Silicon wafer grinding device

Abstract

The utility model discloses a silicon wafer grinding device which comprises a fixed bottom plate, a motor groove is formed in the inner side of the fixed bottom plate, and a sliding rail is arranged on the fixed bottom plate; the first motor is fixedly connected to the inner side of the motor groove, threaded shafts are arranged on the two sides of the first motor, and the threaded shafts are rotationally connected with the fixed bottom plate; the sliding rod is slidably connected to the inner side of the sliding rail, and the sliding rod is in threaded connection with the threaded shaft; the pressure-sensitive grinding assembly is fixedly connected to one side of the sliding rod; the rotating assembly is fixedly connected to the top end of the fixed bottom plate; the clamping assembly is fixedly connected to the inner side of the rotating assembly, and a silicon wafer capable of being clamped and fixed is arranged on the inner side of the clamping assembly. Compared with the prior art, the silicon wafer polishing device has the advantages that a silicon wafer can be efficiently polished in a double-sided mode, pressure can be buffered, and polishing precision, safety and stability can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer manufacturing, in particular to a silicon wafer grinding device. Background Art

[0002] With the development of semiconductor technology, the diameter of silicon wafers is getting larger and larger, while the feature size of integrated circuits is getting smaller and smaller. As a result, higher requirements are placed on the flatness, cleanliness and damage resistance of the silicon wafer surface.

[0003] However, the patents under the existing technology have the following disadvantages:

[0004] (1) The existing utility model silicon wafer grinding devices mostly adopt a single-sided grinding structure, which can only perform single-sided grinding at a time, and the grinding efficiency is low. In addition, the existing silicon wafer grinding devices adjust the grinding thickness by advancing the grinding disk. Since the grinding disk will exert a certain pressure on the silicon wafer, it is very easy to cause damage to the silicon wafer during grinding. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the above technical defects and provide a silicon wafer grinding device which can grind silicon wafers on both sides efficiently and can buffer pressure to improve grinding accuracy.

[0006] In order to solve the above problems, the technical solution of the utility model is: a silicon wafer grinding device, comprising:

[0007] A fixed bottom plate, wherein a motor slot is provided on the inner side of the fixed bottom plate, and a slide rail is provided on the fixed bottom plate;

[0008] Motor 1, the motor 1 is fixedly connected to the inner side of the motor slot, threaded shafts are provided on both sides of the motor 1, and the threaded shafts are rotatably connected to the fixed bottom plate;

[0009] A slide rod, the slide rod is slidably connected to the inner side of the slide rail, and the slide rod is threadedly connected to the threaded shaft;

[0010] A pressure-sensitive grinding component, wherein the pressure-sensitive grinding component is fixedly connected to one side of the sliding rod;

[0011] A rotating assembly, wherein the rotating assembly is fixedly connected to the top end of the fixed bottom plate;

[0012] The clamping assembly is fixedly connected to the inner side of the rotating assembly, and the inner side of the clamping assembly is provided with a silicon wafer that can be clamped and fixed.

[0013] Furthermore, the pressure-sensitive grinding assembly comprises:

[0014] A fixed tube, the fixed tube is fixedly connected to one side of the slide rod, and a fixed shaft 1 is provided on the inner side of the fixed tube;

[0015] A pressure sensor 1, wherein the pressure sensor 1 is fixedly connected to one end of the fixed shaft 1;

[0016] A connecting pipe, wherein the connecting pipe is slidably connected to the inner side of the fixed pipe, and the connecting pipe is slidably connected to the fixed shaft;

[0017] Spring 1, the spring 1 is fixedly connected between the connecting pipe and the pressure sensor 1, and the spring 1 is provided with a damper;

[0018] A grinding disc, the grinding disc is fixedly connected to one end of a connecting tube, a fixing frame is provided on one side of the grinding disc, a fixed shaft 2 is provided between the fixing frames, a fixedly connected pressure sensor 2 is provided at one end of the fixed shaft 2, a sliding block is provided for sliding connection on the outer side of the fixed shaft 2, a fixedly connected spring 2 is provided between the sliding block and the pressure sensor 2, the spring 2 is provided with a damper, and a rotatably connected support rod is provided between the sliding block and the fixed tube.

[0019] Furthermore, the rotating assembly comprises:

[0020] Motor 2, the motor 2 is fixedly connected to the top of the fixed bottom plate, and a gear is provided on one side of the motor 2;

[0021] A support frame, the support frame is fixedly connected to the top of the fixed bottom plate;

[0022] The rotating ring is located on the inner side of the supporting frame, a rotating groove is provided on the outer side of the rotating ring, the supporting frame is inserted into the rotating groove so that the rotating ring and the supporting frame are rotationally connected, and a tooth groove is provided on the outer side of the rotating ring, and the tooth groove is meshed with the gear.

