Chip aging test device

Abstract

The utility model relates to the technical field of chip testing, and discloses a chip aging test device, which comprises a chip aging test board at least provided with a first test seat and a second test seat, the first test seat and the second test seat are located on the same surface, and the first test seat and the second test seat are located on the same horizontal position; the detection mechanism is arranged between the first test seat and the second test seat, the detection mechanism is provided with preset parameters, when a workpiece is inserted into the first test seat and the second test seat, the detection mechanism generates detection parameters, and if the detection parameters do not reach the preset parameters, the detection mechanism sends an abnormal signal. The test efficiency, accuracy and reliability of the chip aging test device are improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip testing, and in particular to a chip aging testing device. Background Art

[0002] Chip aging test is a key step to ensure the reliable operation of integrated circuits during their life cycle. During testing, the chip aging test device applies various test signals and electrical stresses to the chip to accelerate its aging process, thereby discovering potential failures in advance.

[0003] At present, the working parts of integrated chips can be matched into chip aging test devices for chip aging operations. During the process of inserting the working parts into the chip aging test devices, if the working parts are inserted crookedly or not fully inserted for some reason, it is very easy to cause damage to the working parts, affecting the reliability of the device and affecting the test efficiency and accuracy. Utility Model Content

[0004] In view of this, the present application provides a chip aging test device to improve the reliability of chip aging test.

[0005] To achieve the above objectives, the technical solutions adopted are:

[0006] A chip aging test device, comprising:

[0007] A chip aging test board is provided with at least a first test seat and a second test seat, wherein the first test seat and the second test seat are located on the same surface, and the first test seat and the second test seat are located at the same horizontal position;

[0008] The detection mechanism is arranged between the first test seat and the second test seat. The detection mechanism is provided with preset parameters. When the workpiece is inserted into the first test seat and the second test seat, the detection mechanism generates the detection parameters. If the detection parameters do not reach the preset parameters, the detection mechanism sends an abnormal signal.

[0009] The present application is further configured as follows: the chip aging test board is provided with a third test seat, the third test seat is located on the same surface as the first test seat and the second test seat, and the third test seat is located at the same horizontal position as the first test seat and the second test seat, and the detection mechanism is also arranged between the second test seat and the third test seat.

[0010] The present application is further configured as follows: when the workpiece is inserted into the first test seat, the second test seat and the third test seat, the detection mechanism generates two detection parameters, and if the two detection parameters do not reach the preset parameters, the detection mechanism sends an abnormal signal.

[0011] The present application is further configured as follows: the chip aging test board is provided with a controller for receiving the abnormal signal, and after receiving the abnormal signal, the controller keeps the test circuit of the chip aging test board disconnected, and / or

[0012] The alarm circuit of the chip aging test board is turned on and an alarm signal is generated.

[0013] The present application is further configured as follows: the detection mechanism includes an elastic switch, the preset parameters include a preset stroke value, and when the workpiece is inserted into the first test seat, the second test seat and the third test seat, the elastic switch generates two detection stroke values, and if the two detection stroke values ​​do not reach the preset stroke values, the elastic switch sends the abnormal signal.

[0014] The present application is further configured as follows: the detection mechanism includes a pressure sensor, the preset parameters include preset signal values, and when the workpiece is inserted into the first test seat, the second test seat and the third test seat, the pressure sensor generates two detection signal values, and if the two detection signal values ​​do not reach the preset signal values, the pressure sensor sends the abnormal signal.

[0015] The present application is further configured as follows: the elastic switch includes: a switch accommodating chamber, a telescopic button shell, an elastic member, a displacement sensor, a fixing groove, a test rod and a stop column; the switch accommodating chamber is opened between the first test seat and the second test seat, and between the second test seat and the third test seat; the first end surface of the telescopic button shell is arranged in the switch accommodating chamber, and the second end surface of the telescopic button shell is higher than the switch accommodating chamber; a stop column is provided in the switch accommodating chamber, and a fixing groove is provided on the first end surface of the telescopic button shell facing the stop column, the elastic member is arranged in the fixing groove, and at least one end of the elastic member abuts against the stop column; the test rod is located in the elastic member, and at least one end of the test rod is connected to the displacement sensor.

