Light source system adapted to advanced package CPO optical module

Abstract

The utility model relates to the technical field of optical packaging, and particularly discloses a light source system adaptive to an advanced packaging CPO optical module. A light source assembly; the first lens assembly is arranged on the substrate assembly and can change the laser beam into collimated light; the electric chip assembly is in bonding connection with the substrate assembly; the optical chip assembly is inversely arranged on the surface, away from the substrate assembly, of the electric chip assembly; the second lens assembly is connected with the optical chip assembly, a lens structure part of the second lens assembly is opposite to an optical I / O port of the optical chip assembly, and the second lens assembly can converge the collimated light to form convergent light which can enter the optical chip assembly through the optical I / O port of the optical chip assembly; and the optical fiber array assembly is arranged on the substrate assembly. According to the light source system adaptive to the CPO optical module, the optical chip assembly can have large coupling tolerance, and the problem that in the prior art, a PIC and an LD cannot share a substrate, and consequently light falling is caused is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical packaging, and in particular to a light source system adapted to an advanced packaged CPO optical module. Background Art

[0002] In recent years, with the development of the Internet of Things and AI industries, the "cloud" and computing modules have put forward higher speed and greater bandwidth requirements for optical modules used for high-speed signal exchange. The optical I / O of pluggable optical modules has developed from 25Gbps per channel to 100Gbps today. The capacity of optical modules has also developed from 100Gbps to 800Gbps today, and various optical module giants have also begun the development of 1.6T optical modules.

[0003] For pluggable optical modules, their internal packaging is mostly based on COB (Chips on Board) technology, and the signal connection between chips and chips and chips and external systems is mostly achieved through wire bonding, which poses challenges to the improvement of single-channel bandwidth and additional power. At the same time, since the LD (Laser Diode) light source is integrated inside the reliable pluggable module, as the speed of the optical module increases, the thermal management inside the optical module is very difficult.

[0004] Therefore, server manufacturers and optical modules have proposed the CPO (Co-packaged Optics) module architecture, which is to co-package the optical chip and the electrical chip in an advanced package form. CPO technology directly assembles the package body onto the PCB (Printed Circuit Board) where the switch chip is located, realizes the short-distance interconnection between the electrical chip RX (receiver) and the ASIC (Application Specific Integrated Circuit) chip, and by placing the light source outside the laser machine, the overall system can reduce power consumption and expand bandwidth.

[0005] Compared with traditional pluggable optical modules, CPO optical modules require not only rewiring design, but also the optical port protection and light source coupling technology of PIC (Photonic Integrated Circuit) chips, which is one of the most important technical challenges at present. Figure 1It is a typical CPO solution using advanced packaging solutions. Both EIC (Electronic Integrated Circuit) 3 and PIC 4 are bonded to Si interposer (Si transfer board) 2 by flip-chip (flip-chip) method. At the same time, the transfer board is bonded and connected to PCB board 1 by bump (bump). Figure 2 This is the TOSA (Transmitter Optical Subassembly) structure of the traditional COB solution. It can be seen that PIC 4, passive lens ( Figure 2 5 and 6 in the middle), LD module 7 are bonded to the tungsten copper carrier by glue, so when the temperature changes and deformation occurs, the deformation of PIC, LD and lens in the height direction is basically consistent to ensure that the PIC light source will not have obvious light loss. Figure 1 In the advanced packaging solution shown, an interposer and two layers of bumps are introduced between the PIC and the PCB board. At the same time, the thermal expansion coefficient of the PCB itself is very large, so it is impossible to achieve a common substrate connection between the LD and the PIC through a method similar to a tungsten copper carrier board.

[0006] Therefore, how to solve the light loss problem caused by the inability to achieve common substrate connection between PIC and LD in advanced packaging structures has become a technical problem that needs to be solved urgently by technical personnel in this field. Summary of the invention

[0007] The utility model provides a light source system adapted to an advanced package CPO optical module, which solves the light loss problem existing in the related art that a PIC and a LD in an advanced package structure cannot be connected to a common substrate.

[0008] As one aspect of the utility model, a light source system adapted to an advanced packaged CPO optical module is provided, which includes:

[0009] Baseboard assembly;

[0010] A light source assembly, disposed on the substrate assembly and electrically connected to the substrate assembly, capable of emitting a laser beam;

[0011] A first lens assembly is arranged on the substrate assembly, the first lens assembly is arranged opposite to the light port of the light source assembly and is located on the outgoing light path of the laser beam, and can convert the laser beam into collimated light;

[0012] An electric chip assembly, arranged on the substrate assembly and bonded to the substrate assembly, capable of processing at least the electrical signal after photoelectric conversion and outputting it to the substrate assembly;

