Optical fingerprint module with common-substrate double-camera structure

Abstract

The embodiment of the utility model belongs to the technical field of optical fingerprint modules. The utility model also relates to an optical fingerprint module with a common-substrate double-camera structure, which comprises an FPC assembly, two optical fingerprint assemblies are arranged on the FPC assembly, each optical fingerprint assembly comprises an identification chip and a lens base which are arranged on the FPC assembly, and the identification chip is located in the lens base. The two optical fingerprint assemblies are arranged on the FPC assembly to form a common-substrate double-camera fingerprint recognition function, so that the diversity and applicability of fingerprint recognition are improved, the defects of a traditional optical fingerprint recognition technology in a specific scene can be overcome, and particularly, the fingerprint recognition efficiency is greatly improved in a large-size touch screen mobile phone or a user with a short finger. Through the arrangement of the two optical fingerprint assemblies, the comfort and convenience of user operation are greatly improved, the mobile phone fingerprint identification device can adapt to mobile phone screens of different sizes and shapes, and more flexible and diversified fingerprint identification experience is provided for users.

Description

Technical Field

[0001] The utility model relates to the technical field of optical fingerprint modules, and more specifically, to an optical fingerprint module with a common substrate and dual-camera structure. Background Art

[0002] With the advancement of technology and the popularization of smart phones, fingerprint recognition technology has become an indispensable part of smart phones, providing users with a fast and convenient way to authenticate their identities. At present, fingerprint recognition technology is mainly divided into three types: capacitive fingerprint recognition, optical fingerprint recognition and ultrasonic fingerprint recognition. Each technology has its unique advantages and applicable scenarios, but there are also some shortcomings.

[0003] In particular, optical fingerprint recognition technology has been widely used in the field of mobile phones due to its low cost and relatively simple structure. However, traditional optical fingerprint recognition systems usually only set up a fingerprint recognition module at a specified position on the touch screen of the mobile phone. This may cause inconvenience in one-handed operation for large-size touch screen phones or users with shorter fingers. Users need to accurately place their fingers in the designated recognition area, which to some extent reduces the comfort and convenience of use. Therefore, we have made improvements on this and proposed an optical fingerprint module with a common substrate dual-camera structure.

[0004] For example, a Chinese patent (publication number CN213276688U) discloses an under-screen optical fingerprint module structure, including a lens assembly, a fingerprint recognition chip and an FPC board. The lens assembly includes a lens base, a lens group and an IR filter; a circular lens barrel with an upward opening is provided on the upper part of the lens base, the lens group is embedded in the circular lens barrel, the lens base is provided with a light hole and a lens stop facing the circular lens barrel, the IR filter and the fingerprint recognition chip are hoisted below the lens base, the IR filter is located between the lens group and the fingerprint recognition chip, the fingerprint recognition chip is connected to the circuit of the FPC board through a gold wire, and the lens base is provided with side walls fixedly connected to the FPC around the periphery, and the side walls are fixed to the FPC board by glue connection. The side walls play the role of supporting and protecting the fingerprint recognition chip and the components on the FPC board. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present utility model is that the traditional optical fingerprint recognition system usually only sets a fingerprint recognition module at a specified position of the mobile phone touch screen, which may cause inconvenience in one-handed operation for large-size touch screen mobile phones or users with shorter fingers.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] An optical fingerprint module with a common substrate dual-camera structure includes: an FPC component, on which two optical fingerprint components are arranged, and the optical fingerprint component includes an identification chip arranged on the FPC component and a lens base, and the identification chip is located in the lens base.

[0008] As an improved manner of the present invention, a mounting hole is provided on the lens base, and a lens assembly is installed in the mounting hole.

[0009] As an improved manner of the utility model, the FPC assembly includes an FPC body fixedly connected to the lens base, and the identification chip is connected to the FPC body.

[0010] As an improved manner of the present invention, a second reinforcing plate is provided at the bottom of the FPC body, and the position of the second reinforcing plate corresponds to the position of the lens base.

