Audio acquisition assembly, soundproof box and loudspeaker test equipment

Abstract

The utility model discloses an audio acquisition assembly, soundproof box and loudspeaker test equipment, the audio acquisition assembly comprises a connecting rod and an MEMS microphone, the connecting rod is provided with a first segment and a second segment, the first segment is provided with an assembling plane, the first end of the second segment is connected with the first segment, and the second end of the second segment is connected with the MEMS microphone. A first distance difference exists between the second subsection and the assembly plane; the MEMS microphone is installed at the second end of the second section and located on the same side as the first section, and a second distance difference exists between the collecting face of the MEMS microphone and the assembling plane of the first section. The MEMS microphone is small in size and light in weight, has strong anti-environmental interference capability, is connected through the connecting rod, and is convenient to assemble and set an audio acquisition distance.

Description

Technical Field

[0001] The utility model relates to the technical field of loudspeaker testing, in particular to an audio collection component, a sound insulation box and loudspeaker testing equipment. Background Art

[0002] During the speaker testing process, especially the testing of micro speakers, it is necessary to collect the sound signals emitted by the speakers. However, the microphones used in related technologies have problems such as large size, signal attenuation, poor consistency, and unstable sensitivity. In addition, during the collection process, it is necessary to consider the influence of the test environment, such as temperature, humidity, and noise, which may affect the test results. Therefore, in the process of collecting the sound signals emitted by the speaker to be tested, it is necessary to minimize the interference of environmental factors and improve the accuracy of sound signal collection. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an audio acquisition component with the characteristics of high integration, small size, and strong ability to resist environmental interference. The utility model also proposes a soundproof box and a speaker testing device with the audio acquisition component, which can improve the ability to resist environmental interference.

[0004] On the one hand, an embodiment of the utility model provides an audio acquisition component, including:

[0005] A connecting rod, comprising a first segment and a second segment, wherein the first segment is provided with an assembly plane, a first end of the second segment is connected to the first segment, and a first distance difference exists between the second segment and the assembly plane;

[0006] A MEMS microphone is installed at the second end of the second segment and is located on the same side as the first segment, and a second distance difference exists between a collection surface of the MEMS microphone and the assembly plane of the first segment.

[0007] The embodiments of the present invention have at least the following beneficial effects:

[0008] MEMS microphones are small in size, light in weight, and highly resistant to environmental interference. They are connected via connecting rods, making them easy to assemble and set the audio collection distance.

[0009] According to some embodiments of the present invention, the MEMS microphone is provided with a connector, and external communication and power supply are performed through the connector.

[0010] On the other hand, an embodiment of the present invention provides a soundproof box, comprising:

[0011] The box body comprises a front side wall, a rear side wall and a plurality of side walls connected to the front side wall and the rear side wall, the rear side wall and the plurality of side walls are connected with a sound insulation layer, a signal collection cavity is formed between the sound insulation layer and the front side wall, and a sound outlet is arranged on the front side wall;

[0012] The above-mentioned audio collection component is installed on the front side wall and is located in the signal collection cavity, and its position is adapted to the sound outlet.

[0013] The embodiments of the present invention have at least the following beneficial effects:

[0014] A closed signal collection cavity is formed in the box through a sound insulation layer. A microphone for collecting sound signals is installed in the signal collection cavity. The sound signals transmitted through the sound outlet can be collected, which can reduce the interference of environmental factors and is conducive to improving the accuracy of sound signal collection.

[0015] According to some embodiments of the utility model, an assembly plate is installed on the front side wall, a baffle is installed on the assembly plate, a template recess is provided on the first surface of the baffle, and a sound outlet is provided in the template recess and passes through to the second surface of the baffle.

[0016] According to some embodiments of the present invention, the sound insulation layer is a sponge layer or a foam layer.

[0017] According to some embodiments of the present invention, a first assembly recess is provided on the assembly plate, and the baffle is installed in the first assembly recess.

[0018] According to some embodiments of the present invention, a second assembly recess is provided on the assembly plate and located on the upper side of the first assembly recess.

