The invention provides a method for achieving electronic building
brick high-temperature packaging by filling Sn-based solder with micro-nano metallic particles. The method comprises the steps that the micro-nano metallic particles are prepared and mixed with a dispersing agent, a
caking agent,
diluent and scaling
powder; a micro-nano
metallic particle mixture is evenly mixed with pure Sn or Sn-based
soldering paste; the Sn-based
soldering paste is filled with the micro-nano metallic particles and placed on a base plate, alignment process of a part to be welded is completed, and pressure is exerted on the Sn-based
soldering paste; the Sn-based soldering paste is put back in a
reflow oven and experiences a preheating stage, an insulation stage, a reflowing stage and a cooling stage. According to the method for achieving electronic building
brick high-temperature packaging by filling the Sn-based solder with the micro-nano metallic particles, the Sn-based solder is filled with the micro-nano metallic particles, connection and
assembly of high-power devices or components can be achieved under the process condition of being compatible with traditional
reflow soldering, when the devices serve at high temperature, metallic particles are formed inside a connector, excellent
conductivity property and heat-conducting property are achieved, and the heat dissipation index and the
electrical performance index of the electronic building
brick can be significantly improved.