Front-stage detection platform for design verification and front-stage detection system thereof

Abstract

The utility model discloses a front step type detection platform for design verification and a front step type detection system thereof. The front step type detection platform comprises a base, a first vertical part, a bearing part, a second vertical part, a first track part, a second track part and a suspension part, the second rail part is movably arranged on the first rail part so as to move in the first axial direction. The suspension part is used for loading the test module and is movably arranged on the second track part to move in the second axial direction, the test module is configured to be close to the wafer to be tested through the first track part and the second track part, and the bearing part has a position for placing the temperature regulator based on a first height from the base. Therefore, a wafer prober does not need to be erected, the overall erection space is reduced, and the erection cost is reduced.

Description

[Technical field]

[0001] The utility model relates to a detection platform and a detection system thereof, and more specifically, the utility model relates to a front-stage detection platform and a front-stage detection system thereof for design verification which can be applied to image sensor detection. [Background technology]

[0002] When a product is developed, a corresponding verification procedure needs to be formulated to verify the product characteristics through relevant test equipment to provide effective design verification (verification of design) analysis.

[0003] For example, after the design of the image sensor (CMOS Image Sensor, CIS) is completed, a corresponding verification program will be designed to perform various test items through various verification equipment during the mass production process to ensure the quality of the product. For example, through the switching of the relay array, the image sensor is configured in the electrical test mode performed by the automatic test equipment (Automatic Test Equipment, ATE) and the probe tester, or the image sensor is configured in the high-speed image test mode performed by the image capture module.

[0004] Since the product development process may generate a lot of versions, each time a version is completed, a corresponding design verification is usually formulated, such as: setting the verification scope, applicable standards and design verification procedures for mass production verification. If the verification fails and needs to be revised again, the corresponding design verification needs to be formulated again. Among them, since each time the actual test work of the formulated design verification is carried out, various test equipment at the mass production scale is required, and the test equipment at the mass production scale is large and expensive, which requires the test work to be performed in a specific field, resulting in the high cost of design verification in the product development process. [Contents of the utility model]

[0005] In some implementations of the present invention, the formulation cost of design verification in the product development process is reduced.

[0006] In some implementations of the present invention, specific configuration is performed for the required installation space of the test equipment used in the design verification execution process, thereby improving the efficiency of space utilization.

[0007] According to some embodiments of the utility model, the utility model discloses a front-stage detection platform for design verification, comprising: a base, a first upright portion, a bearing portion, a second upright portion, a first rail portion, a second rail portion and a suspension portion. The first upright portion includes two first support frames erected on the base, and each of the two first support frames has a slot for loading a relay carrier assembly. The bearing portion is disposed on the first upright portion and is at a first height from the base, and the bearing portion is used to provide placement of a wafer to be tested and to establish coupling between the wafer to be tested and the relay carrier assembly. The second upright portion includes two second support frames erected on the base. The first rail portion is disposed on the second upright portion. The second rail portion is movably disposed on the first rail portion to move in a first axial direction. The suspension portion is movably disposed on the second rail portion to move in a second axial direction, and the suspension portion includes an extension module for loading a test module. The suspension part is used to enable the test module to be movably configured to be close to the upper surface of the wafer to be tested through the first rail part and the second rail part, and the supporting part has a position for placing the temperature regulator based on a first height from the base.

[0008] According to some embodiments of the utility model, the first rail portion may include a first rail, a first adjustment component and a first seat body, wherein the first rail extends in a first axial direction and is disposed on the two second support frames, and the first seat body is controlled by the first adjustment component and can move on the first rail.

[0009] According to some embodiments of the utility model, the second rail portion may include a second rail, a second adjustment component and a second seat body, wherein the second rail extends in a second axial direction and is disposed on the first seat body, the second seat body is controlled by the second adjustment component and can move on the second rail, and the suspension portion is disposed at one end of the second seat body.

[0010] According to some embodiments of the utility model, it further includes a support frame module and a base. The support frame module can be arranged on the base, and the base can be arranged on the support frame module.

[0011] According to some embodiments of the present invention, the first upright portion further includes a plurality of ribs for mounting on an array relay carrier of the relay carrier assembly, wherein the array relay carrier is loaded in each of the slots of the two first support frames.

[0012] According to some embodiments of the present invention, the temperature regulator may include a heater and / or a refrigerator.

[0013] According to some embodiments of the present invention, the test module may include a light source device.

