LED display device and LED display module

Abstract

The utility model discloses an LED display device and an LED display module. The LED display device comprises a circuit substrate and a plurality of LED display chips. A plurality of groups of solid crystal bonding pads are arranged on the first layer of the circuit substrate, and the plurality of LED display chips are correspondingly connected with the plurality of groups of solid crystal bonding pads; the LED display chips comprise a first LED display chip, a second LED display chip and a third LED display chip; the plurality of LED display chips are arranged in a 4 * 4 matrix on the first layer of the circuit substrate. According to the utility model, through the virtual pixel display scheme that the LED display chips are arranged into the 4 * 4 matrix, the problems of long production cycle and complicated wiring of a circuit board of an LED display product are effectively solved, the production cost is reduced, the space utilization rate of a product bonding pad is improved, the pixel density is improved, and the display effect of the LED display product is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display, in particular to an LED display device and an LED display module. Background Art

[0002] Most of the current virtual pixel product solutions are 2*2, 3*3 matrix solutions, that is, LED display chips are arranged in 2*2, 3*3 matrices. The principle is to add any color based on the RGB three colors, and use the "visual residual" phenomenon of the human eye to generate virtual pixels, so as to achieve the "small pitch" display effect of "large pitch" products, reduce the production restrictions of LED display products, and improve the display effect of small pitch LED display products. However, the existing virtual pixel product solutions have the disadvantages of small number of integrated particles and complex circuit board wiring solutions, resulting in a large number of LED display products, high production costs, and long production cycles. If the number of patches is reduced, the pad space utilization of LED display products will be low, and the pixel density will be low, which will lead to poor display effects of LED display products. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art. The utility model provides an LED display device and an LED display module. By setting the LED display chip to a 4*4 matrix virtual pixel display solution, the problems of long production cycle and complex circuit board wiring of LED display products are effectively solved, production costs are reduced, product pad space utilization is improved, pixel density is increased, and the display effect of LED display products is improved.

[0004] The utility model provides an LED display device, which includes a circuit substrate and a plurality of LED display chips;

[0005] The circuit substrate comprises a four-layer structure, a first layer of the circuit substrate is provided with a plurality of groups of die-bonding pads, and the plurality of LED display chips are connected to the plurality of groups of die-bonding pads correspondingly;

[0006] The LED display chips include a first LED display chip, a second LED display chip, and a third LED display chip;

[0007] The plurality of LED display chips are arranged in a 4*4 matrix on the first layer of the circuit substrate, wherein the positions (1,1), (3,1), (2,2), (4,2), (1,3), (3,3), (2,4), and (4,4) in the 4*4 matrix are LED display chips of the first type, the positions (1,2), (3,2), (1,4), and (3,4) in the 4*4 matrix are LED display chips of the second type, and the positions (2,1), (4,1), (2,3), and (4,3) in the 4*4 matrix are LED display chips of the third type.

[0008] Further, the first type of LED display chip is a red LED display chip, the second type of LED display chip is a green LED display chip, and the third type of LED display chip is a blue LED display chip;

[0009] Or the first LED display chip is a green LED display chip, the second LED display chip is a blue LED display chip, and the third LED display chip is a red LED display chip;

[0010] Or the first type of LED display chip is a blue light LED display chip, the second type of LED display chip is a red light LED display chip, and the third type of LED display chip is a green light LED display chip.

[0011] Furthermore, the plurality of LED display chips are flip chips.

[0012] Furthermore, a plurality of via holes and a plurality of circuit connection lines are provided on the first layer, the second layer, the third layer and the fourth layer of the circuit substrate.

[0013] Furthermore, a plurality of pin pads are arranged on the fourth layer of the circuit substrate.

[0014] Furthermore, the plurality of pin pads are connected to the plurality of groups of die-bonding pads based on corresponding vias and circuit connection lines.

[0015] Furthermore, any group of the bonding pads includes an anode bonding pad and a cathode bonding pad, and any LED display chip is provided with an anode and a cathode, the anode of the LED display chip is correspondingly connected to the anode bonding pad, and the cathode of the LED display chip is correspondingly connected to the cathode bonding pad.

[0016] Furthermore, black ink is also provided on the first layer of the circuit substrate.

[0017] Furthermore, positioning identification ink is also provided on the fourth layer of the circuit substrate.

[0018] The utility model also provides an LED display module, which includes the above-mentioned LED display device.

[0019] The utility model provides an LED display device and an LED display panel. By setting the LED display chip to a 4*4 matrix virtual pixel display solution, the integration degree is 77% higher than that of a 3*3 matrix virtual pixel display solution, and the number of pixel points mounted per unit time is 16. The problems of long production cycle and complex circuit board wiring of LED display products are effectively solved, the production cost is reduced, the product pad space utilization rate is improved, the pixel density is increased, and the display effect of the LED display product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the arrangement of die-bonding pads of the LED display device in the first embodiment of the utility model;

[0022] Figure 2 This is a first schematic diagram of the structure of the LED display device in the first embodiment of the present utility model;

[0023] Figure 3 This is a second schematic diagram of the structure of the LED display device in the first embodiment of the present utility model;

[0024] Figure 4 This is a schematic diagram of the arrangement of die-bonding pads of the LED display device in the second embodiment of the present utility model;

[0025] Figure 5 This is the first schematic diagram of the structure of the LED display device in the second embodiment of the present utility model;

[0026] Figure 6 This is a second schematic diagram of the LED display device structure in the second embodiment of the present utility model;

[0027] Figure 7 This is a schematic diagram of the LED display module structure wiring in the third embodiment of the present utility model;

[0028] Figure 8 This is a schematic diagram of the LED display module structure wiring in the fourth embodiment of the present utility model. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1

[0031] Embodiment 1 of the present invention provides an LED display device, which includes a circuit substrate 1 and sixteen LED display chips. The circuit substrate 1 includes a four-layer structure. Sixteen groups of die-bonding pads are arranged on the first layer of the circuit substrate 1. The LED display chips are connected to the die-bonding pads accordingly.

