Lamp bead and LED display unit

Abstract

The utility model relates to a lamp bead and an LED display screen, the lamp bead comprises a welding part, a substrate and more than two LED chips, the welding part is arranged on the substrate, and each LED chip is fixed on the substrate through the welding part. Among the LED chips, the LED chips of the same type are connected in series or in parallel. According to the LED display unit, the more than two LED chips of the same type are connected in series or in parallel and packaged in the lamp bead, so that the number of the LED chips in the single lamp bead is increased, the brightness of the lamp bead is further improved, the brightness of an LED display screen formed by the LED display unit can meet the brightness requirement of an outdoor scene, and the applicability is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a lamp bead and an LED display unit. Background Art

[0002] With the development of current science and technology, the application scope of LED display screens is becoming more and more extensive, providing convenience for people's lives. LED display screens usually include multiple lamp beads, each of which is equivalent to a pixel point of the LED display screen. Different colors are displayed through each lamp bead, which is combined into the picture displayed by the LED display screen. Among them, the lamp bead includes LED chips, which can convert electrical energy into light energy. A lamp bead includes LED chips of different colors. By switching the light of each LED chip, the function of the lamp bead displaying different colors is realized, thereby realizing the combination of the pictures of the LED display screen.

[0003] Usually, LED chips are set in lamp beads, and the encapsulated LED chips are used as pixels in LED display screens for display. However, the display brightness of a single lamp bead is limited by the brightness of the LED chip. In outdoor environments with high brightness requirements, the brightness of current LED display screens is difficult to meet the brightness requirements of outdoor scenes, and there is a problem of insufficient applicability. Utility Model Content

[0004] Based on this, it is necessary to provide a lamp bead and LED display unit that can improve applicability in response to the above technical problems.

[0005] In a first aspect, the present application provides a lamp bead, the lamp bead comprising a welding part, a substrate, and two or more LED chips, the welding part is arranged on the substrate, and each of the LED chips is fixed to the substrate through the welding part;

[0006] Among the LED chips, LED chips of the same type are connected in series or in parallel.

[0007] In one embodiment, the LED chip includes a first type of chip, a second type of chip and a third type of chip, and the first type of chip, the second type of chip and the third type of chip are fixed to the substrate through the welding member;

[0008] The first-type chips are connected in series, the second-type chips are connected in series, and the third-type chips are connected in series.

[0009] In one embodiment, the number of the first type of chips, the second type of chips and the third type of chips are the same.

[0010] In one embodiment, the number of the first type of chips, the number of the second type of chips, and the number of the third type of chips are different.

[0011] In one embodiment, a positive conductive terminal and a negative conductive terminal are provided on the substrate, and the input end of one of the first type of chips, the input end of one of the second type of chips, and the input end of one of the third type of chips are all connected to the same positive conductive terminal of the substrate; the output end of one of the first type of chips, the output end of one of the second type of chips, and the output end of one of the third type of chips are respectively connected to different negative conductive terminals of the substrate.

[0012] In one embodiment, a positive conductive terminal and a negative conductive terminal are provided on the substrate, and the output end of one of the first type of chips, the output end of one of the second type of chips, and the output end of one of the third type of chips are all connected to the same negative conductive terminal of the substrate; the input end of one of the first type of chips, the input end of one of the second type of chips, and the input end of one of the third type of chips are respectively connected to different positive conductive terminals of the substrate.

[0013] In one embodiment, the LED chip is a Mini LED chip or a Micro LED chip.

[0014] In one of the embodiments, at least one of the first type of chip, the second type of chip and the third type of chip is a Mini LED chip, and at least one is a Micro LED chip.

[0015] In one of the embodiments, the maximum size of the light-emitting surface of the Mini LED chip is 50 microns to 200 microns, and the maximum size of the light-emitting surface of the Micro LED chip is less than or equal to 50 microns.

[0016] In a second aspect, the present application also provides an LED display unit, which includes the lamp beads as described above.