[0014] According to some embodiments of the utility model, the utility model also discloses a front-end detection system for design verification, which is used in conjunction with automated test equipment (ATE) and a host, and does not use a probe tester, and is used to provide control of a temperature variable and a light source variable in an image sensor verification program. The front-end detection system includes: an ambient temperature controller, a data calculation storage, and the aforementioned front-end detection platform. The ambient temperature controller is coupled to a temperature regulator, and the ambient temperature controller is controlled by the host to control the ambient temperature controller based on the image sensor verification program so that the temperature regulator generates a corresponding heating condition or a cooling condition. The data calculation storage is coupled to a relay carrier assembly, and the data calculation storage is controlled by the host. The wafer to be tested is an image sensor. Among them, based on the first rail portion, the second rail portion, and the suspension portion, the test module can be adjusted to be close to the upper surface of the image sensor, and the temperature regulator is close to the bottom surface of the carrier portion, so that the test module controlled by the host can provide a corresponding illumination condition to the image sensor based on the image sensor verification program. Furthermore, corresponding heating conditions or cooling conditions are provided for the image sensor, and the relay carrier assembly is respectively coupled to the host and the automated testing equipment so that the host can execute the image sensor verification procedure.

[0015] According to some embodiments of the present invention, the temperature regulator can transfer heat energy (corresponding to the set heating condition) or cold source (corresponding to the set cooling condition) to the image sensor through conduction by contacting the bottom surface of the carrier.

[0016] According to some embodiments of the present invention, the environment temperature controller and the data computing storage device can be arranged on the front-stage detection platform and located between the base and the pedestal.

[0017] In this way, through the divisibility of the test equipment and the structure of the front-stage detection platform, some of the test equipment under mass production scale can be restructured into a front-stage detection system, so there is no need to set up a wafer probe machine, which reduces the overall installation space of the front-stage detection system and reduces the installation cost.

Brief Description of the Drawings

[0018] Figure 1 is a functional block diagram of a front-stage detection system according to some embodiments of the present utility model;

[0019] Figure 2 It is a three-dimensional schematic diagram of a front-stage detection platform for design verification according to some embodiments of the utility model at a first viewing angle;

[0020] Figure 3 for Figure 2 A three-dimensional schematic diagram of the front-stage detection platform under the second viewing angle;

[0021] Figure 4 for Figure 2 A three-dimensional schematic diagram of the front-stage detection platform under the third perspective;

[0022] Figure 5 for Figure 2 A three-dimensional schematic diagram of a first upright portion of a front-step detection platform;

[0023] Figure 6 It is a three-dimensional schematic diagram of a front-stage detection system for design verification according to some embodiments of the present utility model. [Specific implementation method]

[0024] In order to fully understand the purpose, features and effects of the present invention, the present invention is now described in detail with the help of the following specific implementation methods and the accompanying drawings, as follows:

[0025] In this application, the terms "a" or "an" are used to describe an element or feature. This is only for the convenience of description and to provide a general meaning for the scope of this application. Therefore, unless it is obvious that it is otherwise intended, such description should be understood to include one or at least one, and can be singular or plural.

[0026] In this application, the terms "comprise, include, have" or any other similar terms are not limited to the elements or features listed in this application, but may include other parts that are not explicitly listed but are usually inherent to the elements or features.

[0027] In this application, the terms such as "first" or "second" and the like are used to distinguish or refer to elements or features that are the same or similar, and do not necessarily imply the spatial order of these elements or features. It should be understood that in certain cases or configurations, the ordinal terms can be used interchangeably without affecting the embodiments disclosed or associated with this application.

[0028] In this application, spatially related terms (e.g., above, above, below, below, and the like) describe the relationship of one element or feature to another element or feature. These spatially related terms are intended to cover different orientations of the elements or features in addition to the orientations shown in the drawings. These elements or features can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially related terms used therein will also be interpreted based on the rotated orientation.

[0029] In the present application, these spatially related terms include whether or not other (one or more) elements or (one or more) features are disposed between these elements or features. For example, if the description mentions that a first component is formed on or above a second component, it may include an embodiment in which the first and second components are in direct contact, and it may also include an embodiment in which an additional component is formed between the first and second components so that the first and second components are not in direct contact.

[0030] In the present application, the term "coupling" described herein may refer to direct physical contact or indirect physical contact between two or more components or devices, or to mutual operation or action between two or more components or devices, or to direct or indirect electrical connection (electricity or electrical signals).

[0031] Please refer to Figure 1 , is a functional block diagram of a front-end detection system according to some embodiments. The front-end detection system 10 can be used in conjunction with an automated test device 30 and a host 20, and does not require a probe tester. The front-end detection system 10 includes: a temperature regulator 110, an ambient temperature controller 11 coupled to the temperature regulator 110, a data computing storage 12 coupled to a relay carrier assembly 13, and a test module 14.