[0032] In an optional implementation of this embodiment, Figure 1 and Figure 2 As shown, Figure 1 The schematic diagram of the arrangement of the die bonding pads of the LED display device in the first embodiment of the utility model is shown. Figure 2 The first schematic diagram of the structure of the LED display device in the first embodiment of the utility model is shown. Figure 1 is a structural schematic diagram of the LED display device in which no LED display chip is arranged on the first layer of the circuit substrate, Figure 2 The present invention is a schematic structural diagram of the first layer, the second layer and the third layer of the circuit substrate of the LED display device, wherein the first layer is provided with an LED display chip.

[0033] Specifically, the sixteen LED display chips include a first LED display chip 201, a second LED display chip 202, a third LED display chip 203, a fourth LED display chip 204, a fifth LED display chip 205, a sixth LED display chip 206, a seventh LED display chip 207, an eighth LED display chip 208, a ninth LED display chip 209, a tenth LED display chip 210, an eleventh LED display chip 211, a twelfth LED display chip 212, a thirteenth LED display chip 213, a fourteenth LED display chip 214, a fifteenth LED display chip 215, and a sixteenth LED display chip 216;

[0034] The sixteen groups of die-bonding pads include a first group of die-bonding pads 301, a second group of die-bonding pads 302, a third group of die-bonding pads 303, a fourth group of die-bonding pads 304, a fifth group of die-bonding pads 305, a sixth group of die-bonding pads 306, a seventh group of die-bonding pads 307, an eighth group of die-bonding pads 308, a ninth group of die-bonding pads 309, a tenth group of die-bonding pads 310, an eleventh group of die-bonding pads 311, a twelfth group of die-bonding pads 312, a thirteenth group of die-bonding pads 313, a fourteenth group of die-bonding pads 314, a fifteenth group of die-bonding pads 315, and a sixteenth group of die-bonding pads 316;

[0035] The first LED display chip 201 is connected to the first group of die-bonding pads 301, the second LED display chip 202 is connected to the second group of die-bonding pads 302, the third LED display chip 203 is connected to the third group of die-bonding pads 303, the fourth LED display chip 204 is connected to the fourth group of die-bonding pads 304, the fifth LED display chip 205 is connected to the fifth group of die-bonding pads 305, the sixth LED display chip 206 is connected to the sixth group of die-bonding pads 306, the seventh LED display chip 207 is connected to the seventh group of die-bonding pads 307, the eighth LED display chip 208 is connected to the eighth group of die-bonding pads 308, and the ninth LED display chip 209 is connected to the eighth group of die-bonding pads 309. The D display chip 209 is connected to the ninth group of die-bonding pads 309, the tenth LED display chip 210 is connected to the tenth group of die-bonding pads 310, the eleventh LED display chip 211 is connected to the eleventh group of die-bonding pads 311, the twelfth LED display chip 212 is connected to the twelfth group of die-bonding pads 312, the thirteenth LED display chip 213 is connected to the thirteenth group of die-bonding pads 313, the fourteenth LED display chip 214 is connected to the fourteenth group of die-bonding pads 314, the fifteenth LED display chip 215 is connected to the fifteenth group of die-bonding pads 315, and the sixteenth LED display chip 216 is connected to the sixteenth group of die-bonding pads 316.

[0036] In an optional implementation of the present embodiment, any group of the bonding pads includes an anode bonding pad and a cathode bonding pad, and any LED display chip is provided with an anode and a cathode, the anode of the LED display chip is correspondingly connected to the anode bonding pad, and the cathode of the LED display chip is correspondingly connected to the cathode bonding pad.

[0037] Specifically, taking the first group of bonding pads and the first LED display chip as an example, the first group of bonding pads 301 includes a first anode bonding pad 3011 and a first cathode bonding pad 3012, the anode of the first LED display chip 201 is connected to the first anode bonding pad 3011, the cathode of the first LED display chip 201 is connected to the first cathode bonding pad 3012, and the connection relationship between the remaining bonding pads and the LED display chip will not be repeated one by one.

[0038] In an optional implementation of this embodiment, the LED display chip includes a first LED display chip, a second LED display chip, and a third LED display chip.

[0039] Specifically, the first type of LED display chip is a red light LED display chip, the second type of LED display chip is a green light LED display chip, and the third type of LED display chip is a blue light LED display chip.

[0040] In an optional implementation of the present embodiment, the sixteen LED display chips are arranged in a 4*4 matrix on the first layer of the circuit substrate 1, and the positions (1,1), (3,1), (2,2), (4,2), (1,3), (3,3), (2,4), and (4,4) in the 4*4 matrix are the first type of LED display chips, the positions (1,2), (3,2), (1,4), and (3,4) in the 4*4 matrix are the second type of LED display chips, and the positions (2,1), (4,1), (2,3), and (4,3) in the 4*4 matrix are the third type of LED display chips.

[0041] Specifically, the position (1,1) in the 4*4 matrix is ​​the first LED display chip 201, the position (3,1) in the 4*4 matrix is ​​the third LED display chip 203, the position (2,2) in the 4*4 matrix is ​​the sixth LED display chip 206, the position (4,2) in the 4*4 matrix is ​​the eighth LED display chip 208, the position (1,3) in the 4*4 matrix is ​​the ninth LED display chip 209, and the position (3,3) in the 4*4 matrix is ​​the eleventh LED display chip 21 1, the position (2,4) in the 4*4 matrix is ​​the fourteenth LED display chip 214, the position (4,4) in the 4*4 matrix is ​​the sixteenth LED display chip 216, the first LED display chip 201, the third LED display chip 203, the sixth LED display chip 206, the eighth LED display chip 208, the ninth LED display chip 209, the eleventh LED display chip 211, the fourteenth LED display chip 214, and the sixteenth LED display chip 216 are red LED display chips.

