Integrated circuit chip packaging structure convenient for feeding

Abstract

The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit wafer packaging structure convenient to feed, which comprises a packaging machine, a conveying mechanism is arranged on the outer wall of the packaging machine, and a controller is fixedly connected to the outer wall of the packaging machine and close to the conveying mechanism. A power plug is installed at the position, close to the controller, of the outer wall of the packaging machine, and a supporting plate is fixedly connected to the position, below the conveying mechanism, of the outer wall of the packaging machine. The integrated circuit wafer packaging structure convenient to feed is designed, the conveying mechanism in the integrated circuit wafer packaging structure convenient to feed is used for conveying wafers, and the problem that when an existing integrated circuit wafer packaging structure convenient to feed feeds the integrated circuit wafers into equipment, the integrated circuit wafers cannot be conveyed conveniently is solved. And a worker needs to manually correct the posture of the integrated circuit wafer to prevent the inclined integrated circuit wafer from entering the equipment, so that the operation is time-consuming and labor-consuming.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit chip packaging structure which is convenient for feeding. Background Art

[0002] A circuit chip packaging structure is a device used to package circuit chips, but the existing integrated circuit chip packaging structure still has shortcomings. Specifically, when the integrated circuit chip is sent into the device, the existing integrated circuit chip packaging structure requires workers to manually correct the posture of the integrated circuit chip to prevent the skewed integrated circuit chip from entering the device, which is time-consuming and laborious.

[0003] Therefore, an integrated circuit chip packaging structure that is convenient for feeding is needed to solve the problems raised in the above background technology. Utility Model Content

[0004] The utility model aims to provide an integrated circuit chip packaging structure which is convenient for feeding, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] An integrated circuit chip packaging structure for convenient feeding includes a packaging machine, a conveying mechanism is arranged on the outer wall of the packaging machine, a controller is fixedly connected to the outer wall of the packaging machine near the conveying mechanism, a power plug is installed on the outer wall of the packaging machine near the controller, and a support plate is fixedly connected to the outer wall of the packaging machine below the conveying mechanism;

[0007] The conveying mechanism includes a fixed seat fixedly connected to the feed port of the outer wall of the packaging machine, a conveyor belt is fixedly connected to the top of the fixed seat, a mounting seat is fixedly connected to the top of the fixed seat and on both sides of the conveyor belt, a detection plate is fixedly connected to the top of the mounting seat and above the conveyor belt, a laser sensor is fixedly connected to the bottom center of the detection plate, a reflection strip is fixedly connected to the outer wall of the conveyor belt and at the corresponding position of the laser sensor, a correction strip is slidably connected inside the mounting seat and above the conveyor belt, a piston plate is fixedly connected to the outer wall of the correction strip and inside the mounting seat, a reset spring is fixedly connected to the outer wall of the piston plate and at a position away from the correction strip, and a micro air pump is fixedly connected inside the mounting seat and below the reset spring.

[0008] As a preferred solution of the present invention, the support plate is made of aluminum alloy, and the connection between the controller and the power plug is an electrical connection.

[0009] As a preferred solution of the utility model, the fixing seat, the mounting seat, the detection plate and the piston plate are all made of ABS plastic, the mounting seat is designed as an L-shaped structure, and the correction strip passes through and extends outside the mounting seat.

[0010] As a preferred solution of the utility model, the correction strip is made of silicone, the thickness of the correction strip is matched with the thickness of the integrated circuit chip, and the connection mode between the piston plate and the mounting seat is a sliding connection.

[0011] As a preferred solution of the utility model, the reflective strip is made of aluminum foil, and the connection between the reset spring and the mounting seat, and between the fixing seat and the support plate are all fixed connections.

[0012] As a preferred solution of the utility model, the conveyor belt passes through and extends into the feed port of the packaging machine, and the conveyor belt, the laser sensor, and the micro air pump are all connected to the controller electrically.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. In the utility model, an integrated circuit wafer packaging structure that is convenient for feeding is designed, and the conveying mechanism in the device is used to convey the wafer. The worker places the integrated circuit wafer on the conveyor belt, and the controller starts the conveyor belt, which drives the integrated circuit wafer to move. When the integrated circuit wafer moves to the bottom of the detection plate, the integrated circuit wafer blocks the reflection strip, and the laser sensor cannot receive the laser signal reflected back by the reflection strip. The controller turns off the conveyor belt, and the integrated circuit wafer no longer moves. The controller starts the micro air pump, and the micro air pump sends air into the mounting seat. The air entering the mounting seat pushes the correction strip to move outward through the piston plate, and moves outward. The correction bar will push the integrated circuit chip to move so that the integrated circuit chip is aligned with the feed port of the packaging machine. After the correction is completed, the micro air pump will extract air from the mounting seat, and the reset spring will drive the correction bar to move inward through the piston plate. The correction bar no longer presses against the integrated circuit chip, and the controller starts the conveyor belt. The conveyor belt sends the integrated circuit chip with the corrected posture into the packaging machine, and the packaging machine packages the integrated circuit chip, which solves the problem that the existing integrated circuit chip packaging structure with convenient feeding requires workers to manually correct the posture of the integrated circuit chip when sending the integrated circuit chip into the equipment to prevent the skewed integrated circuit chip from entering the equipment, and the operation is time-consuming and labor-intensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of the fixing seat of the utility model;