[0032] The host 20 controls the automated test equipment 30 to start executing the verification program. The automated test equipment 30 automatically executes the corresponding electrical test items based on the items required by the verification program. During the electrical test, the test signal is transmitted to the object under test (i.e., the image sensor 40) through the coupled relay carrier assembly 13, and then the signal of the test result is transmitted to the data operation storage 12, and the host 20 subsequently obtains the analysis result.

[0033] For the test associated with the image data (the image detection item in the verification procedure), the test module 14 is controlled by the host 20 to generate the required test state. For example, the test source can be a light source, that is, the test module 14 includes a light source device for generating various light source states to provide a sensing capability test for the object to be tested (i.e., the image sensor 40). The signal of the test result is also transmitted to the data operation storage 12 through the relay carrier assembly 13, and the analysis result is subsequently obtained by the host 20. Further, the test module 14 can also include a device that can generate other test sources, such as: RF radio frequency device (for example, a transmitter / receiver with NFC), sound wave device (for example, a transmitter / receiver with a directional microphone), other light source devices (for example, an infrared transmitter / receiver), or other detection devices based on the application of directional electromagnetic waves for detection.

[0034] The host 20 can simultaneously control the temperature regulator 110 through the ambient temperature controller 11. In various test items, the verification procedure can include the inspection of the ambient temperature, and the temperature regulator 110 can provide additional ambient temperature settings. For example, the temperature regulator 110 is operated under a heating condition to transfer heat energy to the object to be tested to achieve the ambient temperature setting; in addition, for another example, the temperature regulator 110 can provide a cooling function, and can be operated under a cold condition (for example: 0 degrees or -20 to -40 degrees or other low temperatures) to transfer the cold source to the object to be tested to achieve the ambient temperature setting. When providing heating conditions, the temperature regulator 110 can transfer heat energy by means of thermal radiation or contact conduction; when providing cooling conditions, the temperature regulator 110 can transfer the cold source by means of convection or contact conduction. In the subsequent embodiments of the present invention, the contact conduction method is used as an example.

[0035] In summary, if Figure 1 As shown, under the configuration of the aforementioned various devices and equipment, the verification procedure can be provided, and the subsequent implementation method is to illustrate the architecture of a front-end detection platform that can integrate these configurations.

[0036] Please also refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 2 is a three-dimensional schematic diagram of a front-stage detection platform for design verification at a first viewing angle according to some embodiments; Figure 3 for Figure 2 A three-dimensional schematic diagram of the front-stage detection platform under the second viewing angle; Figure 4 for Figure 2 A three-dimensional schematic diagram of the front-stage detection platform under the third perspective; Figure 5 for Figure 2 A three-dimensional schematic diagram of the first vertical portion of the front-stage detection platform. For ease of explanation, Figure 3 An array relay carrier board 131 is additionally shown.

[0037] The front-stage detection platform includes: a base 400, a first upright portion 410, a supporting portion 430, a second upright portion 420, a first rail portion 421, a second rail portion 422 and a suspension portion 425. The first upright portion 410 and the second upright portion 420 are both disposed on the base 400. The supporting portion 430 is disposed on the first upright portion 410 and can be spaced from the base 400 by a first height D, so that a temperature regulator 110 can be disposed below the supporting portion 430 (not shown, but can be referred to Figure 6The first rail portion 421 is disposed on the second upright portion 420, and the second rail portion 422 is disposed on the first rail portion 421, so that one end of the suspension portion 425 disposed on the second rail portion 422 can be moved above the bearing portion 430. The first rail portion 421 allows the second rail portion 422 to move in the first axial direction X, and the second rail portion 422 allows the suspension portion 425 to move in the second axial direction Y.

[0038] The first upright portion 410 includes two first support frames 411 and 412 erected on the base 400. The two first support frames 411 and 412 each have a relay carrier assembly 13 (not shown, but may be referred to as Figure 6 ) are loaded with slots 4111 and 4121. In some embodiments, the first upright portion 410 may further include a slot for mounting on the relay carrier assembly 13 (not shown, but can be referred to as Figure 6 ) on the array relay carrier 131. Since the array relay carrier 131 is vertically erected after being installed in the slots 4111 and 4121, the ribs 413 can be used to further support the array relay carrier 131 and enhance its structural strength.