[0017] The above-mentioned lamp bead and LED display unit include a welding part, a substrate, and more than two LED chips. The welding part is arranged on the substrate, and each LED chip is fixed to the substrate through the welding part. Among the LED chips, LED chips of the same type are connected in series or in parallel. By packaging more than two LED chips of the same type in series or in parallel in the lamp bead, the number of LED chips in a single lamp bead is increased, and then the brightness of the lamp bead is increased, so that the brightness of the LED display screen composed of the LED display unit can meet the brightness requirements of outdoor scenes, thereby improving applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a lamp bead frame in one embodiment;

[0019] Figure 2 A schematic diagram of a lamp bead frame in another embodiment;

[0020] Figure 3 This is a schematic diagram of the structure of a lamp bead in one embodiment;

[0021] Figure 4 It is a schematic diagram of the structure of a lamp bead in another embodiment;

[0022] Figure 5 The circuit diagram of a lamp bead in one embodiment is shown;

[0023] Figure 6 This is a schematic diagram of the structure of a lamp bead in another embodiment;

[0024] Figure 7 is a circuit diagram of a lamp bead in another embodiment;

[0025] Figure 8 A schematic diagram of the structure of a lamp bead in another embodiment;

[0026] Fig. 9 A circuit diagram of a lamp bead in another embodiment;

[0027] Fig.10 A schematic diagram of the structure of a lamp bead in another embodiment;

[0028] Fig.11 The figure is a circuit diagram of a lamp bead in yet another embodiment. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0031] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0032] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0034] The lamp bead provided in the embodiment of the present application is one of the unit components constituting the LED display unit. The LED display unit can be an LED display screen, or it can be a part of an LED display screen, which is spliced ​​to form a complete LED display screen. Usually, a lamp bead is used as a pixel point of an LED display screen to form the picture of the LED display screen. The LED display unit usually includes a plurality of lamp beads, each of which displays different colors, and is combined into different pictures displayed by the LED display unit.

[0035] In one embodiment, Figure 1 As shown, a lamp bead is provided, which includes a welding piece 200 , a substrate 400 and more than two LED chips 600 . The welding piece 200 is arranged on the substrate 400 , and each LED chip 600 is fixed to the substrate 400 through the welding piece 200 .

[0036] Among them, the welding part serves as a carrier for installing the LED chip, which can fix the LED chip during the installation process of the LED chip and can conduct current and voltage for the LED chip. The welding part can be a pad, which is the pin in the component package. In practical applications, solder is used to electrically connect the pins of components such as resistors, capacitors, inductors, chips, etc. to the pad. In the present application, solder can be used to electrically connect the pins of the LED chip to the pad. The substrate can be a printed circuit board, which can connect various electronic components through circuits to play a role of conduction and transmission. In the present application, it is mainly used to realize the circuit connection of each LED chip. The LED chip, also known as the LED light-emitting chip, is the core component of the lamp bead, has a PN junction, and can convert electrical energy into light energy.

[0037] Specifically, the welding piece is fixedly arranged on the substrate to realize the installation and connection of specific components. The LED chip is soldered to the welding piece by soldering to complete the connection and fixation of the LED chip in the lamp bead. Among the LED chips, the same type of LED chips are connected in series or in parallel. Figure 1 In the example of six LED chips of the same type connected in series, the connection relationship between the same type of LED chips is exemplified. Furthermore, the series connection of the same type of LED chips can be realized based on the connection relationship of the welding parts set at the corresponding positions. The connection between the LED chips is realized based on the connection relationship between the welding parts, which reduces the connection wires outside the substrate, saves the space of the lamp beads, and can improve the stability of the connection between the LED lamp beads, so that the working reliability of the lamp beads is improved.

[0038] In this embodiment, the lamp bead includes a welding part, a substrate, and more than two LED chips. The welding part is arranged on the substrate, and each LED chip is fixed to the substrate through the welding part. Among the LED chips, LED chips of the same type are connected in series or in parallel. By packaging more than two LED chips of the same type in series or in parallel in the lamp bead, the number of LED chips in a single lamp bead is increased, and then the brightness of the lamp bead is increased, so that the brightness of the LED display unit composed of the lamp beads can meet the brightness requirements of outdoor scenes, thereby improving applicability.

[0039] The type of LED chips in the lamp bead is not limited to one, but can be multiple, and the connection relationship of multiple types of LED chips in the lamp bead is not limited. Figure 2 As shown, the LED chips include a first type chip 620, a second type chip 640 and a third type chip 660, which are fixed to the substrate 400 by a welding member 200. The first type chips 620 are connected in series, the second type chips 640 are connected in series, and the third type chips 660 are connected in series.