[0042] Furthermore, the position (1,2) in the 4*4 matrix is ​​the fifth LED display chip 205, the position (3,2) in the 4*4 matrix is ​​the seventh LED display chip 207, the position (1,4) in the 4*4 matrix is ​​the thirteenth LED display chip 213, and the position (3,4) in the 4*4 matrix is ​​the fifteenth LED display chip 215. The fifth LED display chip 205, the seventh LED display chip 207, the thirteenth LED display chip 213, and the fifteenth LED display chip 215 are green LED display chips.

[0043] Furthermore, the position (2,1) in the 4*4 matrix is ​​the second LED display chip 202, the position (4,1) in the 4*4 matrix is ​​the fourth LED display chip 204, the position (2,3) in the 4*4 matrix is ​​the tenth LED display chip 210, and the position (4,3) in the 4*4 matrix is ​​the twelfth LED display chip 212. The second LED display chip 202, the fourth LED display chip 204, the tenth LED display chip 210, and the twelfth LED display chip 212 are blue light LED display chips.

[0044] Here, sixteen LED display chips are set as a 4*4 matrix virtual pixel display solution. Compared with the 3*3 matrix virtual pixel display solution, the degree of integration is 77% higher, and the number of pixels mounted per unit time is 16. This effectively solves the problems of long production cycle and complex circuit board wiring of LED display products, reduces production costs, improves product pad space utilization, increases pixel density, and thus improves the display effect of LED display products.

[0045] In an optional implementation of this embodiment, the plurality of LED display chips are flip chips.

[0046] In an optional implementation of this embodiment, a plurality of vias and a plurality of circuit connection lines are provided on the first layer, the second layer, the third layer and the fourth layer of the circuit substrate 1 .

[0047] In an optional implementation of the present embodiment, ten pin pads are provided on the fourth layer of the circuit substrate 1 , and the pin pads are correspondingly connected to the die-bonding pads based on corresponding vias and circuit connection lines.

[0048] Specifically, Figure 3 As shown, Figure 3 A second schematic diagram of the structure of the LED display device in the first embodiment of the utility model is shown. Figure 3The fourth layer of the circuit substrate of the LED display device is a schematic diagram of the structure. The fourth layer of the circuit substrate 1 is provided with ten pin pads, including a first pin pad 401, a second pin pad 402, a third pin pad 403, a fourth pin pad 404, a fifth pin pad 405, a sixth pin pad 406, a seventh pin pad 407, an eighth pin pad 408, a ninth pin pad 409, and a tenth pin pad 410;

[0049] The first pin pad 401 is connected to the first anode bonding pad of the first group of bonding pads 301, the anode of the first LED display chip 201, the ninth anode bonding pad of the ninth group of bonding pads 309, and the anode of the ninth LED display chip 209;

[0050] The second pin pad 402 is connected to the first cathode bonding pad of the first group of bonding pads 301, the cathode of the first LED display chip 201, the second cathode bonding pad of the second group of bonding pads 302, the cathode of the second LED display chip 202, the fifth cathode bonding pad of the fifth group of bonding pads 305, the cathode of the fifth LED display chip 205, the sixth cathode bonding pad of the sixth group of bonding pads 306, the cathode of the sixth LED display chip 206, the third cathode bonding pad of the third group of bonding pads 303, the cathode of the third LED display chip 203, the fourth cathode bonding pad of the fourth group of bonding pads 304, the cathode of the fourth LED display chip 204, the seventh cathode bonding pad of the seventh group of bonding pads 307, the cathode of the seventh LED display chip 207, the eighth cathode bonding pad of the eighth group of bonding pads 308, and the cathode of the eighth LED display chip 208;

[0051] The third pin pad 403 is connected to the third anode bonding pad of the third group of bonding pads 303, the anode of the third LED display chip 203, the eleventh anode bonding pad of the eleventh group of bonding pads 311, and the anode of the eleventh LED display chip 211;

[0052] The fourth pin pad 404 is connected to the seventh anode bonding pad of the seventh group of bonding pads 307 , the anode of the seventh LED display chip 207 , the fifteenth anode bonding pad of the fifteenth group of bonding pads 315 , and the anode of the fifteenth LED display chip 215 ;

[0053] The fifth pin pad 405 is connected to the fifth anode bonding pad of the fifth group of bonding pads 305 , the anode of the fifth LED display chip 205 , the thirteenth anode bonding pad of the thirteenth group of bonding pads 313 , and the anode of the thirteenth LED display chip 213 ;

[0054] The sixth pin pad 406 is connected to the fourth anode bonding pad of the fourth group of bonding pads 304 , the anode of the fourth LED display chip 204 , the twelfth anode bonding pad of the twelfth group of bonding pads 312 , and the anode of the twelfth LED display chip 212 ;

[0055] The seventh pin pad 407 is connected to the second anode bonding pad of the second group of bonding pads 302 , the anode of the second LED display chip 202 , the tenth anode bonding pad of the tenth group of bonding pads 310 , and the anode of the tenth LED display chip 210 ;

[0056] The eighth pin pad 408 is connected to the sixth anode bonding pad of the sixth group of bonding pads 306 , the anode of the sixth LED display chip 206 , the fourteenth anode bonding pad of the fourteenth group of bonding pads 314 , and the anode of the fourteenth LED display chip 214 ;