[0017] Figure 3 It is a front cross-sectional view of the fixing seat of the utility model.

[0018] In the figure: 1. packaging machine; 2. conveying mechanism; 3. controller; 4. power plug; 5. support plate; 201. fixing seat; 202. conveyor belt; 203. mounting seat; 204. detection plate; 205. laser sensor; 206. reflection strip; 207. correction strip; 208. piston plate; 209. reset spring; 210. micro air pump. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0020] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a central element. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] For examples, see Figure 1-3 , the utility model provides a technical solution:

[0024] An integrated circuit chip packaging structure for convenient feeding includes a packaging machine 1, a conveying mechanism 2 is arranged on the outer wall of the packaging machine 1, a controller 3 is fixedly connected to the outer wall of the packaging machine 1 and near the conveying mechanism 2, a power plug 4 is installed on the outer wall of the packaging machine 1 and near the controller 3, and a support plate 5 is fixedly connected to the outer wall of the packaging machine 1 and below the conveying mechanism 2;

[0025] The support plate 5 is made of aluminum alloy, and the connection between the controller 3 and the power plug 4 is electrical connection;

[0026] In this embodiment, reference Figure 2 and Figure 3 The conveying mechanism 2 includes a fixed seat 201 fixedly connected to the feeding port of the outer wall of the packaging machine 1, a conveyor belt 202 is fixedly connected to the top of the fixed seat 201, a mounting seat 203 is fixedly connected to the top of the fixed seat 201 and on both sides of the conveyor belt 202, a detection plate 204 is fixedly connected to the top of the mounting seat 203 and above the conveyor belt 202, a laser sensor 205 is fixedly connected to the bottom center of the detection plate 204, a reflection strip 206 is fixedly connected to the outer wall of the conveyor belt 202 and at the corresponding position of the laser sensor 205, a correction strip 207 is slidably connected inside the mounting seat 203 and above the conveyor belt 202, a piston plate 208 is fixedly connected to the outer wall of the correction strip 207 and inside the mounting seat 203, a reset spring 209 is fixedly connected to the outer wall of the piston plate 208 and at a position away from the correction strip 207, and a micro air pump 210 is fixedly connected inside the mounting seat 203 and below the reset spring 209;

[0027] The fixing seat 201, the mounting seat 203, the detection plate 204 and the piston plate 208 are all made of ABS plastic. The mounting seat 203 is an L-shaped structure. The correction strip 207 runs through and extends to the outside of the mounting seat 203. The correction strip 207 is made of silicone. The thickness of the correction strip 207 is adapted to the thickness of the integrated circuit chip. The piston plate 208 is connected to the mounting seat 203 in a sliding manner. The reflection strip 206 is made of aluminum foil. The reset spring 209 is connected to the mounting seat 203 and the fixing seat 201 is connected to the support plate 5 in a fixed manner. The conveyor belt 202 runs through and extends into the feed port of the packaging machine 1. The conveyor belt 202, the laser sensor 205 and the micro air pump 210 are connected to the controller 3 in an electrical manner. The worker places the integrated circuit chip on the conveyor belt 202, and the controller 3 starts the conveyor belt 202. The conveyor belt 202 drives the integrated circuit chip to move. When the integrated circuit chip moves to the bottom of the detection plate 204, the integrated circuit chip blocks the detection plate 204. The laser sensor 205 cannot receive the laser signal reflected by the reflective strip 206, the controller 3 turns off the conveyor belt 202, the integrated circuit chip no longer moves, the controller 3 starts the micro air pump 210, the micro air pump 210 will send air into the mounting seat 203, the air entering the mounting seat 203 will push the correction strip 207 to move outward through the piston plate 208, the correction strip 207 moving outward will push the integrated circuit chip to move, the correction strips 207 located on both sides of the integrated circuit chip will correct the posture of the integrated circuit chip, so that the integrated circuit chip is aligned with the feed port of the packaging machine 1, after the correction is completed, the micro air pump 210 draws air out of the mounting seat 203, the reset spring 209 will drive the correction strip 207 to move inward through the piston plate 208, the correction strip 207 no longer presses against the integrated circuit chip, the controller 3 starts the conveyor belt 202, the conveyor belt 202 sends the integrated circuit chip with the corrected posture into the packaging machine 1, and the packaging machine 1 packages the integrated circuit chip.

