Parallel communication multicolor photodiode and photoelectric display screen

Abstract

The utility model discloses a parallel communication multicolor photodiode and a photoelectric display screen, the multicolor photodiode comprises a support, a visible light emitting chip, a three-channel parallel type driving chip and packaging glue, the support comprises a base and a plurality of pins, the top surface of the base is provided with a packaging cavity, and the plurality of pins are arranged on the base; the visible light emitting chip is arranged in the packaging cavity and comprises a red light emitting chip for emitting red light, a green light emitting chip for emitting green light and a blue light emitting chip for emitting blue light; the three-channel parallel type driving chip is arranged in the packaging cavity, the three-channel parallel type driving chip comprises a first channel, a second channel and a third channel, and the plurality of pins are connected to the visible light emitting chip and the three-channel parallel type driving chip; and the packaging cavity is filled with the packaging adhesive so as to package the three-channel parallel driving chip and the visible light emitting chip. According to the multicolor photodiode provided by the utility model, when a single LED lamp or a plurality of LED lamps are damaged, the normal work of other multicolor photodiodes is not influenced.

Description

Technical Field

[0001] The utility model relates to a photodiode, in particular to a parallel communication magic color photodiode and a photoelectric display screen. Background Art

[0002] With the continuous development of science and technology, photodiodes, as a new generation of light sources, have been applied more and more widely and have penetrated into people's work and life. In the field of optoelectronic display, photodiodes, as important light-emitting components, play a vital role.

[0003] Due to the limitations of their control chips, general color photodiodes can only be used for serial communication. Although this communication method is simple and efficient, it also has certain defects. In display applications, if one or more color photodiodes are damaged, all the color diodes in the entire serial communication circuit will fail, causing the display to not work properly, affecting the user experience.

[0004] In order to solve this problem, some manufacturers have launched a magic color photodiode with a backup communication function. This type of diode has a backup communication circuit added during design. When one photodiode is damaged, the backup communication circuit will start, so that other undamaged diodes can still work normally, thus ensuring the use of the entire display. When two or more magic color photodiodes are damaged, all the magic color diodes on the series communication circuit will fail.

[0005] However, the color photodiode with backup communication function has a complex structure and limited size, and cannot be smaller than 2mm, which may cause certain restrictions for some precision electronic products with strict size requirements. Utility Model Content

[0006] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the purpose of the utility model is to provide a parallel communication magic color photodiode and a photoelectric display screen.

[0007] To achieve the above-mentioned purpose, on the one hand, the colorful photodiodes for parallel communication according to the embodiment of the utility model include:

[0008] A bracket, the bracket comprising a base and a plurality of pins, the top surface of the base having a packaging cavity, and the plurality of pins being arranged on the base;

[0009] A visible light emitting chip, wherein the visible light emitting chip is arranged in the packaging cavity, and the visible light emitting chip comprises a red light emitting chip for emitting red light, a green light emitting chip for emitting green light, and a blue light emitting chip for emitting blue light;

[0010] A three-channel parallel driver chip, the three-channel parallel driver chip is arranged in the packaging cavity, the three-channel parallel driver chip includes a first channel, a second channel and a third channel, a plurality of the pins are connected to the visible light emitting chip and the three-channel parallel driver chip, the red light emitting chip is connected to the first channel, the green light emitting chip is connected to the second channel, and the blue light emitting chip is connected to the third channel;

[0011] Packaging glue is filled in the packaging cavity to package the three-channel parallel driving chip and the visible light emitting chip.

[0012] According to the parallel communication phantom color photodiode provided by the embodiment of the utility model, a three-channel parallel high-type driver chip is used inside to drive each light-emitting chip. In applications such as display screens, multiple phantom color photodiodes can use a parallel communication method, thereby solving the problem that when a single or multiple LED lamps are damaged, the normal operation of other phantom color photodiodes is not affected, thereby ensuring the use of the entire display screen. In addition, the phantom color photodiode has a simple structure and can ensure a small size package, thereby adapting to precision electronic products with strict size requirements such as display screens.

