Electronic equipment

Abstract

The utility model provides electronic equipment, and relates to the technical field of terminal equipment. The problem that an antenna limits the thickness of electronic equipment and is not beneficial to thinning development of the electronic equipment is solved. The electronic equipment comprises a display assembly and a keyboard assembly, wherein the display assembly is rotationally connected with the keyboard assembly. The keyboard assembly comprises a shell, a vapor chamber and a metal structural part. The uniform temperature plate is arranged in the shell. The metal structural member is arranged in the shell, the metal structural member is connected with the uniform temperature plate, the metal structural member and the uniform temperature plate are distributed along the thickness direction of the electronic equipment, and a cavity is formed between the metal structural member and the uniform temperature plate, so that the metal structural member and the uniform temperature plate form a cavity antenna structure.

Description

Technical Field

[0001] The present application relates to a terminal device, and in particular to an electronic device. Background Art

[0002] An antenna is provided in each electronic device, for example, the electronic device may be a laptop computer, and a WIFI antenna is provided in the electronic device so that the electronic device can connect to a wireless network. However, the WIFI antenna is provided inside the electronic device, which will limit the thickness of the electronic device, and is not conducive to the development trend of thinning of electronic devices. Utility Model Content

[0003] An embodiment of the present application provides an electronic device for solving the problem that an antenna will limit the thickness of the electronic device, which is not conducive to the development of thinning of the electronic device.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] An embodiment of the present application provides an electronic device, which includes a display component and a keyboard component, and the display component is rotatably connected to the keyboard component. The keyboard component includes a housing, a temperature averaging plate, and a metal structure. The temperature averaging plate is disposed in the housing. The metal structure is disposed in the housing, the metal structure is connected to the temperature averaging plate, and the metal structure and the temperature averaging plate are distributed along the thickness direction of the electronic device, and a cavity is formed between the metal structure and the temperature averaging plate, so that the metal structure and the temperature averaging plate form a cavity antenna structure.

[0006] The electronic device provided by the present application has a metal structural member disposed in a shell, and the metal structural member and the surface of the temperature equalizer together constitute the boundary of the cavity antenna, thereby forming a cavity antenna structure. Therefore, the thickness dimension of the cavity antenna structure along the thickness direction of the electronic device includes the thickness of the temperature equalizer and the thickness of the metal structural member, as well as the distance between the two. In other words, part of the thickness dimension of the cavity antenna structure is the thickness of the original component inside the electronic device, that is, the thickness dimension of the cavity antenna disposed in the shell is reduced, thereby reducing the thickness dimension of the electronic device, which is conducive to the thinning of the electronic device.

[0007] In a possible implementation of the present application, the electronic device further includes a non-metallic bracket, which is supported between the metal structure and the temperature-averaging plate and is located in the cavity. In this structure, the non-metallic bracket effectively supports the metal structure, thereby further ensuring that the above-mentioned cavity is formed between the metal structure and the surface of the temperature-averaging plate.

[0008] In a possible implementation of the present application, the electronic device further includes a heat sink fin, the heat sink fin is disposed on the temperature equalizing plate, a heat sink hole is provided on the housing, the heat sink fin and the heat sink hole are disposed opposite to each other, and the heat sink fin and the non-metal bracket are distributed along the length direction of the electronic device. Under this structure, the position of the heat sink fin does not need to be moved, and the non-metal bracket is prevented from being disposed between the heat sink fin and the heat sink hole, thereby not affecting the heat dissipation effect.

[0009] In a possible implementation of the present application, the non-metallic bracket includes a first part and a second part, and the first part and the second part are distributed along the length direction of the electronic device; the heat sink fins include a third part and a fourth part, and the third part and the fourth part are distributed along the length direction of the electronic device; the second part and the fourth part are distributed along the width direction of the electronic device, and the second part is located between the heat dissipation hole and the fourth part; the second part is provided with an air duct, and the air duct is connected between the heat sink fins and the heat dissipation hole.

[0010] In this structure, there is a partial overlap between the non-metallic bracket and the heat sink fin along the width direction of the electronic device, namely, the second part and the fourth part, and the second part is provided with an air duct, so that the wind blown by the heat sink fan of the electronic device can flow through the air duct, avoiding the second part from blocking the fourth part of the heat sink fin, and will not affect the heat dissipation effect of the heat sink fin. At the same time, this structure is conducive to increasing the physical size of the metal structure, thereby increasing the cavity space formed between the metal structure and the temperature plate, and further conducive to improving the signal strength of the cavity antenna structure formed by the metal structure and the temperature plate, so as to ensure the performance of the cavity antenna.

[0011] In a possible implementation of the present application, the air duct runs through the surface of the second portion facing the temperature equalizer; or, the air duct runs through the surface of the second portion facing the metal structure. Under this structure, the cross-sectional area of ​​the air duct can be increased, thereby increasing the flow rate in the air duct, which is beneficial to improving the heat dissipation effect of the heat sink fins.

[0012] In a possible implementation of the present application, the metal part includes a first area and a second area, the first area and the second area are distributed along the length direction of the electronic device, the non-metal bracket is arranged between the first area and the temperature equalizer, and the second area and the temperature equalizer are spaced apart; the heat sink fin includes a third part and a fourth part, the third part and the fourth part are distributed along the length direction of the electronic device; the second area and the fourth part are distributed along the width direction of the electronic device, and the fourth part is located on the side of the second area away from the heat dissipation hole. Under this structure, a non-metal bracket is arranged between the second area of ​​the metal structural part and the temperature equalizer, which further increases the cross-sectional area of ​​the above-mentioned air duct, which is conducive to further improving the heat dissipation effect of the heat sink fin.