[0040] Specifically, the first type of chip, the second type of chip and the third type of chip are different types of LED chips. Generally, the main difference between different types of LED chips is that the light-emitting colors of different types of LED chips are different. Exemplarily, if the lamp bead is an RGB lamp bead, the light-emitting colors of the LED chip in the lamp bead can be red, green and blue. Optionally, the colors of the first type of chip, the second type of chip and the third type of chip are different. The light-emitting color of the first type of chip is red, the light-emitting color of the second type of chip is green, and the light-emitting color of the third type of chip is blue. Furthermore, the connection relationship between the same type of LED chips is series connection, such as Figure 2 It should be noted that the number of different types of LED chips may be different.

[0041] According to different settings of the welding parts, the connection methods between the same type of LED chips are also different. Figure 3 As shown, each welding piece is only provided at the welding place of each LED chip, and is divided into two welding areas (areas not covered by the oblique lines) by the substrate (areas covered by the oblique lines). One welding area includes six welding pieces, that is, three pairs of pads, and each pair of pads includes a positive electrode pad and a negative electrode pad. Figure 3 There are a total of 12 pads. Figure 3 The one shown in FIG. 1 is a type of pad, a square pad. Each pair of square pads can be soldered with an LED chip, that is, the input end of the LED chip is soldered to the positive pad, and the output end of the LED chip is soldered to the negative pad. Figure 3 In the embodiment, the LED chips soldered on each pair of interconnected square pads are of the same type, that is, the LED chips of the same type are connected in series.

[0042] The LED chip includes an input terminal and an output terminal. Figure 2 The LED chips in the embodiment of the present invention, taking the first type of chips as an example, can have three connection modes: the first mode, the input end of one first type of chip is connected to the output end of another first type of chip. The second mode, the input ends of two first type of chips are connected. The third mode, the output ends of two first type of chips are connected. Among them, the first connection mode is equivalent to connecting the same type of LED chips in series. The second and third connection modes are equivalent to connecting the same type of LED chips in parallel. In the first connection mode, when the input end of one first type of chip is connected to the output end of another first type of chip, the power input end connected to the welding piece inputs power from the input end of the other first type of chip, so that the power is output from the output end of the first type of chip. In the second connection mode, when the input ends of the two first type of chips are connected, the power input end connected to the welding piece is connected to the common end connected to the two first type of chips, and the two first type of chips are powered. In the third connection mode, when the output ends of the two first type of chips are connected, the power input end connected to the welding piece is simultaneously connected to the input ends of the two first type of chips. The second and third types of chips also have the same three connection methods as the first type of chips, which will not be described here.

[0043] In one embodiment, the input end and the output end of each first type chip are connected alternately, the input end and the output end of each second type chip are connected alternately, and the input end and the output end of each third type chip are connected alternately.

[0044] Specifically, this connection method is the first connection method mentioned above, that is, the same type of LED chips are connected in series, and the input and output ends of the same type of LED chips are connected alternately. Take the connection relationship of the first type of chips as an example for explanation: the first type of chips are marked as chip No. 1 and chip No. 2, then the output end of chip No. 1 is connected to the input end of chip No. 2. If the number of the first type of chips is three, including chip No. 3, then the input end of chip No. 3 is connected to the output end of chip No. 2. As the number of the first type of chips increases, by analogy, the input and output ends of the first type of chips are connected alternately. The connection between the second type of chips and the third type of chips is the same as that of the first type of chips, which will not be repeated here.

[0045] When setting the first type chip, the second type chip and the third type chip, the number of each type of LED chip can be selected arbitrarily according to actual needs. The LED chips in the lamp beads are set accordingly according to the application requirements of different use environments. Figure 4 As shown, in one embodiment, the number of the first type chip 620, the second type chip 640 and the third type chip 660 are the same. In this embodiment, among the LED chips set in the lamp bead, the number of each type of LED chips is the same, and the number of the first type chip, the second type chip and the third type chip are all the same. In this way, when different types of LED chips in the lamp bead are working, the same number of LED chips of each color are in working state. When the LED displays different colors, the display of each color is uniform in brightness while having sufficient brightness.