[0013] In addition, the colorful photodiodes for parallel communication according to the above embodiments of the utility model may also have the following additional technical features:

[0014] According to an embodiment of the utility model, the number of the pins is three, and the three pins are a positive power pin, a negative power pin and a signal input pin;

[0015] The positive power pin has a first welding area located in the packaging cavity, the negative power pin has a second welding area located in the packaging cavity, and the signal input pin has a third welding area located in the packaging cavity;

[0016] The three-channel parallel driving chip is arranged in the second welding area and / or the third welding area, and the three-channel parallel driving chip, the red light emitting chip, the green light emitting chip, and the blue light emitting chip are arranged at intervals in the first welding area.

[0017] According to an embodiment of the present invention, the area of ​​the first welding region covers more than one half of the bottom area of ​​the packaging cavity.

[0018] According to an embodiment of the utility model, the three-channel parallel driving chip includes a positive terminal, a negative terminal, a signal input terminal, a first driving terminal, a second driving terminal and a third driving terminal;

[0019] The positive terminal is electrically connected to the first welding area, the negative terminal is electrically connected to the second welding area, and the signal input terminal is electrically connected to the third welding area;

[0020] One end of the first channel, the second channel and the third channel are commonly connected to the negative terminal, the other end of the first channel serves as the first driving end, and the first driving end is electrically connected to the negative electrode of the red light emitting chip, the other end of the second channel serves as the second driving end, and the second driving end is electrically connected to the negative electrode of the green light emitting chip, and the other end of the third channel serves as the third driving end, and the third driving end is electrically connected to the negative electrode of the blue light emitting chip;

[0021] The positive electrodes of the red light emitting chip, the green light emitting chip and the blue light emitting chip are all electrically connected to the first welding area.

[0022] According to one embodiment of the utility model, the positive power pin also has a positive welding area located on the bottom surface of the base, which is used to connect the positive electrode of the external driving power supply, the negative power pin has a negative welding area located on the bottom surface of the base, which is used for the negative electrode of the external driving power supply, and the signal input pin has a signal input welding area located on the bottom surface of the base, which is used to connect the external control circuit.

[0023] According to an embodiment of the present invention, the base is covered over the plurality of pins by an injection molding process to form an integrated structure.

[0024] According to an embodiment of the utility model, the bottom surface of the three-channel parallel drive chip is fixed to the second welding area and / or the third welding area by means of insulating adhesive;

[0025] The positive electrode of the red light emitting chip is located on the bottom surface of the red light emitting chip, and the bottom surface of the red light emitting chip is fixed to the first welding area by conductive silver glue, and the bottom surfaces of the green light emitting chip and the blue light emitting chip are fixed to the first welding area by insulating glue.

[0026] According to an embodiment of the present invention, the pin is made of copper, and the surface of the pin has a silver-plated layer.

[0027] On the other hand, the optoelectronic display screen according to the embodiment of the utility model has a plurality of the above-mentioned magic color photodiodes communicating in parallel, and the plurality of the magic color photodiodes communicating in parallel are driven in a parallel communication manner.

[0028] According to the optoelectronic display screen provided by the embodiment of the utility model, the above-mentioned photodiodes are used. When a single or part of the diodes are damaged, the use of the entire display screen is not affected, and more reliable and stable performance can be achieved.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1 It is a top view schematic diagram of the parallel communication fantasy color photodiode (with the packaging glue removed) of the embodiment of the utility model;

[0032] Figure 2 It is a pin diagram of the magic color photodiode for parallel communication in the embodiment of the utility model;

[0033] Figure 3 It is a bottom schematic diagram of a magic color photodiode for parallel communication according to an embodiment of the utility model;

[0034] Figure 4 It is an equivalent circuit diagram of the colorful photodiodes for parallel communication according to the embodiment of the utility model.

[0035] Reference numerals:

[0036] 10. Bracket;

[0037] 101. Base;

[0038] 102, power positive pin;

[0039] 102a, first welding area;

[0040] 102b, positive electrode welding area;

[0041] 102c, vacant area;

[0042] 103, power negative pin;

[0043] 103a, second welding area;

[0044] 103b, negative electrode welding area;

[0045] 104, signal input pin;

[0046] 104a, third welding area;

[0047] 104b, signal input pad;

[0048] 20. Three-channel parallel driver chip;

[0049] 30. Red light emitting chip;

[0050] 31. Green light emitting chip;

[0051] 32. Blue light emitting chip.

[0052] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0053] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0054] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0058] The following describes in detail the parallel communication colorful photodiode and photoelectric display screen of the embodiment of the utility model with reference to the accompanying drawings.