[0013] In a possible implementation of the present application, the electronic device further includes an excitation unit and a mainboard, wherein the excitation unit is electrically connected to the metal structure, and the excitation unit is electrically connected to the mainboard. In this way, the metal structure is excited by the excitation unit and fed, so that a limit signal can be issued. Exemplarily, the excitation unit can couple or directly feed the metal structure.

[0014] In a possible implementation of the present application, the housing has a first wall plate, the first wall plate is provided with heat dissipation holes, the edge of the metal part close to the first wall plate is spaced apart from the edge of the temperature averaging plate close to the first wall plate, and the excitation unit is arranged on the surface of the non-metal bracket facing the first wall plate. Under this structure, since the metal structural member and the temperature averaging plate are supported by the non-metal bracket, the excitation unit can be fixed on the surface of the non-metal bracket facing the first wall plate, that is, arranged in the gap of the cavity formed by the metal structural member and the temperature averaging plate, which is conducive to reducing the difficulty of installation.

[0015] In a possible implementation of the present application, the electronic device further includes a first conductive layer, and the first conductive layer is abutted between the edge of the metal structure and the temperature averaging plate. Under this structure, it is beneficial to ensure a stable electrical connection between the metal structure and the temperature averaging plate.

[0016] In a possible implementation of the present application, the electronic device further includes a second conductive layer, which is abutted between the inner wall of the housing and the surface of the metal structure away from the temperature plate. Under this structure, it is beneficial to ensure that the metal structure is electrically connected to the housing to ensure stable grounding of the cavity antenna.

[0017] In a possible implementation of the present application, the electronic device further includes a third conductive layer, which is abutted between the inner wall of the housing and the surface of the temperature averaging plate away from the metal structure. Under this structure, it is beneficial to ensure that the temperature averaging plate is electrically connected to the housing to ensure stable grounding of the cavity antenna.

[0018] In a possible implementation of the present application, the temperature vaporizer includes an evaporation area and a condensation area, and along the length direction of the electronic device, condensation areas are provided on both sides of the evaporation area, and metal structures are provided on both condensation areas, and a cavity is formed between the metal structures and the corresponding condensation areas. Under this structure, dual antennas are provided, which is conducive to improving antenna performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A structural diagram of an electronic device (in an open state) provided in an embodiment of the present application;

[0020] Figure 2 A structural diagram of an electronic device (folded state) provided in an embodiment of the present application;

[0021] Figure 3 A partial structural cross-sectional view of an electronic device provided in an embodiment of the present application;

[0022] Figure 4 A structural diagram of a keyboard assembly of another electronic device provided in an embodiment of the application;

[0023] Figure 5 for Figure 4 A magnified view of the structure of region A;

[0024] Figure 6 for Figure 4 A diagram of the internal structure of the keyboard assembly is provided;

[0025] Figure 7 A three-dimensional diagram of a cavity antenna structure provided in an embodiment of the present application;

[0026] Figure 8 for Figure 7 A cross-sectional view of a cavity antenna structure is provided;

[0027] Fig. 9 A three-dimensional diagram of another cavity antenna structure provided in an embodiment of the present application;

[0028] Fig.10 for Fig. 9 A structural diagram of a cavity antenna structure provided is located within a housing;

[0029] Fig.11 A partial structural cross-sectional view of a keyboard assembly of another electronic device provided in an embodiment of the present application;

[0030] Fig.12 for Fig.11 A partial structural diagram of the cavity antenna structure inside the keyboard assembly is provided;

[0031] Fig.13 A structural diagram of another excitation unit provided in an embodiment of the present application;

[0032] Fig.14 A three-dimensional diagram of another cavity antenna structure provided in an embodiment of the present application;

[0033] Fig.15 for Fig.14 A partial structural cross-sectional view of a cavity antenna structure provided within a housing;

[0034] Fig.16 for Fig.14 A structural diagram of the surface of the cavity antenna structure facing the upper shell is provided;

[0035] Fig.17 for Fig.16 A magnified view of the structure of region B;

[0036] Fig.18 for Fig.14 A structural diagram of a surface of a cavity antenna structure facing the bottom shell is provided;

[0037] Fig.19 for Fig.18 A magnified view of the C region structure;

[0038] Fig. 20 A structural diagram of a temperature homogenizing plate, heat sink fins, and non-metallic bracket provided in an embodiment of the present application;

[0039] Fig.21 for Fig. 20 A partial cross-sectional structural diagram of the provided heat sink fins and non-metallic bracket;

[0040] Fig. 22 for Fig. 20 A partial structural diagram of the non-metallic bracket provided;

[0041] Fig.23 A front view of another air duct provided in an embodiment of the present application;

[0042] Fig.24 for Fig.23 Provide a cross-sectional structural diagram of the air duct;

[0043] Fig.25 for Fig.23 A three-dimensional diagram of the air duct provided;

[0044] Fig.26 A structural diagram of another non-metallic bracket, heat sink fins and metal structural parts provided for an embodiment of the application;

[0045] Fig. 27 for Fig.26 A magnified view of the D region structure;

