Thermal control equipment and wearable equipment
By setting up a thermal control device of semiconductor refrigeration chips and fans in the confined space of the wearable device, the problem of difficulty in dissipating heat in the confined space is solved, rapid cooling is achieved, and staff comfort and work efficiency are improved.
Patent Information
- Application Number
- CN202420940585.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-02-07
- Filing Date
- 2024-05-04
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-05-04
AI Technical Summary
In completely sealed protective clothing, it is difficult to release heat from the inside of the protective clothing to the outside, resulting in difficulty in rapid heat dissipation of internal temperature, affecting the physical strength and working time of the staff.
A thermal control device is designed, including semiconductor refrigeration chips, fans, controllers and batteries. By combining the cold ends and hot ends of semiconductor refrigeration chips with fans, heat dissipation and cooling of heat in confined spaces is achieved.
Through the combination of fans and semiconductor refrigeration chips, the heat in the confined space of the wearable device is quickly and effectively reduced, improving staff comfort and work efficiency.
Smart Images
Figure CN222841436U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a thermal control device and a wearable device. Background Art
[0002] For personnel who need to work in harsh environments and highly polluted environments for a long time, such as emergency rescue personnel in nuclear power plants and chemical plants, fire police, epidemic prevention and disaster relief personnel, etc., they need to wear fully sealed isolation protective clothing for high-load continuous work, which leads to high temperatures inside the protective clothing. If the heat inside the protective clothing is not dissipated and cooled in time, it will quickly consume the physical strength of such personnel and even cause dehydration, seriously shortening working hours and affecting work efficiency. However, in a completely enclosed protective clothing, it is difficult to release heat from the inside of the protective clothing to the outside of the protective clothing. Therefore, how to quickly dissipate the internal temperature of the protective clothing is an urgent problem to be solved. Utility Model Content
[0003] In view of this, the embodiments of the present application hope to provide a thermal control device and a wearable device to at least solve the above-mentioned technical problems.
[0004] To achieve the above purpose, the technical solution of this application is implemented as follows:
[0005] According to one aspect of an embodiment of the present application, a thermal control device is provided, the thermal control device being applied to a confined space of a wearable device, the thermal control device comprising: a semiconductor refrigeration chip, a fan, a controller and a battery connected to each other;
[0006] The semiconductor refrigeration chip has a cold end and a hot end, wherein the cold end is used to deliver cold air to the enclosed space of the wearable device according to a control signal; the hot end is arranged close to the fan and is used to collect heat generated from the enclosed space;
[0007] The fan is arranged at the cold end and the hot end, and is used to blow the heat from the hot end to the cold end, and is used to blow the cold air from the cold end to the enclosed space;
[0008] The controller is used to send the control signal to the semiconductor refrigeration chip according to the current first temperature parameter of the enclosed space and the current second temperature parameter of the heat storage unit;
[0009] The battery is used to provide electrical energy to the semiconductor refrigeration chip, the fan and the controller.
[0010] In the above solution, the thermal control device further includes:
[0011] A cold end heat sink, disposed at the cold end of the semiconductor refrigeration chip, for cooling the received heat;
[0012] The hot end heat sink is arranged at the hot end of the semiconductor refrigeration chip and is used to cool the heat collected by the hot end.
[0013] In the above solution, a first thermally conductive pad is provided between the cold end radiator and the cold end, and a second thermally conductive pad is provided between the hot end radiator and the hot end.
[0014] In the above solution, the thermal control device further includes:
[0015] A heat storage material, disposed at the hot end, for storing waste heat generated in the process of the fan blowing heat from the hot end to the cold end;
[0016] The heat-insulating shell has a containing space for containing the heat storage material and isolating the heat from the external environment.
[0017] In the above solution, the thermal control device further comprises:
[0018] A temperature sensor is connected to the controller, the temperature sensor is arranged in the insulating shell, and is used to monitor the current temperature of the heat storage material to obtain the second temperature parameter; and is arranged in the enclosed space, and is used to monitor the current temperature of the enclosed space to obtain the first temperature parameter, and send the first temperature parameter and the second temperature parameter to the controller.
[0019] In the above solution, the thermal control device further includes:
[0020] A power interface, connected to the battery and used to charge the battery;
[0021] The controller is also used to switch the heat conduction direction of the semiconductor refrigeration chip when the battery is charged through the power interface, so that the hot end collects the heat stored in the heat storage material, and the fan blows the heat to the cold end for cooling, thereby releasing the heat storage space of the storage material.