[0011] As an improved manner of the utility model, two FPC connectors are welded on the top of the FPC body, and the two FPC connectors are respectively connected to the identification chips in the two optical fingerprint components through the FPC body.

[0012] As an improved manner of the present invention, a first reinforcing plate is further fixedly connected to the bottom of the FPC body, and the position of the first reinforcing plate corresponds to the positions of the two FPC connectors.

[0013] As an improved manner of the utility model, a heat dissipation mechanism is provided between the FPC body and the two identification chips, and the heat dissipation mechanism is used for dissipating heat of the identification chips.

[0014] As an improved method of the utility model, the heat dissipation mechanism includes a heat-conducting frame wrapped around the outer peripheral sides of the two identification chips, a heat-conducting plate is fixedly connected between the two heat-conducting frames, the outer surface of the heat-conducting plate passes through the two lens bases, and the bottoms of the two lens bases are provided with a notch for the heat-conducting plate to pass through;

[0015] An installation opening is provided between the FPC body and the second reinforcing plate, and a semiconductor cooling plate located in the installation opening is fixedly connected to the bottom of the heat conducting plate.

[0016] As an improved manner of the utility model, the cold end of the semiconductor refrigeration plate is connected to the heat conducting plate, and the hot end of the semiconductor refrigeration plate is connected to a heat sink.

[0017] As an improved manner of the utility model, a rat tail tube is arranged on the side of the lens base, and the rat tail tube is used for vacuuming the inside of the lens base.

[0018] Compared with the prior art, the embodiments of the present invention mainly have the following beneficial effects:

[0019] In order to solve the problem that the optical fingerprint recognition system in the prior art usually only sets one fingerprint recognition module at a designated position of the mobile phone touch screen, which may cause inconvenience in one-handed operation in large-size touch screen mobile phones or users with shorter fingers, the present application sets two optical fingerprint components on the FPC component to form a common substrate dual-camera fingerprint recognition function, thereby improving the diversity and applicability of fingerprint recognition. This solution can solve the shortcomings of traditional optical fingerprint recognition technology in specific scenarios, especially in large-size touch screen mobile phones or users with shorter fingers. By providing two optical fingerprint components, the setting greatly increases the comfort and convenience of user operation, can adapt to mobile phone screens of different sizes and shapes, and provide users with a more flexible and diverse fingerprint recognition experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an optical fingerprint module with a common substrate dual-camera structure provided in this application;

[0021] Figure 2 The optical fingerprint module with a common substrate dual-camera structure provided in this application Figure 1 Schematic diagram of the structure viewed from above;

[0022] Figure 3 A schematic diagram of the structure of an optical fingerprint module with a common substrate dual-camera structure provided in this application;

[0023] Figure 4 A schematic diagram of the structure of the heat dissipation mechanism of the optical fingerprint module with a dual-camera structure on a common substrate provided by the present application;

[0024] Figure 5 The optical fingerprint module with a common substrate dual-camera structure provided in this application Figure 3 Schematic diagram of the structure viewed from above.

[0025] Indicated in the figure:

[0026] 1. FPC assembly; 101. FPC body; 102. FPC connector; 103. First reinforcement plate; 104. Second reinforcement plate; 2. Optical fingerprint assembly; 201. Identification chip; 202. Lens assembly; 203. Lens base; 3. Heat dissipation mechanism; 301. Heat conduction frame; 302. Heat conduction plate; 303. Mounting port; 304. Semiconductor cooling sheet; 305. Heat sink; 306. Notch; 4. Rat tail tube. DETAILED DESCRIPTION

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Reference to "embodiments" herein means that specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] As described in the background technology, traditional optical fingerprint recognition systems usually only set up a fingerprint recognition module at a designated position on the mobile phone touch screen. This may cause inconvenience in one-handed operation in large-size touch screen phones or users with shorter fingers. Users need to place their fingers accurately in the designated recognition area, which to a certain extent reduces the comfort and convenience of use.