[0013] an optical chip assembly, which is flip-chip mounted on a surface of the electric chip assembly away from the substrate assembly and bonded to the electric chip assembly, wherein an optical I / O port of the optical chip assembly is aligned with an optical port of the light source assembly and is located on an outgoing optical path of the laser beam, and is capable of at least performing a splitting process and a photoelectric conversion process on a received optical signal, wherein the received optical signal includes a converged light incident through the optical I / O port and an optical signal transmitted through the optical fiber array assembly;

[0014] A second lens assembly is fixedly connected to the optical chip assembly and is located on the outgoing optical path of the laser beam, and a lens structure portion of the second lens assembly is arranged opposite to the optical I / O port of the optical chip assembly, and can converge the collimated light to form converged light that can enter the optical chip assembly through the optical I / O port of the optical chip assembly;

[0015] The optical fiber array assembly is arranged on the substrate assembly and is coupled to the optical I / O port of the optical chip assembly at least through the second lens assembly, and can output the optical signal after the optical chip assembly has been split and processed, and can provide a transmission path for the optical signal.

[0016] Furthermore, the second lens assembly includes a connecting portion and a lens structure portion, wherein the lens structure portion is fixedly connected to the connecting portion.

[0017] The connecting portion is fixedly connected to the surface of the optical chip assembly facing away from the electrical chip assembly,

[0018] The lens structure portion and the connecting portion are arranged at a preset angle, and the focus of the lens structure portion is located at the optical I / O port of the optical chip assembly.

[0019] Furthermore, an isolation component is disposed on the substrate component, and the isolation component is located between the lens structure portion of the second lens component and the first lens component.

[0020] Furthermore, a heat-conducting assembly is disposed on the substrate assembly, and the light source assembly, the first lens assembly and the isolation assembly are all connected to the substrate assembly via the heat-conducting assembly.

[0021] Furthermore, it also includes: a packaging body, the light source assembly is arranged on the packaging body, and the packaging body is connected to the substrate assembly through the heat conduction assembly.

[0022] Furthermore, it also includes: a plastic packaging frame, and the optical fiber array assembly is connected to the substrate assembly through the plastic packaging frame.

[0023] The light source system adapted to the advanced packaged CPO optical module provided by the utility model has a first lens assembly and a light source assembly fixedly arranged on a substrate assembly, a second lens assembly fixedly connected to an optical chip assembly, and a lens structure of the second lens assembly and an optical I / O port of the optical chip assembly that can maintain a relatively fixed position. Therefore, after the collimated light emitted by the first lens assembly reaches the lens structure of the second lens assembly, the lens structure of the second lens assembly can convert the collimated light into converged light and then couple it into the optical I / O port of the optical chip assembly to enter the optical chip assembly. Even if the substrate assembly is deformed due to heat, it will not affect the light coupling into the optical chip assembly. Therefore, the structural setting of the light source system adapted to the advanced packaged CPO optical module of the utility model can make the optical chip assembly have a larger coupling tolerance, thereby solving the problem of light loss caused by the inability of PIC and LD to realize a common substrate in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation to the present invention.

[0025] Figure 1 This is a structural diagram of CPO based on advanced packaging in the prior art.

[0026] Figure 2 This is the TOSA structure diagram of the traditional COB solution.

[0027] Figure 3 A top view of a light source system adapted to an advanced packaged CPO optical module provided by the utility model.

[0028] Figure 4 For along Figure 3 AA' cross-sectional view.

[0029] Figure 5 For along Figure 3 Cross-sectional view of BB'.

[0030] Figure 6 A flow chart of an assembly method of a CPO optical module based on advanced packaging provided by the present invention.

[0031] Figure 7a A schematic diagram of coupling and aligning a light source system adapted to an advanced packaged CPO optical module provided by the present invention and an optical chip assembly.

[0032] Figure 7b A top view of the optical chip assembly provided by the utility model connected to an external laser and an external detector.

[0033] Figure 7cThis is a schematic diagram of applying UV glue to the back of the optical chip component provided by the utility model.

[0034] Figure 7d This is a schematic diagram of the utility model for sucking the second lens assembly by a suction nozzle and placing it at a corresponding position of the optical chip assembly.

[0035] Figure 7e This is a schematic diagram of the second lens assembly and the optical chip assembly provided by the utility model after being co-sealed.

[0036] Figure 8 This is a flow chart of the method for assembling the second lens assembly provided by the utility model.

[0037] Fig. 9 This is a flow chart of the method for assembling the first lens assembly provided by the utility model.

[0038] Fig.10a A top view of the heat-conducting component and the isolation component provided by the utility model installed on the heat-conducting component.

[0039] Fig.10b for Fig.10a The corresponding cross-sectional view.

[0040] Fig.10c It is a schematic diagram of sucking up the first lens assembly through the suction nozzle and placing the first lens assembly.

[0041] Fig.10d This is a schematic diagram of the first lens assembly after assembly.

