EMC shielding case and electronic equipment

Abstract

The utility model discloses an EMC shielding case, comprising a first part which comprises a first side wall, a second side wall and a bottom wall, the second side wall is arranged around the first side wall, the bottoms of the first side wall and the second side wall are connected with the bottom wall to form a connection space, the inner surface of the bottom wall is provided with a plurality of elastic convex parts, and the outer surface of the bottom wall is used for connecting a circuit board; the second part comprises a retaining wall, and the bottom end of the retaining wall is inserted into the connecting space in the first direction and elastically abuts against the multiple elastic convex parts; along the second direction and the third direction, the side wall of the retaining wall is separately arranged with the first side wall and the second side wall at intervals; the first direction, the second direction and the third direction are perpendicular to one another; the first portion and the second portion are conductors. The utility model can be in stable contact with the circuit board, and can realize the integrity of shielding. The utility model also provides an electronic device.

Description

Technical Field

[0001] The utility model relates to the technical field of electromagnetic shielding, in particular to an EMC shielding cover and electronic equipment. Background Art

[0002] When high-frequency circuits are working, some of their components (such as inverters) will radiate electromagnetic waves, thereby causing electromagnetic interference to nearby equipment. Therefore, an EMC (Electromagnetic Compatibility) shielding solution is required to ensure that electronic equipment or systems are neither affected by electromagnetic interference nor cause electromagnetic interference to the environment in the same electromagnetic environment.

[0003] At present, common EMC shielding solutions include: 1. Direct contact between a circuit board (such as a PCB circuit board, i.e., a Printed Circuit Board) and a housing (such as an inverter housing) to form a shielding space; 2. Adding multiple springs between the circuit board and the housing.

[0004] Since the circuit board is easily affected by factors such as temperature, welding heat, material, design, etc. and causes warping and deformation, and there are also installation tolerances (such as straightness tolerance) during the manufacturing process, for the first EMC shielding solution, the circuit board and the housing often have no contact or poor contact.

[0005] In order to solve the contact problem existing in the above-mentioned first EMC shielding solution, a second EMC shielding solution is introduced, that is, multiple springs are welded on the circuit board to connect the shell with the multiple springs. However, in the actual installation process, the springs are easily deformed by compression. At the same time, there are gaps between the springs and between the circuit board and the shell, which affects the electromagnetic shielding effect.

[0006] In addition, based on the second EMC shielding solution, some electronic manufacturers usually set a fixed block (such as an aluminum block) between the circuit board and the housing to solve the problem of spring deformation, and mold a shielding member including multiple springs on the housing, so that the multiple springs are connected to the fixed block to release the stress of the springs on the circuit board. However, there is still a shielding gap between the springs, resulting in a relatively incomplete shielding space, and this solution has a high structural and installation complexity, which cannot meet the needs of the current miniaturization of electronic components. Utility Model Content

[0007] The purpose of the utility model is to solve the technical problem that the circuit board and the housing cannot have both good contact and complete shielding in the existing shielding solution. The utility model provides an EMC shielding cover and an inverter, which can stably contact with the circuit board and achieve shielding integrity. In addition, the EMC shielding cover of the utility model has low structural complexity, compact structure and is easy to install.

[0008] In order to solve the above technical problems, the embodiment of the utility model discloses an EMC shielding cover, comprising:

[0009] The first part includes a first side wall, a second side wall and a bottom wall, wherein the second side wall is arranged around the first side wall, the bottoms of the first side wall and the second side wall are connected to the bottom wall to form a connection space, the inner surface of the bottom wall is provided with a plurality of elastic protrusions, and the outer surface of the bottom wall is used for connecting a circuit board;

[0010] The second part includes a retaining wall, wherein along the first direction, the bottom end of the retaining wall is inserted into the connection space and elastically abuts against the plurality of elastic protrusions; along the second direction and the third direction, the side walls of the retaining wall are spaced from the first side wall and the second side wall respectively; the first direction, the second direction and the third direction are perpendicular to each other;

[0011] The first portion and the second portion are electrical conductors.

[0012] By adopting the above technical solution, in actual application, the outer surface of the bottom wall of the first part is set on the circuit board (for example, welded on the circuit board), and the first part is treated as a whole, the welding method is simple, and the cumulative tolerance is small; a connecting space for plugging with the second part is formed between the two side walls and the bottom wall of the first part, and a plurality of elastic protrusions are set on the inner surface of the bottom wall (that is, the bottom of the connecting space); then the retaining wall of the second part is inserted into the connecting space so that the bottom end of the retaining wall can abut against each elastic protrusion.

