall off due to the influence of the use environment. The packaging method without gold wire is adopted to prevent the COB light source from being burned and melted under the impact of large current, and to prevent the gold wire from being pulled and broken by the thermal expansion and contraction stress of silicone gel, resulting in the COB light source dead light. The chips coated with different colors of phosphor glue to form different light colors adopt a cross-phase solid crystal method, which can make the mixing effect between different light colors of the COB light source more uniform. In addition, by setting a wall glue around the boss solid crystal area, the fluorescent powder colloid is evenly sprayed inside the wall glue and on the surfaces of several chips to achieve chip packaging, so that the chip can avoid falling off due to the influence of the use environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model.

[0015] Figure 2 This is a schematic diagram of the first copper foil circuit structure.

[0016] Figure 3 Schematic diagram of the second copper foil circuit structure.

[0017] Figure 4 It is a schematic diagram of the die bonding pad in the boss die bonding area.

[0018] Figure 5 Schematic diagram of the wafer being bonded onto a superconducting aluminum substrate.

[0019] Explanation of the reference numerals: 1. superconducting aluminum substrate; 2. chip; 3. boss solid crystal area; 4. positive and negative electrode pads; 5-1. first copper foil circuit; 5-2. second copper foil circuit; 6. wall glue; 7. phosphor colloid; 8. screw hole; 9. through-hole copper column. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present disclosure, rather than all embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work also fall within the scope of protection of the present disclosure.

[0021] Please refer to Figures 1 to 5 , a mixed-color light source for indoor lighting provided by the technical solution, including a superconducting aluminum substrate 1, a plurality of chips 2, a wall glue 6, and a fluorescent powder colloid 7. The top surface and the bottom surface of the superconducting aluminum substrate 1 are respectively provided with a first copper foil circuit 5-1 and a second copper foil circuit 5-2, the first copper foil circuit 5-1 and the second copper foil circuit 5-2 are electrically connected, and the top surface of the superconducting aluminum substrate 1 is etched with a boss solid crystal area 3 and positive and negative electrode pads 4; the plurality of chips 2 adopt a flip-chip packaging structure, the boss solid crystal area 3 is provided with a plurality of solid crystal pads, and the plurality of solid crystal pads are coated with high thermal conductivity nano-tin paste, and the plurality of chips 2 are sintered by a vacuum eutectic furnace to realize that the plurality of chips 2 are welded on the plurality of solid crystal pads; the periphery of the boss solid crystal area 3 is provided with a wall glue 6 forming a closed circle; the surface of the plurality of chips 2 and the area inside the closed circle formed by the wall glue 6 are evenly sprayed with fluorescent powder colloid 7.

[0022] By using superconducting aluminum material as the substrate, and fixing the flip chip 2 on the superconducting aluminum substrate 1 through high thermal conductivity nano-tin paste, the heat on the chip 2 can be quickly transferred to the superconducting aluminum substrate 1 through the nano-tin paste, and then quickly transferred to the radiator through the superconducting aluminum substrate 1. A double-layer copper foil circuit is designed, and the first copper foil circuit 5-1 of the upper layer and the second copper foil circuit 5-2 of the lower layer are electrically connected through the through-hole copper column 9, which replaces the traditional process of using jumpers, which is beneficial to the stability of the circuit connection. By using the high thermal conductivity nano-tin paste eutectic method, the flip chip 2 and the superconducting aluminum substrate 1 are tightly combined together, and the chip 2 will not fall off due to the influence of the use environment. The gold wire-free packaging method is adopted to prevent the COB light source from burning and melting the gold wire under the impact of large current, resulting in a dead light.

[0023] Preferably, the surfaces of the boss crystal-fixing area 3, the positive and negative electrode pads 4, the first copper foil circuit 5-1, and the second copper foil circuit 5-2 are plated with nickel-palladium-gold, which is beneficial to improving the corrosion resistance, wear resistance, oxidation resistance and conductivity of the metal.

[0024] Preferably, the first copper foil circuit 5-1 is a twelve-series-eight-parallel circuit structure divided into two paths, one of which is twelve-series-four-parallel and the other is also twelve-series-four-parallel. The chips 2 connected to the two circuits are coated with phosphor glue of different colors respectively, and the chips 2 coated with phosphor glue of different colors are arranged in a uniform cross-phase staggered distribution to achieve uniform light color.

[0025] Preferably, the positive and negative electrode pads 4 include two groups, which are connected to the two circuits respectively. The positive and negative electrode pads 4 are connected to the power supply circuit to realize the independent control of the two circuits. The positive and negative electrode pads 4 of the two groups are respectively arranged at the diagonal positions of the superconducting aluminum substrate 1. The superconducting aluminum substrate 1 is provided with 8 screw holes at the other diagonal position where the positive and negative electrode pads 4 are arranged. The 8 screw holes are used to fix and install the indoor lighting mixed color light source.

[0026] Preferably, the superconducting aluminum substrate 1 has a size of 24×24×1.2 mm, and the die-bonding pad of the boss die-bonding area 3 (3) has a size of 0.41×0.84 mm.

[0027] Preferably, the outer diameter of the sealing ring formed by the wall glue 6 is φ21 mm, the width of the ring is 0.5-1 mm, and the height is 0.5-1 mm.