[0042] Fig.11 A flow chart of assembling an optical fiber array assembly provided by the utility model. DETAILED DESCRIPTION

[0043] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0045] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the utility model described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0046] In the prior art, the CPO module with advanced packaging form has problems such as light loss in light source coupling due to the introduction of multiple layers of materials between the PCB when the PIC is flipped. At the same time, since the PIC is placed with its back facing up, it is impossible to realize the solution of packaging the LD and PIC on the same substrate.

[0047] Based on this, the embodiment of the utility model provides a light source system adapted to the advanced package CPO optical module, such as Figures 3 to 5 As shown, including:

[0048] Base plate assembly 100;

[0049] The light source assembly 200 is disposed on the substrate assembly 100 and is electrically connected to the substrate assembly 100 and is capable of emitting a laser beam;

[0050] A first lens assembly 300 is disposed on the substrate assembly 100. The first lens assembly 300 is disposed opposite to the optical port of the light source assembly 200 and is located on the outgoing optical path of the laser beam, and can convert the laser beam into collimated light;

[0051] The electric chip assembly 400 is disposed on the substrate assembly 100 and bonded to the substrate assembly 100, and can at least process the electrical signal after photoelectric conversion and output it to the substrate assembly;

[0052] The optical chip assembly 500 is flip-chip mounted on the surface of the electric chip assembly 400 away from the substrate assembly 100, and is bonded to the electric chip assembly 400. The optical I / O port of the optical chip assembly 500 is aligned with the optical port of the light source assembly 200, and is located on the outgoing optical path of the laser beam, and can at least perform spectroscopic processing and photoelectric conversion processing on the received optical signal, wherein the received optical signal includes the converged light incident through the optical I / O port and the optical signal transmitted through the optical fiber array assembly;

[0053] The second lens assembly 600 is fixedly connected to the optical chip assembly 500 and is located on the outgoing optical path of the laser beam. The lens structure of the second lens assembly 600 is arranged opposite to the optical I / O port of the optical chip assembly 500, and can converge the collimated light to form converged light that can enter the optical chip assembly 500 through the optical I / O port of the optical chip assembly 500.

[0054] The optical fiber array assembly 700 is arranged on the substrate assembly 100, and is coupled to the optical I / O port of the optical chip assembly 500 at least through the second lens assembly 600, and can output the optical signal after the optical chip assembly 500 has been split and processed, and can provide a transmission path for the optical signal.

[0055] In an embodiment of the utility model, the first lens assembly 300 and the light source assembly 200 are both arranged on the substrate assembly 100, and the second lens assembly 600 is connected to the optical chip assembly 500, and the optical chip assembly 500 is connected to the electric chip assembly 400 through a bump, the electric chip assembly 400 is arranged on the substrate assembly 100, and the first lens assembly 300 and the second lens assembly 600 are both on the output light path of the light source assembly 200. Since the first lens assembly 300 and the light source assembly 200 are arranged on a common substrate, the optical chip assembly 500 is fixedly connected to the second lens assembly 600, and the position of the lens structure of the second lens assembly 600 is arranged relative to the optical I / O of the optical chip assembly 500, the collimated light can be converged and then enter the optical chip assembly 500 through the optical I / O of the optical chip assembly 500. Therefore, even when the substrate assembly 100 is deformed due to temperature, the relative position between the focus of the lens structure of the second lens assembly 600 and the optical I / O port of the optical chip assembly 500 can be kept relatively fixed, and the collimated light portion emitted by the first lens assembly 300 can also be kept relatively fixed, that is, the emission and reception of the light source are kept stable, so that the large tolerance stable assembly of the CPO optical module can be effectively realized, and the occurrence of light loss problem caused by the inability of PIC and LD to realize a common substrate in the prior art is solved.

[0056] Therefore, the light source system adapted to the advanced packaged CPO optical module provided by the utility model has a first lens assembly fixedly connected to the light source assembly and then arranged on the substrate assembly, the second lens assembly is connected to the optical chip assembly and the lens structure of the second lens assembly and the optical I / O port of the optical chip assembly can maintain a relatively fixed position. Therefore, after the collimated light emitted by the first lens assembly reaches the lens structure of the second lens assembly, the lens structure of the second lens assembly can convert the collimated light into converged light and then couple it into the optical I / O port of the optical chip assembly to enter the optical chip assembly. Even if the substrate assembly is deformed due to heat, it will not affect the light coupling into the optical chip assembly. Therefore, the structural setting of the light source system adapted to the advanced packaged CPO optical module of the utility model can make the optical chip assembly have a larger coupling tolerance, which solves the problem of light loss caused by the inability of PIC and LD to realize a common substrate in the prior art.

[0057] It should be noted that the light source system adapted to the advanced packaged CPO optical module in the embodiment of the utility model can be adaptively adjusted according to the specific application scenario during specific application. For example, when the light source system is applicable to a laser radar module, the functions of the electric chip component and the optical chip component can be adapted to the functions of the laser radar module; when the light source system is applicable to a computing module, the functions of the electric chip component and the optical chip component can be adapted to the functions of the computing module. Therefore, the applicable scenario of the light source system in the embodiment of the utility model is not limited in the utility model, and it can be applied to a variety of scenarios, and it only needs to make adaptive adjustments to the functions of the electric chip component and the optical chip component as needed.