[0046] Fig.28 A schematic diagram of the simulation of the S11 parameters of the cavity antenna provided in an embodiment of the present application;

[0047] Fig.29 A schematic diagram of efficiency simulation of the cavity antenna provided in an embodiment of the present application;

[0048] Fig.30 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application in the 2.4G frequency band;

[0049] Fig.31 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application in the 5G frequency band;

[0050] Fig.32 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application at a frequency of 2.5 GHz;

[0051] Fig.33 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application at a frequency of 5.1 GHz;

[0052] Fig.34 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application at a frequency of 5.6 GHz;

[0053] Fig.35 A scalar diagram of the electric field simulation of the cavity antenna provided in an embodiment of the present application at a frequency of 2.5 GHz;

[0054] Fig.36 for Fig.35 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided;

[0055] Fig.37 for Fig.35 The electric field simulation vector diagram of the cavity antenna (along the XZ section) is provided;

[0056] Fig.38 A scalar diagram of the electric field simulation of the cavity antenna provided in an embodiment of the present application at a frequency of 5.1 GHz;

[0057] Fig.39 for Fig.38 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided;

[0058] Fig.40 for Fig.38 The electric field simulation vector diagram of the cavity antenna (along the XZ section) is provided;

[0059] Fig.41 A scalar diagram of the electric field simulation of the cavity antenna provided in an embodiment of the present application at a frequency of 5.7 GHz;

[0060] Fig.42 for Fig.41 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided;

[0061] Fig.43 for Fig.41 The electric field simulation vector diagram of the cavity antenna (along the XZ cross section) is provided.

[0062] Figure numerals: 10-electronic device; 100-display component; 110-upper cover; 120-display screen; 200-keyboard component; 210-keyboard; 220-upper shell; 230-bottom shell; 231-first wall panel; 232-heat dissipation holes; 240-temperature averaging plate; 241-evaporation area; 242-condensation area; 250-heat dissipation fins; 251-third part; 252-fourth part; 260-cooling fan; 270-metal structural part; 271-first edge; 272-first area; 273-second area; 280-non-metal bracket; 281-first part; 282-second part; 283-air duct; 290-excitation unit; 300-hinge assembly; 400-first conductive layer; 410-second conductive layer; 420-third conductive layer. DETAILED DESCRIPTION

[0063] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0064] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0065] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0066] In the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0067] The embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a laptop computer. The following examples are all given by taking the electronic device as a laptop computer as an example.

[0068] Specifically, see Figure 1 and Figure 2 , Figure 1 A structural diagram of an electronic device 10 (in an open state) provided in an embodiment of the present application, Figure 2The electronic device 10 (folded state) provided in an embodiment of the present application may include a display assembly 100 , a keyboard assembly 200 , and a hinge assembly 300 .

[0069] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic device 10 is defined as the X-axis direction, the length direction of the electronic device 10 is defined as the Y-axis direction, and the thickness direction of the electronic device 10 is defined as the Z-axis direction. The coordinate system of the electronic device 10 can be flexibly set according to actual needs, and this application only gives an example, which cannot be considered as a special limitation of this application.

[0070] Understandably, Figure 1 and Figure 2 Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 restrictions.

[0071] The display assembly 100 is used to display images, videos, etc. The display assembly 100 may include an upper cover 110 and a display screen 120. The display screen 120 is fixed to the upper cover 110. For example, the display screen 120 may be fixed to the upper cover 110 by bonding, snapping, etc. The display screen 120 is disposed on a side of the upper cover 110 close to the keyboard assembly 200. The upper cover 110 may be made of metal material or plastic material. Therefore, the present application does not specifically limit the material of the upper cover 110.

[0072] In addition, the display screen 120 may be a flexible display screen or a rigid display screen. For example, the display screen 120 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0073] The keyboard assembly 200 is used to edit or perform other operations on the content displayed on the display screen 120. The keyboard 210 part may include a keyboard 210, an upper shell 220 and a bottom shell 230. The keyboard 210 is fixed to the upper shell 220. The upper shell 220 and the bottom shell 230 are fixedly connected to form a shell that can accommodate components. For example, the upper shell 220 and the bottom shell 230 can be fixedly connected by bonding, clamping, threading, welding, etc. The inside of the shell can accommodate electronic components such as a motherboard, a CPU (central processing unit), a graphics card, and a memory.

[0074] Furthermore, the keyboard 210 is electrically connected to the mainboard, and the display screen 120 is electrically connected to the mainboard, so that the content displayed on the display screen 120 can be edited through the keyboard 210 .

[0075] The hinge assembly 300 is used to connect the display assembly and the keyboard assembly 200 so that the two can rotate relative to each other, thereby realizing the conversion of the electronic device 10 between the open state and the folded state.

[0076] Wherein, when the electronic device 10 is in the open state (such as Figure 1 As shown), an angle is formed between the display assembly 100 and the keyboard assembly 200 so that the display screen 120 and the keyboard 210 are separated from each other, so that the image displayed on the display screen 120 can be viewed and operations can be performed through the keyboard 210.

[0077] When the electronic device 10 is in the folded state (eg Figure 2 As shown), the display assembly 100 and the keyboard assembly 200 are buckled together, that is, the two are stacked. Figure 1 The display screen 120 is shown opposite to the keyboard 210, and the display screen 120 and the keyboard 210 are located between the upper cover 110 and the bottom shell 230, so that the display screen 120 and the keyboard 210 can be effectively protected. In this state, the electronic device 10 forms a nearly plate-like structure, which is easy to carry.