[0028] The working process of the utility model is as follows: when the integrated circuit wafer packaging structure designed by the present invention is in operation, a worker places the integrated circuit wafer on the conveyor belt 202, and the controller 3 starts the conveyor belt 202, which drives the integrated circuit wafer to move. When the integrated circuit wafer moves to the bottom of the detection plate 204, the laser sensor 205 cannot receive the laser signal reflected by the reflective strip 206 because the integrated circuit wafer blocks the reflective strip 206. The controller 3 turns off the conveyor belt 202, and the integrated circuit wafer stops moving. The controller 3 starts the micro air pump 210, and the micro air pump 210 sends air into the mounting seat 203. The air will push the correction strip 207 to move outward through the piston plate 208, and the correction strip 207 moving outward will push the integrated circuit chip to move. The correction strips 207 located on both sides of the integrated circuit chip will correct the posture of the integrated circuit chip so that the integrated circuit chip is aligned with the feed port of the packaging machine 1. After the correction is completed, the micro air pump 210 will extract the air from the mounting seat 203, and the reset spring 209 will drive the correction strip 207 to move inward through the piston plate 208. The correction strip 207 no longer presses against the integrated circuit chip, and the controller 3 starts the conveyor belt 202, and the conveyor belt 202 delivers the integrated circuit chip with the corrected posture into the packaging machine 1, and the packaging machine 1 packages the integrated circuit chip.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip packaging structure with convenient feeding, comprising a packaging machine (1), characterized in that: The outer wall of the packaging machine (1) is provided with a conveying mechanism (2); the outer wall of the packaging machine (1) is fixedly connected to a controller (3) at a position close to the conveying mechanism (2); the outer wall of the packaging machine (1) is installed with a power plug (4) at a position close to the controller (3); and the outer wall of the packaging machine (1) is fixedly connected to a support plate (5) below the conveying mechanism (2); The conveying mechanism (2) comprises a fixed seat (201) fixedly connected to a material inlet on the outer wall of the packaging machine (1); a conveyor belt (202) is fixedly connected to the top of the fixed seat (201); a mounting seat (203) is fixedly connected to the top of the fixed seat (201) and on both sides of the conveyor belt (202); a detection plate (204) is fixedly connected to the top of the mounting seat (203) and above the conveyor belt (202); a laser sensor (205) is fixedly connected to the center of the bottom of the detection plate (204); and the outer wall of the conveyor belt (202) and the laser sensor (205) are fixedly connected to the outer wall of the conveyor belt (202). A reflective strip (206) is fixedly connected at a corresponding position of the optical sensor (205); a correction strip (207) is slidably connected inside the mounting seat (203) and above the conveyor belt (202); a piston plate (208) is fixedly connected to the outer wall of the correction strip (207) and inside the mounting seat (203); a reset spring (209) is fixedly connected to the outer wall of the piston plate (208) and at a position away from the correction strip (207); and a micro air pump (210) is fixedly connected inside the mounting seat (203) and below the reset spring (209).

2. The integrated circuit chip packaging structure with convenient feeding according to claim 1, characterized in that: The support plate (5) is made of aluminum alloy, and the controller (3) is connected to the power plug (4) in an electrical manner.

3. The integrated circuit chip packaging structure with convenient feeding according to claim 1, characterized in that: The fixing seat (201), the mounting seat (203), the detection plate (204) and the piston plate (208) are all made of ABS plastic. The mounting seat (203) is designed as an L-shaped structure, and the correction strip (207) passes through and extends outside the mounting seat (203).

4. The integrated circuit chip packaging structure with convenient feeding according to claim 1, characterized in that: The correction strip (207) is made of silicone, the thickness of the correction strip (207) is adapted to the thickness of the integrated circuit chip, and the connection mode between the piston plate (208) and the mounting seat (203) is a sliding connection.

5. The integrated circuit chip packaging structure with convenient feeding according to claim 1, characterized in that: The reflective strip (206) is made of aluminum foil, and the connection between the return spring (209) and the mounting seat (203) and between the fixing seat (201) and the support plate (5) are all fixed connections.

6. The integrated circuit chip packaging structure with convenient feeding according to claim 1, characterized in that: The conveyor belt (202) passes through and extends into the feed port of the packaging machine (1); the conveyor belt (202), the laser sensor (205) and the micro air pump (210) are all electrically connected to the controller (3).

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