[0046] For example, Figure 4 The equivalent circuit diagram is as follows Figure 5 As shown, "R", "B" and "G" represent different types of LED chips respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0047] Alternatively, if Figure 6 As shown, in one embodiment, the number of the first type of chips 620, the number of the second type of chips 640 and the number of the third type of chips 660 are different. That is, the number of the first type of chips, the number of the second type of chips and the number of the third type of chips can be different. The number of each type of LED chip can be determined according to actual needs and is not limited. Figure 6 In the embodiment, the number of the first type of chips 620 is two and they are connected in parallel. The number of the second type of chips 640 and the third type of chips 660 are both one. For example, Figure 6 The equivalent circuit diagram is as follows Figure 7 As shown, "R", "B" and "G" represent different types of LED chips respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0048] In one embodiment, Figure 3 , Figure 4 and Figure 6 As shown, a positive conductive terminal 820 and a negative conductive terminal 840 are disposed on the substrate 400 .

[0049] Specifically, the positive conductive terminal is connected to the power supply as the power input terminal to transmit power to the LED chip in the lamp bead, and the power flows out of the lamp bead through the negative conductive terminal. The positive conductive terminal is connected to the welding piece, which can be connected to each welding piece to supply power to the LED chip welded on each welding piece. Figure 4 The connection method shown is as follows: when the input and output ends of the same type of LED chips are connected alternately, the positive conductive terminal can also be connected to the input end of each type of LED chip through a welding piece, specifically, the input end of the LED chip is connected through the positive solder pad. In a series circuit of LED chips of the same type, the positive conductive terminal is connected to the input end of the LED chip at the head end of the series circuit. The negative conductive terminal is connected to the welding piece, such as Figure 3 As shown, the negative conductive terminal is connected to the negative pad of each pair of pads, and receives the electric energy flowing out of the LED chips welded on each welding part. Figure 4 The connection method shown: when the input and output ends of the same type of LED chips are connected alternately, the negative conductive terminal can also be connected to the output end of each type of LED chip. Specifically, in a series circuit of LED chips of the same type, the negative conductive terminal is connected to the output end of the LED chip at the tail end of the series circuit.

[0050] like Figure 4 As shown, in one embodiment, the lamp bead can adopt common cathode technology, and the output end of one of the chips in the first type of chip 620, the output end of one of the chips in the second type of chip 640, and the output end of one of the chips in the third type of chip 660 are all connected to the same negative conductive terminal 840 of the substrate 400.

[0051] Specifically, three positive conductive terminals are provided on the substrate, which are respectively connected to the first type of chip, the second type of chip and the third type of chip. Specifically, in the series circuit of the same type of LED chips, the first positive conductive terminal is connected to the input end of the LED chip located at the head end in the series circuit of the first type of chip. The second positive conductive terminal is connected to the input end of the LED chip located at the head end in the series circuit of the second type of chip. The third positive conductive terminal is connected to the input end of the LED chip located at the head end in the series circuit of the third type of chip. A negative conductive terminal is provided on the substrate, which is connected to the first type of chip, the second type of chip and the third type of chip at the same time. Specifically, in the series circuit of the same type of LED chips, the negative conductive terminal is connected to the output end of the LED chip located at the tail end in each series circuit. Each series circuit includes a series circuit of the first type of chip, a series circuit of the second type of chip and a series circuit of the third type of chip.

[0052] For example, Figure 6 The lamp beads shown also use common cathode technology.

[0053] In this embodiment, by adopting the common cathode technology, the common cathode technology adopts the precise power supply control technology, and based on the different photoelectric characteristics of different types of LED chips (red, green and blue primary colors), different voltages are allocated to different types of LED chips, and separate precise power supply reduces a part of the power loss of the LED display unit. At the same time, the working characteristics such as low heat and low temperature rise make the LED display unit composed of lamp beads have the advantages of low temperature rise, uniform screen heat, constant color temperature, no color block in long-term use, and good picture display effect. Make the LED chip work reliably and stably, and increase the working stability of the lamp beads.

[0054] In one embodiment, the lamp beads can also use common anode technology, such as Figure 8 As shown, the input end of one of the first type chips 620 , the input end of one of the second type chips 640 , and the input end of one of the third type chips 660 are all connected to the same positive conductive terminal 820 of the substrate 400 .

[0055] Specifically, a positive conductive terminal is provided on the substrate, and is connected to the first type chip, the second type chip, and the third type chip at the same time. Specifically, in the series circuit of LED chips of the same type, the positive conductive terminal is connected to the input end of the LED chip at the head end of each series circuit. Each series circuit includes a series circuit of the first type chip, a series circuit of the second type chip, and a series circuit of the third type chip.

[0056] Furthermore, if Figure 8As shown, the output end of one of the first type chips 620 , the output end of one of the second type chips 640 , and the output end of one of the third type chips 660 are respectively connected to different negative conductive terminals 840 of the substrate 400 .