[0078] On this basis, in order to enable the electronic device 10 to connect to the network and communicate with other devices, different antennas can be set in the electronic device 10 to enable the electronic device 10 to connect to the network. Figure 3 , Figure 3 A partial structural cross-sectional view of an electronic device 10 provided in an embodiment of the present application.

[0079] For example, the antenna may be a WIFI antenna, and the antenna adopts an LDS (Laser Direct Structuring) antenna structure, that is, the LDS antenna is formed on the surface of the bracket. The antenna may be arranged on the display assembly 100, and the upper cover 110 has a structure for accommodating Figure 1 The LDS antenna can be disposed in the accommodation space of the hinge assembly 300 shown in the figure. Alternatively, the antenna can also be disposed in the housing of the keyboard assembly 200 (not shown in the figure).

[0080] Furthermore, the above antenna may adopt a cavity antenna structure, that is, the antenna is surrounded by a closed boundary and only one surface has an opening for signal radiation. The cavity antenna structure has the advantages of an interference cavity and a small clearance space required for the antenna. For example, the cavity antenna structure may be composed of a PCB (Printed Circuit Board) and a steel sheet, on which a SMT device (Surface Mounted Technology) is arranged, and a cavity is formed between the PCB and the steel sheet, thereby forming a cavity antenna structure.

[0081] However, as the electronic device 10 continues to develop towards being thinner and lighter, the thickness of the electronic device 10 continues to decrease. For example, the size of the storage space in the upper cover 110 of the display assembly 100 continues to decrease, and the space that can accommodate the antenna is continuously compressed; and the antenna is arranged in the housing of the keyboard assembly 200, which will limit the reduction of the thickness of the keyboard assembly 200. Therefore, it is not conducive to the thinning of the electronic device 10.

[0082] To solve the above problems, the present application provides another electronic device 10, which includes Figure 1 and Figure 2 The display assembly 100 and the keyboard assembly 200 are shown. Figure 4 , Figure 5 and Figure 6 , Figure 4 A structural diagram of a keyboard assembly 200 of another electronic device 10 provided in an embodiment of the present application, Figure 5 for Figure 4 A magnified view of the A region structure, Figure 6 for Figure 4 An internal structural diagram of the keyboard assembly 200 is provided.

[0083] The keyboard assembly 200 includes a housing composed of an upper housing 220 and a bottom housing 230. The housing is provided with heat dissipation holes 232. Heat generated inside the housing can be transferred to the outside of the housing through the heat dissipation holes 232. For example, the housing can have a first wall plate 231. The heat dissipation holes 232 are provided on the first wall plate 231. The first wall plate 231 is the rear wall plate of the housing, that is, the first wall plate 231 is close to the housing along the X-axis direction. Figure 1 The wall panel on one side of the hinge assembly 300 is shown.

[0084] It can be understood that the housing includes an upper shell 220 and a bottom shell 230, and the first wall plate 231 can be formed on the upper shell 220 or the bottom shell 230, or the first wall plate 231 can be an independent component connected between the upper shell 220 and the bottom shell 230. Therefore, the present application does not make any special limitation on this.

[0085] In addition, the electronic device 10 further includes a temperature averaging plate 240 (VC, Vapor Chamber), heat sink fins 250 and a heat sink fan 260. The temperature averaging plate 240 is used to directly contact with a heating element (not shown in the figure). For example, the heating element may be a CPU, which is disposed in an evaporation region 241 of the temperature averaging plate 240 and in contact with the surface of the temperature averaging plate 240. The heat sink fins 250 are disposed in a condensation region 242 of the temperature averaging plate 240 and in contact with the surface of the temperature averaging plate 240. Along the X-axis direction, the heat sink fins 250 are located between the heat sink fan 260 and the heat sink holes 232 on the first wall plate 231.

[0086] Specifically, the heat generated by the heating element is transferred to the evaporation area 241 of the temperature plate 240, and the working medium inside the temperature plate 240 is transformed from liquid to gas and transferred to the condensation area 242 of the temperature plate 240. The heat carried by the gaseous working medium is transferred to the heat dissipation fins 250 in the condensation area 242. After the gaseous working medium cools down, it is transformed into liquid and flows to the evaporation area 241 again, thus circulating. The heat transferred to the heat dissipation fins 250 is blown out of the housing through the heat dissipation holes 232 by the wind blown by the heat dissipation fan 260, thereby cooling and dissipating the CPU.

[0087] On this basis, the electronic device 10 further includes a metal structure 270, which is disposed in the housing. Figure 7 and Figure 8 , Figure 7 A three-dimensional diagram of a cavity antenna structure provided in an embodiment of the present application, Figure 8 for Figure 7 A cross-sectional view of a cavity antenna structure is provided.

[0088] The metal structure 270 is connected to the temperature averaging plate 240, and the metal structure 270 and the temperature averaging plate 240 are distributed along the thickness direction of the electronic device 10, that is, along the Z axis. A cavity is formed between the metal structure 270 and the temperature averaging plate 240, so that the metal structure 270 and the temperature averaging plate 240 form a cavity antenna structure.

