TO type packaging device aging test seat with lossless loading effect

By designing a lossless loading TO-packaged device aging test seat, the lossless loading of device pins is achieved using metal thimbles and elastic telescopic pins, the problems of device pin friction and tin-plated layer damage in the prior art are solved, and good electrical contact and product appearance protection are achieved.

CN222838103UActive Publication Date: 2025-05-06WU XI NENG XIN JIAN CE KE JI YOU XIAN GONG SI
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Patent Information

Application Number
CN202421550091.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-01
Publication Date
2025-05-06
Estimated Expiration
2034-07-01

AI Technical Summary

Technical Problem

The high-temperature test seats for existing TO-2473-pin or 4-pin packaged power devices are prone to cause friction marks on the device pins and damage to the tin-plated layer during installation, affecting electrical contact and product appearance.

Method used

A TO-type packaging device aging test base with a lossless loading effect was designed, and a metal thimble formed point-to-point contact with the pins of the device to be tested was used, and stable contact and simple loading and unloading process was achieved through an elastic telescopic needle device.

Benefits of technology

The lossless loading of device pins is achieved, friction marks and tin-plated layer damage is avoided, the goodness of electrical contact and the integrity of product appearance is ensured, and loading and unloading time and experimental preparation time are reduced.

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Abstract

The utility model relates to a TO-class packaging device aging test seat with a lossless loading effect, and belongs to the technical field of chip aging test equipment. A horizontal accommodating cabin is assembled at the top of a base; a to-be-tested device is clamped in the horizontal accommodating cabin; a groove is formed in the position, located at the pin of the to-be-tested device, of the horizontally-placed containing cabin, and a metal ejector pin is arranged in the groove in a matched mode; one end of the metal ejector pin abuts against the pin of the to-be-tested device, the other end of the metal ejector pin abuts against the limiting fixing block, and the end face, abutting against the pin of the to-be-tested device, of the metal ejector pin is concave. A PCB is arranged on the other side of the limiting fixing block, and the metal ejector pin is arranged on the PCB in a penetrating mode. The PCB is further connected with one end of an elbow metal pin header, the elbow metal pin header is located below the metal ejector pin, and the other end of the elbow metal pin header is connected with the metal pin header female seat. The contact area of the to-be-tested device pin and the metal ejector pin is small, contact friction between the to-be-tested device pin and the metal ejector pin is avoided, and the appearance of the to-be-tested device pin is protected.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip aging test equipment, in particular to an aging test socket for a TO-type packaged device with a lossless loading effect. Background Art

[0002] The test socket mainly plays the role of carrying and fixing the device under test. The multiple metal conductive reeds inside the test socket each connect the PCB circuit routing and the designated corresponding device pins to complete the electrical test function, and can be placed in a high-temperature aging environment as a whole. For the initial aging screening experiment, that is, after each batch of products is produced, a short-term aging screening experiment will be used to first eliminate unqualified devices with electrical index degradation and failure, and then the qualified devices that have passed the assessment experiment will be sent to downstream customers. At present, the high-temperature test socket corresponding to the TO-2473-pin or 4-pin packaged power device relies on the metal reed inside the test socket to clamp the pin end of the device to achieve electrical contact and mechanical fixation. Before the experiment begins, the device is usually installed first. This process is that the pins of the device are pushed into the window of the reed in the test socket from the outside, and gradually inserted into the bottom of the test socket. In this process, since the pins of the device and the corresponding reeds inside the test socket are fully in contact and form friction displacement, there will be friction marks on the pins of the device. Usually, in order to ensure good contact, the clamping force of the metal reed is tight. After the device pins rub against the reed, the tin plating on the surface will be damaged, and defects in the product appearance inspection cannot be avoided. Utility Model Content

[0003] In view of the shortcomings of the above-mentioned existing production technology, the applicant provides a TO-type packaged device aging test socket with a non-destructive loading effect, so that the pin end of the device can achieve good electrical contact with the inside of the test socket and the pin surface can minimize wear and scratches.

[0004] The technical scheme adopted by the utility model is as follows: a TO-type packaged device aging test seat with a non-destructive loading effect, comprising a base, a horizontal placement accommodating chamber is assembled on the top of the base; a device to be tested is clamped in the horizontal placement accommodating chamber; a groove is opened on the horizontal placement accommodating chamber at the pin position of the device to be tested, and a metal ejector is matched and arranged in the groove; one end of the metal ejector is abutted against the pin of the device to be tested, and the other end is abutted against a limit fixing block, and the end surface of the metal ejector abutting against the pin of the device to be tested is concave; a PCB circuit board is arranged on the other side of the limit fixing block, and the metal ejector is penetrated on the PCB circuit board; the PCB circuit board is also connected to one end of the elbow metal pin header, the elbow metal pin header is located below the metal ejector, and the other end of the elbow metal pin header is connected to the metal pin header female seat.