[0022] In the above solution, there are multiple batteries, and the multiple batteries are connected in series.
[0023] In the above solution, the thermal insulation shell is connected to the semiconductor refrigeration chip, and a thermally conductive adhesive pad is provided between the thermal insulation shell and the semiconductor refrigeration chip.
[0024] In the above scheme, the thermal control device also includes a heat-conducting pipe, which is connected to the external space of the wearable device. The heat-conducting pipe is unidirectional and can only discharge the heat in the enclosed space to the external space. The air in the external space cannot enter the enclosed space through the heat-conducting pipe.
[0025] According to another aspect of the present application, a wearable device is provided, wherein the wearable device has a confined space, and the thermal control device described in any one of the above items is provided in the confined space.
[0026] The thermal control device and wearable device provided by the present application are a solution for dissipating heat and cooling the heat generated in the enclosed space of the wearable device by setting the thermal control device in the enclosed space of the wearable device. The thermal control device includes: a semiconductor refrigeration chip, a fan, a controller and a battery connected to each other; wherein the semiconductor refrigeration chip has a cold end and a hot end, and the cold end is used to deliver cold air to the enclosed space of the wearable device according to a control signal; the hot end is arranged close to the fan and is used to collect the heat generated from the enclosed space; the fan is arranged at the cold end and the hot end, and is used to blow the heat from the hot end to the cold end, and is used to blow the cold air from the cold end to the enclosed space; the controller is used to send the control signal to the semiconductor refrigeration chip according to the current first temperature parameter of the enclosed space and the current second temperature parameter of the heat storage unit; the battery is used to provide power to the semiconductor refrigeration chip, the fan and the controller. In this way, by combining the fan with the semiconductor refrigeration chip, the cooling characteristics of the semiconductor refrigeration chip and the heat dissipation characteristics of the fan can be used to quickly and effectively reduce the heat in the enclosed space of the wearable device. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 The structure of the thermal control device in this application is shown in FIG. Figure 1 ;
[0028] Figure 2 The structure of the thermal control device in this application is shown in FIG. Figure 2 ;
[0029] Figure 3 Schematic diagram of the assembly of the thermal control device in this application Figure 1 ;
[0030] Figure 4 Schematic diagram of the assembly of the thermal control device in this application Figure 2 . DETAILED DESCRIPTION
[0031] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.
[0032] The various specific technical features in the various embodiments described in the specific implementation methods can be combined in various ways without contradiction. For example, different implementation methods can be formed by combining different specific technical features. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features in this application will not be described separately.
[0033] In the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, it can be an electrical connection or a connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.
[0034] It should be noted that the terms "first\second\third" involved in the embodiments of the present application are only used to distinguish similar objects, and do not represent a specific order for the objects. It is understandable that "first\second\third" can be interchanged with a specific order or sequence where permitted. It should be understood that the objects distinguished by "first\second\third" can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.
[0035] The following combination Figure 1 and Figure 2 The thermal control device described in the embodiments of the present application is described in detail.
[0036] The thermal control device provided in the present application can be applied to the confined space of a wearable device, and the wearable device includes but is not limited to protective clothing, protective hats, protective gloves, protective shoes, etc.
[0037] Figure 1 The structure of the thermal control device in this application is shown in FIG. Figure 1 , Figure 2 The structure of the thermal control device in this application is shown in FIG. Figure 2 ;like Figure 1 and Figure 2As shown, the thermal control device of the embodiment of the present application includes: a semiconductor refrigeration chip 10, a fan 20, a controller 30 and a battery 40; wherein the semiconductor refrigeration chip 10, the fan 20, the controller 30 and the battery 40 are connected by wire or wirelessly. The semiconductor refrigeration chip 10 has a cold end A and a hot end B, and the cold end A is used to deliver cold air to the enclosed space of the wearable device according to the control signal; the hot end B is arranged near the fan 20, and is used to collect the heat generated from the enclosed space; the fan 20 is arranged at the cold end A and the hot end B, and is used to blow the heat from the hot end B to the cold end A, and is used to blow the cold air from the cold end A to the enclosed space; the controller 30 is used to send the control signal to the semiconductor refrigeration chip 10 according to the current first temperature parameter of the enclosed space and the current second temperature parameter of the heat storage unit; the battery 40 is used to provide power to the semiconductor refrigeration chip 10, the fan 20 and the controller 30.