[0089] In this way, the electronic device 10 uses the surface of the temperature equalizer 240 as the boundary of the cavity antenna, and forms a cavity between the surface of the temperature equalizer 240 and the surface of the metal structure 270, thereby forming a cavity antenna structure. That is, along the Z-axis direction, the thickness dimension of the cavity antenna structure includes the temperature equalizer 240 and the metal structure 270, and the distance between the two. Since the temperature equalizer 240 is a conventional component inside the electronic device 10, that is, the cavity antenna structure only needs to be provided with the above-mentioned metal structure 270 inside the shell, and no other components (for example, the above-mentioned PCB board) are required. Therefore, the cavity antenna structure formed by the metal structure 270 and the temperature equalizer 240 is conducive to reducing the thickness dimension of the electronic device 10, thereby facilitating the thinning of the electronic device 10.

[0090] On this basis, in the electronic device 10 provided in the embodiment of the present application, the above-mentioned cavity antenna structure may be provided with only one. Alternatively, in order to further improve the antenna signal, the above-mentioned cavity antenna structure may be provided with multiple ones. Fig. 9 and Fig.10 , Fig. 9 A three-dimensional diagram of another cavity antenna structure provided in an embodiment of the present application, Fig.10 for Fig. 9 A structural diagram of a cavity antenna structure provided is located within a housing.

[0091] Exemplarily, the above-mentioned temperature plate 240 includes an evaporation area 241 and a condensation area 242. Along the Y-axis direction, a condensation area 242 is respectively arranged on both sides of the evaporation area 241 of the temperature plate 240. The surface of each condensation area 242 is provided with the above-mentioned heat dissipation fins 250, and each heat dissipation fin 250 is correspondingly provided with a heat dissipation fan 260, and a heat dissipation hole 232 is opened at the position corresponding to each heat dissipation fin 250 on the above-mentioned first wall plate 231. When only one cavity antenna structure is provided, the above-mentioned metal structure 270 can be provided on any one of the two condensation areas 242 (such as Figure 7 shown).

[0092] When there are two cavity antenna structures, please continue to refer to Fig. 9A metal structure 270 can be correspondingly arranged on each condensation area 242 of the above-mentioned temperature equalizing plate 240, so that a cavity antenna structure can be formed between the metal structure 270 and the corresponding condensation area 242, that is, two cavity antennas are arranged in the electronic device 10, and the two cavity antenna structures formed on both sides of the evaporation area 241 can be symmetrically arranged along the X-axis direction, thereby improving the antenna performance.

[0093] It is understandable that along the Y-axis direction, the two metal structural members 270 disposed on both sides of the evaporation region 241 of the temperature homogenizing plate 240 may adopt the same structure or different structures. For example, the two metal structural members 270 may both adopt metal plates; or one metal structural member 270 may adopt a metal plate and the other metal structural member 270 may adopt an FPC board, etc. Therefore, this application does not make any special limitation on this.

[0094] Also, see Fig.11 and Fig.12 , Fig.11 A partial structural cross-sectional view of a keyboard assembly 200 of another electronic device 10 provided in an embodiment of the present application. Fig.12 for Fig.11 A partial structural diagram of the cavity antenna structure inside the keyboard assembly 200 is provided. The keyboard assembly 200 of the above-mentioned electronic device 10 may also include a non-metallic bracket 280, and the non-metallic bracket 280 is supported between the metal structure 270 and the temperature equalizing plate 240, that is, the non-metallic bracket 280 is located in the cavity formed between the metal structure 270 and the temperature equalizing plate 240, so that it can effectively support the metal structure 270. In some other possible examples, the non-metallic bracket 280 may not be provided in the electronic device 10. For example, the metal structure 270 may be fixed to the inner surface of the upper shell 220, so that there is no need to provide a support structure between the metal structure 270 and the temperature equalizing plate 240.

[0095] In some embodiments, the metal structure 270 can be a metal sheet, for example, a steel sheet. The metal structure 270 can be provided with an SMT device, and the metal structure 270 is electrically connected to the above-mentioned main board (not shown in the figure). The edge of the metal structure 270 close to the first wall plate 231 is the first edge 271, and the first edge 271 and the temperature balancing plate 240 are spaced apart along the Z-axis direction, that is, a gap is formed between the first edge 271 and the temperature balancing plate 240, and the above-mentioned non-metallic bracket 280 is arranged opposite to the first wall plate 231. The edges other than the first edge 271 are all connected to the temperature balancing plate 240. For example, the metal structure 270 and the temperature balancing plate 240 can be fixedly connected by fasteners such as screws, so that the above-mentioned cavity can be formed between the metal structure 270 and the temperature balancing plate 240, so that the two form a cavity antenna structure.

[0096] In other embodiments, the metal structure 270 may also be a FPC (Flexible Printed Circuit), or an LDS antenna may be formed on the surface of the non-metal bracket 280 away from the temperature equalizing plate 240. Therefore, this application does not make any special limitation on this.

[0097] On this basis, please continue to refer to Fig.12 The electronic device 10 further includes an excitation unit 290, which is electrically connected to the mainboard and electrically connected to the metal structure 270. The excitation unit 290 excites the metal structure 270 to form a feed, thereby emitting a signal. For example, the excitation unit 290 may be a conductive metal sheet, and the excitation unit 290 may be fixed on the surface of the non-metallic bracket 280 facing the first wall plate 231 to excite the cavity antenna, thereby radiating a signal.