[0016] The present application is further configured as follows: the test rod is connected at the center of the fixing groove, and the test rod is located between the stop columns, and the side edges of the stop columns are located within the coverage of the fixing groove in spatial projection.

[0017] The present application is further configured as follows: a moving block is integrally connected to the first end face of the telescopic button shell, a first moving groove is provided on the inner wall of the switch accommodating cavity, and the moving block is matched in the first moving groove; a stabilizing foot is integrally connected to one end of the moving block, the end of the stabilizing foot is rounded in design, a second moving groove is provided at the bottom of the first moving groove, and the stabilizing foot is matched in the second moving groove.

[0018] The present application is further configured as follows: a shell height of the telescopic button housing is greater than or equal to a slot length of the first movement slot and a cavity height of the switch accommodating cavity.

[0019] To sum up, compared with the prior art, the present application discloses a chip aging test device, including a chip aging test board and a detection mechanism, wherein the first test seat and the second test seat of the chip aging test board are located on the same surface and at the same horizontal position, wherein the detection mechanism is arranged between the first test seat and the second test seat, and when the workpiece is inserted into the first test seat and the second test seat, the detection mechanism generates detection parameters, and if the detection parameters do not reach the preset parameters set by the detection mechanism, the detection mechanism sends an abnormal signal, that is, through the above-mentioned setting, the present application improves the test efficiency, accuracy and reliability of the chip aging test device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a structural schematic diagram of a first chip aging test device provided in this embodiment;

[0022] Figure 2 is a structural schematic diagram of a second chip aging test device provided in this embodiment;

[0023] Figure 3 is a schematic diagram of the framework structure of the chip aging test device provided in this embodiment;

[0024] Figure 4 Schematic diagram of the structure of the elastic switch provided in this embodiment.

[0025] Figure numerals: 1. chip aging test board; 11. first test socket; 12. second test socket; 13. third test socket; 14. first moving slot; 15. second moving slot; 2. working piece; 21. first metallized contact plate; 22. second metallized contact plate; 23. third metallized contact plate; 3. detection mechanism; 31. switch accommodating chamber; 32. telescopic button shell; 321. second buffer pad; 33. elastic member; 34. displacement sensor; 35. fixing slot; 36. test rod; 37. stop column; 38. moving block; 381. first buffer pad; 39. stabilizing foot; 101. chip aging test device; 102. controller; 103. test circuit; 104. alarm circuit. DETAILED DESCRIPTION

[0026] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0027] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0028] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0030] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments.

[0032] like Figure 1 and Figure 2As shown, the chip aging test device of this embodiment includes a chip aging test board 1 and a detection mechanism 3. The chip aging test board 1 is provided with at least a first test seat 11 and a second test seat 12 matching the workpiece 2, wherein the first test seat 11 and the second test seat 12 are located on the same surface, and the first test seat 11 and the second test seat 12 are located at the same horizontal position.

[0033] In the specific implementation process, the detection mechanism 3 is arranged between the first test socket 11 and the second test socket 12. The detection mechanism 3 is provided with preset parameters. When the workpiece 2 is inserted into the first test socket 11 and the second test socket 12, the detection mechanism 3 generates detection parameters. If the detection parameters do not reach the preset parameters, the detection mechanism 3 sends an abnormal signal. Therefore, in the process of inserting the workpiece 2 into the chip aging test board 1 for testing, it can prevent the workpiece 2 from being inserted crookedly or not fully inserted for some reason, thereby avoiding damage to the workpiece 2 and improving the test efficiency, accuracy and reliability of the chip aging test device.

[0034] Furthermore, the work piece 2 of the present embodiment may be a circuit board of an integrated chip, and the end of the work piece 2 facing the chip aging test board 1 may be correspondingly provided with a first metallized contact pad 21 and a second metallized contact pad 22, the first metallized contact pad 21 being inserted into the first test seat 11, and the second metallized contact pad 22 being inserted into the second test seat 12.

[0035] In one embodiment, the workpiece 2 can be a BIB (Bare Integrated Board) circuit board with an integrated chip. The BIB circuit board integrates the chip directly onto the circuit board without the need for packaging. While greatly reducing the volume and weight of the circuit, it can also better transfer and dissipate heat, achieve a more compact layout, and thus improve circuit integration. The chip aging test board 1 can be a BIOven slot test board, wherein BI (Bare Integrated) means that the chip aging test board 1 is designed for bare chip integrated circuits without packaging, and Oven means that the chip aging test board 1 can be heat treated. Therefore, the chip aging test device of this embodiment can be applied to UFS (Universal Flash Storage) BIB Power storage to pass the chip aging test and ensure the high performance and reliability of the UFS storage device.