[0058] As a specific implementation of the second lens assembly 600, Figure 3 and Figure 4 As shown, the second lens assembly 600 includes a connecting portion 610 and a lens structure portion 620, wherein the lens structure portion 620 is fixedly connected to the connecting portion 610.

[0059] The connecting portion 610 is fixedly connected to the surface of the optical chip assembly 500 that is away from the electrical chip assembly 400.

[0060] The lens structure portion 620 and the connecting portion 610 are arranged at a preset angle, and the focus of the lens structure portion 620 is located at the optical I / O port of the optical chip assembly 500 .

[0061] It should be noted that the preset angle between the lens structure 620 and the connecting portion 610 can be set as required, for example, between 70° and 110°. Preferably, the lens structure 620 can be perpendicular to the connecting portion 610.

[0062] It should be understood that in the embodiment of the utility model, the lens structure part 620 is fixedly connected to the optical chip assembly 500 by setting the connecting part 610, and the focus of the lens structure part 620 is located at the optical I / O port of the optical chip assembly 500, that is, the second lens assembly 600 and the optical chip assembly 500 are co-sealed, so that the convergent focus position of the second lens assembly 600 is fixed, as long as the incident light of the lens structure part 620 is collimated light, the outgoing light of the lens structure part 620 can be guaranteed to converge into the optical I / O port of the optical chip assembly 500, so that the optical chip assembly has a larger coupling tolerance.

[0063] It should be noted that, in the embodiment of the present invention, the material of the second lens assembly 600 can specifically be a resin material. Since the resin material is light in weight, it will not introduce excessive stress when it is co-sealed with the optical chip assembly.

[0064] In the embodiment of the utility model, in order to improve the heat dissipation effect, a heat conducting assembly 800 is disposed on the substrate assembly 100 , and the first lens assembly 300 and the light source assembly 200 are both connected to the substrate assembly 100 via the heat conducting assembly 800 .

[0065] It should be understood that in the embodiment of the utility model, in order to achieve the relative position fixation of the first lens assembly 300 and the light source assembly 200, the first lens assembly 300 and the light source assembly 200 are both fixed on the substrate assembly 100 through the heat conductive assembly 800, which can not only improve the heat dissipation performance of the CPO optical module, but also ensure that the laser beam emitted by the light source assembly 200 becomes a stable collimated light.

[0066] In a preferred embodiment of the present invention, the material of the heat conducting component 800 may specifically include tungsten copper.

[0067] In the embodiment of the utility model, in order to improve the efficiency of the light source and reduce the reflection of light, the CPO optical module in the embodiment of the utility model also includes an isolation component 900, and the isolation component 900 is located between the lens structure of the second lens component 600 and the first lens component 300, and the isolation component 900 is connected to the substrate component 100 through the thermal conductive component 800.

[0068] It should be understood that in the embodiment of the utility model, an isolation component 900 is arranged on the light-emitting side of the first lens component 300, and the isolation component 900 can effectively prevent the second lens component 600 from reflecting light, that is, it can incident the collimated light to the second lens component 600 with maximum efficiency, so that the light beam can only be transmitted along the direction of the output light path, thereby improving the transmission efficiency of the light source.

[0069] In addition, in the embodiment of the present invention, the isolation assembly 900 is specifically installed on the substrate assembly 100 through the heat conduction assembly 800 .

[0070] In a preferred embodiment of the present invention, the isolation component 900 may specifically be an optical isolator.

[0071] In a preferred embodiment of the present invention, the lens structures of the first lens assembly 300 and the second lens assembly 600 can be plano-convex lenses.

[0072] In order to realize the installation of the light source assembly 200, as Figure 4 As shown, the light source system adapted to the advanced packaged CPO optical module in the embodiment of the utility model also includes: a package body 210, the light source assembly 200 is arranged on the package body 210, and the package body 210 is connected to the substrate assembly 100 through the heat conductive assembly 800.

[0073] It should be understood that after the light source assembly 200 is connected to the packaging body 210 , it is mounted on the substrate assembly 100 via the heat conduction assembly 800 .

[0074] In the embodiment of the present invention, the package body 210 may specifically be an ALN ​​package body.

[0075] The light source assembly 200 in the embodiment of the present invention may specifically include an LD light source.

[0076] In the embodiment of the present utility model, in order to realize the passive installation of the optical fiber array assembly 700, as shown in FIG. Figure 5 As shown, it also includes: a plastic packaging frame 710, and the optical fiber array assembly 700 is connected to the substrate assembly 100 through the plastic packaging frame 710.