[0098] Specifically, the excitation unit 290 and the metal structure 270 are electrically connected to form a ground, and the excitation unit 290 and the temperature plate 240 can be spaced apart to form a coupled feed, that is, the excitation mode is a radiation aperture coupled excitation, such as Fig.12 Alternatively, see Fig.13 , Fig.13 This is a structural diagram of another excitation unit 290 provided in an embodiment of the present application. The excitation unit 290 may also be in contact with the temperature homogenizing plate 240 to form direct feeding, that is, the excitation method is direct excitation of the radiation aperture.

[0099] It is understandable that the excitation unit 290 may also be disposed in the cavity between the metal structure 270 and the temperature equalizing plate 240 , and coupling feeding or direct feeding may be performed between the excitation unit 290 and the inner wall of the cavity.

[0100] In other examples, the excitation unit 290 may also use a coaxial conductor (not shown in the figure), and the excitation unit 290 includes an inner core and an outer core electrically connected to each other, and the excitation unit 290 extends along the Z-axis direction. In the case where the excitation unit 290 adopts coupled feeding, the outer core is electrically connected to the temperature homogenizing plate 240 to achieve grounding, and the inner core is spaced apart from the metal structural member 270, and coupled excitation is formed between the two. In the case where the excitation unit 290 adopts direct feeding, the outer core is electrically connected to the temperature homogenizing plate 240 to achieve a node, and the inner core is in contact with the metal structural member 270, and direct excitation is formed between the two. Therefore, the present application does not make any special restrictions on this.

[0101] In addition, to further ensure that the cavity antenna is stably grounded, the upper cover 110, the upper shell 220, and the bottom shell 230 of the electronic device 10 provided in the embodiment of the present application can all be made of metal materials. In addition, the electronic device 10 can also include multiple conductive layers, and the above-mentioned metal structure 270 and the temperature averaging plate 240, the metal structure 270 and the upper shell 220, and the temperature averaging plate 240 and the bottom shell 230 can all be electrically connected through the conductive layer.

[0102] See also Fig.14 and Fig.15 , Fig.14 A three-dimensional diagram of another cavity antenna structure provided in an embodiment of the present application, Fig.15 for Fig.14 A partial structural cross-sectional view of the cavity antenna structure provided in the housing, Fig.15 The non-metallic bracket 280 is not shown. The conductive layer may include a first conductive layer 400, a second conductive layer 410 and a third conductive layer 420. For example, the conductive layer may be made of conductive foam or other conductive materials.

[0103] Specifically, the first conductive layer 400 may be disposed between the metal structure 270 and the temperature balancing plate 240. For example, please continue to refer to Fig.14 and Fig.15 The first conductive layer 400 is disposed between the edge of the metal structure 270 away from the first wall plate 231 and the temperature averaging plate 240, and the first conductive layer 400 abuts against between the metal structure 270 and the temperature averaging plate 240, thereby achieving a stable electrical connection between the temperature averaging plate 240 and the metal structure 270, and a cavity can be formed between the two.

[0104] See also Fig.16 and Fig.17 , and combined with Fig.15 , Fig.16 for Fig.14 The structure diagram of the cavity antenna structure facing the surface of the upper shell 220 is provided. Fig.17 for Fig.16 The second conductive layer 410 can be disposed between the metal structure 270 and the upper shell 220. For example, the second conductive layer 410 is disposed near the first edge 271 of the metal structure 270, and the second conductive layer 410 abuts between the metal structure 270 and the upper shell 220, thereby achieving stable grounding of the metal structure 270 and the upper shell 220.

[0105] See also Fig.18 and Fig.19 , and combined with Fig.15 , Fig.17 for Fig.14 The structure diagram of the cavity antenna structure facing the surface of the bottom shell 230 is provided. Fig.19 for Fig.18 The third conductive layer 420 can be disposed between the temperature averaging plate 240 and the bottom shell 230. For example, the third conductive layer 420 is disposed on a side close to the first wall plate 231, and the third conductive layer 420 is in contact with the temperature averaging plate 240 and the bottom shell 230, so as to achieve stable grounding of the temperature averaging plate 240 and the bottom shell 230.

[0106] It is understandable that the number and position of the first conductive layer 400, the second conductive layer 410, and the third conductive layer 420 can be adjusted according to the actual structure and actual scene of the electronic device 10. For example, one first conductive layer 400 can be provided, three second conductive layers 410 can be provided, two third conductive layers 420 can be provided, etc. Therefore, this application does not specifically limit this.

[0107] On the basis of the above-mentioned embodiment, the cavity antenna structure formed by the metal structure 270 and the temperature plate 240 cannot be set too small in physical size to improve its signal strength. However, the trend of thinning and light electronic devices 10 leads to a smaller space inside the shell. Therefore, the metal structure 270 is likely to conflict with other devices inside the shell. For example, the heat sink fins 250 and the non-metallic bracket 280 are distributed along the Y-axis direction, and the relative positions between the two are likely to affect each other.

[0108] Based on this, see Fig. 20 , Fig.21 and Fig. 22 , Fig. 20 The structure diagram of the temperature averaging plate 240, the heat sink fins 250 and the non-metallic bracket 280 provided in the embodiment of the present application is shown in FIG. Fig.21 for Fig. 20 A partial cross-sectional structural diagram of the heat dissipation fin 250 and the non-metallic bracket 280 is provided. Fig. 22 for Fig. 20 A partial structural diagram of a non-metallic bracket 280 is provided.