[0057] Specifically, three negative conductive terminals are provided on the substrate, which are respectively connected to the first type chip, the second type chip and the third type chip. Specifically, in the series circuit of the same type of LED chips, the first negative conductive terminal is connected to the output end of the LED chip at the tail end in the series circuit of the first type chip. The second negative conductive terminal is connected to the output end of the LED chip at the tail end in the series circuit of the second type chip. The third negative conductive terminal is connected to the output end of the LED chip at the tail end in the series circuit of the third type chip.

[0058] For example, Figure 8 The equivalent circuit diagram is as follows Fig. 9 As shown, "R", "B" and "G" represent different types of LED chips respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0059] Alternatively, if Fig.10 As shown, in one embodiment, the number of the first type of chips, the number of the second type of chips, and the number of the third type of chips may be different, and the lamp beads adopt the common anode technology. Fig.10 In the embodiment, the number of the first type of chips 620 is two and they are connected in parallel. The number of the second type of chips 640 and the third type of chips 660 are both one. For example, Fig.10 The equivalent circuit diagram is as follows Fig.11 As shown, "R", "B" and "G" represent different types of LED chips respectively, "R" represents the first type of chip, "G" represents the second type of chip, and "B" represents the third type of chip.

[0060] In this embodiment, the LED chips are connected using common anode technology. Since common anode technology has been maturely applied for many years and has a complete industrial chain, the lamp beads have lower production and maintenance costs.

[0061] In the present application, in order to effectively control the size of the lamp beads, in one embodiment, the LED chip 600 is a Micro LED chip. Micro LED, or LED miniaturization technology, refers to miniaturizing, arraying, and thin-filming traditional LED crystal films using miniaturization process technology, and then transferring the crystal films to the circuit board in batches through mass transfer technology, using physical deposition to manufacture a protective layer, and finally completing the packaging. To form an ultra-small pitch LED, the millimeter-level LED length is further miniaturized to the micron level to achieve ultra-high pixels and ultra-high resolution. Micro LED chips do not require a backlight source, can self-luminous, can be more easily and accurately debugged, and have a longer luminous life and higher brightness.

[0062] The LED chip in this application can also be a Mini LED chip. It is generally believed that Mini LED is a transition chip between traditional LED and Micro LED. Mini LED chips also have a smaller size and can be arranged in multiple units within a unit size. Compared with ordinary LED chips, they can improve the unit brightness of the lamp beads.

[0063] In fact, Micro LED chips and Mini LED chips can be used in combination. That is, among the first type of chip, the second type of chip and the third type of chip, at least one is a Mini LED chip, and at least one is a Micro LED chip. Exemplarily, in one embodiment, the LED chip includes the first type of chip, the second type of chip and the third type of chip, wherein the first type of chip and the second type of chip are Mini LED chips, and the third type of chip is a Micro LED chip.

[0064] Specifically, the size of Mini LED chips and Micro LED chips is very small, and a large number of them can be set in the lamp bead, so that the brightness of the lamp bead is improved. Exemplarily, the maximum size of the light-emitting surface of the Mini LED chip is 50 microns to 200 microns, and the maximum size of the light-emitting surface of the Micro LED chip is less than or equal to 50 microns.

[0065] Based on the same technical concept, an embodiment of the present application also provides an LED display unit, which includes lamp beads as described in the above embodiments.

[0066] Specifically, the connection relationship between the lamp beads can be changed according to the needs of the LED display unit. For example, the lamp beads can be connected in series, that is, single-line series connection. It can also be array series connection, that is, the lamp beads are grouped, the lamp beads in each group are connected in series, and then the lamp beads in each group are connected in parallel. It is also possible to connect a Zener diode in parallel to each lamp bead in single-line series connection. The connection methods are changeable and can be changed according to actual use requirements, and will not be listed one by one here.

[0067] Furthermore, when the substrate of the lamp bead is a printed circuit board (PCB), when the lamp bead is packaged, the color of the printed circuit board can be deepened before the die bonding step to improve the contrast of the lamp bead when it is luminous, as an auxiliary method to increase the display brightness. Optionally, the color of the printed circuit board can be deepened by spraying, black glue dispensing, and laminating. In the laminating process, the transmittance of the laminating film can be adjusted according to actual needs.

[0068] In order to better understand the above scheme, combined with Figure 4 The lamp bead shown is explained in detail below in conjunction with a specific embodiment.

