Aging test tool and aging detection device

Abstract

The utility model provides an aging test tool. The aging test tool comprises a base, a test plate, a cover plate and one or more heat conduction members. The test board is arranged on the base, and one or more test positions used for installing communication modules are arranged on the test board. And the cover plate is detachably connected with the base. The heat conduction piece is arranged on at least one of the cover plate and the base. The heat conduction piece can be used for being thermally coupled with the communication module arranged on the test board so as to export heat of the communication module, so that the communication module is prevented from being overheated, the temperature of the communication module during test is reduced, the test accuracy is improved, and meanwhile, the risk that the communication module is damaged due to overheating is reduced. When the aging test tool is applied to the aging detection device, the test accuracy can also be improved, and the risk of overheating damage of the communication module is reduced at the same time.

Description

Technical Field

[0001] The present application relates to the technical field of electronic product testing, and in particular to an aging test tool and an aging detection device. Background Art

[0002] At present, in order to ensure the reliability of chip products, aging tests are often required to detect chips after they are manufactured. Among them, chip aging test is an electrical stress test method that uses voltage and high temperature to accelerate the electrical failure of devices. It simulates the entire life of the chip operation, thereby exposing defects in the chip as early as possible.

[0003] In the prior art, the high temperature generated during the aging test of the chip will increase the temperature of the chip, which will not only affect the test temperature of the chip and reduce the test accuracy, but also may cause damage to the chip. Utility Model Content

[0004] The embodiments of the present application provide an aging test tool and an aging detection device to at least partially improve the above-mentioned problems.

[0005] The implementation method of the present application is achieved through the following technical solutions.

[0006] On the one hand, an embodiment of the present application provides an aging test fixture, comprising: a base, a test board, a cover plate, and one or more heat-conducting parts. The test board is arranged on the base, and one or more test positions for installing a communication module are arranged on the test board. The cover plate is detachably connected to the base and is used to fix the communication module installed at the test position. The heat-conducting part is arranged on at least one of the cover plate and the base, and is used to be thermally coupled with the communication module installed at the test position.

[0007] In some embodiments, the heat conducting member is protruding from a surface of the cover plate facing the base.

[0008] In some embodiments, each of the test positions is provided with a through hole penetrating the test board, the heat conductor is arranged on the base and embedded in the through hole, and each of the test positions is also provided with a mounting member for installing a communication module, and the mounting member is arranged adjacent to the through hole.

[0009] In some embodiments, the heat conductor is flush with a surface of the test board that is close to the cover plate.

[0010] In some embodiments, the base is provided with a carrying platform, and the test board is detachably arranged on the carrying platform.

[0011] In some embodiments, the supporting platform includes a first platform body, a second platform body and a third platform body, the first platform body and the second platform body are respectively disposed at two ends of the base, and the third platform body is disposed in the middle of the base.

[0012] In some embodiments, a first connection portion is provided at one end of the cover plate, and a second connection portion is provided at the other end; a third connection portion is provided at one end of the base, and a fourth connection portion is provided at the other end, the first connection portion is rotatably connected to the third connection portion, and the second connection portion is detachably connected to the fourth connection portion.

[0013] In some embodiments, the second connection portion and the fourth connection portion are detachably connected via an anti-detachment bolt.

[0014] In some embodiments, the anti-drop bolt is fixedly disposed on the cover plate.

[0015] On the other hand, the embodiment itself also provides an aging detection device, including a power supply unit, a aging box, a communication unit and at least one aging test tool as described above, wherein the aging box is provided with a test space for accommodating the aging test tool, the power supply unit and the communication unit are both arranged in the aging box, and are used to be electrically connected to the aging test tool accommodated in the test space.

[0016] The aging test fixture provided in the embodiment of the present application sets the test board for testing the communication module between the base and the cover plate. Specifically, the communication module can be set on the test board and a heat conductor is set on at least one of the cover plate and the base. The heat conductor can be used to thermally couple with the communication module set on the test board to conduct the heat of the communication module to avoid overheating of the communication module, which is beneficial to reduce the temperature of the communication module during testing, thereby helping to improve the accuracy of the test and reduce the risk of overheating damage to the communication module. When the above-mentioned aging test fixture is applied to the aging detection device, it can also improve the accuracy of the test and reduce the risk of overheating damage to the communication module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the implementation mode of the present application, the drawings required for use in the description of the implementation mode will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A structural block diagram of an aging detection device provided in an embodiment of the present application is shown.