[0023] Furthermore, the clamping assembly comprises:

[0024] A slide groove 1, wherein the slide groove 1 is located on the inner side of the rotating ring;

[0025] A clamping rod, wherein the clamping rod is slidably connected to the first slide groove, a second slide groove is provided on the inner side of the rotating ring, and a fixed shaft three is fixedly connected on both sides of the clamping rod, and the fixed shaft three is slidably connected to the second slide groove;

[0026] An adjusting ring, wherein a rotating groove 2 is provided on the inner side of the rotating ring, and the adjusting ring is rotatably connected to the inner side of the rotating groove 2. Slide grooves 3 are provided on both sides of the adjusting ring, and the slide grooves 3 are slidably connected to the fixed shaft 3. Slide grooves 4 are provided on both sides of the rotating ring, and fixed shafts 4 are fixedly connected on both sides of the adjusting ring, and the fixed shafts 4 are slidably connected to the slide grooves 4.

[0027] An electric push rod is rotatably connected to both sides of the rotating ring, and a driving end of the electric push rod is rotatably connected to a fixed shaft four.

[0028] The advantages of the utility model compared with the existing technology are:

[0029] (1) The utility model provides a silicon wafer grinding device with a pressure-sensitive grinding component. When the grinding disc is pushed forward to grind the silicon wafer, the pressure-sensitive grinding component can buffer the pressure during the pushing, protect the silicon wafer, reduce the breakage rate of the silicon wafer, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The utility model is a three-dimensional diagram of a silicon wafer grinding device.

[0031] Figure 2 This is a cross-sectional view of a silicon wafer grinding device of the utility model. Figure 1 .

[0032] Figure 3 It is an enlarged view of A of a silicon wafer grinding device of the present utility model.

[0033] Figure 4 It is an enlarged view of B of a silicon wafer grinding device of the present utility model.

[0034] Figure 5 This is a cross-sectional view of a silicon wafer grinding device of the utility model. Figure 2 .

[0035] Figure 6 This is a cross-sectional view of a silicon wafer grinding device of the utility model. Figure 3 .

[0036] Figure 7 This is a cross-sectional view of a silicon wafer grinding device of the utility model. Figure 4 .

[0037] Figure 8 It is a stereoscopic diagram of a silicon wafer grinding device in a grinding state according to the utility model.

[0038] As shown in the figure: 1. Fixed base plate; 2. Grinding disc; 3. Motor slot; 4. Slide rail; 5. Motor 1; 6. Threaded shaft; 7. Slide rod; 8. Pressure-sensitive grinding assembly; 9. Rotating assembly; 10. Clamping assembly; 11. Silicon wafer; 12. Fixed tube; 13. Fixed shaft 1; 14. Pressure sensor 1; 15. Connecting tube; 16. Spring 1; 17. Fixed frame; 18. Fixed shaft 2; 19. Pressure sensor 2; 20. Slider; 21. Spring 2; 22. Support rod; 23. Motor 2; 24. Gear; 25. Support frame; 26. Rotating ring; 27. Rotating slot; 28. Tooth slot; 29. ​​Slide slot 1; 30. Clamping rod; 31. Slide slot 2; 32. Fixed shaft 3; 33. Rotating slot 2; 34. Adjusting ring; 35. Slide slot 3; 36. Slide slot 4; 37. Fixed shaft 4; 38. Electric push rod. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] Embodiment 1:

[0042] like Figures 1 to 8 As shown, a silicon wafer grinding device includes: a fixed base plate 1, a motor slot 3 is arranged on the inner side of the fixed base plate 1, and a slide rail 4 is arranged on the fixed base plate 1; a motor 5, the motor 5 is fixedly connected to the inner side of the motor slot 3, and threaded shafts 6 are arranged on both sides of the motor 5, and the threaded shafts 6 are rotatably connected to the fixed base plate 1; a slide bar 7, the slide bar 7 is slidably connected to the inner side of the slide rail 4, and the slide bar 7 is threadedly connected to the threaded shaft 6; a pressure-sensitive grinding component 8, the pressure-sensitive grinding component 8 is fixedly connected to one side of the slide bar 7; a rotating component 9, the rotating component 9 is fixedly connected to the top of the fixed base plate 1; a clamping component 10, the clamping component 10 is fixedly connected to the inner side of the rotating component 9, and a silicon wafer 11 that can be clamped and fixed is arranged on the inner side of the clamping component 10.