[0013] Since the EMC shielding cover of the embodiment of the present application is provided with a first part including a plurality of elastic protrusions, there is no need to consider the flatness between the circuit board and the second part of the retaining wall. The retaining wall elastically abuts against each elastic protrusion so that the second part can stably and well contact the circuit board. At the same time, the first side wall and the second side wall enclose a connection space, and the retaining wall is inserted into the connection space along the first direction to form a complete shielding cavity, thereby effectively improving the shielding effect of the EMC shielding cover.

[0014] According to another specific embodiment of the present invention, each of the plurality of elastic protrusions is a spherical curved surface.

[0015] By adopting the above technical solution, the retaining wall of the embodiment of the present application can elastically abut against multiple elastic protrusions with spherical curved surfaces. Compared with directly connecting the bottom end of the retaining wall to the ground plane of the circuit board, the connection scheme of the embodiment of the present application can ensure sufficient connection between the first part and the second part, and ultimately achieve good contact between the second part and the circuit board.

[0016] According to another specific embodiment of the present invention, a portion of the plurality of elastic protrusions are arranged at intervals along the second direction, and another portion of the plurality of elastic protrusions are arranged at intervals along the third direction.

[0017] By adopting the above technical solution, a plurality of elastic protrusions are arranged at intervals in the second direction and the third direction, respectively, which can ensure that the bottom end of the retaining wall can be fully elastically connected with each elastic protrusion, thereby improving the contact effect between the first part and the second part. Exemplarily, on the other hand, since the elastic protrusions are arranged in an interval manner and are elastic themselves, the height difference between each elastic protrusion can be ignored, thereby improving the fault tolerance of the elastic protrusion processing technology.

[0018] According to another specific embodiment of the present invention, the bottom end of the retaining wall is interference fit with the multiple elastic protrusions.

[0019] According to another specific embodiment of the present utility model, the second part also includes a plate body, and along the first direction, the retaining wall is arranged on the side of the plate body facing the first part, and forms a accommodating space penetrating along the first direction with the plate body, and along the first direction, a part of the connecting space is connected to the accommodating space, and the accommodating space is used to accommodate electronic components.

[0020] By adopting the above technical solution, the plate body of the second part of the embodiment of the present application is provided with a through hole, and a retaining wall is arranged around the through hole, the retaining wall is connected to the side of the plate body facing the first part along the first direction, and the through hole of the plate body and the retaining wall together constitute a storage space for accommodating electronic components (such as filters), and the storage space and a part of the connection space are connected in the first direction. In this arrangement, the EMC shielding cover of the embodiment of the present application can relatively completely shield the electronic components located in the storage space from electromagnetic interference.

[0021] According to another specific implementation of the present utility model, the retaining wall and the plate body are integrally formed.

[0022] By adopting the above technical solution, the retaining wall and the plate body of the second part are made of the same conductive material and are formed in one go through the same mold, which can avoid tedious assembly during the processing, thereby improving production efficiency, saving materials and reducing production costs.

[0023] According to another specific embodiment of the present invention, the first side wall, the second side wall and the retaining wall are respectively rectangular ring structures.

[0024] According to another specific implementation of the present invention, the second part is an inverter housing.

[0025] The embodiment of the utility model further discloses an electronic device, comprising a circuit board and the above-mentioned EMC shielding cover, wherein the first part of the EMC shielding cover is connected to the circuit board.

[0026] By adopting the above technical solution, the electronic device (such as an inverter) in the embodiment of the present application adopts the above EMC shielding cover. On the one hand, a relatively complete shielding space can be formed between the circuit board and the EMC shielding cover. On the other hand, there is good contact between the circuit board and the EMC shielding cover, and the circuit board will not be deformed due to the addition of the shielding device.

[0027] According to another specific embodiment of the present invention, an electronic component is further included, wherein the electronic component is connected to the circuit board, and the first side wall of the first part and the retaining wall of the second part are jointly arranged around the electronic component.

[0028] By adopting the above technical solution, the first side wall and the blocking wall can relatively completely shield the electronic components on the circuit board from electromagnetic interference.