[0059] Reference Figures 1 to 4 As shown, the colorful photodiode for parallel communication provided according to the embodiment of the utility model includes a bracket 10, a visible light emitting chip, a three-channel parallel driving chip 20 and a packaging adhesive.

[0060] Specifically, the bracket 10 includes a base 101 and a plurality of pins, the top surface of the base 101 has a packaging cavity, and the plurality of pins are arranged on the base 101. Exemplarily, the base 101 is a rectangular structure, and a rectangular or circular packaging cavity is provided in the central area of ​​the top surface to accommodate a visible light emitting chip, a three-channel parallel driver chip 20 and a packaging glue. The base 101 material can be made of a plastic material with excellent electrical insulation performance and high temperature resistance, such as polybutylene terephthalate (PBT) engineering plastics. The pins are usually made of a metal conductive material, which is used to connect to the visible light emitting chip, the three-channel parallel driver chip 20 and the external circuit. In production and processing, an injection molding process can be used to make the base 101 injection molded and wrapped around the pins to achieve a stable integrated structure.

[0061] The visible light emitting chip is arranged in the packaging cavity, and the visible light emitting chip includes a red light emitting chip 30 for emitting red light, a green light emitting chip 31 for emitting green light, and a blue light emitting chip 32 for emitting blue light. The three light emitting chips of different colors can form different light effects by mixing.

[0062] A three-channel parallel driver chip 20 is disposed in the packaging cavity, and the three-channel parallel driver chip 20 includes a first channel, a second channel and a third channel. A plurality of pins are connected to the visible light emitting chip and the three-channel parallel driver chip 20. The red light emitting chip 30 is connected to the first channel, the green light emitting chip 31 is connected to the second channel, and the blue light emitting chip 32 is connected to the third channel.

[0063] That is to say, the three-channel parallel driving chip 20 has three independent and parallel first channels, second channels and third channels, corresponding to the three light emitting channels of red light, green light and blue light respectively.

[0064] The three channels are responsible for controlling the red, green and blue light-emitting chips respectively, realizing independent modulation of the three primary colors of light, thereby producing different color mixing effects. The first channel independently controls the light-emitting parameters of the red light-emitting chip 30, the second channel independently controls the light-emitting parameters of the green light-emitting chip 31, and the third channel independently controls the light-emitting parameters of the blue light-emitting chip 32. The output currents of the above three channels can be dynamically adjusted by analog or digital control signals outside the chip, thereby realizing continuous and stepless adjustment of the brightness of the corresponding light-emitting chip.

[0065] In the specific working process, first, the external microcontroller or digital circuit calculates the required ratio of the three primary colors of red, green, and blue according to the color to be synthesized, and sends the corresponding analog or digital control signals to the three channels respectively. After receiving the control signal, the control circuits inside the three channels adjust the output constant current value accordingly, so that the brightness of the red, green, and blue light-emitting chips changes according to the preset ratio value. The three different primary color lights are superimposed with corresponding brightness intensities, and after color mixing and subsequent uniform mixing of the encapsulation glue, the target color can be finally produced. By changing the value of the control signal, the brightness ratio of the three primary colors can be dynamically changed, thereby realizing stepless color adjustment and the synthesis of multiple color light effects.

[0066] The packaging glue is filled in the packaging cavity to encapsulate the three-channel parallel drive chip 20 and the visible light emitting chip. For example, the packaging glue can be a two-component epoxy resin glue with excellent optical properties and weather resistance, and the two-component epoxy resin glue is transparent or translucent. The above-mentioned visible light emitting chip and the three-channel parallel drive chip 20 can be fully encapsulated therein, providing excellent protection and isolation.

[0067] According to the parallel communication phantom color photodiode provided by the embodiment of the utility model, a three-channel parallel high-type driver chip is used inside to drive each light-emitting chip. In applications such as display screens, multiple phantom color photodiodes can use a parallel communication method, thereby solving the problem that when a single or multiple LED lamps are damaged, the normal operation of other phantom color photodiodes is not affected, thereby ensuring the use of the entire display screen. In addition, the phantom color photodiode has a simple structure and can ensure a small size package, thereby adapting to precision electronic products with strict size requirements such as display screens.