[0057] The ninth pin pad 409 is connected to the ninth cathode bonding pad of the ninth group of bonding pads 309, the cathode of the ninth LED display chip 209, the tenth cathode bonding pad of the tenth group of bonding pads 310, the cathode of the tenth LED display chip 210, the thirteenth cathode bonding pad of the thirteenth group of bonding pads 313, the cathode of the thirteenth LED display chip 213, the fourteenth cathode bonding pad of the fourteenth group of bonding pads 314, the cathode of the fourteenth LED display chip 214. The electrode, the eleventh cathode bonding pad of the eleventh group of bonding pads 311, the cathode of the eleventh LED display chip 211, the twelfth cathode bonding pad of the twelfth group of bonding pads 312, the cathode of the twelfth LED display chip 212, the fifteenth cathode bonding pad of the fifteenth group of bonding pads 315, the cathode of the fifteenth LED display chip 215, the sixteenth cathode bonding pad of the sixteenth group of bonding pads 316, and the cathode of the sixteenth LED display chip 216 are connected;

[0058] The tenth pin pad 410 is connected to the eighth anode bonding pad of the eighth group of bonding pads 308 , the anode of the eighth LED display chip 208 , the sixteenth anode bonding pad of the sixteenth group of bonding pads 316 , and the anode of the sixteenth LED display chip 216 .

[0059] Here, the pin pads are correspondingly connected to the die bonding pads and the LED display chip, and the LED display chip is driven and lit by inputting a driving signal at the pin pads.

[0060] In an optional implementation of this embodiment, black ink is further provided on the first layer of the circuit substrate 1 .

[0061] Specifically, the black ink is distributed on the first layer of the circuit substrate 1 except for the die-bonding pad.

[0062] Here, black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device.

[0063] In an optional implementation of this embodiment, positioning identification ink is further provided on the fourth layer of the circuit substrate 1 .

[0064] Due to the symmetry of the pin pad design of the LED display device in this embodiment, the correct direction of the LED display device cannot be quickly identified under the taped CCD image. Here, positioning identification ink is provided on the fourth layer of the circuit substrate to facilitate the machine to perform rapid identification testing and taping, thereby improving the production efficiency of LED display products.

[0065] In summary, the first embodiment of the utility model proposes an LED display device, which sets the LED display chip as a 4*4 matrix virtual pixel display scheme, which has a 77% higher degree of integration than the 3*3 matrix virtual pixel display scheme, and the number of pixels mounted per unit time is 16, which effectively solves the problems of long production cycle of LED display products and complex circuit board wiring, reduces production costs, improves product pad space utilization, and increases pixel density, thereby improving the display effect of LED display products; black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device; positioning identification ink is provided on the fourth layer of the circuit substrate, which is convenient for the machine to perform rapid identification testing and material editing, thereby improving the production efficiency of LED display products.

[0066] Embodiment 2

[0067] Embodiment 2 of the present invention provides an LED display device, which includes a circuit substrate 1 and sixteen LED display chips. The circuit substrate 1 includes a four-layer structure. Sixteen groups of die-bonding pads are arranged on the first layer of the circuit substrate 1. The LED display chips are connected to the die-bonding pads accordingly.

[0068] In an optional implementation of this embodiment, Figure 4 and Figure 5 As shown, Figure 4 The schematic diagram of the arrangement of the die-bonding pads of the LED display device in the second embodiment of the utility model is shown. Figure 5 The first schematic diagram of the structure of the LED display device in the second embodiment of the utility model is shown. Figure 4 is a structural schematic diagram of the LED display device in which no LED display chip is arranged on the first layer of the circuit substrate, Figure 5 The present invention is a schematic structural diagram of the first layer, the second layer and the third layer of the circuit substrate of the LED display device, wherein the first layer is provided with an LED display chip.

[0069] Specifically, the sixteen LED display chips include a first LED display chip 201, a second LED display chip 202, a third LED display chip 203, a fourth LED display chip 204, a fifth LED display chip 205, a sixth LED display chip 206, a seventh LED display chip 207, an eighth LED display chip 208, a ninth LED display chip 209, a tenth LED display chip 210, an eleventh LED display chip 211, a twelfth LED display chip 212, a thirteenth LED display chip 213, a fourteenth LED display chip 214, a fifteenth LED display chip 215, and a sixteenth LED display chip 216;

[0070] The sixteen groups of die-bonding pads include a first group of die-bonding pads 301, a second group of die-bonding pads 302, a third group of die-bonding pads 303, a fourth group of die-bonding pads 304, a fifth group of die-bonding pads 305, a sixth group of die-bonding pads 306, a seventh group of die-bonding pads 307, an eighth group of die-bonding pads 308, a ninth group of die-bonding pads 309, a tenth group of die-bonding pads 310, an eleventh group of die-bonding pads 311, a twelfth group of die-bonding pads 312, a thirteenth group of die-bonding pads 313, a fourteenth group of die-bonding pads 314, a fifteenth group of die-bonding pads 315, and a sixteenth group of die-bonding pads 316;

[0071] The first LED display chip 201 is connected to the first group of die-bonding pads 301, the second LED display chip 202 is connected to the second group of die-bonding pads 302, the third LED display chip 203 is connected to the third group of die-bonding pads 303, the fourth LED display chip 204 is connected to the fourth group of die-bonding pads 304, the fifth LED display chip 205 is connected to the fifth group of die-bonding pads 305, the sixth LED display chip 206 is connected to the sixth group of die-bonding pads 306, the seventh LED display chip 207 is connected to the seventh group of die-bonding pads 307, the eighth LED display chip 208 is connected to the eighth group of die-bonding pads 308, and the ninth LED display chip 209 is connected to the eighth group of die-bonding pads 309. The D display chip 209 is connected to the ninth group of die-bonding pads 309, the tenth LED display chip 210 is connected to the tenth group of die-bonding pads 310, the eleventh LED display chip 211 is connected to the eleventh group of die-bonding pads 311, the twelfth LED display chip 212 is connected to the twelfth group of die-bonding pads 312, the thirteenth LED display chip 213 is connected to the thirteenth group of die-bonding pads 313, the fourteenth LED display chip 214 is connected to the fourteenth group of die-bonding pads 314, the fifteenth LED display chip 215 is connected to the fifteenth group of die-bonding pads 315, and the sixteenth LED display chip 216 is connected to the sixteenth group of die-bonding pads 316.