[0109] The non-metal bracket 280 may include a first portion 281 and a second portion 282, which are distributed along the Y-axis direction, i.e., the length direction of the electronic device 10. The heat sink 250 includes a third portion 251 and a fourth portion 252, which are distributed along the Y-axis direction.

[0110] The second portion 282 of the non-metallic bracket 280 and the fourth portion 252 of the heat dissipation fin 250 are distributed along the X-axis direction, that is, the width direction of the electronic device 10. The second portion 282 is located between the fourth portion 252 and the heat dissipation hole 232 on the first portion 281. The second portion 282 of the non-metallic bracket 280 is provided with an air duct 283, which extends along the X-axis direction.

[0111] In this way, there are partial areas of overlap between the non-metallic bracket 280 and the heat dissipation fins 250 along the X-axis direction, namely the second part 282 and the fourth part 252 mentioned above, and an air duct 283 is opened on the second part 282 of the non-metallic bracket 280, so that the wind blown out by the cooling fan 260 can flow through the air duct 283 to avoid the second part 282 of the non-metallic bracket 280 affecting the normal heat dissipation of the fourth part 252 of the heat dissipation fins 250.

[0112] At the same time, since the non-metallic bracket 280 is arranged between the metal structural part 270 and the temperature equalizing plate 240, that is, the metal structural part 270 can cover the non-metallic bracket 280 to increase the physical size of the metal structural part 270, thereby increasing the cavity space formed between the metal structural part 270 and the temperature equalizing plate 240, which is beneficial to improve the signal strength of the cavity antenna structure formed by the metal structural part 270 and the temperature equalizing plate 240 to ensure the performance of the cavity antenna.

[0113] In some embodiments, see Fig.23 , Fig.24 and Fig.25 , Fig.23 This is a front view of another air duct 283 provided in an embodiment of the present application. Fig.24 for Fig.23 The cross-sectional structure diagram of the air duct 283 is provided, Fig.25 for Fig.23 A three-dimensional diagram of the air duct 283 is provided. The air duct 283 can extend along the Z-axis direction, and the air duct 283 passes through the second portion 282 of the non-metallic bracket 280 toward the surface of the temperature equalizing plate 240, or the air duct 283 passes through the second portion 282 of the non-metallic bracket 280 toward the surface of the metal structural member 270. Under this structure, along the cross section perpendicular to the X-axis direction, the cross-sectional area of ​​the large air duct 283 can be increased, which is beneficial to increase the ventilation volume of the air duct 283, and is beneficial to further improve the heat dissipation effect of the heat sink fins 250.

[0114] In some other possible embodiments, see Fig.26 and Fig. 27 , Fig.26 A structural diagram of another non-metallic bracket 280, heat sink fins 250 and metal structural member 270 provided in an embodiment of the application is shown in FIG. Fig. 27 for Fig.26The metal structure 270 may include a first region 272 and a second region 273, the first region 272 and the second region 273 are distributed along the Y-axis direction, and the non-metal bracket 280 is disposed between the first region 272 and the temperature balancing plate 240. The second region 273 of the metal structure 270 and the fourth portion 252 of the heat sink fin 250 are distributed along the X-axis direction, and the fourth portion 252 is located on the side of the second region 273 away from the first wall plate 231.

[0115] Under this structure, the non-metallic bracket 280 (i.e., the second part 282 of the non-metallic bracket 280) is not arranged between the second area 273 of the metal structural member 270 and the temperature equalizing plate 240, so that the space between the second area 273 and the temperature equalizing plate 240 forms the above-mentioned air duct 283. Therefore, in the cross section perpendicular to the X-axis direction, it is beneficial to further increase the cross-sectional area of ​​the air duct 283, thereby further increasing the ventilation volume of the air duct 283, which is beneficial to further enhance the heat dissipation effect of the heat sink fins 250.

[0116] In summary, in the electronic device provided in the embodiment of the present application, the cavity antenna structure formed by forming the boundary of the cavity between the metal structural member 270 and the surface of the temperature equalizing plate 240 is conducive to reducing the thickness of the cavity antenna structure (i.e., the dimension in the Z-axis direction), thereby helping to reduce the thickness of the electronic device 10 and promoting the thinning of the electronic device 10. The cavity antenna of the electronic device 10 is tested as follows.

[0117] See also Fig.28 and Fig.29 , Fig.28 A schematic diagram of the simulation of the S11 parameters of the cavity antenna provided in the embodiment of the present application, wherein: Fig.28 The upper cover 110 ( Fig.28 Middle curve B) and without upper cover 110 ( Fig.28 The simulation result of curve A). Fig.29 This is a schematic diagram of the efficiency simulation of the cavity antenna provided in the embodiment of the present application, wherein: Fig.29 The S parameter curve of the cavity antenna is included in Fig.29 Curve A in the middle), system radiation efficiency curve ( Fig.29 Curve B) and the system total efficiency curve ( Fig.29 middle curve C).

[0118] Also, see Figure 30 to Figure 34 , Fig.30 This is the far-field radiation pattern of the cavity antenna provided in the embodiment of the present application in the 2.4G frequency band. Fig.31 The far-field radiation pattern of the cavity antenna provided in the embodiment of the present application in the 5G frequency band. Fig.32This is the far-field radiation pattern of the cavity antenna provided in an embodiment of the present application at a frequency of 2.5 GHz. Fig.33 The far-field radiation pattern of the cavity antenna provided in an embodiment of the present application at a frequency of 5.1 GHz. Fig.34 This is the far-field radiation pattern of the cavity antenna provided in an embodiment of the present application at a frequency of 5.6 GHz.

