Resonant cavity module and tunable laser device
By designing a resonant cavity module including a reflective component, a collimating component and an optical amplifier chip in a tunable laser device, the problems of high power consumption, large optical signal line width, and low optical power of existing laser devices are solved, and low power is achieved. Optical signal output with high optical power consumption, narrow linewidth.
Patent Information
- Application Number
- CN202420279510.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-02-02
AI Technical Summary
The existing tunable laser devices have higher overall power consumption, larger optical signal line width, and lower optical power.
Design a resonant cavity module, including a first reflective component, a second reflective component, a first collimation component, a second collimation component and an optical amplifier chip. These components form a resonant cavity and use the gain amplification function of the optical amplifier chip to achieve Oscillation and lasing of optical signals.
Under the condition of lower power consumption, an optical signal with higher optical power is output. Compared with the integrated chip, the optical length of the resonant cavity module of the present application is longer, and the output optical signal has a narrower line width.
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Figure CN222365894U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication devices, in particular to a resonant cavity module and a tunable laser device. Background Art
[0002] Coherent optical communication devices are key devices used in coherent optical communication systems to generate, modulate, transmit and detect coherent optical signals. These devices play an important role in optical communication systems and can achieve high-speed, high-capacity and long-distance optical communication transmission.
[0003] Since coherent optical communication devices have large device insertion loss, there are relatively high requirements for the output optical power of the light source. Tunable laser devices used as light sources usually include gain chips with integrated resonant cavities. The optical signal is reflected back and forth by the reflective films at both ends of the gain chip, oscillated and emitted before being output.
[0004] However, the above-mentioned tunable laser device has high overall power consumption, and the output optical signal line width is large and the optical power is low. Utility Model Content
[0005] The technical problem to be solved by the embodiments of the utility model is to provide a resonant cavity module and a tunable laser device to solve the problems of high overall power consumption, large optical signal line width and low optical power of the tunable laser device in the prior art.
[0006] The utility model discloses a resonant cavity module, comprising a first reflection component, a second reflection component, a first collimation component, a second collimation component and an optical amplifier chip;
[0007] The first collimating component is disposed between the first end of the optical amplifier chip and the first reflecting component;
[0008] The second collimating component is disposed between the second end of the optical amplifier chip and the second reflecting component;
[0009] The optical signal output from the first end of the optical amplifier chip is sequentially transmitted to the first collimation component and the first reflection component, and is returned to the optical amplifier chip for amplification through total reflection by the first reflection component. The amplified optical signal together with the optical signal output from the second end is sequentially transmitted to the second collimation component and the second reflection component, and the second reflection component outputs a part of the optical signal, reflects the other part of the optical signal and returns to the optical amplifier chip for amplification through the second collimation component.
[0010] Optionally, the resonant cavity module further includes a chip base, the optical amplifier chip is welded on the chip base, and the first reflection component, the second reflection component, the first collimation component and the second collimation component are all arranged on the chip base.
[0011] Optionally, a first positioning groove and a second positioning groove arranged side by side are provided on the chip base, the first collimating component is positioned in the first positioning groove, and the first reflecting component is positioned in the second positioning groove.
[0012] Optionally, the chip base is further provided with a third positioning groove and a fourth positioning groove arranged side by side, the second collimating component is positioned in the three positioning grooves, and the second reflecting component is positioned in the fourth positioning groove.
[0013] Optionally, the first reflection component includes a total reflection mirror, and the total reflection mirror totally reflects the optical signal and then incident on the first end of the optical amplifier chip through the first collimation component.
[0014] Optionally, the second reflective component includes a partial reflector, which outputs a portion of the optical signal and reflects another portion of the optical signal to be incident on the second end of the optical amplifier chip through the second collimating component.
[0015] The utility model also discloses a tunable laser device, comprising a filter component and the resonant cavity module as described above, wherein part of the optical signal output by the second reflection component of the resonant cavity module is filtered by the filter component and then output.