[0038] In one implementation of the present application, the thermal control device includes a receiving unit for receiving voice commands or gesture commands, and the controller 30 can control the start and stop of the semiconductor refrigeration chip 10 according to the voice commands or the gesture commands.
[0039] In another implementation of the present application, the thermal control device includes a switch button, and the controller 30 controls the start and stop of the semiconductor refrigeration chip 10 according to the user's switch operation on the switch button.
[0040] like Figure 1 and Figure 2 As shown, the thermal control device also includes: a cold end radiator 50 and a hot end radiator 60, wherein the cold end radiator 50 is arranged at the cold end A of the semiconductor refrigeration chip 10, and is used to cool the received heat; the hot end radiator 60 is arranged at the hot end B of the semiconductor refrigeration chip 10, and is used to cool the heat collected by the hot end B.
[0041] Here, the cold end A can be arranged far away from the interior of the thermal control device, and the hot end B can be arranged near the interior of the thermal control device, so that it is easier for the cold end A to deliver cold air to the enclosed space. For example, the wearable device is a protective suit. After the worker puts on the protective suit, a closed space will be formed inside the protective suit. A pocket can be arranged in the closed space for loading the thermal control device. The pocket can have an air outlet and an air inlet, and the cold end A of the semiconductor refrigeration chip 10 can be arranged near the air outlet, while the hot end B can be arranged far away from the air outlet.
[0042] like Figure 1 and Figure 2As shown, a first thermally conductive pad 71 may be provided between the cold end heat sink 50 and the cold end A, and a second thermally conductive pad 72 may be provided between the hot end heat sink 60 and the hot end B.
[0043] In the present application, the heat dissipation and cooling of the enclosed space can be accelerated by the cold end radiator 50 and the hot end radiator 60. By arranging a thermal conductive adhesive pad between the cold end radiator 50 and the cold end A, and arranging a thermal conductive adhesive pad between the hot end radiator 60 and the hot end B, the cold end radiator 50 and the cold end A, and the hot end radiator 60 and the hot end B can provide bonding force and buffering force.
[0044] For example, a first thermally conductive adhesive pad 71 is provided between the cold-end radiator 50 and the cold end A, so as to reinforce the position between the cold-end radiator 50 and the cold end A, thereby avoiding the occurrence of parts misalignment and affecting the cooling effect; for another example, a second thermally conductive adhesive pad 72 is provided between the hot-end radiator 60 and the hot end B, so as to reinforce the position between the hot-end radiator 60 and the hot end B, thereby avoiding the occurrence of parts misalignment and affecting the heat dissipation effect; for another example, when the wearable device vibrates due to impact, the vibration amplitude between the components in the thermal control device can be reduced, thereby achieving a buffering effect and avoiding damage to the thermal control device.
[0045] The fan 20 in the present application may also be disposed close to the cold end radiator 50 to transport the heat generated in the enclosed space to the cold end radiator 50 and to transport the cold air from the cold end radiator 50 to the enclosed space.
[0046] Here, the wearable device is an example of protective clothing, and the fan 20 can be set at the pocket air outlet and air inlet of the enclosed space, and is used to transport the heat generated in the enclosed space to the cold end radiator 50 through the air inlet, and to transport the cold air from the cold end radiator 50 to the enclosed space through the air outlet, so as to achieve the effect of cooling the heat in the enclosed space.
[0047] like Figure 1 and Figure 2 As shown, the thermal control device also includes: a heat storage material 81, which is arranged at the hot end B and is used to store the residual heat generated in the process of the fan 20 blowing the heat from the hot end B to the cold end A; an insulating shell 82, which has a accommodating space for accommodating the heat storage material and isolating the heat B from the external environment.
[0048] Here, the heat-insulating shell can be formed of a material with heat-insulating properties. The heat storage material 81 can be different according to the ambient temperature. For example, for a high temperature environment (such as about 30 degrees), the heat storage material can be bio-ice, for a room temperature environment (such as about 26 degrees), the heat storage material can be paraffin, and for a low temperature environment (such as about 10 degrees), the heat storage material can be high-temperature water.