[0036] Of course, the chip aging test device of this embodiment is not limited to this, and it can also be applied to the working part testing of other integrated chips, which will not be elaborated here.

[0037] In one embodiment, the chip aging test board 1 can be provided with a third test seat 13, the third test seat 13 is located on the same surface as the first test seat 11 and the second test seat 12, and the third test seat 13 is located at the same horizontal position as the first test seat 11 and the second test seat 12, wherein the detection mechanism 3 can also be arranged between the second test seat 12 and the third test seat 13.

[0038] During the aging test of the workpiece 2, after the workpiece 2 is inserted into the first test socket 11, the second test socket 12 and the third test socket 13, the detection mechanism 3 can generate two detection parameters. If the two detection parameters do not reach the preset parameters, the detection mechanism 3 sends an abnormal signal, thereby further preventing the workpiece 2 from being inserted crookedly or not fully inserted for some reason, thereby avoiding damage to the workpiece 2 and improving the test efficiency, accuracy and reliability of the chip aging test device.

[0039] Furthermore, a third metallized contact pad 23 may be correspondingly provided at one end of the workpiece 2 facing the chip aging test board 1 , and the third metallized contact pad 23 is inserted into the third test socket 13 .

[0040] refer to Figure 3 The chip aging test device 101 of this embodiment inserts the workpiece 2 into the chip aging test board 1 to perform chip performance testing, wherein the chip aging test board 1 may be provided with a controller 102 for receiving an abnormal signal sent by a detection mechanism 3. After receiving the abnormal signal, the controller 102 may keep the test circuit 103 of the chip aging test board 1 disconnected, thereby ensuring that the test work of the chip aging test board 1 is interrupted, and avoiding the test current from damaging the workpiece 2 when the workpiece 2 is inserted crookedly or not fully inserted for some reason, that is, the detection mechanism 3 is used to exert an anti-fool function.

[0041] On the other hand, after receiving the abnormal signal, the controller 102 can keep the test circuit 103 of the chip aging test board 1 disconnected, and / or turn on the alarm circuit 104 of the chip aging test board 1 and generate an alarm signal, thereby performing the fool-proofing function and the alarm function in parallel to improve the test efficiency, accuracy and reliability of the chip aging test device 101.

[0042] In one embodiment, the detection mechanism 3 may include a pressure sensor, and the preset parameters may include a preset signal value, that is, during the aging test of the workpiece 2, when the workpiece 2 is inserted into the first test seat 11, the second test seat 12 and the third test seat 13, the pressure sensor generates two detection signal values. If the two detection signal values ​​do not reach the preset signal values, the pressure sensor sends an abnormal signal. After receiving the abnormal signal, the controller can keep the test circuit of the chip aging test board 1 disconnected and / or turn on the alarm circuit of the chip aging test board 1 and generate an alarm signal. Therefore, under the action of the two pressure sensors, the workpiece 2 is prevented from being inserted crookedly or not fully inserted for some reason, thereby avoiding damage to the workpiece 2 and improving the test efficiency, accuracy and reliability of the chip aging test device.

[0043] In one embodiment, the detection mechanism 3 may include an elastic switch, and the preset parameters may include a preset stroke value, that is, during the aging test of the workpiece 2, when the workpiece 2 is inserted into the first test seat 11, the second test seat 12 and the third test seat 13, the elastic switch can generate two detection stroke values. If the two detection stroke values ​​do not reach the preset stroke values, the elastic switch sends an abnormal signal. After receiving the abnormal signal, the controller can keep the test circuit of the chip aging test board 1 disconnected and / or turn on the alarm circuit of the chip aging test board 1 and generate an alarm signal. Therefore, under the action of the two elastic switches, the workpiece 2 is prevented from being inserted crookedly or not fully inserted for some reason, thereby avoiding damage to the workpiece 2 and improving the test efficiency, accuracy and reliability of the chip aging test device.