[0029] According to another specific implementation of the present invention, the electronic device includes an inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1a A cross-sectional view of an electronic device adopting an EMC shielding solution in some embodiments of the present invention is shown.

[0031] Figure 1b A three-dimensional diagram showing an electronic device adopting an EMC shielding solution in other embodiments of the present invention.

[0032] Figure 2 A three-dimensional diagram of an inverter according to an embodiment of the utility model and an EMC shielding cover used therein is shown.

[0033] Figure 3 A three-dimensional view of the first part of the EMC shielding cover according to an embodiment of the utility model is shown.

[0034] Figure 4 A three-dimensional view of the second part of the EMC shielding cover according to an embodiment of the utility model is shown.

[0035] Figure 5 A cross-sectional view of an EMC shielding cover according to an embodiment of the utility model is shown.

[0036] Figure 6 Show Figure 5 A partial enlarged view of the F area. DETAILED DESCRIPTION

[0037] The following is an explanation of the implementation of the present invention by specific specific embodiments. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that, in the absence of conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0038] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0039] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0040] The terms “first”, “second”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0041] In the description of this embodiment, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0042] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0043] See also Figure 1a and Figure 1b, two traditional EMC (Electromagnetic Compatibility) shielding solutions are shown by way of example. Figure 1a A cross-sectional view of an electronic device in an EMC shielding solution using direct contact is shown, Figure 1b A partial perspective view of an electronic device in an EMC shielding solution using a metal spring is shown.

[0044] like Figure 1a As shown, the electronic device includes a circuit board 100, a housing 110, and an electronic component 120. Figure 1a In the EMC shielding scheme shown, the electronic component 120 includes components that can emit high-frequency interference signals, such as IGBT (Insulated Gate Bipolar Transistor) power modules; the housing 110 has an electromagnetic shielding function, and the housing 110 includes a direction perpendicular to the circuit board 100 (such as Figure 1a The connecting end 111 extends in the direction a shown in FIG. 1 , and the connecting end 111 contacts the circuit board 100 (eg, Figure 1a As shown in the dotted box E), a shielding space can be formed.

[0045] Exemplarily, the shell 110 may be a metal shell with a fully enclosed structure or a partially enclosed structure, and the shell 110 may also be provided with holes or slits, which is not limited in the embodiments of the present application.

[0046] However, this shielding solution will result in the disadvantage of poor connection. The reasons are: for example, the circuit board will be easily warped due to thermal stress caused by uneven heating after welding, which will cause inaccurate positioning and hinder the installation of electronic components. At the same time, there are installation tolerances (such as straightness tolerance) in the manufacturing process. Therefore, for the first solution, there is often no contact or poor contact between the circuit board and the shell.

[0047] In order to solve the defects brought by the above-mentioned shielding scheme, a scheme of adding a conductive spring sheet (such as a metal spring sheet) between the circuit board and the housing can be provided, thereby effectively avoiding the risk of circuit board warping and poor contact between the circuit board and the housing. Figure 1b As shown, Figure 1b The electronic device shown exemplarily includes a circuit board 200 , a housing 210 , a plurality of springs 220 , and electronic components (not shown in the figure, such as an IGBT power module).

[0048] exist Figure 1bIn the EMC shielding scheme shown, multiple spring clips 220 are welded on the circuit board 200, and the end of the spring clip 220 away from the circuit board 200 is in contact with the shell 210, so that a shielding space can be formed, but there is a gap 2000 between the spring clips 220, resulting in a relatively incomplete shielding space under this scheme; at the same time, due to the large cumulative tolerance in the process of welding multiple spring clips 220 to the circuit board 200 and assembling them to the shell 210, the spring clips 220 are easily flattened during actual installation work.

[0049] In order to solve the technical problem that the spring sheet 220 is easy to deform, some electronic manufacturers usually set a shielding member including multiple spring sheets on the housing (not shown in the figure), and then set a fixing member (such as a fixing block, or an aluminum block) between the circuit board and the housing to fix the circuit board. At this time, multiple spring sheets are connected to the fixing block, which can release the stress of the spring sheets on the circuit board and make the force uniform. However, this solution still has the gap problem introduced by the use of spring sheets, and the shielding space is relatively incomplete. In addition, this solution has high structural and installation complexity and cannot meet the needs of the current miniaturization of electronic components.