[0005] As a further improvement of the above technical solution:

[0006] Preferably, the metal ejector pin is an elastic telescopic needle-shaped device; the structure of the metal ejector pin is as follows: it includes a base column and a telescopic ejector pin; the base column is a hollow cylinder, an elastic member is installed inside the base column, the top surface of the telescopic ejector pin is concave, and the bottom surface of the telescopic ejector pin is in a fully extended state under the influence of the elastic force of the elastic member inside the base column; the telescopic ejector pin is arranged inside the base column and slidably cooperates with the base column to form a telescopic state; an elastic member is arranged at the bottom of the telescopic ejector pin, and the other end of the elastic member is against the bottom surface of the base column.

[0007] Preferably, the elastic member is a metal spring.

[0008] Preferably, the PCB circuit board and the limiting fixing block are assembled and fixed by a first fixing bolt.

[0009] Preferably, the upper edge of the horizontal storage compartment is vertically assembled and fixed to the base by second fixing bolts.

[0010] Preferably, the horizontal storage chamber is provided with a plurality of slots for placing metal ejectors, each slot is provided with a metal ejector, and every two slots are independent cavities; the number of the metal ejectors matches the number of pins of the device under test.

[0011] Preferably, the structure of the base is: a PEEK base or a ceramic base.

[0012] Preferably, the horizontal placement accommodating chamber is used for placing the device to be tested, and the horizontal placement accommodating chamber is a horizontal placement accommodating chamber made of PEEK high temperature resistant material.

[0013] The beneficial effects of the utility model are as follows:

[0014] The TO-type packaged device aging test socket with non-destructive loading effect of the utility model has a compact and reasonable structure, and the test process is easy to operate. The utility model sets a metal ejector for the pin position of the device to be tested, and sets the metal ejector as an elastic and retractable metal needle-shaped device, and the contact surface of the metal ejector is concave. On this basis, the metal ejector and the pin of the sample to be tested form the same horizontal orientation, and form a point-to-point contact with the end position of the device pin; the concave top can form a good contact with the tip of the device pin and is not easy to deflect and fall off. Since the contact area between the device pin and the metal ejector of the test socket is extremely small, and the tip of the pin of the device to be tested is a mechanical cutting point when the device to be tested is produced and packaged, and there is no tin-plated wrapping layer itself, the contact friction between the two does not produce surface scratches, and the original appearance of the device pin is maintained without any negative impact, thereby achieving non-destructive installation;

[0015] The utility model also has the following advantages:

[0016] (1) The cooperation between the metal ejector pin and the device under test of the utility model no longer requires an additional pressing and fixing device, which greatly reduces the height of the overall test seat, saves space, stabilizes the device, and meets the requirements of aging experiments;

[0017] (2) The cooperation between the metal ejector and the device under test of the utility model utilizes the elastic change of the metal ejector itself. It is only necessary to slowly push the device under test as a whole toward the metal ejector after the elastic top of the telescopic ejector is supported, and at the same time, the device as a whole is pressed down into the horizontal placement and storage chamber below, and then it is completely loaded; when the device needs to be taken out, the device under test is pushed forward toward the ejector and then lifted up, and the device can be ejected from the chamber and unloaded. This form of loading and unloading takes a short time, greatly shortening the preparation time for the experiment;

[0018] (3) The test seat structure of the utility model adopts the form of a base and a horizontal placement storage cabin, which has a good top view and is more convenient for visual inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0020] Figure 2 for Figure 1 main view.

[0021] Figure 3 for Figure 2 Left side view.

[0022] Figure 4 for Figure 2 Top view of the .

[0023] Wherein: 1. Metal pin header; 2. Device to be tested; 3. Horizontal storage compartment; 4. Metal ejector pin; 5. Limiting fixing block; 6. PCB circuit board; 7. Elbow metal pin header; 8. First fixing bolt; 9. Base; 10. Second fixing bolt. DETAILED DESCRIPTION

[0024] The specific implementation of the present utility model is described below in conjunction with the accompanying drawings.

[0025] like Figure 1 to Figure 4As shown, the TO-type packaged device aging test socket with non-destructive loading effect of this embodiment includes a base 9, a horizontal placement accommodating chamber 3 is assembled on the top of the base 9; a device to be tested 2 is clamped in the horizontal placement accommodating chamber 3; a groove is opened on the horizontal placement accommodating chamber 3 at the pin position of the device to be tested 2, and a metal ejector 4 is matched and arranged in the groove; one end of the metal ejector 4 is abutted against the pin of the device to be tested 2, and the other end is abutted against the limiting fixing block 5, and the end surface of the metal ejector 4 abutting against the pin of the device to be tested 2 is concave; a PCB circuit board 6 is arranged on the other side of the limiting fixing block 5, and the metal ejector 4 is penetrated on the PCB circuit board 6; the PCB circuit board 6 is also connected to one end of an elbow metal pin header 7, the elbow metal pin header 7 is located below the metal ejector 4, and the other end of the elbow metal pin header 7 is connected to the metal pin header female seat 1.

[0026] In the present embodiment, the metal ejector pin 4 is an elastic telescopic needle-shaped device; specifically, the structure of the metal ejector pin 4 is as follows: it includes a base column and a telescopic ejector pin; the base column is a hollow cylinder, an elastic member is installed inside the base column, the top surface of the telescopic ejector pin is concave, and the bottom surface of the telescopic ejector pin is in a fully extended state under the influence of the elastic force of the elastic member inside the base column; the telescopic ejector pin is arranged inside the base column and slides with the base column to form a telescopic state.