[0019] According to some embodiments of the present invention, a third assembly recess is provided on the assembly plate and is located at the lower side of the first assembly recess.

[0020] According to some embodiments of the present invention, a sealing ring is provided on the baffle and located in the recessed position of the template.

[0021] On the other hand, an embodiment of the present invention further provides a speaker testing device, comprising the above-mentioned sound insulation box.

[0022] The embodiments of the present invention have at least the following beneficial effects:

[0023] A closed signal collection cavity is formed in the box through a sound insulation layer. A microphone for collecting sound signals is installed in the signal collection cavity. The sound signals transmitted through the sound outlet can be collected, which can reduce the interference of environmental factors and is conducive to improving the accuracy of sound signal collection.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 This is a structural diagram of an audio acquisition component of an embodiment of the utility model;

[0027] Figure 2 It is a side view of the audio collection component of the embodiment of the utility model;

[0028] Figure 3 A schematic diagram of the structure of a loudspeaker testing device according to an embodiment of the utility model;

[0029] Figure 4 This is a schematic diagram of the structure of the soundproof box of an embodiment of the utility model;

[0030] Figure 5 for Figure 4 A cross-sectional view of the AA position;

[0031] Figure 6 for Figure 4 The middle circle shows a partial enlarged view of position B;

[0032] Figure 7 for Figure 4 A schematic diagram of the structure of the baffle of the soundproof box shown;

[0033] Figure 8 for Figure 4 A schematic structural diagram of the assembly plate of the sound insulation box is shown.

[0034] Reference numerals:

[0035] Upper template 10, lower template 20, box 100, sound insulation layer 101, signal collection cavity 102, assembly plate 200, first assembly recess 201, second assembly recess 202, third assembly recess 203, assembly blind hole 204, baffle 210, template recess 211, sound outlet 212, sealing ring 213, connecting rod 310, first segment 311, second segment 312, assembly plane 313, MEMS microphone 320, collection surface 321, connector 322. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0038] In the description of the present utility model, "several" means one or more, "multiple" means more than two, greater than, less than, and exceeding are understood as not including the number itself, and "above", "below", and "within" are understood as including the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation”, and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention based on the specific content of the technical solution.

[0040] Please refer to Figure 1 and Figure 2 This embodiment discloses an audio collection component, including a connecting rod 310 and a MEMS microphone 320, wherein the connecting rod 310 has a first segment 311 and a second segment 312, wherein the first segment 311 is provided with an assembly plane 313, wherein a first end of the second segment 312 is connected to the first segment 311, and a first distance difference is provided between the second segment 312 and the assembly plane 313, such as Figure 2 As shown by the mark H1 in the figure, the MEMS microphone 320 is installed at the second end of the second segment 312 and is located on the same side as the first segment 311. There is a second distance difference between the collection surface 321 of the MEMS microphone 320 and the assembly plane 313 of the first segment 311, as shown in FIG. Figure 2As shown by mark H2, when connected to an external structure (such as the assembly board 200 below) through the assembly plane 313, the distance between the collection surface 321 of the MEMS microphone 320 and the external structure is the second distance difference, so that the distance between the MEMS microphone 320 and the sound outlet to be collected (i.e., the sound outlet 212 below) can be set to facilitate signal collection.

[0041] Compared with ECM (electret capacitor) microphones, the sensitivity of MEMS microphone 320 is not affected by temperature, vibration, humidity and time, and has high heat resistance. MEMS microphone 320 can withstand high-temperature reflow soldering during processing without affecting performance. MEMS microphone 320 can provide external bias through ASIC (application-specific integrated circuit) chip. Effective bias can enable MEMS microphone 320 to maintain stable acoustic and electrical parameters throughout the operating temperature range, and can also support microphone designs with different sensitivities. MEMS microphone 320 has a high power supply rejection ratio, which can effectively suppress fluctuations in power supply voltage, and MEMS microphone 320 is integrated with broadband RF (radio frequency) suppression function, which can effectively suppress radio frequency interference. In addition, MEMS microphone 320 is small in size and light in weight, and the size of the vibration film inside MEMS microphone 320 is smaller, so it generates less vibration when collecting sound signals.