[0072] In an optional implementation of the present embodiment, any group of the bonding pads includes an anode bonding pad and a cathode bonding pad, and any LED display chip is provided with an anode and a cathode, the anode of the LED display chip is correspondingly connected to the anode bonding pad, and the cathode of the LED display chip is correspondingly connected to the cathode bonding pad.

[0073] Specifically, taking the first group of bonding pads and the first LED display chip as an example, the first group of bonding pads 301 includes a first anode bonding pad 3011 and a first cathode bonding pad 3012, the anode of the first LED display chip 201 is connected to the first anode bonding pad 3011, the cathode of the first LED display chip 201 is connected to the first cathode bonding pad 3012, and the connection relationship between the remaining bonding pads and the LED display chip will not be repeated one by one.

[0074] In an optional implementation of this embodiment, the LED display chip includes a first LED display chip, a second LED display chip, and a third LED display chip.

[0075] Specifically, the first type of LED display chip is a red light LED display chip, the second type of LED display chip is a green light LED display chip, and the third type of LED display chip is a blue light LED display chip.

[0076] In an optional implementation of the present embodiment, the sixteen LED display chips are arranged in a 4*4 matrix on the first layer of the circuit substrate 1, and the positions (1,1), (3,1), (2,2), (4,2), (1,3), (3,3), (2,4), and (4,4) in the 4*4 matrix are the first type of LED display chips, the positions (1,2), (3,2), (1,4), and (3,4) in the 4*4 matrix are the second type of LED display chips, and the positions (2,1), (4,1), (2,3), and (4,3) in the 4*4 matrix are the third type of LED display chips.

[0077] Specifically, the position (1,1) in the 4*4 matrix is ​​the first LED display chip 201, the position (3,1) in the 4*4 matrix is ​​the third LED display chip 203, the position (2,2) in the 4*4 matrix is ​​the sixth LED display chip 206, the position (4,2) in the 4*4 matrix is ​​the eighth LED display chip 208, the position (1,3) in the 4*4 matrix is ​​the ninth LED display chip 209, and the position (3,3) in the 4*4 matrix is ​​the eleventh LED display chip 21 1, the position (2,4) in the 4*4 matrix is ​​the fourteenth LED display chip 214, the position (4,4) in the 4*4 matrix is ​​the sixteenth LED display chip 216, the first LED display chip 201, the third LED display chip 203, the sixth LED display chip 206, the eighth LED display chip 208, the ninth LED display chip 209, the eleventh LED display chip 211, the fourteenth LED display chip 214, and the sixteenth LED display chip 216 are red LED display chips.

[0078] Furthermore, the position (1,2) in the 4*4 matrix is ​​the fifth LED display chip 205, the position (3,2) in the 4*4 matrix is ​​the seventh LED display chip 207, the position (1,4) in the 4*4 matrix is ​​the thirteenth LED display chip 213, and the position (3,4) in the 4*4 matrix is ​​the fifteenth LED display chip 215. The fifth LED display chip 205, the seventh LED display chip 207, the thirteenth LED display chip 213, and the fifteenth LED display chip 215 are green LED display chips.

[0079] Furthermore, the position (2,1) in the 4*4 matrix is ​​the second LED display chip 202, the position (4,1) in the 4*4 matrix is ​​the fourth LED display chip 204, the position (2,3) in the 4*4 matrix is ​​the tenth LED display chip 210, and the position (4,3) in the 4*4 matrix is ​​the twelfth LED display chip 212. The second LED display chip 202, the fourth LED display chip 204, the tenth LED display chip 210, and the twelfth LED display chip 212 are blue light LED display chips.

[0080] Here, sixteen LED display chips are set as a 4*4 matrix virtual pixel display solution. Compared with the 3*3 matrix virtual pixel display solution, the degree of integration is 77% higher, and the number of pixels mounted per unit time is 16. This effectively solves the problems of long production cycle and complex circuit board wiring of LED display products, reduces production costs, improves product pad space utilization, increases pixel density, and thus improves the display effect of LED display products.

[0081] In an optional implementation of this embodiment, the plurality of LED display chips are flip chips.

[0082] In an optional implementation of this embodiment, a plurality of vias and a plurality of circuit connection lines are provided on the first layer, the second layer, the third layer and the fourth layer of the circuit substrate 1 .

[0083] In an optional implementation of the present embodiment, ten pin pads are provided on the fourth layer of the circuit substrate 1 , and the pin pads are correspondingly connected to the die-bonding pads based on corresponding vias and circuit connection lines.

[0084] Specifically, Figure 6 As shown, Figure 6 A second schematic diagram of the structure of the LED display device in the second embodiment of the present utility model is shown. Figure 6 The fourth layer of the circuit substrate of the LED display device is a schematic diagram of the structure. The fourth layer of the circuit substrate 1 is provided with ten pin pads, including a first pin pad 401, a second pin pad 402, a third pin pad 403, a fourth pin pad 404, a fifth pin pad 405, a sixth pin pad 406, a seventh pin pad 407, an eighth pin pad 408, a ninth pin pad 409, and a tenth pin pad 410;

[0085] The first pin pad 401 is connected to the first anode bonding pad of the first group of bonding pads 301, the anode of the first LED display chip 201, the third anode bonding pad of the third group of bonding pads 303, and the anode of the third LED display chip 203;