[0077] It should be understood that, since the optical chip assembly 500 in the embodiment of the utility model has a large coupling tolerance, the installation requirements of the optical fiber array assembly 700 are reduced, so the installation of the optical fiber array assembly 700 can be achieved by means of passive patching, and the reception of the optical signal of the optical chip assembly will not be affected. That is, after the plastic packaging frame 710 is installed on the substrate assembly 100, the optical fiber array assembly 700 can be inserted into the plastic packaging frame 710; thereby improving the patching efficiency of the optical fiber array assembly 700.

[0078] It should be noted that, in the embodiments of the present utility model, Figure 3 and Figure 5As shown, the optical fiber array assembly 700 is coupled to the optical I / O port of the optical chip assembly 500 through the third lens assembly 720 and the second lens assembly 600. The optical signal after the optical chip assembly 500 is split and processed can be output through the optical I / O port and then transmitted to the optical fiber array assembly through the second lens assembly 600 and the third lens assembly 720 in sequence; in addition, the optical fiber array assembly 700 can also receive external optical signals, that is, the received optical signals can be coupled into the optical chip assembly 500 through the optical I / O port again after passing through the third lens assembly 720 and the second lens assembly 600 in sequence. Therefore, the optical fiber array assembly in the embodiment of the utility model can not only receive the optical signal after the optical chip assembly is split and processed, but also couple the external optical signal into the optical chip assembly. It should be understood that the optical signal coupled into the optical chip assembly through the optical fiber array assembly can enter the electrical chip assembly after the photoelectric conversion processing of the optical chip assembly, and then be transmitted to the substrate assembly after being processed by the electrical chip assembly.

[0079] In the embodiment of the present utility model, the substrate assembly 100 may specifically be a PCB board.

[0080] In addition, in the embodiment of the utility model, since the coupling tolerance of the optical chip assembly is improved, when the substrate assembly 100 is heated and produces a large deformation amount, even if a relatively large displacement deviation occurs between the optical chip assembly and the substrate assembly, since the light source assembly and the first lens assembly are both fixed on the substrate assembly, it is possible to ensure that the outgoing light of the first lens assembly is stably emitted, and the second lens assembly is fixedly connected to the optical chip assembly, and the second lens assembly can convert the collimated light into convergent light and incident on the optical chip assembly, that is, it will still not affect the light reception of the optical chip assembly, that is, the light reception will not be affected under heat conditions, thereby effectively improving the thermal performance of the CPO optical module.

[0081] In an embodiment of the utility model, after the light source assembly 200 emits a laser beam, it becomes a collimated beam after passing through the first lens assembly 300. After passing through the isolation assembly 900, the collimated beam can be transmitted to the second lens assembly 600. The second lens assembly 600 can converge the collimated beam to the optical I / O port of the optical chip assembly 500. After the converged light enters the optical chip assembly 500 through the optical I / O port, the optical chip assembly 500 can perform photoelectric conversion and branching on the light. The electrical signal after the photoelectric conversion enters the electrical chip assembly 400, and then enters the substrate assembly 100 for transmission after being processed by the electrical chip assembly 400. The optical signal after branching by the optical chip assembly 500 is transmitted to the optical fiber array assembly 700 through optical coupling. Finally, the light array assembly 700 outputs the optical signal processed by the optical chip assembly 500.

[0082] Therefore, the light source system adapted to the advanced packaged CPO optical module provided by the embodiment of the utility model, since the first lens assembly and the light source assembly are both arranged on the substrate assembly, the second lens assembly is connected to the optical chip assembly and the lens structure of the second lens assembly and the optical I / O port of the optical chip assembly can maintain a relatively fixed position, so after the collimated light emitted by the first lens assembly reaches the lens structure of the second lens assembly, the lens structure of the second lens assembly can convert the collimated light into converged light and then couple it into the optical I / O port of the optical chip assembly to enter the optical chip assembly, even if the substrate assembly is deformed due to heat, it will not affect the light coupling into the optical chip assembly, so the structural setting of the light source system adapted to the advanced packaged CPO optical module of the utility model can make the optical chip assembly have a larger coupling tolerance, solving the problem of light loss caused by the inability of the optical chip assembly PIC and the light source LD to realize the common substrate in the prior art. In addition, it is precisely based on the larger coupling tolerance of the optical chip assembly that the optical fiber array assembly of the embodiment of the utility model can realize passive coupling with the optical chip assembly, and is installed on the substrate assembly in the form of a passive patch, which improves the patch efficiency. It is also based on the optical chip component that the coupling tolerance is improved. When the substrate component is heated and produces a large deformation, even if a relatively large displacement deviation occurs between the optical chip component and the substrate component, it will not affect the light reception of the optical chip component, that is, the light reception will not be affected under heat conditions, thus effectively improving the thermal performance of the CPO optical module.

[0083] As another embodiment of the present invention, a method for assembling a light source system adapted to an advanced packaged CPO optical module is provided, wherein: Figure 6 As shown, including:

[0084] S100, providing a substrate assembly;

[0085] In the embodiment of the present utility model, the substrate assembly 100 may specifically be a PCB board.