[0044] Among them, the end of the elastic switch can abut against one end of the workpiece 2 provided with a metallized contact plate, so that when the workpiece 2 is inserted into the first test seat 11, the second test seat 12 and the third test seat 13, the elastic switch is compressed by the workpiece 2 to generate two detection stroke values.

[0045] refer to Figure 4 The elastic switch of this embodiment may include a switch accommodating chamber 31, a telescopic button shell 32, an elastic member 33, a displacement sensor 34, a fixing groove 35, a test rod 36 and a stop column 37. The switch accommodating chamber 31 is opened between the first test seat 11 and the second test seat 12, and between the second test seat 12 and the third test seat 13. The first end surface of the telescopic button shell 32 is arranged in the switch accommodating chamber 31, and the second end surface of the telescopic button shell is higher than the switch accommodating chamber, that is, the telescopic button shell 32 is connected to the switch accommodating chamber 31 and can slide relative to the switch accommodating chamber 31, thereby ensuring that the elastic switch is actuated after being compressed.

[0046] Among them, a stop column 37 is provided in the switch accommodating cavity 31, and a fixing groove 35 is provided on the first end surface of the telescopic button shell 32 facing the stop column 37. The elastic member 33 is arranged in the fixing groove 35, and at least one end of the elastic member 33 abuts against the stop column 37 to ensure the stroke resetting action of the elastic switch; and the test rod 36 is located in the elastic member 33, and at least one end of the test rod 36 is connected to the displacement sensor 34. Then, when the working piece 2 is inserted into the test seat, the working piece 21 forces the telescopic button shell 32 to slide into the switch accommodating cavity 31, and the test rod 36 is displaced relative to the displacement sensor 34 to generate a detection stroke value.

[0047] In order to keep the telescopic button housing 32 and the test rod 36 running smoothly during the operation of the elastic switch, the test rod 36 is connected to the center of the fixing groove 35, and the test rod 36 is located between the symmetrically arranged stop columns 37, thereby providing an escape space for the test rod 36.

[0048] Based on the reset requirement of the elastic switch, the two ends of the elastic member 33 respectively abut against the bottom of the fixing groove 35 and the stop column 37, and the side of the stop column 37 is located within the coverage range of the fixing groove 35 in spatial projection to prevent the stop column 37 from interfering with the sliding of the telescopic button shell 32.

[0049] In order to further ensure that the telescopic button shell 32 slides smoothly relative to the switch accommodating chamber 31, the first end surface of the telescopic button shell 32 of this embodiment is integrally connected with a moving block 38 for sliding connection. The moving block 38 is located in the switch accommodating chamber 11. The inner wall of the switch accommodating chamber 11 is provided with a first moving groove 14. The moving block 38 is matched in the first moving groove 14, that is, the telescopic button shell 32 is guided to slide through the cooperation between the first moving groove 14 and the moving block 38.

[0050] Among them, one end of the moving block 38 is integrally connected with a stabilizing foot 39, the end of the stabilizing foot 39 is designed with a round head, and a second moving groove 15 is opened at the bottom of the first moving groove 14, and the stabilizing foot 39 is matched in the second moving groove 15, that is, the cooperation between the second moving groove 15 and the stabilizing foot 39 stabilizes the sliding of the telescopic button shell 32, thereby improving the stability of the elastic switch.

[0051] The shell height of the telescopic button shell 32 is greater than or equal to the slot length of the first movement slot 14 and the cavity height of the switch accommodating cavity 31 to ensure the travel space of the test rod 36 and facilitate the displacement sensor 34 to generate a detection stroke value.

[0052] The top surface of the moving block 38 of this embodiment is connected to a first buffer pad 381, and the top surface of the telescopic button shell 32 is connected to a second buffer pad 321. The second buffer pad 321 is provided with anti-slip grooves. The first buffer pad 381 facilitates the stable contact between the moving block 38 of the telescopic button shell 32 and the inner wall of the switch accommodating cavity 31, and the second buffer pad 321 facilitates the working piece 2 to press the telescopic button shell 32.

