Anode fixing device for wafer electroplating bath

By designing an anode fixing device for wafer electroplating, the problem of poor contact caused by anode consumption is solved, the utilization rate of the anode and the plating efficiency are improved, and the consumption of the non-plating area is reduced.

CN222666073UActive Publication Date: 2025-03-25SUZHOU YINGTAKIZAWA SEMICON EQUIP CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202420963687.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-07
Publication Date
2025-03-25
Estimated Expiration
2034-05-07

AI Technical Summary

Technical Problem

In vertical electroplating devices, the consumption of the anode causes its size to be reduced, the contact between the wire and the anode is poor, which cannot meet production needs, and the anode utilization rate is low.

Method used

An anode fixing device for wafer electroplating tanks is designed, including a support plate, a titanium plate, a titanium rod and a pressure ring plate. The tight contact and current distribution of the anode are improved through the sealing ring and the shrapnel, and the titanium plate and the titanium rod are fixed to the support plate through the pressure ring plate to reduce the consumption of the non-electroplating area.

Benefits of technology

The contact between the titanium plate and the anode is improved, the service life of the titanium rod is extended, the utilization rate of the titanium plate is increased, and the consumption of the anode in the non-electroplating area is reduced.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses an anode fixing device for a wafer electroplating bath, which comprises a support plate, and a titanium plate, a titanium rod and a compression ring plate which are arranged on one side of the support plate, the compression ring plate is connected with the support plate, one end of the titanium rod extends out of the top of the support plate, the other end of the titanium rod is connected with the titanium plate, and the titanium plate is connected with the titanium rod. The titanium plate is arranged between the supporting plate and the pressing ring plate, a sealing ring is arranged between the pressing ring plate and the supporting plate, and the titanium plate is provided with a circle of elastic pieces. The device is simple in structure and convenient to use, the anode can be elastically pressed, and the contact between the titanium plate and the anode is improved through elastic connection between the arranged anode and the titanium plate and pressing of the titanium plate on the supporting plate through the pressing ring plate, so that the utilization rate of the titanium plate is increased. And the contact between the anode and electroplating liquid is reduced by utilizing the sealing performance of the pressing ring and the sealing ring, so that the consumption of the anode in a non-electroplating area is reduced.
Need to check novelty before this filing date? Find Prior Art