[0068] In one embodiment of the present invention, there are three pins, which are a positive power pin 102 , a negative power pin 103 , and a signal input pin 104 .

[0069] The positive power pin 102 has a first welding area 102a located in the packaging cavity, the negative power pin 103 has a second welding area 103a located in the packaging cavity, and the signal input pin 104 has a third welding area 104a located in the packaging cavity.

[0070] The three-channel parallel driver chip 20 is disposed in the second welding area 103a and / or the third welding area 104a, and the red light emitting chip 30, the green light emitting chip 31, and the blue light emitting chip 32 are disposed in the first welding area 102a at intervals.

[0071] In this embodiment, the positive power pin 102 and the negative power pin 103 provide positive power for the entire photodiode. The portion of the positive power pin 102 extending into the package cavity forms a first welding area 102a. The red light emitting chip 30, the green light emitting chip 31 and the blue light emitting chip 32 are all arranged on this first welding area 102a, which is convenient for forming an electrical connection with the positive power pin 102. The negative power pin 103 also forms a second welding area 103a in the portion extending into the package cavity, and the signal input pin 104 is a pin for providing a control signal to the three-channel parallel driver chip 20. It forms a third welding area 104a in the package cavity. The three-channel parallel driver chip 20 is welded on the second welding area 103a and / or the third welding area 104a, which is convenient for connecting the negative power pin 103 and the signal input pin 104.

[0072] In the manufacturing process, the three-channel parallel driver chip 20 can be fixed to the second welding area 103a and / or the third welding area 104a by bonding or welding, and the three visible light emitting chips can be fixed to the first welding area 102a by bonding or welding at intervals. Then, according to the predetermined electrical wiring diagram requirements, the three-channel parallel driver chip 20 and each end of the visible light emitting chip are welded to the corresponding first welding area 102a, second welding area 103a, and third welding area 104a, and finally the entire packaging cavity is filled with protective packaging colloid to fix the molding.

[0073] This layout method reasonably allocates the positive power pin 102, the negative power pin 103, and the signal input pin 104, ensuring the normal power supply and control of the three-channel parallel driver chip 20 and each visible light emitting chip, and ensuring the stability and reliability of the overall electrical system.

[0074] In an embodiment of the present invention, the area of ​​the first welding region 102a covers more than one half of the bottom area of ​​the packaging cavity.

[0075] In this embodiment, the area of ​​the first welding area 102a is large enough to cover more than half of the area of ​​the bottom of the packaging cavity. In this way, on the one hand, the heat dissipation capacity of the visible light emitting chip is improved. By designing the first welding area 102a to be large enough. The contact area between the visible light emitting chip and the first welding area 102a can be increased, thereby improving the heat dissipation efficiency of the visible light emitting chip. The heat generated during the light emitting process can be quickly diffused outward by the first welding area 102a through good heat conduction, avoiding heat accumulation and excessive temperature rise. On the other hand, sufficient layout space for visible light emitting chips is provided. The larger area of ​​the first welding area 102a provides sufficient space for the layout of the three light emitting chips of red, green and blue, and the distance between each light emitting chip can be appropriately opened in the first welding area 102a to avoid being too compact and affecting the light effect.

[0076] In one embodiment of the present invention, a three-channel parallel driving chip includes a positive terminal vdd, a negative terminal gnd, a signal input terminal din, a first driving terminal out1, a second driving terminal out2 and a third driving terminal out3.

[0077] The positive terminal vdd is electrically connected to the first welding area 102a, the negative terminal gnd is electrically connected to the second welding area 103a, and the signal input terminal din is electrically connected to the third welding area 104a.

[0078] One end of the first channel, the second channel and the third channel are commonly connected to the negative terminal gnd, the other end of the first channel serves as the first driving end out1, and the first driving end out1 is electrically connected to the negative electrode of the red light emitting chip 30, the other end of the second channel serves as the second driving end out2, and the second driving end out2 is electrically connected to the negative electrode of the green light emitting chip 31, and the other end of the third channel serves as the third driving end out3, and the third driving end out3 is electrically connected to the negative electrode of the blue light emitting chip 32.

[0079] The positive electrodes of the red light emitting chip 30, the green light emitting chip 31, and the blue light emitting chip 32 are all electrically connected to the first welding area 102a. For example, the electrical connection between each end of these chips and the welding area can be achieved by bonding wire welding to achieve reliable electrical connection.