[0016] Optionally, the filter component includes a first filter element and a second filter element arranged side by side, and part of the optical signal output by the second reflective component of the resonant cavity module is filtered by the first filter element and the second filter element in sequence before being output.
[0017] Optionally, the tunable laser device further comprises an optical isolator, which is disposed at an output end of the tunable laser device and is used to prevent the output optical signal from being reflected back to the filter component.
[0018] Optionally, the tunable laser device further comprises a cooling element, and the resonant cavity module, the filter assembly and the optical isolation element are all mounted on the cooling element.
[0019] Compared with the prior art, the beneficial effect of the resonant cavity module and the tunable laser device provided by the embodiments of the utility model is that: by arranging the first collimation component between the first end of the optical amplifier chip and the first reflection component, and the second collimation component between the second end of the optical amplifier chip and the second reflection component, the first reflection component, the first collimation component, the optical amplifier chip, the second collimation component and the second reflection component form a resonant cavity. Since the resonant cavity is formed based on the optical amplifier chip, the optical signal is continuously transmitted back and forth in the resonant cavity to form oscillation and further lasing, so that a high optical power optical signal can be continuously output to the outside of the resonant cavity under the condition of lower power consumption. Moreover, compared with the integrated chip, the optical length of the resonant cavity module of the present application is longer, and the output optical signal has a narrower line width. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:
[0021] Figure 1 It is a three-dimensional schematic diagram of a resonant cavity module provided in an embodiment of the utility model;
[0022] Figure 2 It is a schematic diagram of the optical path of the resonant cavity module provided in an embodiment of the utility model;
[0023] Figure 3 It is a three-dimensional schematic diagram of a chip base provided by an embodiment of the utility model;
[0024] Figure 4 It is a three-dimensional schematic diagram of a tunable laser device provided in an embodiment of the utility model.
[0025] The reference numerals in the figures are:
[0026] 100, resonant cavity module; 110, first reflection component; 120, second reflection component; 130, first collimation component; 140, second collimation component; 150, optical amplifier chip; 160, chip base; 161, first positioning groove; 162, second positioning groove; 163, third positioning groove; 164, fourth positioning groove;
[0027] 200, filter assembly; 210, first filter element; 220, second filter element; 300, optical isolation element; 400, cooling element; 500, housing. DETAILED DESCRIPTION
[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.
[0029] The present utility model embodiment provides a resonant cavity module 100, such as Figure 1 and Figure 2 As shown, the resonant cavity module 100 includes a first reflective component 110, a second reflective component 120, a first collimating component 130, a second collimating component 140 and an optical amplifier chip 150.
[0030] The first collimating component 130 is disposed between the first end of the optical amplifier chip 150 and the first reflecting component 110;
[0031] The second collimating component 140 is disposed between the second end of the optical amplifier chip 150 and the second reflecting component 120;
[0032] Among them, the optical signal output from the first end of the optical amplifier chip 150 is transmitted to the first collimating component 130 and the first reflecting component 110 in sequence, and is fully reflected by the first reflecting component 110 and returned to the optical amplifier chip 150 for amplification. The amplified optical signal and the optical signal output from the second end are transmitted to the second collimating component 140 and the second reflecting component 120 in sequence. The second reflecting component 120 outputs a part of the optical signal, reflects the other part of the optical signal and returns it to the optical amplifier chip 150 through the second collimating component 140 for amplification.
[0033] In the present application, the first collimating component 130 is arranged between the first end of the optical amplifier chip 150 and the first reflecting component 110, and the second collimating component 140 is arranged between the second end of the optical amplifier chip 150 and the second reflecting component 120. The first reflecting component 110, the first collimating component 130, the optical amplifier chip 150, the second collimating component 140 and the second reflecting component 120 form a resonant cavity. Since the resonant cavity is formed based on the optical amplifier chip 150, the overall power consumption is low, and the optical signal is continuously transmitted back and forth in the resonant cavity to form oscillation and further lasing, so that a high optical power optical signal can be continuously output to the outside of the resonant cavity under low power consumption conditions. In addition, compared with the integrated chip, the resonant cavity module 100 of the present application has a longer optical length and the output optical signal has a narrower line width.