[0049] Here, there may be multiple heat storage materials 81, and the types of the multiple heat storage materials 81 may be different. The thermal control device may also intelligently select the heat storage material corresponding to the ambient temperature according to the current ambient temperature to store the heat in the current enclosed space.
[0050] The present application adopts a heat-insulating shell to accommodate the heat storage material, thereby preventing the heat stored in the heat storage material from leaking out.
[0051] like Figure 1 and Figure 2 As shown, the thermal control device in the present application may also include: a temperature sensor 90;
[0052] The temperature sensor 90 may be connected to the controller 30. There may be multiple temperature sensors 90. One of the temperature sensors 90 may be arranged in the heat-insulating shell 82 to monitor the current temperature of the heat storage material 81 to obtain the second temperature parameter. One of the temperature sensors 90 may be arranged in the enclosed space to monitor the current temperature of the enclosed space to obtain the first temperature parameter. The obtained first temperature parameter and second temperature parameter may be sent to the controller 30. Of course, a temperature sensor 90 may also be arranged on the outer surface of the protective suit to monitor the ambient temperature of the environment where the protective suit is located to determine which heat storage material to use.
[0053] Here, the temperature sensor 90 may be connected to the controller 30 in a wired manner or a wireless manner. Furthermore, when the temperature sensor 90 sends the obtained first temperature parameter and the second temperature parameter to the controller 30, the obtained first temperature parameter and the second temperature parameter may be converted into an electrical signal and sent to the controller 30. Of course, the controller 30 may also convert the first temperature parameter and the second temperature parameter sent by the temperature sensor 90 into an electrical signal.
[0054] Here, the controller 30 can also control the hot end of the semiconductor refrigeration chip 10 to stop collecting heat when the temperature sensor 90 detects that the current temperature of the heat storage material 81 is greater than or equal to the temperature threshold (for example, 50 degrees), so that the heat storage material 81 no longer absorbs heat. At this time, the heat in the enclosed space can be reduced by blowing air into the enclosed space only by the fan 20, so as to protect the components in the thermal control device and prevent the chip from burning.
[0055] like Figure 1 and Figure 2 As shown, in the present application, the semiconductor refrigeration chip 10 may further include: a power interface 100;
[0056] The power interface 100 can be connected to the battery 40 to charge the battery 40;
[0057] The heat storage material 81 is also used to release the stored heat when the battery 40 is charged through the power interface 100 .
[0058] For example, taking the above-mentioned protective clothing as an example, when the staff takes off the protective clothing and plugs the power cord into the power interface 100 to charge the battery 40 of the thermal control device, the heat dissipation function of the heat storage material 81 will be activated, and the controller 30 will control the hot end B of the semiconductor refrigeration chip 10 to transfer the heat stored in the heat storage material 81 to the cold end A to release the heat in the heat storage material 81, so that the heat storage material 81 can quickly restore the maximum heat storage capacity.
[0059] Here, there may be a plurality of batteries 40, and the plurality of batteries 40 may be connected in series to increase the power supply and power supply duration of the thermal control device.
[0060] Here, the battery 40 can also be movably connected to the controller 30, the heat storage material 81 and the semiconductor refrigeration chip 10. Through the movable connection, the battery 40 can be replaced in time when it is detected that the battery 40 is low on power.
[0061] The thermal control device provided by the present application utilizes the thermoelectric coupling effect generated by the cold end and the hot end of the semiconductor refrigeration chip changing the conduction direction under the driving current or voltage and combines it with a fan, and utilizes the heat dissipation performance of the fan to dissipate the heat released by the semiconductor refrigeration chip, thereby realizing the cooling of the heat in the confined space of the wearable device, improving the comfort of the staff when wearing the wearable device, thereby improving the work efficiency and work quality. The problem that the prior art cannot achieve external heat dissipation in a confined environment is overcome.