[0019] Figure 2An exploded view of an aging test tool provided in one embodiment of the present application is shown.

[0020] Figure numerals: aging detection device 1, aging test tool 10, base 110, support platform 111, first platform 111a, second platform 111b, third platform 111c, third connecting part 112, fourth connecting part 113, test board 120, test position 121, through hole 122, mounting part 123, cover plate 130, first connecting part 131, second connecting part 132, anti-detachment bolt 133, heat conductor 140, power supply unit 20, aging box 30, test space 310, communication unit 40, communication board 410, computer 420, communication module 2. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the implementation mode of the present application. Obviously, the described implementation mode is only a part of the implementation mode of the utility model, not all the implementation modes. Based on the implementation mode in the utility model, all other implementation modes obtained by those skilled in the art without making creative work are within the scope of protection of the utility model.

[0022] The technical solutions in the implementation modes of the present application will be described clearly and completely below in conjunction with the accompanying drawings in the implementation modes of the present application.

[0023] At present, in order to ensure the reliability of chip products, aging tests are often required to detect chips after they are manufactured. Among them, chip aging test is an electrical stress test method that uses voltage and high temperature to accelerate the electrical failure of devices. It simulates the entire life of the chip operation, thereby exposing defects in the chip as early as possible.

[0024] In the prior art, the high temperature generated during the aging test of the chip will increase the temperature of the chip, which will not only affect the test temperature of the chip and reduce the test accuracy, but also may cause damage to the chip.

[0025] Based on the above questions, please refer to Figure 1 An embodiment of the present application provides an aging detection device 1, which can be used to detect a communication module 2. The aging detection device 1 may include a power supply unit 20, an aging box 30, a communication unit 40, and an aging test tool 10. The communication module 2 to be detected can be installed on the aging test tool 10.

[0026] A test space 310 for accommodating the aging test tool 10 can be set in the aging box 30. It can be understood that since the aging test of the communication module 2 is usually carried out in a high temperature environment, the above-mentioned test space 310 can be a closed independent space. For example, a closed chamber for testing can be set in the aging box 30 to form a test space 310 inside the above-mentioned chamber.

[0027] The power supply unit 20 can be arranged in the aging box 30 and electrically connected to the aging test tooling 10. It should be noted that the embodiment of the present application does not limit the specific form of the power supply unit 20. For example, in one embodiment, the power supply unit 20 can be a battery, and in other embodiments, the power supply unit 20 can be an electrical plug, etc., which can be specifically limited.

[0028] The communication unit 40 can also be arranged in the aging box 30 and electrically connected to the aging test fixture 10. At the same time, the communication unit 40 can also be electrically connected to the power supply unit 20. The communication unit 40 can be used to issue a detection instruction to the aging test fixture 10 and to receive the test result of the aging detection fixture. The embodiment of the present application does not limit the specific form of the communication unit 40. For example, it can be a combination of a communication board 410 and a computer 420. The communication board 410 is electrically connected to the aging test fixture 10, the power supply unit 20 and the computer 420. During the test process, the data can be transmitted to the communication module 2 installed on the aging test fixture 10 through the computer 420, the communication board 410 and the aging test fixture 10 in turn to realize the test of the module.

[0029] See also Figure 2 The aging test fixture 10 can be set in the test space 310 and can be used as a carrier of the communication module 2 that needs to be tested. In this embodiment, the aging test fixture 10 can be used to fix the communication module 2 to facilitate the aging test of the communication module 2.

[0030] The aging test fixture 10 may include a base 110 , a test board 120 , a cover 130 , and one or more heat conducting members 140 . Specifically, the communication module 2 may be disposed on the test board 120 .

[0031] Please continue reading Figure 2 In this embodiment, the test board 120 can be arranged on the base 110 and can be fixed to the base 110 by the cover 130, that is, the test board 120 can be arranged between the base 110 and the cover 130, and one or more test positions 121 for installing the communication module 2 can be arranged on the test board 120. When it is necessary to perform an aging test on the communication module 2, the communication module 2 can be directly installed in the test position 121 for performing the aging test.

