Pressing point die for wafer temperature measuring point wiring
By designing a pressing point mold for wafer temperature measurement, the problem of signal wire winding and breaking is solved, and the accurate measurement of the specific point temperature on the wafer and the standardization of the temperature measurement process is achieved.
Patent Information
- Application Number
- CN202323266181.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-01
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2033-12-01
AI Technical Summary
In the prior art, when measuring the temperature of the wafer, the signal line is prone to wrap around and confusing, and the strength at the connection between the thermocouple and the signal line is weak, which easily leads to the signal line being pulled out and it is impossible to accurately detect the temperature of certain specific points on the wafer.
A pressing point mold for wafer temperature measurement point wiring is designed, including the ring inner membrane, groove, trace groove and pressure film. By fixing the signal line in the trace groove and pressing it with the pressing film, the tension force is differentiated to the ring inner membrane and wafer to avoid the force being concentrated at the connection between the thermocouple and the signal line.
It effectively avoids the problem of signal line winding and pulling, realizes accurate measurement of the temperature of specific points on the wafer, and improves the reliability and efficiency of temperature measurement by standardizing signal line wiring.
Smart Images
Figure CN222618041U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer temperature measurement, in particular to a pressure point mold used for wafer temperature measurement point routing. Background Art
[0002] In the semiconductor industry, the commonly used detection method is thermal imaging detection. The advantage of this detection method is that it is easy to use, but its disadvantage is that it is easily disturbed by light, has large detection errors, and cannot accurately detect the temperature of certain specific points on the wafer. In order to accurately measure the temperature of certain specific points on the wafer, the thermocouple needs to be fixed on the temperature measurement point, and the thermocouple needs to transmit its temperature signal through the signal line. When there are too many temperature measurement points on the wafer, the signal line will be tangled and chaotic. Secondly, the strength of the connection between the thermocouple and the signal line is relatively weak. When the signal line is subjected to tension, the force will be concentrated at the connection between the thermocouple and the signal line, which can easily break the signal line.
[0003] Therefore, it is necessary to design a pressure point mold for wafer temperature measurement point routing that can solve the above problems. Utility Model Content
[0004] Purpose of the utility model: A pressure point mold for routing temperature measurement points on a wafer to solve the above-mentioned problems existing in the prior art.
[0005] In order to solve the above technical problems, the utility model provides a pressure point mold for routing temperature measurement points of wafers. The mold includes an annular inner film, a groove is provided on the annular inner film, a routing groove is provided at the bottom of the groove, and a pressure film is provided above the routing groove. The pressure film is used to press the signal line fixed in the routing groove.
[0006] As a preferred solution, the number of wiring troughs is two.
[0007] As a preferred solution, the inner membrane of the annular ring is composed of a left membrane and a right membrane, and a wiring groove is respectively provided on the left membrane and the right membrane, and the left membrane and the right membrane are spliced into the groove.
[0008] As a preferred solution, the outer side of the inner membrane of the annular ring is wrapped with a sleeve membrane, and the sleeve membrane is provided with wiring holes.
[0009] As a preferred solution, the sleeve film is provided with a left positioning hole, a right positioning hole and a middle positioning hole for facilitating the positioning of the left film, the right film and the pressing film.
[0010] As a preferred solution, the material of the annular inner membrane and the pressing membrane is high temperature resistant stainless steel.
[0011] As a preferred solution, the sleeve membrane is made of high temperature resistant stainless steel.
[0012] Beneficial effects: The utility model relates to a pressing point mold for routing temperature measuring points on a wafer. When in use, the signal line of the thermocouple is first fixed in the routing groove, and then it is pressed by the pressing film, and the inner film of the circular ring is fixed on the wafer. When the signal line is subjected to tension, part of the tension will be differentiated to the inner film of the circular ring, and then differentiated to the wafer, so as to avoid the force being concentrated at the connection between the thermocouple and the signal line. The mold can also standardize the routing of the signal line of the thermocouple to avoid the signal line from being entangled and chaotic. In addition, the mold can be used to make the size of the glue points for fixing the thermocouples consistent, and the mold can be used to apply pressure to the glue for fixing the temperature measuring points to discharge the glue bubbles and make the glue density consistent, thereby achieving consistency in thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0014] Figure 2 It is a partial structural schematic diagram of the utility model.
[0015] Figure 3 It is an exploded schematic diagram of the overall structure of the utility model.
[0016] The reference numerals in the figures are: sleeve film 1, left film 2, right film 3, pressing film 4, wiring groove 5, wiring hole 6, groove 7, left positioning hole 8, middle positioning hole 9, right positioning hole 10. DETAILED DESCRIPTION
[0017] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.