[0050] Based on this, see Figure 2 The embodiment of the present application provides an EMC shielding cover 1 and an inverter using the EMC shielding cover 1. Figure 2 A three-dimensional diagram of an inverter according to an embodiment of the present application is exemplarily shown.

[0051] It should be noted that the EMC shielding cover of the embodiment of the present application is not limited to the inverter, but can also be applied to any other electronic equipment and system that requires electromagnetic shielding and has no conflicting installation processes, such as controllers, motors, etc. The embodiment of the present application is described by taking the inverter in the field of automotive electronic products as an example.

[0052] Continue reading Figure 2 The inverter of the embodiment of the present application includes an EMC shielding cover 1 and a circuit board 30, such as Figure 2 As shown, the EMC shielding cover 1 is connected to the ground plane of the circuit board 30 (ie, one side of the circuit board 30 indicated along the Z1 direction).

[0053] In a possible implementation, the inverter of the embodiment of the present application further includes an electronic component (not shown in the figure, but a connector 40 of the electronic component is shown by way of example), the connector 40 is connected to the circuit board 30, and the above-mentioned EMC shielding cover 1 can surround the connector 40 to form a relatively complete shielding space.

[0054] The above-mentioned electronic components include components that can emit high-frequency interference signals. For example, in an inverter, it can be an IGBT power module or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). In the following embodiments of the present application, no specific exemplary restrictions are made on the electronic components, but they are interpreted as connectors 40.

[0055] By adopting the above technical solution, the inverter of the embodiment of the present application adopts the above EMC shielding cover. On the one hand, it can relatively completely shield the electromagnetic interference of high-frequency electronic components (connectors 40). On the other hand, there is good contact between the circuit board and the EMC shielding cover 1, and the circuit board 30 will not be deformed due to the addition of the shielding device.

[0056] The EMC shielding cover 1 according to the embodiment of the present application is described in detail below.

[0057] Continue reading Figure 2 The EMC shielding cover 1 of the embodiment of the present application includes a first part 10 and a second part 20. The first part 10 is used to connect the circuit board 30. The second part 20 is provided with a retaining wall 201. The retaining wall 201 can be inserted into the first part 10 to form a complete shielding space, and the electronic components that need to be electromagnetically shielded are wrapped between the first part 10 and the second part 20.

[0058] It should be noted that the first part 10 and the second part 20 of the embodiment of the present application are conductors, so that their conductive properties can be used to effectively shield electromagnetic signals. Exemplarily, the first part 10 and the second part 20 of the embodiment of the present application are made of metal materials, such as aluminum, copper and the like.

[0059] See also Figure 3 , Figure 3 A perspective view of the first part 10 in a top view is shown as an example.

[0060] Figure 3 The first part 10 shown is a rectangular ring structure, but this shape is only one possible implementation of the embodiment of the present application. The first part 10 can also be other shapes, such as a square ring, an elliptical ring, a trapezoidal ring, etc. The embodiment of the present application does not limit the shape of the first part 10, and it can be selected according to the actual application. For example, the shape of the first part 10 can be determined according to the arrangement of the circuit board.

[0061] The first part 10 of the embodiment of the present application includes a first side wall 101, a second side wall 102 and a bottom wall 103. Accordingly, in a possible implementation, the first side wall 101 and the second side wall 102 are rectangular ring structures, and the embodiment of the present application does not limit the shapes of the first side wall 101 and the second side wall 102.

[0062] See also Figure 3 Combined with Figure 2 Exemplarily, the first side wall 101 of the first part 10 and the retaining wall 201 of the second part 20 are arranged together around the connector 40.

[0063] By adopting the above technical solution, the first side wall 101 and the blocking wall 201 can relatively completely shield the electronic components (connectors 40 ) on the circuit board 30 from electromagnetic interference.

[0064] Continue reading Figure 3 Combined with Figure 2 The outer surface 1031 of the bottom wall 103 is used to connect the circuit board 30, that is, the outer surface 1031 is a side of the bottom wall 103 close to the circuit board 30 along the first direction (such as Figure 2 and Figure 3 Accordingly, the inner surface of the bottom wall 103 is the side of the bottom wall 103 away from the circuit board 30 along the first direction (eg Figure 2 and Figure 3 The inner surface of the bottom wall 103 will be described in detail later.