[0119] For example, when the cavity antenna is at a frequency of 2.5 GHz, refer to Figure 35 to Figure 37 , Fig.35 This is a scalar diagram of the electric field simulation of the cavity antenna provided in the embodiment of the present application at a frequency of 2.5 GHz. Fig.36 for Fig.35 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided. Fig.37 for Fig.35 The electric field simulation vector diagram of the cavity antenna (along the XZ cross section) is provided.

[0120] Alternatively, for the case of the above cavity antenna at 5.1 GHz, see Figures 38 to 40 , Fig.38 This is a scalar diagram of the electric field simulation of the cavity antenna provided in the embodiment of the present application at a frequency of 5.1 GHz. Fig.39 for Fig.38 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided. Fig.40 for Fig.38 The electric field simulation vector diagram of the cavity antenna (along the XZ cross section) is provided.

[0121] Alternatively, when the cavity antenna is at 5.7 GHz, please refer to Figure 41 to Figure 43 , Fig.41 This is a scalar diagram of the electric field simulation of the cavity antenna provided in the embodiment of the present application at a frequency of 5.7 GHz. Fig.42 for Fig.41 The electric field simulation vector diagram of the cavity antenna (along the YZ section) is provided. Fig.43 for Fig.41 The electric field simulation vector diagram of the cavity antenna (along the XZ cross section) is provided.

[0122] As can be seen from the above drawings, the embodiment of the present application provides an electronic device 10, in which the cavity antenna structure formed by the metal structure 270 and the temperature plate 240 as the cavity boundary can work normally in different frequency bands. Therefore, while ensuring the normal operation of the cavity antenna, the cavity antenna structure can also reduce the thickness of the electronic device 10, thereby facilitating the thinning of the electronic device 10.

[0123] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0124] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: It includes a display component and a keyboard component, wherein the display component is rotatably connected to the keyboard component; the keyboard component includes: case; A temperature balancing plate is arranged in the housing; A metal structure is arranged in the shell, the metal structure is connected to the temperature averaging plate, and the metal structure and the temperature averaging plate are distributed along the thickness direction of the electronic device, and a cavity is formed between the metal structure and the temperature averaging plate, so that the metal structure and the temperature averaging plate form a cavity antenna structure.

2. The electronic device according to claim 1, characterized in that: The electronic device further comprises a non-metallic bracket, which is supported between the metal structure and the temperature homogenizing plate and is located in the cavity.

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises a heat sink fin, which is arranged on the temperature equalizing plate. The shell is provided with heat dissipation holes, and the heat sink fin is arranged opposite to the heat dissipation holes. The heat sink fin and the non-metallic bracket are distributed along the length direction of the electronic device.

4. The electronic device according to claim 3, characterized in that: The non-metallic bracket includes a first part and a second part, and the first part and the second part are distributed along the length direction of the electronic device; the heat dissipation fin includes a third part and a fourth part, and the third part and the fourth part are distributed along the length direction of the electronic device; The second part and the fourth part are distributed along the width direction of the electronic device, and the second part is located between the heat dissipation hole and the fourth part; the second part is provided with an air duct, and the air duct is connected between the heat dissipation fins and the heat dissipation hole.

5. The electronic device according to claim 4, characterized in that: The air duct passes through the surface of the second portion facing the temperature homogenizing plate; or, the air duct passes through the surface of the second portion facing the metal structural component.

6. The electronic device according to claim 3, characterized in that: The metal part includes a first area and a second area, the first area and the second area are distributed along the length direction of the electronic device, the non-metallic bracket is arranged between the first area and the temperature averaging plate, and the second area is spaced apart from the temperature averaging plate; The heat dissipation fin includes a third part and a fourth part, and the third part and the fourth part are distributed along the length direction of the electronic device; the second area and the fourth part are distributed along the width direction of the electronic device, and the fourth part is located on a side of the second area away from the heat dissipation hole.

7. The electronic device according to any one of claims 2 to 6, characterized in that: The electronic device further comprises an excitation unit and a main board, wherein the excitation unit is electrically connected to the metal structure, and the excitation unit is electrically connected to the main board.

8. The electronic device according to claim 7, characterized in that: The shell has a first wall plate, which is provided with heat dissipation holes. The metal part is arranged at an edge close to the first wall plate and is spaced apart from the edge close to the first wall plate of the temperature equalizing plate. The excitation unit is arranged on the surface of the non-metallic bracket facing the first wall plate.

9. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further includes a first conductive layer, wherein the first conductive layer is abutted between an edge of the metal structure and the temperature homogenizing plate.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further includes a second conductive layer, which is abutted between the inner wall of the housing and the surface of the metal structure away from the temperature homogenizing plate.

11. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further includes a third conductive layer, and the third conductive layer is abutted between the inner wall of the housing and the surface of the temperature homogenizing plate away from the metal structure.

12. The electronic device according to any one of claims 1 to 6, characterized in that: The temperature homogenizing plate includes an evaporation area and a condensation area, and along the length direction of the electronic device, the condensation areas are arranged on both sides of the evaporation area, the metal structural parts are arranged on the two condensation areas, and a cavity is formed between the metal structural parts and the corresponding condensation areas.

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