[0018] The applicant's research found that when there are too many temperature measurement points on the wafer, the signal line will be tangled and confused. Secondly, the strength of the connection between the thermocouple and the signal line is relatively weak. When the signal line is subjected to tension, the force will be concentrated at the connection between the thermocouple and the signal line, which can easily break the signal line.
[0019] To this end, the utility model provides a pressure point mold for wafer temperature measurement point routing, please refer to Figures 1 to 3The mold includes a circular inner film, a groove 7 is arranged on the circular inner film, a wiring groove 5 is arranged at the bottom of the groove 7, a pressing film 4 is arranged above the wiring groove 5, and the pressing film 4 is used to press the signal line fixed in the wiring groove 5; in specific implementation, the signal line of the thermocouple is first fixed in the wiring groove 5, and then it is pressed by the pressing film 4, and the circular inner film is fixed on the wafer. When the signal line is subjected to tension, part of the tension will be differentiated to the circular inner film, and then differentiated to the wafer, avoiding the force concentration at the connection between the thermocouple and the signal line. The mold can also standardize the routing of the signal line of the thermocouple to avoid the entanglement of the signal line.
[0020] Preferably, there are generally two signal lines of the thermocouple, so the number of wiring slots 5 is set to two.
[0021] Preferably, the inner membrane of the annular ring is composed of a left membrane 2 and a right membrane 3, and a wiring groove 5 is respectively provided on the left membrane 2 and the right membrane 3. The left membrane 2 and the right membrane 3 are spliced into the groove 7. Since the signal line is relatively thin and easily elastically deformed, it is troublesome to align and fix the two signal lines in the wiring groove 5 at one time. The inner membrane of the annular ring is divided into the left membrane 2 and the right membrane 3. After the signal lines can be fixed on the wiring grooves 5 of the left membrane 2 and the right membrane 3 respectively, the left membrane 2 and the right membrane 3 are spliced together, thereby improving the efficiency of the staff in fixing the signal lines.
[0022] Furthermore, a sheath 1 is wrapped around the outer side of the annular inner membrane, and a wiring hole 6 is provided on the sheath 1. The sheath 1 protects the annular inner membrane, and the signal line fixed on the annular inner membrane can extend through the wiring hole 6.
[0023] Furthermore, the sleeve film 1 is provided with a left positioning hole 8, a right positioning hole 10 and a middle positioning hole 9 for facilitating the positioning of the left film 2, the right film 3 and the pressing film 4. When the sleeve film 1 is put on the inner film of the annular ring, it can be aligned through the left positioning hole 8, the right positioning hole 10 and the middle positioning hole 9.
[0024] Preferably, when the temperature of the wafer is measured, the temperature of the wafer will increase, so the material of the inner film of the ring and the pressing film 4 is high-temperature resistant stainless steel.
[0025] Preferably, when the temperature of the wafer is measured, the temperature of the wafer will increase, so the material of the sleeve film 1 is high-temperature resistant stainless steel.
[0026] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings; however, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, various equivalent transformations can be made to the technical scheme of the present invention, and these equivalent transformations all belong to the protection scope of the present invention.
Claims
1. A pressure point mold for wafer temperature measurement point routing, characterized in that: include: Ring lining; A groove is arranged on the inner film of the circular ring, a wiring groove is arranged at the bottom of the groove, and a pressing film is arranged above the wiring groove, and the pressing film is used to press the signal line fixed in the wiring groove.
2. A pressure point mold for wafer temperature measurement point routing according to claim 1, characterized in that: The number of wiring troughs is two.
3. A pressure point mold for wafer temperature measurement point routing according to claim 1, characterized in that: The inner membrane of the annular ring is composed of a left membrane and a right membrane, and the left membrane and the right membrane are respectively provided with a wiring groove, and the left membrane and the right membrane are spliced into the groove; The outer side of the inner membrane of the circular ring is wrapped with a sleeve membrane, and the sleeve membrane is provided with wiring holes.
4. A pressure point mold for wafer temperature measurement point routing according to claim 3, characterized in that: The sleeve film is provided with a left positioning hole, a right positioning hole and a middle positioning hole for facilitating the positioning of the left film, the right film and the pressing film.
5. The pressure point mold for wafer temperature measurement point routing according to claim 1, characterized in that: The materials of the annular inner membrane and the pressing membrane are high temperature resistant stainless steel.
6. The pressure point mold for wafer temperature measurement point routing according to claim 3, characterized in that: The material of the sleeve membrane is high temperature resistant stainless steel.