[0065] The second side wall 102 is disposed around the first side wall 101. Figure 3 The size L1 of the first side wall 101 is smaller than the size L2 of the second side wall 102, and the size L2 of the first side wall 101 is smaller than the size L2 of the second side wall 102. Figure 3 In the X direction shown in FIG. 1 , a size L3 of the first side wall 101 is smaller than a size L4 of the second side wall 102 .

[0066] The second direction and the third direction are related to the first direction (such as Figure 2 The Z direction shown in Figure 1 is perpendicular to each other. Figure 2 and Figure 3 For example, the first direction is the thickness direction of the circuit board 30, and the second direction is the length direction of the circuit board 30 (eg Figure 2 and Figure 3 The third direction is the width direction of the circuit board 30 (as shown in the Y direction). Figure 2 and Figure 3 X direction shown in FIG.

[0067] See also Figure 3 Combined with Figure 2, the bottom of the first side wall 101 and the second side wall 102 (ie Figure 3 The side indicated by the Z2 direction in the middle) is connected to the bottom wall 103, specifically, along the width direction of the bottom wall 103 (such as Figure 3 In the direction b shown in FIG, one side of the bottom wall 103 is connected to the bottom of the first side wall 101 , and the other side of the bottom wall 103 is connected to the bottom of the second side wall 102 .

[0068] Thus, the first side wall 101, the second side wall 102 and the bottom wall 103 can form a wall with an open top (i.e. Figure 3 The connecting space S is a connecting space S in which the side indicated by the Z1 direction is not closed. Exemplarily, the connecting space S is in a rectangular ring shape, the bottom wall of the connecting space S is the inner surface 1032 of the bottom wall 103, one of the side walls of the connecting space S is the inner surface of the first side wall 101, and the other side wall is the inner surface of the second side wall 102.

[0069] Continue reading Figure 3 Combined with Figure 2 Meanwhile, eighteen elastic protrusions 104 are provided on the inner surface 1032 of the bottom wall 103. Exemplarily, on both sides of the bottom wall 103 along the second direction (i.e. Figure 3 Four elastic protrusions 104 are arranged at intervals on both sides of the bottom wall 103 along the third direction (i.e. Figure 3 Five elastic protrusions 104 are respectively provided on both sides (in the X direction).

[0070] However, the embodiment of the present application does not limit the number of elastic protrusions 104. For example, three elastic protrusions 104 may be arranged at intervals on the left side of the bottom wall 103 along the second direction, five elastic protrusions 104 may be arranged at intervals on the right side of the bottom wall 103 along the second direction, four elastic protrusions 104 may be arranged at intervals on the upward side of the bottom wall 103 along the third direction, and seven elastic protrusions 104 may be arranged at intervals on the downward side of the bottom wall 103 along the third direction; or, an equal number of elastic protrusions 104 may be arranged on both sides indicated by the second direction and both sides indicated by the third direction, respectively.

[0071] That is to say, the elastic protrusions 104 of the embodiment of the present application can be different in number, spacing between adjacent elastic protrusions 104, and the height of each elastic protrusion 104 relative to the bottom wall 103 while satisfying the requirements of being elastic and protruding from the inner surface 1032 of the bottom wall 103.

[0072] In one possible implementation, see Figure 6 Combination Figure 3 , Figure 6The partially enlarged cross-sectional view of the elastic protrusion 104 in the EMC shielding cover of the embodiment of the present application is shown as an example. It can be seen that each elastic protrusion 104 is a spherical curved surface. However, the embodiment of the present application does not limit the shape of the elastic protrusion 104. As long as it is elastic and can be convexly arranged on the inner surface 1032 of the bottom wall 103, it belongs to the protection scope of the embodiment of the present application.

[0073] See also Figure 4 Combined with Figure 2 , Figure 4 The second part 20 is exemplarily shown in a three-dimensional view from a bottom-up perspective. The second part 20 includes a retaining wall 201. Exemplarily, the retaining wall 201 is a rectangular ring structure, but the embodiment of the present application does not limit the shape of the retaining wall 201.

[0074] See also Figure 5 and Figure 6 , along the first direction (such as Figure 5 The Z direction shown in FIG. 2 ), the bottom end of the retaining wall 201 (i.e. Figure 5 The end of the retaining wall 201 (in the direction Z2) is inserted into the connection space S and elastically abuts against the multiple elastic protrusions 104. In a possible implementation, the bottom end of the retaining wall 201 is in interference contact with the multiple elastic protrusions 104.