[0039] The carrier 430 can be fixed on the two first support frames 411 and 412 by a detachable assembly. The carrier 430 is used to place the wafer to be tested (for example, an image sensor) and to establish a coupling relationship between the wafer to be tested and the relay carrier assembly. For example, the carrier 430 can include a socket for plugging the bottom terminal of the wafer to be tested. One end of the array relay carrier 131 is adjacent to the carrier 430. Through a conductive connection device (not shown) between the terminals, a coupling relationship between the socket and the array relay carrier 131 can be established for signal transmission.

[0040] The first track portion 421 includes a first track 4211, a first adjustment assembly 4212 and a first seat 4213. The first track 4211 is disposed on the second upright portion 420, the first adjustment assembly 4212 is disposed on the first track 4211, and the first seat 4213 is disposed on the first track 4211 and is controlled by the first adjustment assembly 4212 to be movable on the first track 4211. Figures 2 to 4 The example shows the meshing relationship between the threaded rod and the first seat 4213 and the limiting relationship of the first seat 4213 by the first track 4211, so that when the threaded rod is rotated, the first seat 4213 can only move leftward or rightward on the first axis X.

[0041] The second rail portion 422 includes a second rail 4221, a second adjustment assembly 4222 and a second seat 4223. The second rail 4221 is disposed on the first seat 4213, the second adjustment assembly 4222 is disposed on the second rail 4221, and the second seat 4223 is disposed on the second rail 4221 and is controlled by the second adjustment assembly 4222 to be movable on the second rail 4221. Similarly, Figures 2 to 4 The example shows the meshing relationship between the threaded rod and the second seat 4223 and the limiting relationship between the second seat 4223 and the second track 4221, so that when the threaded rod is rotated, the second track 4221 can only move upward or downward on the second axis Y.

[0042] The suspension part 425 is disposed on the second base body 4223. The extension module 4251 of the suspension part 425 is used to load the aforementioned test module 14 (not shown in the figure, but can be referred to in detail). Figure 6 ). The suspension portion 425 can allow the test module 14 to be moved and configured to be close to the upper surface of the wafer to be tested through the first rail portion 421 and the second rail portion 422. The extension module 4251 can adjust its position in the third axial direction Z by selecting a fixed position on the suspension portion 425. Among them, the test module 14, as mentioned above, can be a light source device for generating various light source states. In some other embodiments, the extension module 4251 can also be loaded with multiple test source devices at the same time, for example, at least two selected from the following: a light source device with a visible light wavelength, an RF radio frequency device, an acoustic wave device, and other types of light source devices with non-visible light wavelengths.

[0043] Please refer to Figure 6 , is a three-dimensional schematic diagram of a front-stage detection system for design verification according to some embodiments. The front-stage detection system includes: an environmental temperature controller 11, a data computing storage 12, and the front-stage detection platform including a base 400, a first upright portion 410, a second upright portion 420, a first rail portion 421, a second rail portion 422, a suspension portion 425, and a carrying portion 430.

[0044] Through the divisibility of the original test equipment in the mass production line, the smallest unit (data operation storage 12, relay carrier assembly 13 and automated test equipment 30 (ATE)) is taken for design verification, and the ambient temperature controller 11 and the test module 14 are integrated into a set of front-end detection systems for design verification.

[0045] When the DUT is undergoing wafer probe testing during the mass production process, if it is necessary to test the temperature and / or light source, then during the design verification process after the DUT is developed, it is necessary to consider the verification of temperature and light source, which requires the collection of relevant data through mass production equipment. However, with the use of the aforementioned front-end detection system, the user does not need to use the mass production equipment wafer probe machine and mass production equipment ATE, which are expensive and occupy a lot of space. The user can use the aforementioned front-end detection platform in a small field to construct a device with an environmental temperature controller 11, a data calculation storage 12, a relay carrier assembly 13, a test module 14, and a temperature regulator 110 (please refer to Figure 1 ), the host 20, and the detection system of the automated testing equipment 30. The temperature regulator 110 can be installed by means of an assembly frame 111 set up on the base 400, so that the temperature regulator 110 can be close to the bottom surface of the bearing part, or even contact it.

[0046] To sum up, with the use of the front-stage detection platform, the overall installation space of the front-stage detection system can be miniaturized and the installation cost is low. At the same time, it can provide various resources required for design verification, improve space utilization efficiency and reduce the cost of design verification in the product development process.