[0043] The pressure-sensing grinding assembly 8 includes: a fixed tube 12, the fixed tube 12 is fixedly connected to one side of the slide rod 7, and a fixed shaft 13 is arranged on the inner side of the fixed tube 12; a pressure sensor 14, the pressure sensor 14 is fixedly connected to one end of the fixed shaft 13; a connecting tube 15, the connecting tube 15 is slidably connected to the inner side of the fixed tube 12, and the connecting tube 15 is slidably connected to the fixed shaft 13; a spring 16, the spring 16 is fixedly connected between the connecting tube 15 and the pressure sensor 14, and the spring 16 has a damper; a grinding disc 2, The grinding disc 2 is fixedly connected to one end of the connecting tube 15, and a slidingly connected fixing frame 17 is set on one side of the grinding disc 2, and a fixedly connected fixed shaft 18 is set between the fixing frames 17, and a fixedly connected pressure sensor 19 is set at one end of the fixed shaft 18, and a slidingly connected slider 20 is set on the outer side of the fixed shaft 18, and a fixedly connected spring 21 is set between the slider 20 and the pressure sensor 19, and the spring 21 has a damper, and a rotatably connected support rod 22 is set between the slider 20 and the fixed tube 12.

[0044] The rotating assembly 9 includes: a motor 23, which is fixedly connected to the top of the fixed base plate 1, and a gear 24 is arranged on one side of the motor 23; a support frame 25, which is fixedly connected to the top of the fixed base plate 1; a rotating ring 26, which is located on the inner side of the support frame 25, and a rotating groove 27 is arranged on the outer side of the rotating ring 26, and the support frame 25 is inserted into the rotating groove 27 so that the rotating ring 26 is rotatably connected to the support frame 25, and a tooth groove 28 is arranged on the outer side of the rotating ring 26, and the tooth groove 28 is meshed with the gear 24.

[0045] The clamping assembly 10 includes: a slide groove 29, which is located on the inner side of the rotating ring 26; a clamping rod 30, which is slidably connected to the slide groove 29, a slide groove 2 31 is provided on the inner side of the rotating ring 26, and fixed shafts 32 are fixedly connected on both sides of the clamping rod 30, and the fixed shaft 32 is slidably connected to the slide groove 2 31; an adjusting ring 34, a rotating groove 2 33 is provided on the inner side of the rotating ring 26, and the adjusting ring 34 is rotatably connected to the inner side of the rotating groove 2 33, slide grooves 35 are provided on both sides of the adjusting ring 34, and the slide groove 35 is slidably connected to the fixed shaft 32, a slide groove 4 36 is provided on both sides of the rotating ring 26, and fixed shafts 4 37 are fixedly connected on both sides of the adjusting ring 34, and the fixed shaft 4 37 is slidably connected to the slide groove 4 36; an electric push rod 38, which is rotatably connected to both sides of the rotating ring 26, and the driving end of the electric push rod 38 is rotatably connected to the fixed shaft 4 37.

[0046] In specific use, the silicon wafer 11 is placed in the rotating ring 26, and the electric push rod 38 is started to push the fixed shaft four 37 to slide in the slide groove four 36, so that the adjustment ring 34 rotates in the rotating groove two 33, and the adjustment ring 34 drives the slide groove three 35 to operate. The operating slide groove three 35 pushes the fixed shaft three 32 to slide in the slide groove two 31, so that the clamping rod extends to clamp and fix the silicon wafer 11.

[0047] Starting motor 23 causes gear 24 to rotate, which drives rotating ring 26 to rotate through tooth groove 28, so that the clamped silicon wafer 11 rotates at high speed. Starting motor 1 5 causes threaded shaft 6 to rotate, and threaded shaft 6 drives slide rod 7 to slide in the slide rail, so that the grinding discs 2 on both sides move toward the silicon wafer and gradually fit closely to the silicon wafer.

[0048] When the grinding disc 2 contacts and applies pressure to the silicon wafer 11, the connecting tube 15 slides in the fixed tube 12 and squeezes the spring 16. The damper provided by the spring 16 can buffer and reduce shock. At the same time, the pressure sensor 14 will monitor the pressure value at this time. When the pressure threshold is reached, the pressure sensor 14 controls the motor 5 to turn off, so that the slide rod 7 stops advancing.

[0049] Similarly, when the grinding disc 2 contacts and applies pressure to the silicon wafer 11, the support rod 22 rotates, driving the slider 20 to slide on the outside of the fixed shaft 18 and squeezing the spring 21. The damper provided by the spring 21 can buffer and reduce shock. At the same time, the pressure sensor 2 19 will monitor the pressure value at this time. When the pressure threshold is reached, the pressure sensor 2 19 can also control the motor 5 to turn off, so that the slide rod 7 stops advancing.

