Manual test socket suitable for chip development test

Abstract

The utility model relates to a manual test socket suitable for chip development test, which comprises a lower shell, an upper shell and the lower shell are movably connected through a rotating shaft, a mounting groove is arranged in the lower shell, a plurality of probe holes are arranged at the center of the bottom surface of the mounting groove, and probes are connected in the probe holes in a penetrating manner. A guide mounting plate for mounting a chip is connected in the mounting groove, a guide groove is formed in the center of the guide mounting plate, a plurality of through holes are formed in the guide mounting plate, each through hole corresponds to each probe one to one, and a buffer spring is connected between the mounting groove and the guide mounting plate; guide grooves are formed in the four corners of the lower shell, guide holes matched with the guide grooves are formed in the guide mounting plate, guide connecting columns which penetrate through the guide holes to guide and connect the guide mounting plate are connected into the guide grooves, and a pressing block is connected to the upper shell opposite to the guide grooves. According to the utility model, the test efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to a manual test socket suitable for chip development testing. Background Art

[0002] With the development of science and technology, electronic chips have been widely used in various electronic products. After the mass production of chips, it is necessary to test the qualification of the chips to select unqualified chips and retain qualified chips. However, in the current semiconductor chip testing field, the test socket mainly includes a lower test socket body, a test probe and a lower test socket probe holding plate to complete the test of a single-sided pin array chip.

[0003] After searching, the patent: A manual straight pin test socket with adsorption function (CN201821174825.5), including a lower seat and an upper cover, the two are connected by a rotating shaft; the lower seat is provided with a test base, the test base is provided with a chip positioning groove, the chip positioning groove is provided with a plurality of adsorption component mounting through holes, the adsorption component mounting through holes are provided with a suction cup, and the lower seat is provided with an air path through hole on the lower side of the adsorption component mounting through hole; the upper cover is provided with a pressure plate that acts on the test base, and a floating plate is provided on the pressure plate at a position corresponding to the chip positioning groove. The above-mentioned manual test socket is aimed at the problem of reverse installation. Compared with the current chip testing, efficient operation is required, and the above-mentioned structure also needs to be adjusted, which affects the test.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a new structure of manual test socket suitable for chip development and testing, making it more valuable for industrial use. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a manual test socket suitable for chip development testing.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A manual test socket suitable for chip development and testing, comprising a lower shell and an upper shell matched with the lower shell, the upper shell and the lower shell being movably connected by a rotating shaft, a mounting groove is provided in the lower shell, a plurality of probe holes are provided at the center of the bottom surface of the mounting groove, probes are inserted in the probe holes, wherein the upper part of the probe passes through the probe hole and is located in the mounting groove, a guide mounting plate for chip mounting is connected in the mounting groove, a guide groove is provided in the center of the guide mounting plate, a plurality of through holes are provided on the guide mounting plate located in the guide groove, each of the through holes is arranged in a one-to-one correspondence with each probe, a buffer spring is connected between the mounting groove and the guide mounting plate, guide grooves are provided at four corners of the lower shell, a guide hole matching the guide groove is provided on the guide mounting plate, a guide connecting column passing through the guide hole to guide and connect the guide mounting plate is connected in the guide groove, and a pressing block is connected to the upper shell opposite to the guide groove.

[0008] Preferably, in the manual test socket suitable for chip development testing, the mounting groove and the guide mounting plate are both provided with spring grooves for accommodating buffer springs.

[0009] Preferably, in the manual test socket suitable for chip development testing, a torsion spring is connected to the rotating shaft connecting the upper shell and the lower shell.

[0010] Preferably, in the manual test socket suitable for chip development testing, the upper shell is connected to the lower shell by a snap.

[0011] Preferably, in the manual test socket suitable for chip development testing, an upper guide hole is opened in the center of the upper shell, an upper connecting column is connected to the upper guide hole, the upper connecting column passes through the upper guide hole and is connected to the pressure block, and an upper buffer spring is connected between the pressure block and the lower end surface of the upper shell.

[0012] Preferably, in the manual test socket suitable for chip development testing, the pressing block is a pressing block made of plastic material.

[0013] Preferably, in the manual test socket suitable for chip development testing, guide grooves are provided around the guide grooves.

[0014] By means of the above solution, the utility model has at least the following advantages:

[0015] The utility model can quickly test the chip used for development and testing, and effectively improve the test efficiency.