[0028] Preferably, the first copper foil circuit 5 - 1 and the second copper foil circuit 5 - 2 are provided with through-hole copper pillars 9 , and the electrical connection between the first copper foil circuit 5 - 1 and the second copper foil circuit 5 - 2 is achieved through the through-hole copper pillars 9 .

[0029] Preferably, the power of the single chip 2 is 0.2-1 W, and the driving current is 60 mA-350 mA.

[0030] Preferably, the fluorescent powder colloid 7 is prepared by mixing and stirring a high-temperature-resistant and high-color-rendering fluorescent powder and silica gel in a ratio of 2.67:1.

[0031] The indoor lighting mixed-color light source disclosed in this scheme is manufactured in the following process: a highly thermally conductive superconducting aluminum material is used as a substrate. The surface of the superconducting aluminum substrate 1 is etched with a boss solid crystal area 3, a first copper foil circuit 5-1, a second copper foil circuit 5-2, and a number of solid crystal pads, and a screw hole 8 is provided. The boss solid crystal area 3, the first and second copper foil circuits, and the solid crystal pad surfaces are all plated with nickel-palladium-gold. A highly thermally conductive nano-tin paste is printed on the boss solid crystal area 3 of the superconducting aluminum substrate 1 by an automatic printing machine, and then the flip chip 2 is fixed to the boss solid crystal area 3 of the superconducting aluminum substrate 1 by an automatic solid crystal machine, and then placed in a vacuum eutectic furnace for sintering and welding, so that the chip 2 and the superconducting aluminum substrate 1 can be tightly combined. An automatic dam machine is used to apply the wall glue 6 to form a circular retaining wall with a diameter of 21 mm on the periphery of the boss solid crystal area 3 of the superconducting aluminum substrate 1. High color rendering and high temperature resistance phosphor and silica gel are prepared in a ratio of 2.67:1, and are fully stirred and mixed by an automatic mixer. The superconducting aluminum substrate 1 is then placed in an automatic powder spraying machine for powder coating with phosphor colloid 7, and finally sent to an oven for baking and curing to form a complete indoor lighting mixed color light source.

[0032] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. A mixed color light source for indoor lighting, characterized in that: include: A superconducting aluminum substrate, wherein the top surface and the bottom surface of the superconducting aluminum substrate are respectively provided with a first copper foil circuit and a second copper foil circuit, the first copper foil circuit and the second copper foil circuit are electrically connected, and the top surface of the superconducting aluminum substrate is etched with a boss crystal fixing area and positive and negative electrode pads; A plurality of chips, wherein the plurality of chips adopt a flip-chip packaging structure, the boss bonding area is provided with a plurality of bonding pads, the plurality of bonding pads are coated with a high thermal conductivity nano-tin paste, and the plurality of chips are sintered in a vacuum eutectic furnace to realize welding of the plurality of chips on the plurality of bonding pads; Wall glue, the periphery of the boss solid crystal area is provided with a wall glue forming a closed circle; Fluorescent powder colloid is evenly sprayed on the surfaces of the plurality of wafers and the area within the closed circle formed by the wall glue.

2. The indoor lighting mixed color light source according to claim 1, characterized in that: The surfaces of the boss crystal fixing area, the positive and negative electrode pads, the first copper foil circuit, and the second copper foil circuit are plated with nickel-palladium-gold.

3. The indoor lighting mixed color light source according to claim 2, characterized in that: The first copper foil circuit is a twelve-in-eight-in-two circuit structure, one of which is twelve-in-four-in-one and the other is twelve-in-four-in-one. The chips connected to the two circuits are coated with phosphor glue of different colors, and the chips coated with phosphor glue of different colors are evenly cross-distributed.

4. The indoor lighting mixed color light source according to claim 3, characterized in that: The positive and negative electrode pads include two groups, which are respectively connected to the two circuits. The positive and negative electrode pads are connected to the power supply circuit to realize independent control of the two circuits. The positive and negative electrode pads of the two groups are respectively arranged at diagonal positions of the superconducting aluminum substrate.

5. The indoor lighting mixed color light source according to claim 4, characterized in that: The superconducting aluminum substrate is provided with screw holes at another diagonal position where the positive and negative electrode pads are provided, and the screw holes are used to fix and install the indoor lighting mixed-color light source.

6. The indoor lighting mixed color light source according to claim 1, characterized in that: The size of the superconducting aluminum substrate is 24×24×1.2 mm, and the size of the crystal bonding pad in the boss crystal bonding area is 0.41×0.84 mm.

7. The indoor lighting mixed color light source according to claim 6, characterized in that: The outer diameter of the sealing ring formed by the wall glue is φ21mm, the width of the ring is 0.5-1mm, and the height is 0.5-1mm.

8. The indoor lighting mixed color light source according to claim 1, characterized in that: The first copper foil circuit and the second copper foil circuit are provided with through-hole copper pillars, and the electrical connection between the first copper foil circuit and the second copper foil circuit is achieved through the through-hole copper pillars.

9. The indoor lighting mixed color light source according to claim 1, characterized in that: The power of a single chip is 0.2-1W, and the drive current is 60mA-350mA.

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