[0034] The optical signal output from the optical amplifier chip 150 to the second collimator component 140 includes the optical signal amplified by the internal gain of the optical amplifier chip 150 and the optical signal originally output from the second end. The optical signal reflected by the second reflective component 120 and returned to the optical amplifier chip 150 through the second collimator component 140 also forms gain and amplification inside the chip, that is, there is always a part of the optical energy that is continuously transmitted back and forth in the resonant cavity module 100 and forms oscillation and further lasing, and this process is repeated infinitely. In this way, after countless back and forth oscillations and countless lasings, the resonant laser of the resonant cavity module 100 becomes stronger and stronger, and is continuously transmitted to the outside of the cavity without interruption.
[0035] The first collimating component 130 can convert the divergent light beam into a parallel light beam, so that the light beam remains parallel during propagation, or focus the parallel light beam to a point, which can be used to control the propagation direction and angle of the light beam, so that the light beam can be focused on a distant target. Specifically, the optical signal output from the first end of the optical amplifier chip 150 is converted into a parallel light signal by the first collimating component 130, and the parallel light signal is transmitted to the first reflecting component 110, and the first reflecting component 110 reflects all the parallel light signals back to the first collimating component 130, and the first collimating component 130 focuses the parallel light signal and transmits it to the optical amplifier chip 150.
[0036] Specifically, in this embodiment, the first collimating component 130 includes a first collimating lens, which can convert the optical signal output from the first end of the optical amplifier chip 150 into a parallel optical signal, transmit it to the first reflecting component 110, and can focus the optical signal reflected back by the first reflecting component 110 and transmit it to the optical amplifier chip 150.
[0037] In other embodiments, the first collimating assembly 130 may also include a collimating lens structure, wherein the collimating lens structure includes a plurality of collimating lenses. The collimating lens structure may also collimate or focus the optical signal.
[0038] The second collimating component 140 can also convert the divergent light beam into a parallel light beam, so that the light beam remains parallel during propagation, or focus the parallel light beam to a point, which can be used to control the propagation direction and angle of the light beam, so that the light beam can be focused on a distant target. Specifically, the optical signal output from the second end of the optical amplifier chip 150 is converted into a parallel light signal by the second collimating component 140, and the parallel light signal is transmitted to the second reflecting component 120, and the second reflecting component 120 reflects a part of the parallel light signal back to the second collimating component 140, and the second collimating component 140 focuses the reflected parallel light signal and transmits it to the optical amplifier chip 150.
[0039] Specifically, in this embodiment, the second collimating component 140 includes a second collimating lens, which can convert the optical signal output by the optical amplifier chip 150 into a parallel optical signal, transmit it to the second reflecting component 120, and can focus the optical signal reflected back by the second reflecting component 120 and transmit it to the optical amplifier chip 150.
[0040] In other embodiments, the second collimating assembly 140 may also include a collimating lens structure, wherein the collimating lens structure includes a plurality of collimating lenses. The collimating lens structure may also collimate or focus the optical signal.
[0041] The optical amplifier chip 150 is a chip that integrates components such as lasers and optical amplifiers. The laser is used as a light source to emit an optical signal. The optical amplifier chip 150 can emit an optical signal by passing current, and can also amplify the input optical signal. Compared with the gain chip, the optical amplifier chip 150 requires less current and consumes less power, so that the overall power consumption of the resonant cavity module 100 is lower. Among them, the first end of the optical amplifier chip 150 outputs an optical signal, specifically, it outputs a divergent light beam through the output waveguide port of the first end. The second end of the optical amplifier chip 150 outputs an optical signal, specifically, it outputs an emitted light beam through the output waveguide port of the second end.
[0042] In this embodiment, the first reflection component 110 includes a total reflection mirror, which totally reflects the optical signal and then transmits it to the first end of the optical amplifier chip 150 through the first collimating component 130 .