[0053] To summarize, the chip aging test device of the present embodiment includes a chip aging test board 1 and a detection mechanism 3. The first test seat 11 and the second test seat 12 of the chip aging test board 1 are on the same surface and located at the same horizontal position, wherein the detection mechanism 3 is arranged between the first test seat 11 and the second test seat 12. When the workpiece 2 is inserted into the first test seat 11 and the second test seat 12, the detection mechanism 3 generates detection parameters. If the detection parameters do not reach the preset parameters set by the detection mechanism, the detection mechanism 3 sends an abnormal signal, thereby preventing the workpiece 2 from being inserted crookedly or not fully inserted for some reason to avoid damage to the workpiece 2, thereby improving the testing efficiency, accuracy and reliability of the chip aging test device.

[0054] The above is a detailed introduction to the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A chip aging test device, characterized in that: include: A chip aging test board is provided with at least a first test seat and a second test seat, wherein the first test seat and the second test seat are located on the same surface, and the first test seat and the second test seat are located at the same horizontal position; The detection mechanism is arranged between the first test seat and the second test seat. The detection mechanism is provided with preset parameters. When the workpiece is inserted into the first test seat and the second test seat, the detection mechanism generates the detection parameters. If the detection parameters do not reach the preset parameters, the detection mechanism sends an abnormal signal.

2. A chip aging test device as claimed in claim 1, characterized in that: The chip aging test board is provided with a third test seat, the third test seat is located on the same surface as the first test seat and the second test seat, and the third test seat is located at the same horizontal position as the first test seat and the second test seat, and the detection mechanism is also arranged between the second test seat and the third test seat.

3. A chip aging test device as claimed in claim 2, characterized in that: When the workpiece is inserted into the first test seat, the second test seat and the third test seat, the detection mechanism generates two detection parameters. If the two detection parameters do not reach the preset parameters, the detection mechanism sends an abnormal signal.

4. A chip aging test device as claimed in claim 1 or 3, characterized in that: The chip aging test board is provided with a controller for receiving the abnormal signal. After receiving the abnormal signal, the controller keeps the test circuit of the chip aging test board disconnected, and / or The alarm circuit of the chip aging test board is turned on and an alarm signal is generated.

5. A chip aging test device as claimed in claim 3, characterized in that: The detection mechanism includes an elastic switch, and the preset parameters include preset stroke values. When the workpiece is inserted into the first test seat, the second test seat and the third test seat, the elastic switch generates two detection stroke values. If the two detection stroke values ​​do not reach the preset stroke values, the elastic switch sends the abnormal signal.

6. A chip aging test device as claimed in claim 5, characterized in that: The detection mechanism includes a pressure sensor, and the preset parameters include preset signal values. When the workpiece is inserted into the first test seat, the second test seat and the third test seat, the pressure sensor generates two detection signal values. If the two detection signal values ​​do not reach the preset signal values, the pressure sensor sends the abnormal signal.

7. A chip aging test device as claimed in claim 5, characterized in that: The elastic switch includes: a switch accommodating chamber, a telescopic button shell, an elastic member, a displacement sensor, a fixing groove, a test rod and a stop column; the switch accommodating chamber is opened between the first test seat and the second test seat, and between the second test seat and the third test seat; the first end surface of the telescopic button shell is arranged in the switch accommodating chamber, and the second end surface of the telescopic button shell is higher than the switch accommodating chamber; a stop column is arranged in the switch accommodating chamber, and a fixing groove is arranged on the first end surface of the telescopic button shell facing the stop column, the elastic member is arranged in the fixing groove, and at least one end of the elastic member abuts against the stop column; the test rod is located in the elastic member, and at least one end of the test rod is connected to the displacement sensor.

8. A chip aging test device as claimed in claim 7, characterized in that: The test rod is connected at the center of the fixing groove, and the test rod is located between the stop columns, and the side edges of the stop columns are located within the coverage range of the fixing groove in spatial projection.

9. A chip aging test device as claimed in claim 7, characterized in that: A moving block is integrally connected to the first end face of the telescopic button shell, a first moving groove is provided on the inner wall of the switch accommodating cavity, and the moving block is matched in the first moving groove; a stabilizing foot is integrally connected to one end of the moving block, the end of the stabilizing foot is round-headed, a second moving groove is provided at the bottom of the first moving groove, and the stabilizing foot is matched in the second moving groove.

10. A chip aging test device as claimed in claim 9, characterized in that: The shell height of the telescopic button housing is greater than or equal to the slot length of the first movement slot and the cavity height of the switch accommodating cavity.

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