[0086] The second pin pad 402 is connected to the fifth anode bonding pad of the fifth group of bonding pads 305, the anode of the fifth LED display chip 205, the seventh anode bonding pad of the seventh group of bonding pads 307, and the anode of the seventh LED display chip 207;

[0087] The third pin pad 403 is connected to the second anode bonding pad of the second group of bonding pads 302, the anode of the second LED display chip 202, the fourth anode bonding pad of the fourth group of bonding pads 304, and the anode of the fourth LED display chip 204;

[0088] The fourth pin pad 404 is connected to the sixth anode bonding pad of the sixth group of bonding pads 306 , the anode of the sixth LED display chip 206 , the eighth anode bonding pad of the eighth group of bonding pads 308 , and the anode of the eighth LED display chip 208 ;

[0089] The fifth pin pad 405 is connected to the first cathode bonding pad of the first group of bonding pads 301, the cathode of the first LED display chip 201, the second cathode bonding pad of the second group of bonding pads 302, the cathode of the second LED display chip 202, the fifth cathode bonding pad of the fifth group of bonding pads 305, the cathode of the fifth LED display chip 205, the sixth cathode bonding pad of the sixth group of bonding pads 306, the cathode of the sixth LED display chip 206, the ninth cathode bonding pad of the ninth group of bonding pads 309, the cathode of the ninth LED display chip 209, the tenth cathode bonding pad of the tenth group of bonding pads 310, the cathode of the tenth LED display chip 210, the thirteenth cathode bonding pad of the thirteenth group of bonding pads 313, the cathode of the thirteenth LED display chip 213, the fourteenth cathode bonding pad of the fourteenth group of bonding pads 314, and the cathode of the fourteenth LED display chip 214;

[0090] The sixth pin pad 406 is connected to the fourteenth anode bonding pad of the fourteenth group of bonding pads 314 , the anode of the fourteenth LED display chip 214 , the sixteenth anode bonding pad of the sixteenth group of bonding pads 316 , and the anode of the sixteenth LED display chip 216 ;

[0091] The seventh pin pad 407 is connected to the ninth anode bonding pad of the ninth group of bonding pads 309 , the anode of the ninth LED display chip 209 , the eleventh anode bonding pad of the eleventh group of bonding pads 311 , and the anode of the eleventh LED display chip 211 ;

[0092] The eighth pin pad 408 is connected to the thirteenth anode bonding pad of the thirteenth group of bonding pads 313, the anode of the thirteenth LED display chip 213, the fifteenth anode bonding pad of the fifteenth group of bonding pads 315, and the anode of the fifteenth LED display chip 215;

[0093] The ninth pin pad 409 is connected to the tenth anode bonding pad of the tenth group of bonding pads 310, the anode of the tenth LED display chip 210, the twelfth anode bonding pad of the twelfth group of bonding pads 312, and the anode of the twelfth LED display chip 212;

[0094] The tenth pin pad 410 is connected to the third cathode bonding pad of the third group of bonding pads 303, the cathode of the third LED display chip 203, the fourth cathode bonding pad of the fourth group of bonding pads 304, the cathode of the fourth LED display chip 204, the seventh cathode bonding pad of the seventh group of bonding pads 307, the cathode of the seventh LED display chip 207, the eighth cathode bonding pad of the eighth group of bonding pads 308, the cathode of the eighth LED display chip 208, and the The eleventh cathode bonding pad of the eleventh group of bonding pads 311, the cathode of the eleventh LED display chip 211, the twelfth cathode bonding pad of the twelfth group of bonding pads 312, the cathode of the twelfth LED display chip 212, the fifteenth cathode bonding pad of the fifteenth group of bonding pads 315, the cathode of the fifteenth LED display chip 215, the sixteenth cathode bonding pad of the sixteenth group of bonding pads 316, and the cathode of the sixteenth LED display chip 216 are connected.

[0095] Here, the pin pads are correspondingly connected to the die bonding pads and the LED display chip, and the LED display chip is driven and lit by inputting a driving signal at the pin pads.

[0096] In an optional implementation of this embodiment, black ink is further provided on the first layer of the circuit substrate 1 .

[0097] Specifically, the black ink is distributed on the first layer of the circuit substrate 1 except for the die-bonding pad.

[0098] Here, black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device.

[0099] In an optional implementation of this embodiment, positioning identification ink is further provided on the fourth layer of the circuit substrate 1 .

[0100] Due to the symmetry of the pin pad design of the LED display device in this embodiment, the correct direction of the LED display device cannot be quickly identified under the taped CCD image. Here, positioning identification ink is provided on the fourth layer of the circuit substrate to facilitate the machine to perform rapid identification testing and taping, thereby improving the production efficiency of LED display products.

[0101] In summary, the second embodiment of the utility model proposes an LED display device, which sets the LED display chip as a 4*4 matrix virtual pixel display scheme, which has a 77% higher degree of integration than the 3*3 matrix virtual pixel display scheme, and the number of pixels mounted per unit time is 16, which effectively solves the problems of long production cycle and complex circuit board wiring of LED display products, reduces production costs, improves product pad space utilization, and increases pixel density, thereby improving the display effect of LED display products; black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device; positioning identification ink is provided on the fourth layer of the circuit substrate, which is convenient for the machine to perform rapid identification testing and material editing, thereby improving the production efficiency of LED display products.

[0102] Embodiment 3

[0103] The third embodiment of the present invention provides an LED display module, which includes the LED display devices in the first embodiment, and the LED display devices are arranged in a matrix.

[0104] Specifically, Figure 7 As shown, Figure 7 The schematic diagram of the LED display module structure wiring in the third embodiment of the present utility model is shown. Figure 7 The LED display module shown in the figure includes four LED display devices in the first embodiment, namely, a first LED display device 51, a second LED display device 52, a third LED display device 53, and a fourth LED display device 54, wherein the four LED display devices are arranged in a 2*2 matrix.