[0075] See also Figures 4 to 6 The retaining wall 201 includes an inner wall 2011 and an outer wall 2012. Exemplarily, the inner wall 2011 and the outer wall 2012 are respectively surrounded into a rectangular structure.

[0076] See also Figure 5 and Figure 6 Combined with Figure 2 , Figure 5 The cross-sectional view of the EMC shielding cover according to the embodiment of the present application is shown as an example. Figure 6 By way of example Figure 5 A partial enlarged view of the F region in FIG. 1 shows that along the second direction (eg Figure 5 and Figure 6 In the Y direction shown in FIG, the inner wall 2011 of the retaining wall 201 is spaced apart from the inner surface of the first side wall 101, and the outer wall 2012 of the retaining wall 201 is spaced apart from the inner surface of the second side wall 102.

[0077] Although Figure 5 and Figure 6 The third direction cannot be shown more intuitively, but further combined with Figure 2 and Figure 3 It can be seen that, accordingly, along the third direction (such as Figure 2 and Figure 3The inner wall 2011 of the retaining wall 201 is still spaced apart from the inner surface of the first side wall 101, and the outer wall 2012 of the retaining wall 201 is also spaced apart from the inner surface of the second side wall 102.

[0078] See also Figures 2 to 6 , using the above technical solution, in actual application, the outer surface of the bottom wall 103 of the first part 10 is set on the circuit board 30, for example, the outer surface of the bottom wall 103 is welded to the ground plane 30 of the circuit board by SMT (Surface Mounted Technology), and a connecting space S for plugging with the second part 20 is formed between the two side walls of the first part 10 and the bottom wall 103, and a plurality of elastic protrusions 104 are arranged on the inner surface of the bottom wall 103 (that is, the bottom of the connecting space S); then the retaining wall 201 of the second part 20 is inserted into the connecting space S so that the bottom end of the retaining wall 201 can abut against each elastic protrusion 104.

[0079] Since the EMC shielding cover of the embodiment of the present application is provided with the first part 10 including a plurality of elastic protrusions 104, there is no need to consider the flatness between the circuit board 30 and the retaining wall 201 of the second part 20, and the retaining wall 201 elastically abuts against each elastic protrusion 104, so that the second part 20 can stably and well contact the circuit board 30. At the same time, the first side wall 101 and the second side wall 102 enclose a connection space S, and the retaining wall 201 is inserted into the connection space S along the first direction, so as to form a complete shielding cavity, thereby effectively improving the shielding effect of the EMC shielding cover.

[0080] See also Figure 2 and Figure 4 In a possible implementation manner, the second portion 20 further includes a plate 202, along the first direction (eg Figure 2 and Figure 4 The retaining wall 201 is arranged on the side of the plate body 202 facing the first part 10 (i.e. Figure 2 and Figure 4 Further, the middle of the plate body 202 is hollowed out, so that the retaining wall 201 and the plate body 202 can form a receiving space Q, and the receiving space Q runs through the second part 20 along the first direction. The receiving space Q can be used to receive electronic components.

[0081] In a possible implementation, the retaining wall 201 and the plate body 202 are integrally formed. By adopting this technical solution, for example, the retaining wall 201 and the plate body 202 of the second part 20 can be made of the same conductive material and formed in one go through the same mold, which can avoid cumbersome assembly during the processing, thereby improving production efficiency, saving materials, and reducing production costs.

[0082] See also Figure 6 Combined with Figures 2 to 5 , along the first direction (such as Figure 6 The Z direction shown in FIG. 1 ), a portion of the connecting space S is connected to the accommodating space Q. The interval between the inner side wall 2011 of the retaining wall 201 and the inner surface of the first side wall 101 in the second direction is a first interval (eg Figure 6 The inner side wall 2011 and the inner surface of the first side wall 101 are located in the third direction (see Figure 2 The interval in the X direction (shown in FIG. 1 ) is the second interval.

[0083] That is, the portion of the connection space S communicating with the accommodation space Q refers to the sum of the areas of the first interval and the second interval along the first direction and located in the connection space S, respectively. Figure 6 The dashed box S1 in the middle exemplarily shows that the first interval is located in the area of ​​the connection space S along the first direction. Figure 6 The second interval is not shown in the area where the connection space S is located along the first direction, but referring to Figure 6 The dashed box S1 is combined with Figures 2 to 5 As well as the above textual description, it can be clearly understood that the second interval is arranged in the area of ​​the connection space S along the first direction.