[0080] Specifically, the positive terminal vdd and the negative terminal gnd of the three-channel parallel driving chip are connected to the first welding area 102a and the second welding area 103a respectively, so as to receive positive and negative DC power from the outside, which provides the required operating voltage for the internal circuit of the three-channel parallel chip and the visible light emitting chip.

[0081] The signal input terminal din is connected to the third pad 104a and is used to receive control signals from an external microcontroller or digital circuit. These control signals are usually transmitted in PWM (pulse width modulation) or digital bus encoding, and include parameters such as the brightness ratio of the desired RGB three primary colors.

[0082] The three-channel parallel driver chip has a decoding circuit inside, which can analyze the control signal data from the signal input terminal din in real time and extract the red, green and blue brightness ratio parameters corresponding to the target color. According to the brightness ratio parameters obtained by decoding, the three channels (the first channel, the second channel and the third channel) respectively adjust their output duty cycle, that is, the length of the conduction time. The higher the duty cycle, the longer the conduction time, and the greater the output current.

[0083] The driving ends of the first channel, the second channel and the third channel (i.e., the first driving end out1, the second driving end out2 and the third driving end out3) are respectively connected to the negative electrodes of the red light emitting chip 30, the green light emitting chip 31 and the blue light emitting chip 32. When the channel is turned on, a certain current will flow from the driving end, and the light emitting chip will be driven through the loop formed by the positive and negative electrodes of the light emitting chip.

[0084] Since the three channels are independently controllable, the current of the three driving ends can be adjusted separately, and then the brightness of the red / green / blue light-emitting chips can be controlled separately. After the red, green and blue light emitted by the three light-emitting chips are evenly mixed by the packaging glue, the visual effect of the target color can be finally synthesized. By changing the duty cycle of the three channels in real time, the proportion of the three primary colors can be dynamically adjusted to achieve stepless color change and multiple color gradient effects.

[0085] In general, the three-channel parallel independent drive design, with the help of PWM or digital control signals, internal decoding circuits and independently controllable three-way output channels, can accurately adjust the brightness ratio of the RGB primary color light-emitting chips and mix them into color light effects in an infinite number of states, achieving high-precision and high-flexibility intelligent dimming control.

[0086] In addition, in some embodiments, the three-channel parallel driver chip has a built-in gamma calibration algorithm to improve the grayscale level and realize high grayscale drive display. The address can be encoded through an external burning device, and the LED drive can be controlled through parallel communication of the single-chip microcomputer to realize the individual grayscale and cascade control of the chip, and the constant current value and pulse width modulation grayscale value output by each driver end can be set separately through commands.

[0087] In one embodiment of the utility model, the positive power pin 102 also has a positive electrode welding area 102b located on the bottom surface of the base 101, which is used to connect the positive electrode of the external driving power supply. The negative power pin 103 has a negative electrode welding area 103b located on the bottom surface of the base 101, which is used for the negative electrode of the external driving power supply. The signal input pin 104 has a signal input welding area 104b located on the bottom surface of the base 101, which is used to connect the external control circuit.

[0088] In this embodiment, in addition to the above-mentioned three pins forming the first welding area 102a, the second welding area 103a and the third welding area 104a in the packaging cavity to connect the three-channel parallel driving chip and the visible light emitting chip, the three pins are also provided with corresponding welding areas at the bottom of the base 101, namely the positive electrode welding area 102b, the negative electrode welding area 103b and the signal input welding area 104b, which are used to connect to the external circuit.

[0089] Specifically, the positive power pin 102 forms a positive electrode welding area 102b on the bottom surface of the base 101. This metal pad area can be directly welded to the positive electrode of the external driving power supply to supply the positive voltage to the entire photodiode system. The negative power pin 103 forms a negative electrode welding area 103b on the bottom surface of the base 101. This metal pad area can be connected to the negative electrode of the external driving power supply to provide a negative reference voltage and current loop for the system. The signal input pin 104 also forms a signal input welding area 104b on the bottom surface of the base 101. This metal pad area is used to connect to the signal output end of the external control circuit or microcontroller to receive a PWM dimming signal or a digital control bus signal that controls the color of the photodiode.