[0105] In an optional implementation of this embodiment, the LED display module includes a four-layer circuit board, wherein the first layer circuit board, the second layer circuit board and the third layer circuit board are provided with a plurality of vias and a plurality of circuit connection lines, and the LED display device is fixed on the first layer circuit board.

[0106] It should be noted that, due to the circuit board manufacturing process, a fourth layer of circuit board is also provided here.

[0107] In an optional implementation of this embodiment, on the LED display module, the second pin pads of the LED display devices in the same row are connected in parallel to each other based on the vias provided on the first layer circuit board, the second layer circuit board and the circuit connection line on the third layer circuit board, and the ninth pin pads of the LED display devices in the same row are connected in parallel to each other based on the vias provided on the first layer circuit board, the second layer circuit board and the circuit connection line on the third layer circuit board;

[0108] The first pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the fifth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the third pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the fourth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the eighth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, and the tenth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board;

[0109] The sixth pin pads of the LED display devices in the same column are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board, and the seventh pin pads of the LED display devices in the same column are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board.

[0110] Specifically, Figure 7 As shown, the second pin pad of the first LED display device 51 and the second pin pad of the second LED display device 52 are connected in parallel with each other based on the vias arranged on the first layer circuit board and the second layer circuit board and the circuit connection lines on the third layer circuit board; the ninth pin pad of the first LED display device 51 and the ninth pin pad of the second LED display device 52 are connected in parallel with each other based on the vias arranged on the first layer circuit board and the second layer circuit board and the circuit connection lines on the third layer circuit board; the second pin pad of the third LED display device 53 and the second pin pad of the fourth LED display device 54 are connected in parallel with each other based on the vias arranged on the first layer circuit board and the second layer circuit board and the circuit connection lines on the third layer circuit board; the ninth pin pad of the third LED display device 53 and the ninth pin pad of the fourth LED display device 54 are connected in parallel with each other based on the vias arranged on the first layer circuit board and the second layer circuit board and the circuit connection lines on the third layer circuit board;

[0111] The first pin pad of the first LED display device 51 and the first pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the fifth pin pad of the first LED display device 51 and the fifth pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the third pin pad of the first LED display device 51 and the third pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the fourth pin pad of the first LED display device 51 and the fourth pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the eighth pin pad of the first LED display device 51 and the eighth pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the tenth pin pad of the first LED display device 51 and the tenth pin pad of the third LED display device 53 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; The first pin pad of the second LED display device 52 and the first pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the fifth pin pad of the second LED display device 52 and the fifth pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the third pin pad of the second LED display device 52 and the third pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the fourth pin pad of the second LED display device 52 and the fourth pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the eighth pin pad of the second LED display device 52 and the eighth pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board; the tenth pin pad of the second LED display device 52 and the tenth pin pad of the fourth LED display device 54 are connected in parallel based on the circuit connection line set on the first layer of the circuit board;

[0112] The sixth pin pad of the first LED display device 51 and the sixth pin pad of the third LED display device 53 are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board. The seventh pin pad of the first LED display device 51 and the seventh pin pad of the third LED display device 53 are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board. The sixth pin pad of the second LED display device 52 and the sixth pin pad of the fourth LED display device 54 are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board. The seventh pin pad of the second LED display device 52 and the seventh pin pad of the fourth LED display device 54 are connected in parallel with each other based on the vias set on the first layer of the circuit board and the circuit connection lines on the second layer of the circuit board.

[0113] In summary, the third embodiment of the utility model provides an LED display module, including the LED display device in the first embodiment. By setting the LED display chip to a 4*4 matrix virtual pixel display scheme, the degree of integration is 77% higher than that of the 3*3 matrix virtual pixel display scheme, and the number of pixels mounted per unit time is 16, which effectively solves the problems of long production cycle and complex circuit board wiring of LED display products, reduces production costs, improves product pad space utilization, and increases pixel density, thereby improving the display effect of LED display products; black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device; positioning identification ink is provided on the fourth layer of the circuit substrate, which is convenient for the machine to perform rapid identification testing and material editing, thereby improving the production efficiency of LED display products.

[0114] Embodiment 4

[0115] Embodiment 4 of the present invention provides an LED display module, which includes the LED display devices in Embodiment 2, a first LED display device 61, a second LED display device 62, a third LED display device 63, and a fourth LED display device 64, and the LED display devices are arranged in a matrix.

[0116] Specifically, Figure 8 As shown, Figure 8 The schematic diagram of the LED display module structure wiring in the fourth embodiment of the utility model is shown. Figure 8 The LED display module shown in the embodiment includes four LED display devices in the second embodiment, and the four LED display devices are arranged in a 2*2 matrix.

[0117] In an optional implementation of this embodiment, the LED display module includes two layers of circuit boards, wherein a first layer of the circuit board is provided with a plurality of circuit connection lines, and the LED display device is fixed on the first layer of the circuit board.

[0118] It should be noted that, due to the circuit board manufacturing process, a second layer of circuit board is also provided here.

[0119] In an optional implementation of this embodiment, on the LED display module, the fifth pin pads of the LED display devices in the same row are connected in parallel to each other based on the circuit connection line set on the first layer of the circuit board, and the tenth pin pads of the LED display devices in the same row are connected in parallel to each other based on the circuit connection line set on the first layer of the circuit board;

[0120] The first pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the second pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the third pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the fourth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the sixth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the seventh pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the eighth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, and the ninth pin pads of the LED display devices in the same column are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board.