[0032] Further, in one embodiment, the test position 121 may be provided with a mounting member 123 for mounting the communication module 2 and a through hole 122 penetrating the test board 120. The embodiment of the present application does not limit the specific form of the mounting member 123. For example, in one embodiment, the mounting member 123 may be a chip ejector pin, and the communication module 2 may be electrically connected to the mounting member 123. In this embodiment, the test position 121 may be a square area, wherein the mounting member 123 may be arranged around a position near the edge of the above-mentioned square area, and the through hole 122 may be arranged in the area surrounded by the mounting member 123, that is, the mounting member 123 may be arranged adjacent to the through hole 122. When the communication module 2 is installed in the test position 121 of the test board 120, at least a portion of the surface of the communication module 2 close to the test board 120 may correspond to the through hole 122, and the heat of the communication module 2 may be dissipated through the through hole 122, so as to facilitate the heat dissipation of the communication module 2.

[0033] The base 110 can be provided with a carrier platform 111, and the test board 120 can be detachably arranged on the carrier platform 111. This makes it convenient for the user to install the test board 120 with the communication module 2 to be tested on the base 110 when the communication module 2 needs to be tested. It is also convenient for the user to remove the test board 120 from the base 110 after testing the communication module 2, so as to avoid the user directly installing and disassembling the communication module 2 on the base 110, thereby facilitating user operation. At the same time, arranging the test board 120 on the carrier platform 111 can reduce the contact area between the test board 120 and the base 110, thereby forming a gap between the test board 120 and the base 110. The above-mentioned gap can be used for air flow, which is beneficial to heat dissipation of the test board 120, and is beneficial to reducing the heat transferred by the test board 120 to the communication module 2, and is beneficial to lowering the temperature of the communication module 2.

[0034] The embodiment of the present application does not limit the specific detachable manner of the test board 120 and the carrier 111. For example, in one embodiment, the test board 120 can be connected to the carrier 111 by screws, that is, in this embodiment, the test board 120 and the carrier 111 can be provided with screw holes respectively, and the user can fix the test board 120 on the carrier 111 by screwing the screws into the screw holes. For example, in another embodiment, the test board 120 can be connected to the carrier 111 by means of snap connection or mortise and tenon connection, which is not limited here and can be set according to actual conditions.

[0035] It should be noted that the embodiments of the present application do not limit the specific setting method of the support platform 111. For example, in one embodiment, a depression can be set in a partial area of ​​the surface of the base 110, and the area without the depression can form the support platform 111. For example, in another embodiment, a protrusion can be set on the surface of the base 110, and the protrusion can be used as the support platform 111. In some other embodiments, a combination of the above two methods can also be adopted. Specifically, a groove can be set on the surface of the base 110, and protrusions can be set at both ends of the groove to form the support platform 111. In this embodiment, the support platform 111 can also play a role in guiding the installation of the test board 120. It can be set according to actual conditions and is not limited here.

[0036] The embodiment of the present application does not limit the specific structure of the carrier 111. For example, in one embodiment, the carrier 111 may include a first platform 111a, a second platform 111b, and a third platform 111c, wherein the first platform 111a and the second platform 111b may be respectively arranged at the two ends of the base 110, and the third platform 111c may be arranged in the middle of the base 110, so that the contact area between the test board 120 and the carrier 111 is larger, thereby facilitating the improvement of the structural stability of the test board 120 when it is arranged on the carrier 111. It is understandable that in other embodiments, the carrier 111 may also include a fourth platform, a fifth platform, etc., which are arranged in the middle of the base 110, that is, between the two ends of the base 110. It should be noted that too many platforms should not be arranged, which will increase the complexity of the user's installation of the test board 120 on the base 110. At the same time, too many platforms will increase the contact area between the test board 120 and the base 110, which is not conducive to the heat dissipation of the test board 120.

[0037] Furthermore, in this embodiment, a third connection portion 112 may be provided at one end of the base 110, and a fourth connection portion 113 may be provided at the other end. The third connection portion 112 and the fourth connection may be used to connect with the cover 130. In this embodiment, the cover 130 may be detachably connected to the base 110 and used to fix the communication module 2 installed in the test position 121.

