Integrated COB light source substrate

Abstract

The utility model relates to the technical field of COB light source substrates, in particular to an integrated COB light source substrate which comprises a bottom plate, a protective layer is fixedly connected to the surface of the bottom plate, LED wafers are fixedly connected to the interior of the bottom plate at equal intervals, a heat dissipation assembly is arranged at the bottom of the bottom plate, and a positioning assembly is arranged on the outer side of the bottom plate. The heat dissipation assembly comprises heat dissipation fins and heat conduction fins, the heat dissipation fins are arranged at the bottom of the bottom plate, and the heat conduction fins are arranged at the bottoms of the heat dissipation fins. According to the COB surface light source, through the arrangement of the heat dissipation assembly, under the cooperation of the heat dissipation fins and the heat conducting fins, efficient heat dissipation of the COB surface light source can be achieved, the heat dissipation efficiency of the COB surface light source is effectively improved, normal use of the COB surface light source can be ensured, the COB surface light source is prevented from being damaged due to too high heat, and the service life of the COB surface light source is prolonged; through the arrangement of the positioning assembly, the COB light source is not easy to slip, so that the COB light source is not easy to damage, repeated positioning is not needed, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light source substrates, in particular to an integrated COB light source substrate. Background Art

[0002] With the development of LED light source packaging technology, a new type of LED light source device, namely COB (chip on board packaging) light source device, has received more and more attention. COB light source device is a light source device that directly mounts multiple chips on the surface of the heat dissipation substrate through a die-bonding adhesive. It has the characteristics of low cost, high light efficiency, uniform light color and ease of use. At the same time, COB light sources are favored by the market for their advantages such as ease of application and diversified design.

[0003] After searching, the patent application number is (202321292030.5), which discloses "an integrated COB light source", which solves the problem that existing electronic lighting products such as decorative lamps, lighting lamps, and projection lamps tend to be lighter and smaller in size;

[0004] However, the above device has the following problems: when using LED lamps for projection lighting, the light-emitting components on the COB light source substrate emit light, and then the light is projected through the reflective components. However, since the power of the LED lamp is relatively large during projection lighting, the light-emitting components on the COB light source substrate emit light and generate a large amount of heat. After the COB light source substrate is used for a long time, heat may accumulate inside the lampshade, thereby affecting the service life of the COB light source substrate and causing a high failure rate of the COB light source substrate. For this reason, we propose an integrated COB light source substrate to solve the above problems. Utility Model Content

[0005] The utility model aims to provide an integrated COB light source substrate to solve the problem in the above background technology that the COB light source substrate may accumulate heat after long-term use, thereby affecting the service life of the COB light source substrate.

[0006] To achieve the above object, the utility model provides the following technical solution: an integrated COB light source substrate, comprising a bottom plate, a protective layer fixedly connected to the surface of the bottom plate, LED chips fixedly connected to the inside of the bottom plate at equal intervals, a heat dissipation component arranged at the bottom of the bottom plate, and a positioning component arranged on the outside of the bottom plate;

[0007] The heat dissipation assembly comprises heat dissipation fins and heat conductive sheets. The bottom of the base plate is provided with heat dissipation fins, and the bottom of the heat dissipation fins is provided with heat conductive sheets.

[0008] Preferably, the positioning assembly includes a first positioning hole, a connecting plate, a connecting hole and a second positioning hole. The first positioning hole is opened on the left and right sides of the base plate, and connecting holes are opened on the front and back sides of the base plate. The base plates are fixedly connected to each other, and the front and back sides of the two groups of base plates are fixedly connected with connecting plates, and the second positioning hole is opened in the connecting plate.

[0009] Preferably, the upper end of the heat dissipation fin is located at the center position of the bottom of the base plate and is fixedly connected with the heat dissipation fin, and the upper end of the heat conductive sheet is fixedly connected with the heat dissipation fin.

[0010] Preferably, connection points are symmetrically arranged on both sides of the surface of the bottom plate, a positive pole mark is fixedly connected to the left surface of the bottom plate, and a negative pole mark is fixedly connected to the right surface of the bottom plate.

[0011] Preferably, a certain gap is left between the heat dissipation fins, and the position of the gap corresponds to the position of the LED chip one by one.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model can achieve efficient heat dissipation of COB surface light sources through the arrangement of heat dissipation components, with the cooperation of heat dissipation fins and heat conductive sheets, effectively improve the heat dissipation efficiency of COB surface light sources, ensure the normal use of COB surface light sources, prevent the COB surface light sources from being damaged due to excessive heat, and extend the service life of the COB surface light sources.

[0014] 2. The utility model provides a positioning component, and with the cooperation of the first positioning hole, the connecting plate, the connecting hole and the second positioning hole, a first positioning hole which is concave inwards is provided on the periphery of the bottom plate. The position of the COB light source is determined during the installation process, so that the COB light source is not easy to slip and is not easy to be damaged. Moreover, since the COB light source does not slip, there is no need to repeatedly position the same COB light source, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the heat dissipation component of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the positioning component of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the heat dissipation fins of the utility model.