[0121] Specifically, Figure 8 As shown, the fifth pin pad of the first LED display device 61 and the fifth pin pad of the second LED display device 62 are connected in parallel based on the circuit connection line set on the first layer of the circuit board, the tenth pin pad of the first LED display device 61 and the tenth pin pad of the second LED display device 62 are connected in parallel based on the circuit connection line set on the first layer of the circuit board, the fifth pin pad of the third LED display device 63 and the fifth pin pad of the fourth LED display device 64 are connected in parallel based on the circuit connection line set on the first layer of the circuit board, and the tenth pin pad of the third LED display device 63 and the tenth pin pad of the fourth LED display device 64 are connected in parallel based on the circuit connection line set on the first layer of the circuit board;

[0122] The first pin pad of the first LED display device 61 and the first pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board. The second pin pad of the first LED display device 61 and the second pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board. The third pin pad of the first LED display device 61 and the third pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board. The fourth pin pad of the first LED display device 61 and the fourth pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board. The circuit connection lines on the first layer circuit board are connected in parallel with each other, the sixth pin pad of the first LED display device 61 and the sixth pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection lines set on the first layer circuit board, the seventh pin pad of the first LED display device 61 and the seventh pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection lines set on the first layer circuit board, the eighth pin pad of the first LED display device 61 and the first pin pad of the third LED display device 63 are connected in parallel with each other based on the circuit connection lines set on the eighth layer circuit board, the ninth pin pad of the first LED display device 61 and the ninth pin pad of the third LED display device The ninth pin pad of the LED display device 63 is connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board, the first pin pad of the second LED display device 62 and the first pin pad of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board, the second pin pad of the second LED display device 62 and the second pin pad of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board, the third pin pad of the second LED display device 62 and the third pin pad of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection line set on the first layer of the circuit board, and the fourth pin pad of the second LED display device 62 The pin pads and the fourth pin pads of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the sixth pin pads of the second LED display device 62 and the sixth pin pads of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the seventh pin pads of the second LED display device 62 and the seventh pin pads of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection lines set on the first layer of the circuit board, the eighth pin pads of the second LED display device 62 and the first pin pads of the fourth LED display device 64 are connected in parallel with each other based on the circuit connection lines set on the eighth layer of the circuit board,The ninth pin pad of the second LED display device 62 and the ninth pin pad of the fourth LED display device 64 are connected in parallel to each other based on the circuit connection line set on the first layer circuit board.

[0123] In summary, the fourth embodiment of the utility model provides an LED display module, including the LED display device in the second embodiment. By setting the LED display chip to a 4*4 matrix virtual pixel display scheme, the degree of integration is 77% higher than that of the 3*3 matrix virtual pixel display scheme, and the number of pixels mounted per unit time is 16, which effectively solves the problems of long production cycle and complex circuit board wiring of LED display products, reduces production costs, improves product pad space utilization, and improves pixel density, thereby improving the display effect of LED display products; black ink is provided on the first layer of the circuit substrate, which can effectively improve the contrast of the LED display device and improve the display effect of the LED display device; positioning identification ink is provided on the fourth layer of the circuit substrate, which is convenient for the machine to perform rapid identification testing and material editing, thereby improving the production efficiency of LED display products; the circuit board of the LED display module only requires two layers, which effectively reduces the production cost and is conducive to the promotion of LED display products.

[0124] The above is a detailed introduction to an LED display device and an LED display module provided by an embodiment of the utility model. Specific examples are used in this article to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. An LED display device, characterized in that: The LED display device includes a circuit substrate and a plurality of LED display chips; The circuit substrate comprises a four-layer structure, a first layer of the circuit substrate is provided with a plurality of groups of die-bonding pads, and the plurality of LED display chips are connected to the plurality of groups of die-bonding pads correspondingly; The LED display chips include a first LED display chip, a second LED display chip, and a third LED display chip; The plurality of LED display chips are arranged in a 4*4 matrix on the first layer of the circuit substrate, wherein the positions (1,1), (3,1), (2,2), (4,2), (1,3), (3,3), (2,4), and (4,4) in the 4*4 matrix are LED display chips of the first type, the positions (1,2), (3,2), (1,4), and (3,4) in the 4*4 matrix are LED display chips of the second type, and the positions (2,1), (4,1), (2,3), and (4,3) in the 4*4 matrix are LED display chips of the third type.

2. The LED display device according to claim 1, characterized in that: The first type of LED display chip is a red LED display chip, the second type of LED display chip is a green LED display chip, and the third type of LED display chip is a blue LED display chip; Or the first LED display chip is a green LED display chip, the second LED display chip is a blue LED display chip, and the third LED display chip is a red LED display chip; Or the first type of LED display chip is a blue light LED display chip, the second type of LED display chip is a red light LED display chip, and the third type of LED display chip is a green light LED display chip.

3. The LED display device according to claim 1, characterized in that: The plurality of LED display chips are flip chips.

4. The LED display device according to claim 1, characterized in that: A plurality of via holes and a plurality of circuit connection lines are arranged on the first layer, the second layer, the third layer and the fourth layer of the circuit substrate.

5. The LED display device according to claim 4, characterized in that: A plurality of pin pads are arranged on the fourth layer of the circuit substrate.

6. The LED display device according to claim 5, characterized in that: The plurality of pin pads are correspondingly connected to the plurality of groups of die-bonding pads based on corresponding vias and circuit connection lines.

7. The LED display device according to claim 1, characterized in that: Any group of the bonding pads includes an anode bonding pad and a cathode bonding pad, and any LED display chip is provided with an anode and a cathode, the anode of the LED display chip is correspondingly connected to the anode bonding pad, and the cathode of the LED display chip is correspondingly connected to the cathode bonding pad.

8. The LED display device according to claim 1, characterized in that: Black ink is also provided on the first layer of the circuit substrate.

9. The LED display device according to claim 1, characterized in that: Positioning identification ink is also provided on the fourth layer of the circuit substrate.

10. An LED display module, characterized in that: The LED display module comprises the LED display device according to any one of claims 1-9.

Images