[0038] Specifically, a first connection portion 131 may be provided at one end of the cover plate 130, and a second connection portion 132 may be provided at the other end. The first connection portion 131 may cooperate with the third connection portion 112, and the second connection portion 132 may cooperate with the fourth connection portion 113 to achieve a detachable connection between the base 110 and the cover plate 130. The embodiment of the present application does not limit the specific structures of the first connection portion 131, the second connection portion 132, the third connection portion 112, and the fourth connection portion 113. For example, in one embodiment, the first connection portion 131 and the third connection portion 112 may be rotatably connected, and the cover plate 130 may rotate around the connection between the first connection portion 131 and the third connection portion 112 to selectively open or close relative to the base 110.

[0039] The embodiment of the present application does not limit the specific rotational connection form of the first connection part 131 and the third connection part 112. For example, the first connection part 131 can be an axis or a hole, and the third connection part 112 can be a hole or an axis. The first connection part 131 and the third connection part 112 are rotationally connected in the form of hole-axis matching. It can be understood that in another embodiment, the first connection part 131 and the third connection can both be set as holes, and the aging test fixture 10 can also include a rotating shaft, which can be simultaneously passed through the first connection part 131 and the third connection part 112. The specific connection form can be set according to actual conditions and is not limited here.

[0040] In this embodiment, the second connection part 132 can be detachably connected to the fourth connection part 113, so that the upper cover can be detachably connected to the base 110. The embodiment of the present application also does not limit the specific connection form of the second connection part 132 and the fourth connection part 113. For example, in one embodiment, the second connection part 132 can be snap-connected with the fourth connection part 113. Specifically, the second connection part 132 can be provided with a card slot or a card block, and the fourth connection part 113 can be provided with a card block or a card slot, etc. At the same time, the second connection part 132 or the fourth connection part 113 can be provided with a button structure for pushing out the card block. When the card block is clamped in the card slot, the card block can be pushed out of the card slot through the button structure to achieve a detachable connection between the second connection part 132 and the fourth connection part 113.

[0041] In this embodiment, the second connection part 132 and the fourth connection part 113 can be detachably connected by the anti-detachment bolt 133. Specifically, the anti-detachment bolt 133 can be fixedly arranged on the cover plate 130 and serve as the second connection part 132, and the fourth connection part 113 can be a bolt hole arranged on the base 110. When the cover plate 130 needs to be fixed to the base 110, the anti-detachment bolt 133 can be screwed into the bolt hole, and when the cover plate 130 needs to be disassembled from the base 110, the anti-detachment bolt 133 can be screwed out of the bolt hole. Since the anti-detachment bolt 133 is fixedly connected to the cover plate 130, the user does not need to remove the anti-detachment bolt 133 after screwing the anti-detachment bolt 133 out of the bolt hole. At the same time, when the user needs to fix the cover plate 130 to the base 110, the anti-detachment bolt 133 does not need to be installed on the cover plate 130. The above-mentioned second connection part 132 and the fourth connection part 113 simplify the user's operation.

[0042] Please continue reading Figure 2 The heat conductor 140 can be arranged on at least one of the cover plate 130 and the base 110, and is used for thermal coupling with the communication module 2 installed in the test position 121. The heat conductor 140 can be used to export the heat of the communication module 2, thereby reducing the temperature of the communication module 2. The embodiment of the present application does not limit the specific number of the heat conductor 140. The heat conductor 140 can also be set to one or more. When the test position 121 is provided with one, the heat conductor 140 can be set to one or two. When the heat conductor 140 is set to two, the two heat conductors 140 can be respectively arranged on two opposite surfaces of the test position 121. That is to say, when the communication module 2 is installed in the test position 121, the two heat conductors 140 can be respectively thermally coupled with the two opposite surfaces of the communication module 2.

[0043] In one embodiment, the heat conductor 140 can be disposed on the cover 130. Specifically, the heat conductor 140 can be protruded from the surface of the cover 130 facing the base 110. When the cover 130 is fixedly connected to the base 110, the heat conductor 140 can be thermally coupled to the communication module 2. When the cover 130 is separated from the base 110, the heat conductor 140 can be separated from the communication module 2.

[0044] In another embodiment, the heat conductor 140 can be disposed on the base 110 and can be embedded in the through hole 122 of the test board 120 to be thermally coupled with the communication module 2. Furthermore, in one embodiment, the heat conductor 140 can be flush with the surface of the test board 120 close to the cover plate 130, so that the communication module 2 can be in direct contact with the heat conductor 140, thereby improving the efficiency of heat exchange between the communication module 2 and the heat conductor 140, which is beneficial to reduce the temperature of the communication module 2.