[0016] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the utility model in an open state;

[0020] Figure 3 It is a structural schematic diagram of the lower shell of the utility model. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0023] Example

[0024] like Figure 1 , Figure 2 and Figure 3As shown, a manual test socket suitable for chip development and testing comprises a lower shell 1 and an upper shell 2 matched with the lower shell 1, wherein the upper shell 2 and the lower shell 1 are movably connected via a rotating shaft, a mounting groove 3 is provided in the lower shell 1, a plurality of probe holes 4 are provided at the center of the bottom surface of the mounting groove 3, probes 5 are inserted into the probe holes 4, wherein the upper part of the probes 5 passes through the probe holes and is located in the mounting groove 3, a guide mounting plate 6 for chip mounting is connected in the mounting groove 3, a guide groove 7 is provided at the center of the guide mounting plate 6, A plurality of through holes 8 are provided on the guide mounting plate 6 located in the guide groove 7, and each of the through holes 8 is arranged one-to-one corresponding to each probe 5. A buffer spring 9 is connected between the mounting groove 3 and the guide mounting plate 6. Guide grooves 11 are provided at the four corners of the lower shell 1. A guide hole 12 matching the guide groove is provided on the guide mounting plate 6. A guide connecting column 13 that passes through the guide hole to guide and connect the guide mounting plate 6 is connected in the guide groove 11. A pressure block 14 is connected to the upper shell 2 opposite to the guide groove 7.

[0025] The installation groove 3 and the guide installation plate 6 of the utility model are both provided with a spring groove 10 for assembling the buffer spring 9 .

[0026] In the present invention, a torsion spring is connected to the rotating shaft connecting the upper shell 2 and the lower shell 1 , and the upper shell 2 is connected to the lower shell 1 via a buckle 15 .

[0027] An upper guide hole 16 is provided at the center of the upper shell 2 in the utility model, and an upper connecting column 17 is connected to the upper guide hole 16. The upper connecting column 17 passes through the upper guide hole 16 and is connected to the pressure block 14. An upper buffer spring 18 is connected between the pressure block 14 and the lower end surface of the upper shell 2, wherein the pressure block 14 is a pressure block made of plastic material.

[0028] The guide groove 7 of the utility model is provided with a guide groove around it, which can facilitate the operator to take it quickly.

[0029] The working principle of the utility model is as follows:

[0030] During specific operation, the product (chip to be tested) is placed in the guide groove, and the contact points below the product are aligned with the through holes one by one. Then the upper shell is pressed down, and the product and the guide mounting plate are forced to descend together through the pressure block, so that the probe touches the contact point of the product. Then the upper shell and the lower shell are snapped together through the buckle. At this time, the contact point of the product is completely in contact with the probe. Finally, the socket is connected to the test device to test the product.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0032] In the description of this application, it should be noted that the terms "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0034] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A manual test socket suitable for chip development testing, characterized in that: The invention comprises a lower shell (1) and an upper shell (2) matched with the lower shell (1), wherein the upper shell (2) and the lower shell (1) are movably connected via a rotating shaft, a mounting groove (3) is provided in the lower shell (1), a plurality of probe holes (4) are provided at the center of the bottom surface of the mounting groove (3), probes (5) are inserted into the probe holes (4), wherein the upper part of the probes (5) passes through the probe holes and is located in the mounting groove (3), a guide mounting plate (6) for chip mounting is connected in the mounting groove (3), a guide groove (7) is provided at the center of the guide mounting plate (6), and the probes (5) located in the guide groove (7) are provided in the guide groove (7). A plurality of through holes (8) are provided on the guide mounting plate (6), each of the through holes (8) being arranged in one-to-one correspondence with each probe (5), a buffer spring (9) being connected between the mounting groove (3) and the guide mounting plate (6), guide grooves (11) being provided at four corners of the lower shell (1), a guide hole (12) matching the guide groove being provided on the guide mounting plate (6), a guide connecting column (13) passing through the guide hole to guide and connect the guide mounting plate (6) being connected in the guide groove (11), and a pressure block (14) being connected to the upper shell (2) opposite to the guide groove (7).

2. A manual test socket suitable for chip development testing according to claim 1, characterized in that: The installation groove (3) and the guide installation plate (6) are both provided with a spring groove (10) for installing a buffer spring (9).

3. A manual test socket suitable for chip development testing according to claim 1, characterized in that: A torsion spring is connected to the rotating shaft connecting the upper shell (2) and the lower shell (1).

4. A manual test socket suitable for chip development testing according to claim 1, characterized in that: The upper shell (2) is connected to the lower shell (1) via a buckle (15).

5. A manual test socket suitable for chip development testing according to claim 1, characterized in that: An upper guide hole (16) is provided at the center of the upper shell (2), an upper connecting column (17) is connected to the upper guide hole (16), the upper connecting column (17) passes through the upper guide hole (16) and is connected to the pressure block (14), and an upper buffer spring (18) is connected between the pressure block (14) and the lower end surface of the upper shell (2).

6. A manual test socket suitable for chip development testing according to claim 1, characterized in that: The pressing block (14) is a pressing block made of plastic material.

7. A manual test socket suitable for chip development testing according to claim 1, characterized in that: A guide groove is provided around the guide groove (7).

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