[0086] S200, assembling an electric chip assembly on the substrate assembly so that the electric chip assembly is bonded to the substrate assembly;

[0087] In the embodiment of the utility model, the electric chip assembly 400 is assembled on the substrate assembly 100, and the electric chip assembly 400 can be specifically a co-sealed chip assembly including a transimpedance amplifier and a driver, etc. The electric chip assembly 400 is assembled on the substrate assembly 100, and is connected to the electric connector on the substrate assembly 100 through the electrical connector on the electric chip assembly 400 to achieve bonding.

[0088] Specifically, a bump may be provided on the substrate assembly to achieve electrical connection with the UBM Pad on the back side of the electrical chip assembly 400 .

[0089] S300, flipping the optical chip assembly 500 on the surface of the electric chip assembly 400 away from the substrate assembly 100, so that the optical chip assembly 500 is bonded to the electric chip assembly 400;

[0090] In the embodiment of the utility model, the optical chip assembly 500 is mounted on the surface of the electric chip assembly 400 away from the substrate assembly 100 through a flip-chip process, and the optical chip assembly 500 is bonded to the electric chip assembly 400 through respective electrical connectors. Specifically, the electrical connection can be achieved through the bump disposed on the optical chip assembly 500 and the UBM Pad on the top surface of the electric chip assembly 400.

[0091] S400, assembling a second lens assembly on a surface of the optical chip assembly facing away from the electrical chip assembly, so that a lens structure portion of the second lens assembly is arranged opposite to an optical I / O port of the optical chip assembly;

[0092] In an embodiment of the utility model, the second lens assembly 600 includes a connecting portion 610 and a lens structure portion 620, the lens structure portion 620 is connected to the connecting portion 610, the connecting portion 610 is connected to the surface of the optical chip assembly 500 away from the electrical chip assembly 400, the lens structure portion 620 is perpendicular to the connecting portion 610, and the focus of the lens structure portion 620 is located at the optical I / O port of the optical chip assembly 500.

[0093] Specifically, a second lens assembly is mounted on the surface of the optical chip assembly facing away from the electrical chip assembly, such as Figure 8 As shown, including:

[0094] S410, clamping the collimating optical fiber array to align with the ring waveguide coupling of the optical chip assembly at least through the second lens assembly;

[0095] like Figure 7a and Figure 7b As shown, the collimating fiber array 20 is first clamped with a fixture 10 for coupling and alignment with the loop waveguide 510 (Loop waveguide) of the optical chip assembly 500. During the coupling process, the two optical fibers corresponding to the collimating fiber array and the loop waveguide 510 are respectively connected to the external laser 30 and the external detector 40.

[0096] S420, adjusting the relative position of the optical port of the collimating fiber array and the optical I / O port of the optical chip assembly according to the optical power of the optical signal received by the target optical fiber in the collimating fiber array, and maintaining the relative position of the collimating fiber array and the optical chip assembly unchanged until the optical power of the optical signal received by the target optical fiber in the collimating fiber array reaches a first target value;

[0097] It should be understood here that the target optical fiber in the collimating optical fiber array is the optical fiber corresponding to the ring waveguide in the optical chip assembly.

[0098] According to the optical power reading on the external detector, the relative position of the collimating fiber array optical port and the optical I / O port of the optical chip assembly is dynamically adjusted. When the value displayed by the external detector reaches the first target value, the position of the fixture is fixed to ensure that the relative position of the collimating fiber array and the optical chip assembly remains unchanged. It should be noted that the first target value here can be set according to demand. As an optional embodiment, the first target value can be the maximum value displayed by the external detector. Of course, other values ​​can also be set as needed, which is not limited here.

[0099] S430, placing a second lens assembly in a region between the optical chip assembly and the collimating optical fiber array, and adjusting the position of the second lens assembly according to the optical power of the optical signal received by the target optical fiber in the collimating optical fiber array;

[0100] Specifically, Figure 7c and Figure 7d As shown, UV glue 520 is applied to the back of the optical chip assembly 500, and the second lens assembly 600 is sucked up by the suction nozzle 50 and placed at the corresponding position between the optical chip assembly 500 and the collimating fiber array, and the position of the second lens assembly 600 is dynamically adjusted by observing the degree of the external detector.

[0101] S440. When the optical power of the optical signal received by the target optical fiber in the collimating optical fiber array reaches a second target value, the placement position of the second lens assembly is determined and the fixed connection between the second lens assembly and the optical chip assembly is completed.

[0102] like Figure 7e As shown, when the external detector reading reaches the second target value, the nozzle position is kept fixed, UV curing is completed, and the second lens assembly and the optical chip assembly are co-packaged. It should be noted that the second target value here can specifically be the maximum value displayed by the external detector, and of course other values ​​can be set as needed, which is not limited here.