[0069] In one embodiment, the LED display unit is an LED display screen, and the LED display screen is packaged using MiP (Micro LED in Package) technology. MiP is a relatively novel packaging architecture based on Micro LED. By rewiring the MicroLED chip substrate and fanning out the pins, the electrodes that were originally difficult to measure are led out through the line, so that the pin distance is increased, and the difficulty of testing and mounting is reduced. The LED display screen includes a plurality of lamp beads, and the lamp beads include welding parts, substrates, positive conductive terminals, negative conductive terminals and LED chips, and each LED chip is a Micro LED chip. The LED chips include first-class chips, second-class chips and third-class chips, and the first-class chips, second-class chips and third-class chips are fixed to the substrate through welding parts. Among them, the first-class chip is a red chip, the second-class chip is a green chip, and the third-class chip is a blue chip. When the LED chip includes red, green and blue colors and is packaged using MiP (Micro LED in Package) technology, the lamp bead can be called a single-pixel RGB single Mirco chip, and the lamp bead has been packaged and can display different colors in the LED display screen. Since the number of LED chips emitting light per unit area is twice as much as before, the brightness can also be increased from the original 2000 to 3000 nits to 4000 to 6000 nits, which is more suitable for outdoor scenes that require high brightness.

[0070] In this embodiment, the traditional large-size LED chips are replaced by connecting Mini LED / Micro LED chips in series or in parallel, effectively increasing the lumen value of a single lamp bead, thereby making the lamp bead emit brighter light. By connecting multiple single-color LED chips in series in a single-pixel RGB single Mirco chip, such as changing the design from RGB (one LED chip for each of the three colors) to RR-GG-BB (two LED chips for each of the three colors), the brightness is increased and the brightness uniformity is improved, which can meet the brightness requirements of outdoor scenes.

[0071] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A lamp bead, characterized in that: The lamp bead comprises a welding piece, a substrate and more than two LED chips, the welding piece is arranged on the substrate, and each LED chip is fixed to the substrate through the welding piece; Among the LED chips, LED chips of the same type are connected in series or in parallel; wherein the LED chips include a first type of chip, a second type of chip and a third type of chip, the first type of chip, the second type of chip and the third type of chip are fixed to the substrate through the welding part, the first type of chips are connected in series, the second type of chips are connected in series, and the third type of chips are connected in series.

2. The lamp bead according to claim 1, characterized in that: The lamp beads are RGB lamp beads, the luminous color of the first type of chip is red, the luminous color of the second type of chip is green, and the luminous color of the third type of chip is blue.

3. The lamp bead according to claim 1, characterized in that: The number of the first type of chips, the second type of chips and the third type of chips is the same.

4. The lamp bead according to claim 1, characterized in that: The number of the first type of chips, the second type of chips and the third type of chips are different.

5. The lamp bead according to any one of claims 1 to 4, characterized in that: A positive conductive terminal and a negative conductive terminal are provided on the substrate, and an input end of one of the first type of chips, an input end of one of the second type of chips, and an input end of one of the third type of chips are all connected to the same positive conductive terminal of the substrate; an output end of one of the first type of chips, an output end of one of the second type of chips, and an output end of one of the third type of chips are respectively connected to different negative conductive terminals of the substrate.

6. The lamp bead according to any one of claims 1 to 4, characterized in that: A positive conductive terminal and a negative conductive terminal are provided on the substrate, and the output end of one of the first type of chips, the output end of one of the second type of chips and the output end of one of the third type of chips are all connected to the same negative conductive terminal of the substrate; the input end of one of the first type of chips, the input end of one of the second type of chips and the input end of one of the third type of chips are respectively connected to different positive conductive terminals of the substrate.

7. The lamp bead according to any one of claims 1 to 6, characterized in that: The LED chip is a Mini LED chip or a Micro LED chip.

8. The lamp bead according to claim 7, characterized in that: Among the first type of chip, the second type of chip and the third type of chip, at least one is a MiniLED chip, and at least one is a Micro LED chip.

9. The lamp bead according to claim 7 or 8, characterized in that: The maximum size of the light-emitting surface of the Mini LED chip is 50 microns to 200 microns, and the maximum size of the light-emitting surface of the Micro LED chip is less than or equal to 50 microns.

10. An LED display unit, characterized in that: The LED display unit comprises the lamp bead as described in any one of claims 1-9.

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