[0062] Figure 3 Schematic diagram of the assembly of the thermal control device in this application Figure 1 , Figure 4 Schematic diagram of the assembly of the thermal control device in this application Figure 2 ,like Figure 3 , Figure 4 As shown, the assembly method is as follows:
[0063] The temperature sensor 90 can be first installed on the insulation shell 82, and then the heat storage material 81 can be filled into the insulation shell 82; the fan 20 can be installed on the cold end radiator 50 through the first set of bolts 101; the semiconductor refrigeration sheet 10 can be installed between the cold end radiator 50 and the hot end radiator 60, wherein the cold end radiator 50 is bonded and fixed to the cold end A of the semiconductor refrigeration sheet 10 through the first thermal conductive adhesive pad 71, and the hot end radiator 60 is bonded and fixed to the hot end B of the semiconductor refrigeration sheet 10 through the second thermal conductive adhesive pad 72; the hot end radiator 60 is fixedly connected to the cold end radiator 50 through the second set of bolts 102 to form a refrigeration module C. Finally, the refrigeration module C is fixed to the insulation shell 82 through the third set of bolts 103 to complete the assembly of the thermal control device.
[0064] Here, in order to ensure the thermal insulation effect, necessary thermal insulation pads may be added between the contact surfaces of the refrigeration module C and the thermal insulation shell 82 .
[0065] In the present application, the heat-insulating shell 82 can also be connected to the semiconductor refrigeration chip 10, and a heat-conducting adhesive pad is provided between the heat-insulating shell 82 and the semiconductor refrigeration chip 10. Thus, the semiconductor refrigeration chip and the heat-insulating shell can be fixed, and the shock-proof and buffering effect can be achieved when the device collides.
[0066] In the present application, the thermal control device may further include a heat-conducting pipe (not shown in the figure), which may be connected to the external space of the wearable device, and a one-way air outlet valve is provided at one end of the external space, so that the heat-conducting pipe can realize one-way transmission, that is, the heat-conducting pipe can only discharge the heat of the enclosed space to the external space, and the air of the external space cannot enter the enclosed space through the heat-conducting pipe. In this way, the heat of the enclosed space can be further cooled.
[0067] The thermal control device provided in the present application obtains the current first temperature parameter of the enclosed space of the wearable device and / or the current second temperature parameter of the heat storage material in the thermal control device; based on the first temperature parameter and the second temperature parameter, controls the semiconductor refrigeration chip in the thermal control device to deliver cold air to the enclosed space. The refrigeration characteristics of the semiconductor refrigeration chip can be used to quickly and effectively reduce the heat of the enclosed space of the wearable device.
[0068] For example, in one implementation, if the first temperature parameter is greater than or equal to a first temperature threshold and the second temperature parameter is less than a second temperature threshold, the semiconductor refrigeration chip in the thermal control device is controlled to deliver cold air to the enclosed space at a first speed; wherein the first temperature threshold and the second temperature threshold may be the same or different.
[0069] Here, it may be a scenario where the temperature of the enclosed space is high and has reached a preset temperature threshold, but the heat storage temperature of the heat storage material is low and has not yet reached the preset temperature threshold.
[0070] For example, the wearable device is protective clothing, the average temperature inside the protective clothing (the monitoring value from temperature sensor A) is higher than the cooling threshold of the thermal control device (that is, the first temperature parameter is greater than the first temperature threshold), and the temperature of the heat storage material has not reached the saturation temperature (that is, the second temperature parameter is less than or equal to the second temperature threshold), and the thermal control device turns on the cooling mode + air supply mode.
[0071] In another implementation of the present application, if the first temperature parameter is less than the first temperature threshold, and the second temperature parameter is less than the second temperature threshold, the semiconductor refrigeration chip in the thermal control device is controlled to deliver cold air to the enclosed space at a second speed, and the second speed is less than the first speed;
[0072] Here, it may be a scenario where the temperature of the enclosed space is low and does not reach the preset temperature threshold, but the heat storage temperature of the heat storage material also does not reach the preset temperature threshold.
[0073] For example, the average temperature inside the protective clothing is lower than the cooling threshold of the thermal control device (that is, the first temperature parameter is less than the first temperature threshold), and the temperature of the heat storage material has not reached the saturation temperature (that is, the second temperature parameter is less than or equal to the second temperature threshold), and the thermal control device reduces the cooling speed.
[0074] If the first temperature parameter is greater than or equal to the first temperature threshold, and the second temperature parameter is greater than or equal to the second temperature threshold, the semiconductor refrigeration chip is controlled to stop supplying cold air to the enclosed space.
[0075] Here, it may be a scenario where the temperature of the enclosed space is high and has reached a preset temperature threshold, and the heat storage temperature of the heat storage material is also high and has reached a preset temperature threshold.