[0103] S500, sequentially assembling a light source assembly and a first lens assembly on the substrate assembly so that the optical port of the light source assembly is aligned with the optical I / O port of the optical chip assembly, and the first lens assembly is arranged opposite to the optical port of the light source assembly, and can convert the laser beam emitted by the light source assembly into collimated light; wherein the second lens assembly can converge the collimated light to form converged light that can enter the optical chip assembly through the optical I / O port of the optical chip assembly;

[0104] In an embodiment of the utility model, a light source assembly 200 and a first lens assembly 300 are assembled on a substrate assembly, wherein the optical port of the light source assembly 200 is aligned with the optical I / O port of the optical chip assembly 500, and the first lens assembly 300 is arranged opposite to the optical port of the light source assembly 200.

[0105] Specifically, the light source assembly and the first lens assembly are sequentially assembled on the substrate assembly, such as Fig. 9 As shown, including:

[0106] S510, providing a heat conduction component, an isolation component, a light source component and a first lens component;

[0107] In the embodiment of the utility model, the material of the heat conducting component may specifically include tungsten copper.

[0108] S520, fixing the heat conducting component to the substrate component;

[0109] S530, sequentially fixing a light source assembly and an isolation assembly on the heat-conducting assembly, and wire-bonding the light source assembly and the substrate assembly to achieve electrical connection between the light source assembly and the substrate assembly, wherein an optical port of the light source assembly is aligned with an optical I / O port of the optical chip assembly;

[0110] In the embodiment of the present utility model, Figures 10a to 10c As shown, the heat conducting component 800, the light source component 200, the isolation component 900 and the first lens component 300 are fixedly connected to the substrate component 100 in sequence, and the method of pasting can be adopted, or other fixed connection methods can be selected as needed. Specifically, the light source component 200 is pasted to the heat conducting component 800 through the packaging body 210, and the optical port of the light source component 200 is aligned with the optical I / O port of the optical chip component 500 as much as possible, the bonding of the light source component 200 and the substrate component 100 is completed, and the light source component is powered.

[0111] S540, setting a first lens assembly between the isolation assembly and the light source assembly, and adjusting the position of the first lens assembly by monitoring the optical power of the optical signal of the convergent light incident from the optical chip assembly through the optical I / O port;

[0112] In the embodiment of the present utility model, Fig.10c As shown, glue is dispensed in the area corresponding to the first lens assembly 300 of the thermal conductive assembly 800, and the first lens assembly 300 is sucked by a suction nozzle, and the position of the first lens assembly 300 is dynamically adjusted by monitoring the detector reading inside the optical chip assembly 500.

[0113] S550: When the optical power of the optical signal of the convergent light incident on the optical chip assembly through the optical I / O port reaches a third target value, determine the position of the first lens assembly and complete the fixing of the first lens assembly.

[0114] like Fig.10d As shown, when the detector reading inside the optical chip assembly reaches the third target value, UV curing completes the fixation of the first lens assembly. It should be noted that the third target value here can specifically be the maximum value displayed by the detector inside the optical chip assembly. Of course, other values ​​can also be set as needed, which is not limited here.

[0115] S600, assembling an optical fiber array assembly on the substrate assembly so that the optical fiber array assembly is coupled to the optical I / O port of the optical chip assembly at least through the second lens assembly, and the optical fiber array assembly can output the optical signal after the optical chip assembly has been split and processed, and can provide a transmission path for the optical signal.

[0116] In the embodiment of the utility model, after the first lens assembly is assembled, the optical fiber array assembly is assembled on the substrate assembly, and the optical fiber array assembly is coupled and connected with the optical chip assembly.

[0117] Specifically, the optical fiber array assembly is assembled on the substrate assembly, such as Fig.11 As shown, including:

[0118] S610, fixing and connecting a plastic sealing frame on the substrate assembly;

[0119] It should be understood that the plastic frame is fixedly connected to the substrate assembly, and then the substrate assembly and the plastic frame are fixedly connected together. It should be noted here that the specific fixed connection method can be selected according to actual needs, for example, it can be an adhesive connection.

[0120] S620, inserting a collimated optical fiber array into the plastic packaging frame to form an optical fiber array assembly.

[0121] like Figure 5 As shown, the collimated optical fiber array is inserted into the plastic frame 710 to form the optical fiber array assembly 700, and the optical array assembly is coupled and connected with the optical chip assembly.

[0122] In the embodiment of the present utility model, Figure 5As shown, the optical fiber array assembly 700 is coupled to the optical I / O port of the optical chip assembly 500 through the third lens assembly 720 and the second lens assembly 600. The optical signal after the optical chip assembly 500 is split and processed can be output through the optical I / O port and then transmitted to the optical fiber array assembly through the second lens assembly 600 and the third lens assembly 720 in sequence; in addition, the optical fiber array assembly 700 can also receive external optical signals, that is, the received optical signals can be coupled into the optical chip assembly 500 through the optical I / O port again after passing through the third lens assembly 720 and the second lens assembly 600 in sequence. Therefore, the optical fiber array assembly in the embodiment of the utility model can not only receive the optical signal after the optical chip assembly is split and processed, but also couple the external optical signal into the optical chip assembly. It should be understood that the optical signal coupled into the optical chip assembly through the optical fiber array assembly can enter the electrical chip assembly after the photoelectric conversion processing of the optical chip assembly, and then be transmitted to the substrate assembly after being processed by the electrical chip assembly.