[0050] When the monitored pressure decreases, pressure sensor 14 and pressure sensor 2 19 can control motor 1 5 to start, so that the slide bar 7 continues to move forward, and this process is repeated until the slide bar 7 slides to one end of the slide rail 4, so that the silicon wafer 11 can be polished to the required thickness.

[0051] The electrical components appearing in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that controls a computer, etc. The specific implementation method of the present disclosure omits the detailed description of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer polishing device, characterized in that: include: A fixed base plate (1), wherein a motor slot (3) is provided on the inner side of the fixed base plate (1), and a slide rail (4) is provided on the fixed base plate (1); Motor 1 (5), the motor 1 (5) is fixedly connected to the inner side of the motor slot (3), threaded shafts (6) are provided on both sides of the motor 1 (5), and the threaded shafts (6) are rotatably connected to the fixed bottom plate (1); A slide rod (7), wherein the slide rod (7) is slidably connected to the inner side of the slide rail (4), and the slide rod (7) is threadedly connected to the threaded shaft (6); A pressure-sensitive grinding component (8), wherein the pressure-sensitive grinding component (8) is fixedly connected to one side of the sliding rod (7); A rotating assembly (9), wherein the rotating assembly (9) is fixedly connected to the top end of the fixed base plate (1); A clamping assembly (10) is fixedly connected to the inner side of the rotating assembly (9), and a silicon wafer (11) that can be clamped and fixed is provided on the inner side of the clamping assembly (10).

2. A silicon wafer polishing device according to claim 1, characterized in that: The pressure-sensitive grinding assembly (8) comprises: A fixed tube (12), the fixed tube (12) being fixedly connected to one side of the slide rod (7), and a fixed shaft (13) being provided on the inner side of the fixed tube (12); A pressure sensor 1 (14), wherein the pressure sensor 1 (14) is fixedly connected to one end of a fixed shaft 1 (13); A connecting pipe (15), wherein the connecting pipe (15) is slidably connected to the inner side of the fixed pipe (12), and the connecting pipe (15) is slidably connected to the fixed shaft (13); Spring 1 (16), the spring 1 (16) is fixedly connected between the connecting pipe (15) and the pressure sensor 1 (14), and the spring 1 (16) is provided with a damper; A grinding disc (2), wherein the grinding disc (2) is fixedly connected to one end of a connecting tube (15), a fixing frame (17) is provided on one side of the grinding disc (2), a fixing shaft (18) is provided between the fixing frames (17), a fixed pressure sensor (19) is provided at one end of the fixed shaft (18), a sliding block (20) is provided on the outer side of the fixed shaft (18), a fixed spring (21) is provided between the sliding block (20) and the pressure sensor (19), the spring (21) is provided with a damper, and a rotatably connected support rod (22) is provided between the sliding block (20) and the fixing tube (12).

3. A silicon wafer polishing device according to claim 1, characterized in that: The rotating assembly (9) comprises: Motor 2 (23), the motor 2 (23) is fixedly connected to the top of the fixed base plate (1), and a gear (24) is provided on one side of the motor 2 (23); A support frame (25), wherein the support frame (25) is fixedly connected to the top end of the fixed base plate (1); A rotating ring (26), the rotating ring (26) is located on the inner side of the support frame (25), a rotating groove (27) is provided on the outer side of the rotating ring (26), the support frame (25) is inserted into the rotating groove (27) so that the rotating ring (26) and the support frame (25) are rotationally connected, and a tooth groove (28) is provided on the outer side of the rotating ring (26), and the tooth groove (28) is meshed with the gear (24).

4. A silicon wafer polishing device according to claim 3, characterized in that: The clamping assembly (10) comprises: A slide groove (29), wherein the slide groove (29) is located on the inner side of the rotating ring (26); A clamping rod (30), wherein the clamping rod (30) is slidably connected to the first slide groove (29), a second slide groove (31) is provided on the inner side of the rotating ring (26), and fixed shafts (32) are fixedly connected on both sides of the clamping rod (30), and the fixed shafts (32) are slidably connected to the second slide groove (31); An adjusting ring (34), a rotating groove 2 (33) is provided on the inner side of the rotating ring (26), the adjusting ring (34) is rotatably connected to the inner side of the rotating groove 2 (33), sliding grooves 3 (35) are provided on both sides of the adjusting ring (34), the sliding grooves 3 (35) are slidably connected to the fixed shaft 3 (32), sliding grooves 4 (36) are provided on both sides of the rotating ring (26), and fixed shafts 4 (37) are fixedly connected on both sides of the adjusting ring (34), the fixed shafts 4 (37) are slidably connected to the sliding grooves 4 (36); An electric push rod (38) is rotatably connected to both sides of the rotating ring (26), and a driving end of the electric push rod (38) is rotatably connected to a fixed shaft four (37).

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