[0029] In order to solve this technical problem, the utility model provides an optical fingerprint module with a common substrate dual-camera structure.

[0030] Specifically, please refer to Figure 1-Figure 2 The optical fingerprint module with a common substrate dual-camera structure specifically includes:

[0031] The FPC component 1 has two optical fingerprint components 2 disposed thereon. The optical fingerprint component 2 includes an identification chip 201 disposed on the FPC component 1 and a lens base 203 . The identification chip 201 is located inside the lens base 203 .

[0032] The optical fingerprint module with a common substrate dual-camera structure provided by the utility model forms a common substrate dual-camera fingerprint recognition function by setting two optical fingerprint components 2 on an FPC component 1, thereby improving the diversity and applicability of fingerprint recognition. This solution can solve the shortcomings of traditional optical fingerprint recognition technology in specific scenarios, especially in large-size touch screen mobile phones or users with shorter fingers. By providing the setting of two optical fingerprint components 2, the comfort and convenience of user operation are greatly increased, and it can adapt to mobile phone screens of different sizes and shapes, providing users with a more flexible and diverse fingerprint recognition experience.

[0033] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] Embodiment 1 of the optical fingerprint module with a common substrate and dual-camera structure of the utility model

[0037] Please refer to Figure 1-Figure 2 The optical fingerprint module of the common substrate dual-camera structure of the utility model includes: an FPC component 1, two optical fingerprint components 2 are arranged on the FPC component 1, the optical fingerprint component 2 includes an identification chip 201 and a lens base 203 arranged on the FPC component 1, and the identification chip 201 is located in the lens base 203. The present application forms a common substrate dual-camera fingerprint recognition function by arranging two optical fingerprint components 2 on the FPC component 1, thereby improving the diversity and applicability of fingerprint recognition. This solution can solve the shortcomings of traditional optical fingerprint recognition technology in specific scenarios, especially in large-size touch screen mobile phones or users with shorter fingers. By providing two optical fingerprint components 2, the setting greatly increases the comfort and convenience of user operation, can adapt to mobile phone screens of different sizes and shapes, and provide users with a more flexible and diverse fingerprint recognition experience.

[0038] Further, such as Figure 1 As shown, a mounting hole is provided on the lens base 203, and the lens assembly 202 is installed in the mounting hole. The lens base 203 is used for installing the lens assembly 202 and protecting the identification chip 201. The mounting hole is provided to provide the required space for installing the lens assembly 202.

[0039] Further, such as Figure 1 and Figure 4 As shown, the FPC assembly 1 includes an FPC body 101 fixedly connected to the lens base 203, and the identification chip 201 is connected to the FPC body 101. The FPC body 101 is used to connect the identification chip 201 to the mobile phone to transmit the data collected by the identification chip 201 to the mobile phone.

[0040] Further, such as Figure 1 and Figure 2 As shown, a second reinforcing plate 104 is provided at the bottom of the FPC body 101, and the position of the second reinforcing plate 104 corresponds to the position of the lens base 203. The second reinforcing plate 104 can support and reinforce the corresponding position of the FPC body 101 and the lens base 203, so that the FPC body 101 can support the lens base 203.

[0041] Further, such as Figure 1 As shown, two FPC connectors 102 are welded on the top of the FPC body 101. The two FPC connectors 102 are respectively connected to the identification chips 201 in the two optical fingerprint components 2 through the FPC body 101. The setting of the FPC connector 102 can facilitate the connection between the FPC body 101 and the mobile phone.

[0042] Further, such as Figure 2 As shown, a first reinforcing plate 103 is also fixedly connected to the bottom of the FPC body 101. The position of the first reinforcing plate 103 corresponds to the position of the two FPC connectors 102. The first reinforcing plate 103 can support and reinforce the corresponding positions of the FPC body 101 and the FPC connectors 102, so that the FPC body 101 can support the FPC connector 102 and the FPC connector 102 can be plugged in and out.