[0047] The utility model discloses preferred embodiments above, but those skilled in the art should understand that the embodiments herein are only used to describe the utility model and should not be interpreted as limiting the scope of the utility model. It should be noted that all changes and substitutions equivalent to the embodiments should be understood to be included in the scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

[0048] [Reference Signs]

[0049] 10 Pre-stage detection system

[0050] 11 Ambient temperature controller

[0051] 110 Temperature Regulator

[0052] 111 Assembly Stand

[0053] 12 Data computing storage

[0054] 13 Relay carrier assembly

[0055] 131 Array relay carrier board

[0056] 14 Test Module

[0057] 20 Host

[0058] 30 Automated testing equipment

[0059] 40 Image Sensor

[0060] 400 Base

[0061] 410 First vertical part

[0062] 411 First support frame

[0063] 4111 Card Slot

[0064] 412 First support frame

[0065] 4121 Card Slot

[0066] 413 Ribs

[0067] 420 Second vertical part

[0068] 421 First Track Department

[0069] 4211 First Track

[0070] 4212 First adjustment component

[0071] 4213 First Block

[0072] 422 Second Track Department

[0073] 4221 Second Track

[0074] 4222 Second adjustment component

[0075] 4223 Second seat

[0076] 425 Suspension

[0077] 4251 Extension Module

[0078] 430 bearing part

[0079] D First height

[0080] X First Axis

[0081] Y Second Axis

[0082] Z third axis

Claims

1. A front-end detection platform for design verification, characterized in that: The front-end detection platform includes: a base; A first upright portion, comprising two first support frames erected on the base, each of the two first support frames having a slot for loading a relay carrier assembly; a bearing portion, disposed on the first upright portion and spaced apart from the base by a first height, the bearing portion being used to place a wafer to be tested and to establish coupling between the wafer to be tested and the relay carrier assembly; A second upright portion, comprising two second support frames erected on the base; a first track portion, disposed on the second upright portion; a second track portion, movably disposed on the first track portion to move in a first axial direction; and a suspension portion, movably disposed on the second track portion to move in a second axial direction, the suspension portion comprising an extension module for loading a test module, The suspension part is used to enable the test module to be movably configured to be close to the upper surface of the wafer to be tested through the first rail part and the second rail part, and the supporting part has a position for placing a temperature regulator based on the first height from the base.

2. The front-stage detection platform according to claim 1, characterized in that: The first track portion includes a first track, a first adjustment component and a first seat, wherein the first track extends in the first axial direction and is disposed on the two second support frames, and the first seat is controlled by the first adjustment component and can move on the first track.

3. The front-stage detection platform according to claim 2, characterized in that: The second track portion includes a second track, a second adjustment component and a second seat body, wherein the second track extends in the second axial direction and is disposed on the first seat body, the second seat body is controlled by the second adjustment component and can move on the second track, and the suspension portion is disposed at one end of the second seat body.

4. The front-stage detection platform according to any one of claims 1 to 3, characterized in that: It further comprises a support frame module and a base, wherein the support frame module is arranged on the base, and the base is arranged on the support frame module.

5. The front-stage detection platform according to claim 4, characterized in that: The first upright portion further comprises a plurality of ribs for being mounted on an array relay carrier of the relay carrier assembly, wherein the array relay carrier is loaded in each of the slots of the two first support frames.

6. The front-stage detection platform according to claim 4, characterized in that: The temperature regulator includes at least one of the following two: a heater and a cooler.

7. The front-stage detection platform according to claim 4, characterized in that: The testing module includes a light source device.

8. A front-end detection system for design verification, used in conjunction with an automated test device and a host, without using a probe tester, and used to provide control of a temperature variable and a light source variable in an image sensor verification procedure, characterized in that: The front-stage detection system comprises: A front-end inspection platform as claimed in any one of claims 4 to 7, wherein the wafer to be tested is an image sensor, wherein the test module can be adjusted to be close to the upper surface of the image sensor based on the first rail portion, the second rail portion and the suspension portion, and the temperature regulator is close to the bottom surface of the carrier portion, so that the test module controlled by the host can provide a corresponding irradiation condition for the image sensor based on the image sensor verification program, and provide a corresponding heating condition or a cooling condition for the image sensor, and the relay carrier assembly is respectively coupled to the host and the automated test equipment, so that the host can execute the image sensor verification program; an environment temperature controller coupled to the temperature regulator, the environment temperature controller being controlled by the host, so as to control the environment temperature controller based on the image sensor verification program so that the temperature regulator generates the corresponding heating condition or the cooling condition; and A data operation storage is coupled to the relay carrier assembly, and the data operation storage is controlled by the host.

9. The front-stage detection system according to claim 8, characterized in that: The temperature regulator transmits the heating condition or the cooling condition to the image sensor through conduction by contacting with the bottom surface of the carrying portion.

10. The front-stage detection system according to claim 8 or 9, characterized in that: The environmental temperature controller and the data calculation storage are arranged on the front-stage detection platform and are located between the base and the pedestal.

Images