[0027] In this embodiment, exemplarily, the elastic member is a spring.

[0028] In this embodiment, the PCB circuit board 6 and the limiting fixing block 5 are assembled and fixed by means of a first fixing bolt 8 .

[0029] In this embodiment, the upper edge of the horizontal storage compartment 3 is assembled and fixed to the base 9 via second fixing bolts 10 in the vertical direction.

[0030] In this embodiment, a plurality of slots for placing metal ejector pins 4 are provided on the horizontal placement chamber 3, each slot is provided with a metal ejector pin 4, and every two slots are independent cavities; the number of metal ejector pins 4 matches the number of pins of the device under test 2.

[0031] In this embodiment, illustratively, the structure of the base 9 is: a PEEK base or a ceramic base; the horizontal placement accommodation chamber 3 is used to place the device to be tested 2, and the horizontal placement accommodation chamber 3 is a horizontal placement accommodation chamber made of PEEK high temperature resistant material.

[0032] In actual work, the loading and unloading process of the utility model is as follows:

[0033] During loading: align the pins of the device under test 2 with the top of the metal ejector 4. After the telescopic ejector of the metal ejector 4 is held, slowly push the device under test 2 as a whole in the retracting direction of the telescopic ejector. At the same time, press the device under test 2 as a whole downward into the horizontal placement accommodating chamber 3 below, and finally load it completely.

[0034] When unloading: push the device under test 2 forward for a distance in the retracting direction of the telescopic ejector and then lift it upward, so that the device under test 2 can be ejected from the horizontal storage chamber 3 for unloading.

[0035] The utility model has a reasonable structure and is easy to operate. After the device under test 2 is placed in the horizontal placement accommodating chamber 3 of the utility model, the pin end of the device under test 2 abuts against the concave end of the metal ejector 4, so that the pin end of the device under test 2 and the inside of the test seat can achieve good electrical contact, and the pin surface is free from wear and scratch marks to the greatest extent; at the same time, the metal ejector 4 is used for loading and unloading through the specific elastic telescopic needle structure, which not only ensures the stability of the contact end, but also reduces the time for loading and unloading, thereby shortening the preparation time for the experiment.

[0036] The above description is an explanation of the utility model, not a limitation of the utility model. The scope of the utility model is defined by the claims. Any form of modification can be made within the protection scope of the utility model.

Claims

1. A TO-type package device aging test socket with non-destructive loading effect, characterized in that: The device comprises a base (9), a horizontal placement accommodating chamber (3) is assembled on the top of the base (9); a device to be tested (2) is clamped in the horizontal placement accommodating chamber (3); a groove is formed on the horizontal placement accommodating chamber (3) at the position of the pin of the device to be tested (2), and a metal ejector pin (4) is matched and arranged in the groove; One end of the metal ejector pin (4) abuts against the pin of the device under test (2), and the other end abuts against the limit fixing block (5); the end surface of the metal ejector pin (4) abutting against the pin of the device under test (2) is concave; A PCB circuit board (6) is arranged on the other side of the limit fixing block (5), and the metal ejector pin (4) is inserted into the PCB circuit board (6); the PCB circuit board (6) is also connected to one end of an elbow metal pin header (7), the elbow metal pin header (7) is located below the metal ejector pin (4), and the other end of the elbow metal pin header (7) is connected to the metal pin header female seat (1).

2. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The metal ejector pin (4) is an elastic and retractable needle-shaped device.

3. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 2, characterized in that: The structure of the metal ejector pin (4) is as follows: it comprises a bottom column and a telescopic ejector pin; The bottom column is a hollow cylinder, an elastic member is installed inside the bottom column, the top surface of the telescopic ejector is concave, and the bottom surface of the telescopic ejector is in a fully extended state under the influence of the elastic force of the elastic member inside the bottom column; The telescopic ejector pin is arranged in the bottom column and is slidably matched with the bottom column to form a telescopic state.

4. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 3, characterized in that: The elastic member is a metal spring.

5. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The PCB circuit board (6) and the limiting fixing block (5) are assembled and fixed by means of a first fixing bolt (8).

6. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The upper edge of the horizontal storage compartment (3) is vertically assembled and fixed to the base (9) via a second fixing bolt (10).

7. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The horizontal storage chamber (3) is provided with a plurality of slots for accommodating the metal ejector pins (4), each slot is provided with a metal ejector pin (4), and every two slots are independent cavities.

8. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The number of the metal ejector pins (4) matches the number of pins of the device to be tested (2).

9. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The structure of the base (9) is: a PEEK base or a ceramic base.

10. The TO-type package device aging test socket with non-destructive loading effect as claimed in claim 1, characterized in that: The horizontal placement accommodating chamber (3) is used for placing the device to be tested (2), and the horizontal placement accommodating chamber (3) is a PEEK horizontal placement accommodating chamber.