[0076] For example, if the average temperature inside the protective clothing is higher than the cooling threshold of the thermal control device (i.e., the first temperature parameter is greater than or equal to the first temperature threshold), and the temperature of the heat storage material has reached the saturation temperature (i.e., the second temperature parameter is greater than or equal to the second temperature parameter threshold), the thermal control device turns off the cooling mode and maintains the air supply mode.
[0077] In the present application, if it is detected that the battery in the thermal control device is in a charging state, the hot end of the semiconductor refrigeration chip is controlled to conduct the heat stored in the heat storage material to the cold end of the semiconductor refrigeration chip. In this way, the heat stored in the heat storage material can be quickly exported.
[0078] In the present application, a wearable device may also be provided, wherein the wearable device has a confined space, and the above-mentioned thermal control device may be provided in the confined space.
[0079] Here, the wearable device includes but is not limited to protective clothing, protective hats, protective shoes, protective masks, etc., and the wearable device can be used in harsh environments.
[0080] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. In addition, the features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.
[0081] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A thermal control device, characterized in that: The thermal control device is applied to a confined space of a wearable device, and comprises: a semiconductor refrigeration chip, a fan, a controller and a battery connected to each other; The semiconductor refrigeration chip has a cold end and a hot end, wherein the cold end is used to deliver cold air to the enclosed space of the wearable device according to a control signal; the hot end is arranged close to the fan and is used to collect heat generated from the enclosed space; The fan is arranged at the cold end and the hot end, and is used to blow the heat from the hot end to the cold end, and is used to blow the cold air from the cold end to the enclosed space; A heat storage material is provided at the hot end, and the heat storage material is used to store the waste heat generated in the process of the fan blowing the heat from the hot end to the cold end; The controller is used to send the control signal to the semiconductor refrigeration chip according to the current first temperature parameter of the enclosed space and the current second temperature parameter of the heat storage material; The battery is used to provide electrical energy to the semiconductor refrigeration chip, the fan and the controller.
2. The thermal control device according to claim 1, characterized in that: The thermal control device further comprises: A cold end heat sink, disposed at the cold end of the semiconductor refrigeration chip, for cooling the received heat; The hot end heat sink is arranged at the hot end of the semiconductor refrigeration chip and is used to cool the heat collected by the hot end.
3. The thermal control device according to claim 2, characterized in that: A first thermally conductive pad is arranged between the cold end radiator and the cold end, and a second thermally conductive pad is arranged between the hot end radiator and the hot end.
4. The thermal control device according to any one of claims 1 to 3, characterized in that: The thermal control device further comprises: The heat-insulating shell has a containing space for containing the heat storage material and isolating the heat from the external environment.
5. The thermal control device according to claim 4, characterized in that: The thermal control device also includes: A temperature sensor is connected to the controller, the temperature sensor is arranged in the insulating shell, and is used to monitor the current temperature of the heat storage material to obtain the second temperature parameter; and is arranged in the enclosed space, and is used to monitor the current temperature of the enclosed space to obtain the first temperature parameter, and send the first temperature parameter and the second temperature parameter to the controller.
6. The thermal control device according to claim 4, characterized in that: The thermal control device further comprises: A power interface, connected to the battery and used to charge the battery; The controller is also used to switch the heat conduction direction of the semiconductor refrigeration chip when the battery is charged through the power interface, so that the hot end collects the heat stored in the heat storage material, and the fan blows the heat to the cold end for cooling, thereby releasing the heat storage space of the heat storage material.
7. The thermal control device according to claim 1, characterized in that: The battery has a plurality of cells, and the plurality of cells are connected in series.
8. The thermal control device according to claim 4, characterized in that: The heat-insulating shell is connected to the semiconductor refrigeration chip, and a heat-conducting adhesive pad is arranged between the heat-insulating shell and the semiconductor refrigeration chip.
9. The thermal control device according to claim 1, characterized in that: The thermal control device also includes a heat-conducting pipe, which is connected to the external space of the wearable device. The heat-conducting pipe is unidirectional and can only discharge the heat in the enclosed space to the external space. The air in the external space cannot enter the enclosed space through the heat-conducting pipe.
10. A wearable device, characterized in that: The wearable device has a closed space, and the thermal control device according to any one of claims 1 to 9 is provided in the closed space.