[0042] In order to solve the problems of large size, signal attenuation, poor consistency and unstable sensitivity of the test hardware ECM microphone, the MEMS microphone 320 is considered to be used to replace the traditional ECM microphone for testing the speaker device. The advantage is that it is small in size. Compared with the currently widely used ECM microphone, the MEMS microphone 320 has stronger heat resistance, vibration resistance and anti-RF interference performance. Due to its strong heat resistance, the MEMS microphone 320 can adopt a fully automatic surface mount (SMT) production process, while most ECM microphones require manual soldering. For production testing, while reducing the production cost advantage, it can also provide a higher degree of design freedom to match the differentiated appearance design of the corresponding product, and meet the closer test position distance and test requirements. It can be seen that the advantages of the MEMS microphone 320, such as small size, good heat resistance, good consistency, good stability, high reliability and anti-RF interference, are also applicable to the acoustic performance test of speaker devices.

[0043] Please refer to Figure 1 The MEMS microphone 320 is provided with a connector 322, and external communication and power supply are performed through the connector 322. For example, the MEMS microphone 320 is communicated with an external board through the connector 322, thereby being powered through the connector 322 and transmitting the collected signal to the external board to facilitate analysis of the collected signal.

[0044] In order to facilitate understanding of the purpose of the audio collection component of this embodiment, a speaker testing device is used as an application example for explanation below.

[0045] Please refer to Figure 3 This embodiment discloses a speaker testing device, including a soundproof box, please refer to Figure 4 , Figure 5 and Figure 6 The soundproof box includes a box body 100 and the above-mentioned audio collection component. The box body 100 has a front side wall, a rear side wall, and multiple side walls connected to the front side wall and the rear side wall, such as an upper side wall, a lower side wall, a left side wall, and a right side wall. A sound insulation layer 101 is connected to the rear side wall and the multiple side walls. A signal collection cavity 102 is formed between the sound insulation layer 101 and the front side wall. In some application examples, a sound outlet 212 is provided on the front side wall, and in other application examples, an assembly plate 200 is installed on the front side wall, and a baffle 210 is installed on the assembly plate 200. Please refer to Figure 7 The first surface of the baffle 210 is provided with a template recess 211, and a sound outlet 212 is provided in the template recess 211 and penetrates to the second surface of the baffle 210. The microphone is installed on the second surface of the assembly board 200 and is located in the signal collection cavity 102, and the position is adapted to the sound outlet 212. The sound insulation layer 101 forms a closed signal collection cavity 102 in the box 100, and the microphone for collecting sound signals is installed in the signal collection cavity 102, so that the sound signal transmitted through the sound outlet 212 can be collected, which can reduce the interference of environmental factors and is conducive to improving the accuracy of sound signal collection.

[0046] When in use, the front side of the baffle 210 is provided with an upper template 10 and a lower template 20 capable of closing and separating the molds. The speaker product to be tested is placed in the product accommodating recess of the lower template 20. After the upper template 10 and the lower template 20 are closed, they are inserted into the template recess 211 and abut against the baffle 210, so that the sound outlet of the speaker product faces the sound outlet 212 of the baffle 210, so as to seal the sound outlet of the speaker product, which is beneficial to reduce the interference of environmental factors.

[0047] Please refer to Figure 5 The connecting rod 310 of the audio collection component is installed on the second surface of the assembly board 200, and the MEMS microphone 320 is installed on the connecting rod 310 and has a first distance gap with the baffle 210, that is, the second distance difference mentioned above, so that the MEMS microphone 320 is placed at the first distance gap of the sound outlet 212, which is beneficial to improve the stability of the test.

[0048] In order to improve the anti-interference ability, the sound insulation layer 101 is a sponge layer or a foam layer, which can effectively absorb the noise, vibration and other interference in the environment, reduce the interference of environmental factors on the signal collection cavity 102, and help improve the accuracy of signal collection.