[0043] The arrangement of the total reflection mirror can realize the reflection of all the optical signals back to the first collimating assembly 130. In specific applications, a total reflection film is plated on the total reflection mirror to realize 100% reflection of the optical signal.
[0044] In other embodiments, the first reflection component 110 may include a total reflection mirror structure, which includes a plurality of total reflection mirrors. The total reflection mirror structure may also achieve 100% reflection of the optical signal.
[0045] In this embodiment, the second reflective component 120 includes a partial reflector, which outputs a portion of the optical signal and reflects another portion of the optical signal to be incident on the second end of the optical amplifier chip 150 through the second collimating component 140 .
[0046] The setting of the partial reflector can realize the reflection of part of the light signal back to the second collimating component 140, and the transmission of the other part of the light signal. In specific applications, a partial reflective film is plated on the partial reflector, which can reflect part of the transmitted light and transmit the rest. The reflection ratio can be any ratio between 0-100%, for example, the reflection ratio can be 10% and the transmission ratio can be 90%, or the reflection ratio can be 5% and the transmission ratio can be 95%, etc. The user can set it according to actual needs.
[0047] In other embodiments, the second reflective component 120 may include a partial reflector structure, which includes a plurality of partial reflectors. The partial reflector structure may also reflect a portion of the light signal back to the second collimating component 140 and transmit another portion of the light signal for output.
[0048] refer to Figure 1In this embodiment, the resonant cavity module 100 further includes a chip base 160 , the optical amplifier chip 150 is soldered on the chip base 160 , and the first reflection component 110 , the second reflection component 120 , the first collimation component 130 and the second collimation component 140 are all disposed on the chip base 160 .
[0049] By arranging the first reflection component 110, the second reflection component 120, the first collimation component 130 and the second collimation component 140 on the chip base 160 on which the optical amplifier chip 150 is welded, the optical amplifier chip 150 is packaged together with other components and arranged on the chip base 160, the packaging and assembly is convenient, and the chip base 160 can be moved to move the entire resonant cavity and the whole can be combined with other components to form other functional components, such as a tunable laser device, and the operation is very convenient.
[0050] Among them, the optical amplifier chip 150 can be welded on the chip base 160 by eutectic welding. Eutectic welding is an important method in microelectronic assembly, also known as low melting point alloy welding. A eutectic alloy sheet (eutectic solder) is placed between the chip and the carrier, and the alloy is heated to the eutectic point in a certain protective atmosphere to melt it, and then filled between the tube core and the carrier. At the same time, a small amount of gold on the back of the tube core and the surface of the carrier will enter the molten solder. After cooling, an atomic bond between the alloy solder and the gold layer will be formed, thereby completing the welding of the chip and the tube shell or other circuit carriers. Eutectic welding has the advantages of low connection resistance, high heat transfer efficiency, uniform heat dissipation, high welding strength, and good process consistency.
[0051] refer to Figure 1 and Figure 3 In this embodiment, a first positioning groove 161 and a second positioning groove 162 arranged side by side are provided on the chip base 160 , the first collimating component 130 is positioned in the first positioning groove 161 , and the first reflecting component 110 is positioned in the second positioning groove 162 .
[0052] The first positioning groove 161 and the second positioning groove 162 are provided to respectively position the first collimating component 130 and the first reflecting component 110 , and a passive alignment assembly method is adopted to achieve accurate assembly and positioning of the first collimating component 130 and the first reflecting component 110 , and the process is simple.
[0053] refer to Figure 1 and Figure 3 In this embodiment, the chip base 160 is further provided with a third positioning groove 163 and a fourth positioning groove 164 arranged side by side, the second collimating component 140 is positioned in the three positioning grooves, and the second reflecting component 120 is positioned in the fourth positioning groove 164 .
[0054] The second collimating assembly 140 and the second reflecting assembly 120 are positioned respectively by providing the third positioning groove 163 and the fourth positioning groove 164 , and the assembly and positioning of the second collimating assembly 140 and the second reflecting assembly 120 are achieved by adopting a passive alignment assembly method, and the process is simple.