[0123] In summary, the assembly method of the light source system adapted to the advanced packaged CPO optical module provided by the utility model is to set the light source assembly and the first lens assembly on the substrate assembly, and seal the second lens assembly with the optical chip assembly, and the lens structure of the second lens assembly and the optical I / O port of the optical chip assembly can keep the position relatively fixed, so that after the collimated light emitted by the first lens assembly reaches the lens structure of the second lens assembly, the lens structure of the second lens assembly can convert the collimated light into converged light and then couple it into the optical I / O port of the optical chip assembly to enter the optical chip assembly, even if the substrate assembly is deformed due to heat, it will not affect the light coupling into the optical chip assembly, so the assembly method of the light source system adapted to the advanced packaged CPO optical module of the utility model can make the optical chip assembly have a larger coupling tolerance, which solves the problem of light loss caused by the inability of PIC and LD to realize the common substrate in the prior art. In addition, it is precisely based on the larger coupling tolerance of the optical chip assembly that the optical fiber array assembly of the embodiment of the utility model can achieve passive coupling with the optical chip assembly, and is installed on the substrate assembly in the form of a passive patch, which improves the patch efficiency. It is also based on the optical chip component that the coupling tolerance is improved. When the substrate component is heated and produces a large deformation, even if a relatively large displacement deviation occurs between the optical chip component and the substrate component, it will not affect the light reception of the optical chip component, that is, the light reception will not be affected under heat conditions, thus effectively improving the thermal performance of the CPO optical module.

[0124] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A light source system adapted to an advanced package CPO optical module, characterized in that: include: Baseboard assembly; A light source assembly, disposed on the substrate assembly and electrically connected to the substrate assembly, capable of emitting a laser beam; A first lens assembly is arranged on the substrate assembly, the first lens assembly is arranged opposite to the light port of the light source assembly and is located on the outgoing light path of the laser beam, and can convert the laser beam into collimated light; An electric chip assembly, arranged on the substrate assembly and bonded to the substrate assembly, capable of processing at least the electrical signal after photoelectric conversion and outputting it to the substrate assembly; an optical chip assembly, which is flip-chip mounted on a surface of the electric chip assembly away from the substrate assembly and bonded to the electric chip assembly, wherein an optical I / O port of the optical chip assembly is aligned with an optical port of the light source assembly and is located on an outgoing optical path of the laser beam, and is capable of at least performing a splitting process and a photoelectric conversion process on a received optical signal, wherein the received optical signal includes a converged light incident through the optical I / O port and an optical signal transmitted through the optical fiber array assembly; A second lens assembly is fixedly connected to the optical chip assembly and is located on the outgoing optical path of the laser beam, and a lens structure portion of the second lens assembly is arranged opposite to the optical I / O port of the optical chip assembly, and can converge the collimated light to form converged light that can enter the optical chip assembly through the optical I / O port of the optical chip assembly; The optical fiber array assembly is arranged on the substrate assembly and is coupled to the optical I / O port of the optical chip assembly at least through the second lens assembly, and can output the optical signal after the optical chip assembly has been split and processed, and can provide a transmission path for the optical signal.

2. The light source system adapted to the advanced package CPO optical module according to claim 1, characterized in that: The second lens assembly includes a connecting portion and a lens structure portion, wherein the lens structure portion is fixedly connected to the connecting portion. The connecting portion is fixedly connected to a surface of the optical chip assembly facing away from the electrical chip assembly, The lens structure portion and the connecting portion are arranged at a preset angle, and the focus of the lens structure portion is located at the optical I / O port of the optical chip assembly.

3. The light source system adapted to the advanced package CPO optical module according to claim 1, characterized in that: An isolation component is disposed on the substrate component, and the isolation component is located between the lens structure portion of the second lens component and the first lens component.

4. The light source system adapted to the advanced package CPO optical module according to claim 3, characterized in that: A heat-conducting component is disposed on the substrate component, and the light source component, the first lens component and the isolation component are all connected to the substrate component via the heat-conducting component.

5. The light source system adapted to the advanced package CPO optical module according to claim 4, characterized in that: Also includes: A packaging body, the light source assembly is arranged on the packaging body, and the packaging body is connected to the substrate assembly through the heat conduction assembly.

6. The light source system adapted to the advanced package CPO optical module according to claim 1, characterized in that: Also includes: A plastic packaging frame, through which the optical fiber array assembly is connected to the substrate assembly.

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