High-reliability high-frequency attenuator

By designing the connection structure of transition pins and corrugated U-shaped clips in high-frequency coaxial attenuators, the problem of insufficient reliability and high-frequency electrical performance of existing high-frequency coaxial attenuators is solved, and higher reliability and electrical performance indicators are achieved.

CN222637633UActive Publication Date: 2025-03-18SHENZHEN YULONGTONG ELECTRON
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Patent Information

Application Number
CN202421303644.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-07
Publication Date
2025-03-18
Estimated Expiration
2034-06-07

AI Technical Summary

Technical Problem

The existing high-frequency coaxial attenuators have shortcomings in terms of reliability and high-frequency electrical performance indicators, resulting in inconvenient use and a narrow range of application.

Method used

A high-reliability and high-frequency attenuator is designed. By welding the transition pins at both ends of the chip and elastically connected to the pins and jacks through the transition pins, it avoids the transmission of axial and radial forces to the chip. A corrugated U-shaped clip made of beryllium bronze is used to enhance the connection strength and heat dissipation effect.

Benefits of technology

It significantly improves the reliability of the attenuator and the electrical performance indicators at high frequencies, providing better high-frequency electrical performance and higher reliability than conventional attenuators.

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Abstract

The utility model relates to the technical field of attenuators, in particular to a high-reliability high-frequency attenuator which comprises a shell, a cavity is arranged in the middle of the shell, a chip, a pin and a jack are arranged in the shell, an inner conductor is arranged in the middle of the cavity, the chip is arranged in the inner conductor, and the inner conductor is fixedly connected with the chip through a connecting mechanism. Pressing sleeves are arranged at the positions, located on the two sides of the inner conductor, in the cavity, placing grooves are formed in the sides, away from the chip, of the two pressing sleeves, media are arranged in the placing grooves in a sliding mode, the contact pin and the jack are arranged in the middles of the two media respectively, and the two ends of the chip are fixedly connected with the contact pin and the jack respectively through transition contact pins. According to the utility model, the reliability of the attenuator and the electrical performance index under high frequency can be obviously improved, and the attenuator has better electrical performance index and higher reliability under high frequency compared with a conventional attenuator.
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