[0055] The resonant cavity module 100 of the present application is used as an external resonant cavity in a tunable laser device.
[0056] The present application also provides a tunable laser device, such as Figure 4 As shown, the tunable laser device includes a filter component 200 and the resonant cavity module 100 as described above, and a portion of the optical signal output by the second reflective component 120 of the resonant cavity module 100 is filtered by the filter component 200 and then output.
[0057] The resonant cavity module 100 in the tunable laser device of the present application is formed by arranging the first collimating component 130 between the first end of the optical amplifier chip 150 and the first reflecting component 110, and the second collimating component 140 between the second end of the optical amplifier chip 150 and the second reflecting component 120. The first reflecting component 110, the first collimating component 130, the optical amplifier chip 150, the second collimating component 140 and the second reflecting component 120 form a resonant cavity. Since the resonant cavity is formed based on the optical amplifier chip 150, the overall power consumption is low, and the optical signal is continuously transmitted back and forth in the resonant cavity to form oscillation and further lasing, so that a high optical power optical signal can be continuously output to the outside of the resonant cavity under low power consumption conditions. In addition, compared with the integrated chip, the resonant cavity module 100 of the present application has a longer optical length and the output optical signal has a narrower line width.
[0058] The optical signal output by the resonant cavity module 100 is filtered by the filter component 200, so as to filter and select the wavelength and output an optical signal of a single wavelength or a single mode.
[0059] refer to Figure 4 In this embodiment, the filter component 200 includes a first filter element 210 and a second filter element 220 arranged side by side, and part of the optical signal output by the second reflective component 120 of the resonant cavity module 100 is filtered by the first filter element 210 and the second filter element 220 in sequence and then output.
[0060] The optical signal forms an oscillating laser in the resonant cavity module 100, which is output through partial reflection mirror transmission of the second reflection component 120. The output laser is a collimated light beam, which is a multi-mode light. The multi-mode resonant light passes through the first filter 210 and the second filter 220 successively. At the same time, only light of a single wavelength can pass through the first filter 210 and the second filter 220 at the same time, thus completing the filtering and selection of wavelengths, that is, filtering the multi-mode light into a single wavelength or a single mode of light.
[0061] Regarding the selection of wavelength by the filter, the first filter 210 and the second filter 220 are generally controlled to have different operating temperatures, so that light of different wavelengths passes through the first filter 210 and the second filter 220, thereby completing the selection of wavelength.
[0062] The first filter element 210 and the second filter element 220 can be filters or filter plates, both of which can filter and select light wavelengths.
[0063] A filter is an optical component used to selectively transmit or block light of a specific wavelength or frequency. Filters are usually made of specific optical materials, such as glass, film, crystal, etc., and usually have a more complex structure, which can achieve more precise spectral selection and filtering functions.
[0064] A filter is a simple filtering element, usually a thin or sheet-like optical material with specific optical properties. Filters usually have a simpler structure and are used to selectively transmit or block light of a specific wavelength or frequency.
[0065] refer to Figure 4 The tunable laser device further includes an optical isolator 300 , which is disposed at the output end of the tunable laser device and is used to prevent the output optical signal from being reflected back to the filter component 200 .
[0066] The optical isolator 300 may be specifically an optical isolator. An optical isolator is an optical passive device that allows light to pass in one direction only and blocks light from passing in the opposite direction. Its function is to prevent the adverse effects of backward transmission light generated in the optical path due to various reasons on the tunable laser device.
[0067] refer to Figure 4 In this embodiment, the tunable laser device further includes a cooling element 400 , and the resonant cavity module 100 , the filter component 200 and the optical isolation element 300 are all mounted on the cooling element 400 .
[0068] Since the transmission of optical signals generates heat, the cooling element 400 can be provided to dissipate heat from the resonant cavity module 100 , the filter assembly 200 and the optical isolation element 300 .