[0020] In the figure: 1. Base plate; 2. Protective layer; 3. LED chip; 4. Heat dissipation component; 401. Heat dissipation fin; 402. Heat conductive sheet; 5. Positioning component; 501. First positioning hole; 502. Connecting plate; 503. Connecting hole; 504. Second positioning hole; 6. Connecting point; 7. Positive pole marking; 8. Negative pole marking. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model provides an embodiment: an integrated COB light source substrate, comprising a bottom plate 1, a protective layer 2 is fixedly connected to the surface of the bottom plate 1, LED chips 3 are fixedly connected to the inside of the bottom plate 1 at equal intervals, a heat dissipation component 4 is arranged at the bottom of the bottom plate 1, and a positioning component 5 is arranged on the outside of the bottom plate 1;

[0023] The heat dissipation component 4 includes heat dissipation fins 401 and heat conductive sheets 402. The heat dissipation fins 401 are disposed at the bottom of the bottom plate 1, and the heat conductive sheets 402 are disposed at the bottom of the heat dissipation fins 401.

[0024] The device solves the problem that heat may accumulate on the COB light source substrate after long-term use, thereby affecting the service life of the COB light source substrate, by disposing the heat dissipation component 4.

[0025] Furthermore, the positioning assembly 5 includes a first positioning hole 501, a connecting plate 502, a connecting hole 503, and a second positioning hole 504. The first positioning holes 501 are provided on the left and right sides of the bottom plate 1, and the connecting holes 503 are provided on the front and rear sides of the bottom plate 1. The bottom plates 1 are fixedly connected to each other, and the front and rear sides of the two groups of bottom plates 1 are fixedly connected with the connecting plates 502, and the second positioning holes 504 are provided in the connecting plates 502. Figure 3 As shown, the structure is used to quickly position the base plate 1 through the first positioning hole 501 and the second positioning hole 504 to improve installation efficiency.

[0026] Furthermore, the upper end of the heat sink fin 401 is located at the center of the bottom of the base plate 1 and is fixedly connected to the heat sink fin 401, and the upper end of the heat conducting sheet 402 is fixedly connected to the heat sink fin 401. Figure 2 As shown, the structure is used to expand the contact area with the air through the heat dissipation fins 401 and the heat conductive sheet 402, conduct heat generated during the operation of the LED chip 3, and dissipate heat through the heat conductive sheet 402 to extend the service life of the device.

[0027] Furthermore, connection points 6 are symmetrically arranged on both sides of the surface of the bottom plate 1, a positive pole mark 7 is fixedly connected to the left surface of the bottom plate 1, and a negative pole mark 8 is fixedly connected to the right surface of the bottom plate 1. Figure 3 As shown, the structure is used to connect with another group of bottom plates 1 with the same pole adjacent to each other through the connection point 6, so as to facilitate connection, and the positive and negative poles can be distinguished conveniently through the setting of the positive pole mark 7 and the negative pole mark 8.

[0028] Furthermore, a certain gap is left between the heat dissipation fins 401, and the position of the gap corresponds to the position of the LED chip 3. Figure 4 As shown, the structure is used to improve the heat conduction effect of the heat dissipation fins 401 through the arrangement of the heat dissipation fins 401 .

[0029] Working principle: When used, Figure 3 As shown, the positive and negative poles are first distinguished by the positive pole mark 7 and the negative pole mark 8, and the corresponding connection points 6 are connected. Then, the first positioning hole 501 and the second positioning hole 504 on the surface of the bottom plate 1 are used for quick positioning, and the bottom plate 1 is installed. After the installation is completed, as shown in FIG. Figure 2 and Figure 4 As shown, the LED chip 3 generates heat during operation, and the heat on the base plate 1 is absorbed by the heat dissipation fins 401 at the bottom, and is conducted to the thermal conductive sheet 402 through the heat dissipation fins 401, and then the heat is dissipated to the outside through the heat dissipation fins 401 and the thermal conductive sheet 402, which effectively dissipates the heat of the COB surface light source, effectively improves the heat dissipation efficiency of the COB surface light source, and extends the service life of the device. The above is the entire working principle of the utility model.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. An integrated COB light source substrate, comprising a base plate (1), characterized in that: A protective layer (2) is fixedly connected to the surface of the base plate (1), LED chips (3) are fixedly connected to the inside of the base plate (1) at equal intervals, a heat dissipation component (4) is arranged at the bottom of the base plate (1), and a positioning component (5) is arranged on the outside of the base plate (1); The heat dissipation assembly (4) comprises heat dissipation fins (401) and heat conductive sheets (402); the bottom of the base plate (1) is provided with heat dissipation fins (401), and the bottom of the heat dissipation fins (401) is provided with heat conductive sheets (402).

2. The integrated COB light source substrate according to claim 1, characterized in that: The positioning assembly (5) comprises a first positioning hole (501), a connecting plate (502), a connecting hole (503) and a second positioning hole (504); the first positioning holes (501) are provided on the left and right sides of the bottom plate (1); the connecting holes (503) are provided on the front and rear sides of the bottom plate (1); the bottom plates (1) are fixedly connected to each other in pairs; the front and rear sides of two groups of bottom plates (1) are fixedly connected to the connecting plates (502); and the second positioning holes (504) are provided in the connecting plates (502).

3. The integrated COB light source substrate according to claim 1, characterized in that: The upper end of the heat dissipation fin (401) is located at the center of the bottom of the base plate (1) and is fixedly connected to the heat dissipation fin (401), and the upper end of the heat conductive sheet (402) is fixedly connected to the heat dissipation fin (401).

4. The integrated COB light source substrate according to claim 1, characterized in that: Connection points (6) are symmetrically arranged on both sides of the surface of the bottom plate (1), a positive pole mark (7) is fixedly connected to the left surface of the bottom plate (1), and a negative pole mark (8) is fixedly connected to the right surface of the bottom plate (1).

5. The integrated COB light source substrate according to claim 1, characterized in that: A certain gap is left between the heat dissipation fins (401), and the position of the gap corresponds one-to-one to the position of the LED chip (3).

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