[0090] With the above structure, each positive electrode welding area 102b, negative electrode welding area 103b and signal input welding area 104b are integrated with the corresponding pins and base 101 to form an integrated structure, which realizes a highly integrated connection between the photodiode and the external power supply and control circuit, and is conducive to modular assembly. In addition, it is worth mentioning that the pins do not extend out of the base 101, so that it can meet the high-precision requirements of matrix diode arrangement in products such as display screens.

[0091] Exemplarily, the positive power pin 102 also forms a vacant area 102 c on the bottom surface of the base 101 .

[0092] It is understandable that in some other embodiments, the pins may also extend outward to form electrodes connected to the outside, which may be selected according to specific application requirements.

[0093] Preferably, the base 101 is coated on the outside of the plurality of pins by an injection molding process to form an integrated structure. During injection molding, the plastic shell of the base 101 will tightly cover the pins, and the plastic and the metal will completely bite each other, forming an extremely strong integrated structure. It can ensure that there is no gap between the base 101 and the pins, thereby greatly improving the overall sealing. It effectively prevents the intrusion of external pollutants such as dust and water vapor. In addition, after the pins are integrated with the base 101, the overall size can be made more compact, which is conducive to high-precision design.

[0094] In one embodiment of the present invention, the bottom surface of the three-channel parallel driving chip is fixed to the second welding area 103a and / or the third welding area 104a by means of insulating adhesive.

[0095] The positive electrode of the red light emitting chip 30 is located at the bottom surface of the red light emitting chip 30, and the bottom surface of the red light emitting chip 30 is fixed to the first welding area 102a by conductive silver glue, and the bottom surfaces of the green light emitting chip 31 and the blue light emitting chip 32 are fixed to the first welding area 102a by insulating glue.

[0096] In this embodiment, the bottom surface of the three-channel parallel driver chip 20 is fixed to the second welding area 103a and the third welding area 104a by insulating glue. The insulating glue can form a layer of insulating medium between the three-channel parallel driver chip 20 and the second welding area 103a and the third welding area 104a to prevent the three-channel parallel driver pins from short-circuiting with the metal welding area and causing electrical failure. At the same time, the insulating glue can firmly fix the three-channel parallel driver chip 20 on the surface of the second welding area 103a and the third welding area 104a. The insulating glue has good thermal conductivity, which helps the three-channel parallel driver chip 20 to quickly transfer heat when working and achieve efficient heat dissipation. Through this insulating glue bonding method, the reliability and stability of the connection between the three-channel parallel driver chip 20 and the second welding area 103a and / or the third welding area 104a can be ensured.

[0097] Different welding methods are used for the three light-emitting chips. The positive electrode of the red light-emitting chip 30 is located on its bottom surface, so a conductive silver glue is used to bond and fix its bottom surface to the first welding area 102a. The conductive silver glue contains conductive fillers such as silver powder, which can form a good electrical connection between the red light-emitting chip 30 and the first welding area 102a. At the same time, the conductive silver glue also has excellent thermal conductivity, which is beneficial for the red light-emitting chip 30 to quickly transfer heat to the first welding area 102a. The positive electrodes of the green light-emitting chip 31 and the blue light-emitting chip 32 are at the top, so their bottom surfaces are bonded and fixed to the first welding area 102a by insulating glue. The role of the insulating glue is to firmly fix the chip and play an electrical insulation role to prevent the chip pins from short-circuiting. This classified bonding method fully combines the characteristics of different chip structures, while ensuring reliable electrical connection and excellent heat dissipation, it also reduces manufacturing costs.

[0098] Preferably, the pin is made of copper, and the surface of the pin has a silver coating. The copper pin has good electrical conductivity, can reduce the resistance value of the circuit, and improve the transmission efficiency of the circuit. Processing a layer of silver coating on the surface of the pin can further improve the electrical conductivity of the pin. The silver coating has good anti-oxidation and anti-corrosion properties, can protect the surface of the pin, and avoid circuit failures due to oxidation or corrosion. In addition, the surface of the silver coating is smooth and clean, can provide good welding performance, and make the welding of the pin and other components more stable and reliable. At the same time, the surface of the silver coating also has good reflectivity, which can improve the optical performance of the photodiode.

[0099] The embodiment of the utility model further provides a photoelectric display screen having a plurality of the above-mentioned magic color photodiodes communicating in parallel, and the plurality of the magic color photodiodes communicating in parallel are driven in a parallel communication manner.