[0069] Specifically, the cooling element 400 may be a semiconductor refrigerator, which includes a plurality of thermocouples, which are controlled by electric current. When electric current passes through the thermocouples, the thermocouples on one side absorb heat, making them colder, while the thermocouples on the other side release heat, making them hotter. By controlling the direction and magnitude of the electric current, the temperature can be adjusted and controlled. The semiconductor refrigerator has no mechanical movement, no vibration, no noise, a compact structure, and a fast response.
[0070] In this embodiment, the tunable laser device may further include a shell 500, on which an optical window is arranged, and the resonant cavity module 100, the filter assembly 200, the optical isolation element 300 and the cooling element 400 are all arranged in the shell 500, and finally the optical signal output by the optical isolation element 300 is output from the optical window.
[0071] The arrangement of the positioning grooves in the resonant cavity module 100 of the tunable laser device enables the collimated light beam output by the tunable laser device to be emitted from the center of the light window, which facilitates the subsequent coupling of the device with the external optical fiber and laser welding.
[0072] The tunable laser device of the present application can be used in coherent optical communication transmission links as a tunable laser light source to meet the application scenario requirements of high power and narrow linewidth.
[0073] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.
Claims
1. A resonant cavity module, characterized in that: It includes a first reflection component, a second reflection component, a first collimation component, a second collimation component and an optical amplifier chip; The first collimating component is disposed between the first end of the optical amplifier chip and the first reflecting component; The second collimating component is disposed between the second end of the optical amplifier chip and the second reflecting component; The optical signal output from the first end of the optical amplifier chip is sequentially transmitted to the first collimation component and the first reflection component, and is returned to the optical amplifier chip for amplification through total reflection by the first reflection component. The amplified optical signal together with the optical signal output from the second end is sequentially transmitted to the second collimation component and the second reflection component, and the second reflection component outputs a part of the optical signal, reflects the other part of the optical signal and returns to the optical amplifier chip for amplification through the second collimation component.
2. The resonant cavity module according to claim 1, characterized in that: The resonant cavity module further comprises a chip base, the optical amplifier chip is welded on the chip base, and the first reflection component, the second reflection component, the first collimation component and the second collimation component are all arranged on the chip base.
3. The resonant cavity module according to claim 2, characterized in that: The chip base is provided with a first positioning groove and a second positioning groove arranged side by side, the first collimating component is positioned in the first positioning groove, and the first reflecting component is positioned in the second positioning groove.
4. The resonant cavity module according to claim 3, characterized in that: The chip base is also provided with a third positioning groove and a fourth positioning groove arranged side by side, the second collimating component is positioned in the three positioning grooves, and the second reflecting component is positioned in the fourth positioning groove.
5. The resonant cavity module according to any one of claims 1 to 4, characterized in that: The first reflection component includes a total reflection mirror, and the total reflection mirror totally reflects the optical signal and then the optical signal is incident to the first end of the optical amplifier chip through the first collimation component.
6. The resonant cavity module according to claim 5, characterized in that: The second reflective component includes a partial reflective mirror, which outputs a portion of the optical signal and reflects another portion of the optical signal and is incident on the second end of the optical amplifier chip through the second collimating component.
7. A tunable laser device, characterized in that: It comprises a filter component and a resonant cavity module as claimed in any one of claims 1 to 6, wherein part of the optical signal output by the second reflective component of the resonant cavity module is filtered by the filter component and then output.
8. The tunable laser device according to claim 7, characterized in that: The filter assembly includes a first filter element and a second filter element arranged side by side, and part of the optical signal output by the second reflective assembly of the resonant cavity module is filtered by the first filter element and the second filter element in sequence before being output.
9. The tunable laser device according to claim 7, characterized in that: The tunable laser device further comprises an optical isolator, which is arranged at the output end of the tunable laser device and is used to prevent the output optical signal from reflecting back to the filter component.
10. The tunable laser device according to claim 9, characterized in that: The tunable laser device further comprises a cooling element, and the resonant cavity module, the filter assembly and the optical isolation element are all mounted on the cooling element.