[0045] It is understandable that, in another embodiment, the heat conducting member 140 may be provided on both the cover plate 130 and the base 110 at the same time. For details, reference may be made to the above contents and no further elaboration is given here.

[0046] The embodiments of the present application also do not limit the specific form of the heat conductive member 140. For example, in one embodiment, the heat conductive member 140 can be made of a flexible heat conductive material, such as a graphene heat conductive film, a heat conductive gasket or a heat conductive silicone grease, etc., and can be specifically limited according to actual conditions. The heat conductive member 140 is arranged on the cover plate 130 and / or the base 110, so that the heat conductive member 140 can be reused. At the same time, since the heat conductive member 140 is arranged to be made of a head-shaped heat conductive material, the heat conductive member 140 will be compressed after contacting with the communication module 2, and the heat conductive member 140 can restore its deformation after being separated from the communication module 2, so that the heat conductive member 140 can be reused, thereby reducing the detection cost.

[0047] The aging test fixture 10 provided in the embodiment of the present application sets the test board 120 for testing the communication module 2 between the base 110 and the cover 130. Specifically, the communication module 2 can be set on the test board 120 and a heat conductor 140 is set on at least one of the cover 130 and the base 110. The heat conductor 140 can be used to thermally couple with the communication module 2 set on the test board 120 to conduct the heat of the communication module 2 to avoid overheating of the communication module 2, which is beneficial to reduce the temperature of the chip during testing, thereby helping to improve the accuracy of the test and reduce the risk of chip overheating damage. When the above-mentioned aging test fixture 10 is applied to the aging detection device 1, it can also improve the accuracy of the test and reduce the risk of overheating damage to the communication module 2.

[0048] In this utility model, unless otherwise clearly specified or limited, the terms "installation", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an integral connection, or a transmission connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0049] In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present utility model, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any at least one embodiment or example. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present utility model and the features of different embodiments or examples without contradiction.

[0050] The above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. An aging test tool, characterized in that: include: Base; A test board, the test board is arranged on the base, and the test board is provided with one or more test positions for installing a communication module; A cover plate, the cover plate is detachably connected to the base and is used to fix the communication module installed at the test position; as well as One or more heat conducting members are disposed on at least one of the cover plate and the base and are used for thermal coupling with the communication module installed at the test position.

2. The aging test tool according to claim 1, characterized in that: The heat conducting member is protrudingly disposed on a surface of the cover plate facing the base.

3. The aging test tool according to claim 1, characterized in that: Each of the test positions is provided with a through hole penetrating the test board, the heat conductive member is arranged on the base and embedded in the through hole, and each of the test positions is also provided with a mounting member for mounting a communication module, and the mounting member is arranged adjacent to the through hole.

4. The aging test tool according to claim 3, characterized in that: The heat conducting member is flush with a surface of the test board close to the cover plate.

5. The aging test tool according to any one of claims 1 to 4, characterized in that: The base is provided with a bearing platform, and the test board is detachably arranged on the bearing platform.

6. The aging test tool according to claim 5, characterized in that: The supporting platform comprises a first platform body, a second platform body and a third platform body. The first platform body and the second platform body are respectively arranged at two ends of the base, and the third platform body is arranged in the middle of the base.

7. The aging test tool according to any one of claims 1 to 4, characterized in that: A first connection part is provided at one end of the cover plate, and a second connection part is provided at the other end; a third connection part is provided at one end of the base, and a fourth connection part is provided at the other end; the first connection part is rotatably connected to the third connection part, and the second connection part is detachably connected to the fourth connection part.

8. The aging test tool according to claim 7, characterized in that: The second connection portion and the fourth connection portion are detachably connected via an anti-detachment bolt.

9. The aging test tool according to claim 8, characterized in that: The anti-drop bolt is fixedly arranged on the cover plate.

10. An aging detection device, characterized in that: It includes a power supply unit, an aging box, a communication unit and at least one aging test tool as described in any one of claims 1 to 9, wherein a test space for accommodating the aging test tool is provided in the aging box, and the power supply unit and the communication unit are both arranged in the aging box and are used to be electrically connected to the aging test tool accommodated in the test space.

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