[0100] According to the optoelectronic display screen provided by the embodiment of the utility model, the above-mentioned photodiodes are used. When a single or part of the diodes are damaged, the use of the entire display screen is not affected, and more reliable and stable performance can be achieved.

[0101] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0102] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A colorful photodiode for parallel communication, characterized in that: include: A bracket, the bracket comprising a base and a plurality of pins, the top surface of the base having a packaging cavity, and the plurality of pins being arranged on the base; A visible light emitting chip, wherein the visible light emitting chip is arranged in the packaging cavity, and the visible light emitting chip comprises a red light emitting chip for emitting red light, a green light emitting chip for emitting green light, and a blue light emitting chip for emitting blue light; A three-channel parallel driver chip, the three-channel parallel driver chip is arranged in the packaging cavity, the three-channel parallel driver chip includes a first channel, a second channel and a third channel, a plurality of the pins are connected to the visible light emitting chip and the three-channel parallel driver chip, the red light emitting chip is connected to the first channel, the green light emitting chip is connected to the second channel, and the blue light emitting chip is connected to the third channel; Packaging glue is filled in the packaging cavity to package the three-channel parallel driving chip and the visible light emitting chip.

2. The parallel communication magic color photodiode according to claim 1, characterized in that: There are three pins, which are a positive power pin, a negative power pin and a signal input pin; The positive power pin has a first welding area located in the packaging cavity, the negative power pin has a second welding area located in the packaging cavity, and the signal input pin has a third welding area located in the packaging cavity; The three-channel parallel driving chip is arranged in the second welding area and / or the third welding area, and the red light emitting chip, the green light emitting chip and the blue light emitting chip are arranged in the first welding area at intervals.

3. The parallel communication magic color photodiode according to claim 2, characterized in that: The area of ​​the first welding region covers more than one half of the bottom area of ​​the packaging cavity.

4. The parallel communication magic color photodiode according to claim 2, characterized in that: The three-channel parallel driving chip includes a positive terminal, a negative terminal, a signal input terminal, a first driving terminal, a second driving terminal and a third driving terminal; The positive terminal is electrically connected to the first welding area, the negative terminal is electrically connected to the second welding area, and the signal input terminal is electrically connected to the third welding area; One end of the first channel, the second channel and the third channel are commonly connected to the negative terminal, the other end of the first channel serves as the first driving end, and the first driving end is electrically connected to the negative electrode of the red light emitting chip, the other end of the second channel serves as the second driving end, and the second driving end is electrically connected to the negative electrode of the green light emitting chip, and the other end of the third channel serves as the third driving end, and the third driving end is electrically connected to the negative electrode of the blue light emitting chip; The positive electrodes of the red light emitting chip, the green light emitting chip and the blue light emitting chip are all electrically connected to the first welding area.

5. The colorful photodiode for parallel communication according to claim 2, characterized in that: The positive power pin also has a positive welding area located on the bottom surface of the base, which is used to connect the positive electrode of the external driving power supply. The negative power pin has a negative welding area located on the bottom surface of the base, which is used for the negative electrode of the external driving power supply. The signal input pin has a signal input welding area located on the bottom surface of the base, which is used to connect the external control circuit.

6. The colorful photodiode for parallel communication according to claim 1, characterized in that: The base is covered on the outside of the plurality of pins through an injection molding process to form an integrated structure.

7. The colorful photodiode for parallel communication according to claim 2, characterized in that: The bottom surface of the three-channel parallel drive chip is fixed to the second welding area and / or the third welding area by bonding with insulating adhesive; The positive electrode of the red light emitting chip is located on the bottom surface of the red light emitting chip, and the bottom surface of the red light emitting chip is fixed to the first welding area by conductive silver glue, and the bottom surfaces of the green light emitting chip and the blue light emitting chip are fixed to the first welding area by insulating glue.

8. The colorful photodiode for parallel communication according to claim 1, characterized in that: The pin is made of copper, and the surface of the pin has a silver-plated layer.

9. A photoelectric display screen, characterized in that: A plurality of colorful photodiodes communicating in parallel as claimed in any one of claims 1 to 8 are provided, and the plurality of colorful photodiodes communicating in parallel are driven in a parallel communication manner.

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