[0043] Embodiment 2 of the optical fingerprint module with a common substrate and dual-camera structure of the utility model

[0044] Please refer to Figure 1-Figure 2 The optical fingerprint module of the common substrate dual-camera structure of the utility model includes: an FPC component 1, two optical fingerprint components 2 are arranged on the FPC component 1, the optical fingerprint component 2 includes an identification chip 201 and a lens base 203 arranged on the FPC component 1, and the identification chip 201 is located in the lens base 203. The present application forms a common substrate dual-camera fingerprint recognition function by arranging two optical fingerprint components 2 on the FPC component 1, thereby improving the diversity and applicability of fingerprint recognition. This solution can solve the shortcomings of traditional optical fingerprint recognition technology in specific scenarios, especially in large-size touch screen mobile phones or users with shorter fingers. By providing two optical fingerprint components 2, the setting greatly increases the comfort and convenience of user operation, can adapt to mobile phone screens of different sizes and shapes, and provide users with a more flexible and diverse fingerprint recognition experience.

[0045] Further, such as Figure 1 As shown, a mounting hole is provided on the lens base 203, and the lens assembly 202 is installed in the mounting hole. The lens base 203 is used for installing the lens assembly 202 and protecting the identification chip 201. The mounting hole is provided to provide the required space for installing the lens assembly 202.

[0046] Further, such as Figure 1 and Figure 4 As shown, the FPC assembly 1 includes an FPC body 101 fixedly connected to the lens base 203, and the identification chip 201 is connected to the FPC body 101. The FPC body 101 is used to connect the identification chip 201 to the mobile phone to transmit the data collected by the identification chip 201 to the mobile phone.

[0047] Further, such as Figure 1 and Figure 2 As shown, a second reinforcing plate 104 is provided at the bottom of the FPC body 101, and the position of the second reinforcing plate 104 corresponds to the position of the lens base 203. The second reinforcing plate 104 can support and reinforce the corresponding position of the FPC body 101 and the lens base 203, so that the FPC body 101 can support the lens base 203.

[0048] Further, such as Figure 1 As shown, two FPC connectors 102 are welded on the top of the FPC body 101. The two FPC connectors 102 are respectively connected to the identification chips 201 in the two optical fingerprint components 2 through the FPC body 101. The setting of the FPC connector 102 can facilitate the connection between the FPC body 101 and the mobile phone.

[0049] Further, such as Figure 2 As shown, a first reinforcing plate 103 is also fixedly connected to the bottom of the FPC body 101. The position of the first reinforcing plate 103 corresponds to the position of the two FPC connectors 102. The first reinforcing plate 103 can support and reinforce the corresponding positions of the FPC body 101 and the FPC connectors 102, so that the FPC body 101 can support the FPC connector 102 and the FPC connector 102 can be plugged in and out.

[0050] Further, such as Figure 3-Figure 5 As shown, a heat dissipation mechanism 3 is provided between the FPC body 101 and the two identification chips 201 . The heat dissipation mechanism 3 is used for dissipating heat of the identification chips 201 , thereby reducing the situation where heat accumulation affects the operation of the identification chips 201 .

[0051] Further, such as Figure 4-Figure 5 As shown, the heat dissipation mechanism 3 includes a heat-conducting frame 301 wrapped around the outer peripheral side of the two identification chips 201, a heat-conducting plate 302 is fixedly connected between the two heat-conducting frames 301, the outer surface of the heat-conducting plate 302 passes through the two lens bases 203, and the bottoms of the two lens bases 203 are both provided with notches 306 for the heat-conducting plates 302 to pass through, the heat-conducting frame 301 and the heat-conducting plates 302 are both made of insulating heat-conducting materials, and the insulating heat-conducting materials include but are not limited to alumina ceramics, which have good insulating heat-conducting properties. The lens base 203 and the FPC body 101 are fixedly connected by sealant, and the notch 306 and the heat-conducting plate 302 are also filled with sealant for sealing;

[0052] An installation opening 303 is provided between the FPC body 101 and the second reinforcement plate 104, and a semiconductor cooling plate 304 located in the installation opening 303 is fixedly connected to the bottom of the heat conducting plate 302. The semiconductor cooling plate 304 cools the heat generated by the identification chip 201 when it is working by absorbing the heat through the heat conducting frame 301 and the heat conducting plate 302 to achieve heat dissipation.