[0084] More specifically, the EMC shielding cover of the embodiment of the present application is used to shield electronic components. Figures 2 to 5 The connector 40 of the electronic component is shown as an example. Figure 2 and Figure 5 Combined with Figure 3 and Figure 4 It can be understood that the connector 40 is electrically connected to the circuit board 30, and the first part 10 is arranged around the connector 40. After the retaining wall 201 of the second part 20 is inserted into the connection space S along the first direction, the first part 10, the second part 20, and the circuit board 30 can form a relatively complete shielding space to surround the connector 40. The above-mentioned accommodating space Q is used to accommodate the connector 40, but further, the connector 40 is actually also located in the space P formed by the first side wall 101 of the first part 10 (such as Figure 3 shown).

[0085] In a possible implementation manner, the second portion 20 is a housing of the inverter, that is, the plate body 202 of the embodiment of the present application may not be used as Figure 4The regular plate body extending along the second direction (Y direction) in the inverter can also be a shell for covering the entire circuit board 30 in the inverter, and the retaining wall 201 is a relatively small part set on the side of the shell facing the circuit board. For example, in this embodiment, multiple retaining walls 201 can be set on the plate body 202 serving as the inverter shell, which will include multiple accommodating spaces Q penetrating along the first direction. Correspondingly, multiple first parts 10 are set on the circuit board 30, which can electromagnetically shield multiple electronic components of high-frequency interference signals. Although the embodiments of the present application Figures 2 to 6 This implementation is not shown in the figure, but this implementation belongs to the protection scope of the embodiments of the present application.

[0086] Although the present invention has been illustrated and described with reference to certain preferred embodiments of the present invention, it should be understood by those skilled in the art that the above contents are further detailed descriptions of the present invention in combination with specific embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art may make various changes in form and details, including making several simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. An EMC shielding cover, characterized in that: include: The first part includes a first side wall, a second side wall and a bottom wall, wherein the second side wall is arranged around the first side wall, the bottoms of the first side wall and the second side wall are connected to the bottom wall to form a connection space, the inner surface of the bottom wall is provided with a plurality of elastic protrusions, and the outer surface of the bottom wall is used for connecting a circuit board; The second part includes a retaining wall, along the first direction, the bottom end of the retaining wall is inserted into the connection space and elastically abuts against the plurality of elastic protrusions; Along the second direction and the third direction, the side walls of the retaining wall are spaced apart from the first side wall and the second side wall respectively; the first direction, the second direction and the third direction are perpendicular to each other; The first portion and the second portion are electrical conductors.

2. The EMC shielding cover according to claim 1, characterized in that: Each of the plurality of elastic protrusions is a spherical curved surface.

3. The EMC shielding cover according to claim 1, characterized in that: A portion of the plurality of elastic protrusions is arranged at intervals along the second direction, and another portion of the plurality of elastic protrusions is arranged at intervals along the third direction.

4. The EMC shielding cover according to claim 1, characterized in that: The bottom end of the retaining wall is interference-fitted with the plurality of elastic protrusions.

5. The EMC shielding cover according to claim 1, characterized in that: The second part also includes a plate body. Along the first direction, the retaining wall is arranged on a side of the plate body facing the first part, and forms a accommodating space penetrating along the first direction with the plate body. Along the first direction, a part of the connecting space is connected to the accommodating space, and the accommodating space is used to accommodate electronic components.

6. The EMC shielding cover according to claim 5, characterized in that: The retaining wall and the plate body are integrally formed.

7. The EMC shielding cover according to claim 1, characterized in that: The first side wall, the second side wall and the retaining wall are respectively rectangular ring structures.

8. The EMC shielding cover according to claim 1, characterized in that: The second part is an inverter housing.

9. An electronic device, characterized in that: The invention comprises a circuit board and the EMC shielding cover according to any one of claims 1 to 8, wherein the first part of the EMC shielding cover is connected to the circuit board.

10. The electronic device according to claim 9, characterized in that: It also includes an electronic component, which is connected to the circuit board, and the first side wall of the first part and the blocking wall of the second part are arranged together around the electronic component.

11. The electronic device according to claim 9, characterized in that: The electronic device includes an inverter.

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