Heat dissipation pasting machine table fixing baffle jig capable of increasing number of heat dissipation fins

By increasing and expanding the diameter of the front and rear positioning plates, the number of heat dissipation patches wound on the heat dissipation patch machine table is increased, and the problem of replacing heat dissipation patches in the prior art is solved, which is easy to cause scratches, top injuries and mixing, and achieves a more efficient replacement process and a more stable adhesion quality.

CN222630736UActive Publication Date: 2025-03-18JIANGSU UNION SEMICON
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Patent Information

Application Number
CN202420581430.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-25
Publication Date
2025-03-18
Estimated Expiration
2034-03-25

AI Technical Summary

Technical Problem

In the prior art, it takes a long time to replace the heat dissipation patch for each heat dissipation patch, which affects the production capacity. During the replacement process, it is easy to cause scratches, top injuries and scattering of the heat dissipation patch, and easily cause mixing.

Method used

By adding a transparent front positioning plate and rear positioning plate and increasing its diameter to 249-250mm, the front positioning plate and rear positioning plate position the winded heat dissipation end surface, so that the number of heat dissipation patches wound on the barrel increases, and the number of single-roll heat dissipation patches increases to about 9,000 heat dissipation patches.

Benefits of technology

It reduces the number of times people replace the heat dissipation patch, saves time and effort, avoids scratches, top injuries and scattering of the heat dissipation patch, prevents heat dissipation patch mix, improves the stability and reliability of the adhesion quality, and thus improves product production capacity.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model discloses a heat dissipation pasting machine table fixing baffle jig capable of increasing the number of heat dissipation fins in the semiconductor COF packaging field, which comprises a machine table panel, a rotatable rotating shaft is connected to the machine table panel, an installation cylinder is sleeved on the rotating shaft, a circular rear disc body is integrally arranged at the rear end of the installation cylinder, and the circular rear disc body is provided with a baffle plate. The front end of the installation cylinder is fixedly connected with a round front disc body, the periphery of the rotating shaft penetrating through the front disc body is sleeved with a pressing sleeve, the front end of the rotating shaft penetrating through the pressing sleeve is provided with a threaded section, the threaded section is in threaded connection with a gland, and the front end of the front positioning plate and the rear end of the rear positioning plate are provided with a plurality of first positioning rods and second positioning rods which are evenly distributed in the circumferential direction respectively. Each first positioning rod forwards penetrates through the front disc body and is sleeved with a first locking nut, and each second positioning rod backwards penetrates through the rear disc body and is sleeved with a second locking nut. According to the utility model, the number of times of replacing the heat dissipation patches by personnel can be reduced, time and labor are saved, and the heat dissipation patches are prevented from being scratched, jacked and scattered.
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