[0053] Further, such as Figure 5 As shown, the cold end of the semiconductor refrigeration plate 304 is connected to the heat conducting plate 302, and the hot end of the semiconductor refrigeration plate 304 is connected to the heat sink 305. The heat sink 305 is used to connect the hot end of the semiconductor refrigeration plate 304 to the housing of the mobile phone to dissipate heat to the external environment through the housing of the mobile phone.

[0054] Further, such as Figure 4-Figure 5 As shown, a rat tail tube 4 is disposed on the side of the lens base 203 , and the rat tail tube 4 is used for evacuating the inside of the lens base 203 , so that a vacuum dry environment can be formed between the lens base 203 and the FPC body 101 .

[0055] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. An optical fingerprint module with a common substrate dual-camera structure, characterized in that: include: An FPC component (1) is provided with two optical fingerprint components (2), the optical fingerprint components (2) comprising an identification chip (201) provided on the FPC component (1) and a lens base (203), the identification chip (201) being located inside the lens base (203).

2. The optical fingerprint module with a common substrate dual-camera structure according to claim 1, characterized in that: The lens base (203) is provided with a mounting hole, and the lens assembly (202) is mounted in the mounting hole.

3. The optical fingerprint module with a common substrate dual-camera structure according to claim 2, characterized in that: The FPC assembly (1) comprises an FPC body (101) fixedly connected to a lens base (203), and an identification chip (201) is connected to the FPC body (101).

4. The optical fingerprint module with a common substrate dual-camera structure according to claim 3, characterized in that: A second reinforcement plate (104) is provided at the bottom of the FPC body (101), and the position of the second reinforcement plate (104) corresponds to the position of the lens base (203).

5. The optical fingerprint module with a common substrate dual-camera structure according to claim 4, characterized in that: Two FPC connectors (102) are welded on the top of the FPC body (101), and the two FPC connectors (102) are respectively connected to the identification chips (201) in the two optical fingerprint components (2) through the FPC body (101).

6. The optical fingerprint module with a common substrate dual-camera structure according to claim 5, characterized in that: A first reinforcing plate (103) is also fixedly connected to the bottom of the FPC body (101), and the position of the first reinforcing plate (103) corresponds to the positions of the two FPC connectors (102).

7. The optical fingerprint module with a common substrate dual-camera structure according to claim 6, characterized in that: A heat dissipation mechanism (3) is provided between the FPC body (101) and the two identification chips (201), and the heat dissipation mechanism (3) is used for dissipating heat from the identification chips (201).

8. The optical fingerprint module with a common substrate dual-camera structure according to claim 7, characterized in that: The heat dissipation mechanism (3) comprises a heat-conducting frame (301) wrapped around the outer circumference of the two identification chips (201); a heat-conducting plate (302) is fixedly connected between the two heat-conducting frames (301); the outer surface of the heat-conducting plate (302) passes through the two lens bases (203); and the bottoms of the two lens bases (203) are each provided with a notch (306) for the heat-conducting plate (302) to pass through. An installation opening (303) is provided between the FPC body (101) and the second reinforcing plate (104), and a semiconductor cooling plate (304) located in the installation opening (303) is fixedly connected to the bottom of the heat conducting plate (302).

9. The optical fingerprint module with a common substrate dual-camera structure according to claim 8, characterized in that: The cold end of the semiconductor refrigeration sheet (304) is connected to the heat conduction plate (302), and the hot end of the semiconductor refrigeration sheet (304) is connected to a heat sink (305).

10. The optical fingerprint module with a common substrate dual-camera structure according to claim 9, characterized in that: A rat tail tube (4) is provided on the side of the lens base (203), and the rat tail tube (4) is used for evacuating the inside of the lens base (203).

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