[0049] Please refer to Figure 8 , a first assembly recess 201 is provided on the assembly plate 200, and the baffle 210 is installed in the first assembly recess 201. During the assembly process, the baffle 210 can be quickly positioned, which is conducive to improving the assembly efficiency. A second assembly recess 202 is provided on the assembly plate 200 and located on the upper side of the first assembly recess 201. The second assembly recess 202 is used to install an external lifting and translational module, which is convenient for assembly and positioning, and is conducive to improving the assembly efficiency. A third assembly recess 203 is provided on the assembly plate 200 and located on the lower side of the first assembly recess 201. The third assembly recess 203 is used to install an external linear motion module, which is convenient for assembly and positioning, and is conducive to improving the assembly efficiency. An assembly blind hole 204 is provided on the assembly plate 200. For example, the assembly blind hole 204 is used to assemble the baffle 210, the lifting and translational module, and the linear motion module. The assembly blind hole 204 does not penetrate the assembly plate 200, which can reduce the penetration of interference factors such as water vapor and noise into the box 100, which is conducive to improving the accuracy of the test.

[0050] Please refer to Figure 7 In order to improve the accuracy of the test, a sealing ring 213 is provided on the baffle 210 and in the template recess 211. During the test, the external upper template 10 and the lower template 20 are combined and abutted against the baffle 210. The sealing ring 213 can seal the connection position between the baffle 210 and the upper template 10 and the lower template 20, thereby reducing the interference of environmental factors on the sound outlet 212, thereby improving the accuracy of the test.

[0051] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An audio acquisition component, characterized in that: include: A connecting rod (310) comprising a first segment (311) and a second segment (312), wherein the first segment (311) is provided with an assembly plane (313), a first end of the second segment (312) is connected to the first segment (311), and a first distance difference exists between the second segment (312) and the assembly plane (313); A MEMS microphone (320) is mounted at the second end of the second segment (312) and is located on the same side as the first segment (311), and a second distance difference exists between a collection surface (321) of the MEMS microphone (320) and the assembly plane (313) of the first segment (311).

2. The audio acquisition component according to claim 1, characterized in that: The MEMS microphone (320) is provided with a connector (322), and external communication and power supply are performed through the connector (322).

3. A soundproof box, characterized in that: include: A box body (100) comprising a front side wall, a rear side wall, and a plurality of side walls connected to the front side wall and the rear side wall, a sound insulation layer (101) being connected to the rear side wall and the plurality of side walls, a signal collection cavity (102) being formed between the sound insulation layer (101) and the front side wall, and a sound outlet (212) being provided on the front side wall; The audio collection component as claimed in claim 1 or 2 is installed on the front side wall and located in the signal collection cavity (102), and its position is adapted to the sound outlet (212).

4. The soundproof box according to claim 3, characterized in that: An assembly plate (200) is mounted on the front side wall, a baffle plate (210) is mounted on the assembly plate (200), a template recess (211) is provided on a first surface of the baffle plate (210), and a sound outlet (212) is provided in the template recess (211) and penetrates to a second surface of the baffle plate (210).

5. The soundproof box according to claim 3 or 4, characterized in that: The sound insulation layer (101) is a sponge layer or a foam layer.

6. The soundproof box according to claim 4, characterized in that: A first assembly recess (201) is provided on the assembly plate (200), and the baffle plate (210) is installed in the first assembly recess (201).

7. The soundproof box according to claim 6, characterized in that: A second assembly recess (202) is provided on the assembly plate (200) and is located on the upper side of the first assembly recess (201).

8. The soundproof box according to claim 6 or 7, characterized in that: A third assembly recess (203) is provided on the assembly plate (200) and is located below the first assembly recess (201).

9. The soundproof box according to claim 4, characterized in that: A sealing ring (213) is provided on the baffle plate (210) and located in the template recess (211).

10. A speaker testing device, characterized in that: Comprising the sound insulation box as described in any one of claims 3 to 9.

Images