Gas cap device for improving copper deposition wire of circuit board

Abstract

A gas cap device for improving a copper deposition wire of a circuit board comprises a gantry wire gas cap and a pressure release valve, and is characterized in that the pressure release valve comprises a gas inlet, a gas outlet and a gas outlet, the gas cap is connected with the gas outlet, and the gas inlet is communicated with a lower end gas channel. After a pressure release valve is additionally arranged on an air pipe of an original gas cap method, landing is accelerated in a gas release mode, the situation that bubbles in holes cannot be discharged can be obviously improved, and the functional problem caused by the bubbles is reduced, and no copper exists in the holes.

Description

Technical Field

[0001] The utility model belongs to the field of circuit board processing, and in particular relates to an air cap device for improving copper sinking lines of circuit boards. Background Art

[0002] The gantry line equipment, which is the most widely used copper deposition line at present, is a vertical chemical copper deposition method. For circuit boards with small apertures and high board thickness, the treatment of bubbles in the holes is a more obvious defect. The existing treatment solution is the gas cap method, which uses air pressure to lift up the flying target with the circuit board and then let it fall to discharge the bubbles in the hole. The unimproved gas cap descends slowly and cannot play the role of discharging the bubbles in the hole. As modern intelligent equipment becomes more and more advanced, the corresponding circuit boards are also required to be higher and higher. The aperture will become smaller and smaller, and the stacking will become higher and higher. The existing process capabilities cannot meet the production of circuit boards with higher difficulty.

[0003] Therefore, a gas capping device for improving copper wires on circuit boards is needed. Utility Model Content

[0004] The above-mentioned purpose of the utility model is achieved through the following technical solutions:

[0005] A gas cap device for improving copper deposition lines on circuit boards includes a gantry line gas cap and a pressure relief valve. The invention is characterized in that the pressure relief valve includes an air inlet, an air outlet, and an exhaust port, the gas cap is connected to the air outlet, and the air inlet is connected to the lower end airway.

[0006] Preferably, the pressure relief valve is used in conjunction with a block valve.

[0007] In summary, the present invention includes at least one of the following beneficial technical effects:

[0008] After installing a pressure relief valve on the air pipe of the original air cap method, the descent is accelerated by releasing air, which can significantly improve the situation where bubbles in the hole cannot be discharged and reduce the functional problems caused by bubbles, such as no copper in the hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a plan view of the air release valve of the gas cap device of the utility model;

[0010] Reference numerals: 1 air inlet, 2 air outlet, 3 exhaust port. DETAILED DESCRIPTION

[0011] The above-mentioned purpose of the utility model is achieved through the following technical solutions:

[0012] A gas cap device for improving copper deposition lines on circuit boards includes a gantry line gas cap and a pressure relief valve, wherein the pressure relief valve includes an air inlet 1, an air outlet 2, and an exhaust port 3, the gas cap is connected to the air outlet 2, and the air inlet 1 is connected to the lower end airway.

[0013] Specifically, the pressure relief valve is used in conjunction with a block valve.

[0014] Working principle: Gas in the system overflows into the exhaust valve cavity. As the gas in the valve increases, the pressure rises. When the air pressure is greater than the system pressure, the exhaust port is opened; the exhaust port is closed after the gas is exhausted. When negative pressure is generated in the system, the exhaust port is opened. Since the external atmospheric pressure is greater than the system pressure at this time, the atmosphere will enter the system through the exhaust port to prevent the harm of negative pressure. If the valve cap on the exhaust valve body is tightened, the exhaust valve stops exhausting. Under normal circumstances, the valve cap should be in the open state. The exhaust valve can also be used in conjunction with the isolation valve to facilitate the inspection and maintenance of the exhaust valve.

[0015] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A gas cap device for improving copper wire of circuit board, including a gantry line gas cap and a pressure relief valve, characterized in that: The pressure relief valve comprises an air inlet (1), an air outlet (2), and an exhaust port (3); the air cap is connected to the air outlet (2), and the air inlet (1) is in communication with the lower air passage.

2. The gas capping device for improving copper wire of a circuit board according to claim 1, characterized in that: The pressure relief valve is used in conjunction with a cut-off valve.

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