Chip testing equipment
By designing a chip test equipment including a test bench, test box, test module, pressure plate and drive parts, the problem of low testing efficiency of small batch R&D samples is solved, and a fast and efficient testing process is achieved.
Patent Information
- Application Number
- CN202421591676.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-05
AI Technical Summary
After the chip packaging is cut, for small batches of R&D samples, the use of large batches of test equipment requires queueing for testing, which is time-consuming and labor-intensive, making it difficult to improve the testing efficiency.
A chip testing equipment is designed, including a test bench, a test box, a test module, a press plate and a drive piece. The test module can place the chip to be tested, the pressure plate is located above the test module, and the pressure plate is driven close to or away from the chip to be tested by the driver to tighten or loosen the chip to be tested.
The equipment is simple in structure and is easy to connect or disassemble. It is suitable for testing small batches of samples, which can significantly improve the testing efficiency and save time.
Smart Images
Figure CN222850711U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of storage devices, and in particular to a chip testing device. Background Art
[0002] In the field of chip packaging and testing, chips will be tested after being packaged and cut into pieces in order to select good chips from defective chips. Large-scale product testing will use large-scale testing equipment for automatic testing, which is complex and large equipment. For small-batch chip testing as R&D samples, if large-scale testing equipment is used, it is necessary to queue for testing, which is time-consuming and labor-intensive. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip testing device that can improve the testing efficiency.
[0004] According to the first aspect of the present application, the chip testing device includes: a test bench, the test bench having a first accommodating space, the test bench having a first opening; a test box, the test box is placed in the first accommodating space, the upper surface of the test box faces the first opening; a test module, the test module is installed on the upper surface of the test box, the test module is partially exposed from the first opening, and the test module can place a chip to be tested; a pressure plate, the pressure plate is located above the test module; a driving member, the driving member is installed on the test bench, the driving member is connected to the pressure plate, and the driving member can drive the pressure plate to approach or move away from the chip to be tested to tighten or loosen the chip to be tested.
[0005] According to some embodiments of the present application, the test box includes a shell and a test board, the shell has a second accommodating space inside, and the test board is installed in the shell and located in the second accommodating space.
[0006] According to some embodiments of the present application, the test module includes a test socket and a test adapter board, the test socket is connected to the test board through the test adapter board, and the test socket is provided with a test slot for placing the chip to be tested.
[0007] According to some embodiments of the present application, the test module includes a test expansion board, which is installed on the upper surface of the shell, one end of the test expansion board is connected to the test board, and the other end is connected to the test adapter board.
[0008] According to some embodiments of the present application, the test module includes a test socket base, which is arranged between the test socket and the test adapter board. The test socket base is provided with a plurality of fixing grooves, and the plurality of test sockets are respectively placed on the plurality of fixing grooves.
[0009] According to some embodiments of the present application, a plurality of pressing portions are provided on the side of the pressing plate facing the test module, and the pressing portions correspond one-to-one to the test slots.
[0010] According to some embodiments of the present application, the driving member includes a first cylinder and a second cylinder, the first cylinder can drive the pressure plate to move back and forth in a first direction, and the second cylinder can drive the pressure plate to move back and forth in a second direction, and the first direction is perpendicular to the second direction.
[0011] According to some embodiments of the present application, two driving members are included, one driving member is connected to one end of the pressing plate, and the other driving member is connected to the other end of the pressing plate.
[0012] According to some embodiments of the present application, a display device is further included, wherein the display device is connected to the test board, and the display device is used to display the status of the test socket and the chip to be tested.
[0013] According to some embodiments of the present application, a switch is further included, wherein the switch is installed on the test bench, the switch is connected to the driving member, and the switch can control the opening and closing of the driving member.
[0014] The chip testing equipment according to the embodiment of the present application has at least the following beneficial effects: the present application uses the necessary test modules and test boxes to implement the testing of the chip to be tested, and the pressure plate is arranged above the test module and connected to the driving member. The driving member drives the pressure plate to approach or move away from the chip to be tested to tighten or loosen the chip to be tested. The present application has a simple structure and a portable connection or disassembly method. It is suitable for testing small batches of R&D samples, and can improve the testing efficiency of small batches of R&D samples and save time.
[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:
[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the chip testing device according to the embodiment of the present application (the driving component and the test bench are not shown);
[0018] Figure 2This is a front view of the chip testing device according to an embodiment of the present application;
[0019] Figure 3 A top view of a chip testing device according to an embodiment of the present application;
[0020] Figure 4 This is a schematic diagram of the structure of the pressure plate in the chip testing equipment of the embodiment of the present application.
[0021] Reference numerals:
[0022] Test box 100, test module 200, test table 300, pressing plate 400, driving member 500, display device 600, first switch 700, second switch 800,
[0023] Test socket 210, test adapter board 220, test expansion board 230, test socket base 240,
[0024] The pressing portion 410 and the buffer member 420 . DETAILED DESCRIPTION
[0025] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0026] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0027] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0028] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0029] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0030] In the prior art, during the chip testing and packaging process, the chips will be selected after the chip packaging and cutting, and finally good chips and defective chips will be selected. Enterprises or factories have large-scale testing needs when testing chips, so they generally use large-scale testing equipment to test various chips. Large-scale testing equipment has a large test volume and complex operation. For small-batch chips of R&D samples, if large-scale testing equipment is used for testing, not only does it take a long time to wait for the order, but it also wastes testing resources, which is time-consuming and labor-intensive. Based on this, the present application proposes a chip testing device with a simple structure, which is suitable for small-batch testing of R&D samples, can save testing time and improve testing efficiency.
[0031] Reference Figure 1 , Figure 2 and Figure 3 The chip testing equipment of the present application mainly includes a testing table 300 , a testing box 100 , a testing module 200 , a pressing plate 400 and a driving member 500 .
[0032] The test bench 300 has a first accommodating space, and the test bench 300 is provided with a first opening. The test bench 300 is generally a square cabinet, and the first opening is opened on the upper surface of the test bench 300. The test box 100 is placed in the first accommodating space, and the upper surface of the test box 100 faces the first opening, wherein the test module 200 can place the chip to be tested, and the test module 200 is installed on the upper surface of the test box 100, and the test module 200 is partially exposed from the first opening, so that the test module 200 can be easily operated.
[0033] The test box 100 includes a shell and a test board. The shell has a second accommodating space inside. The test board is installed in the shell and is located in the second accommodating space. The test board is used to test the chip to be tested. In the embodiment of the present application, Figure 1 As shown, the description is made with four test boxes 100 . In order to organize the circuits of the test boards, a plurality of test boards are placed in different test boxes 100 .
[0034] Reference Figure 1 and Figure 2The test module 200 includes a test socket 210 and a test adapter board 220. The test socket 210 is connected to the test board through the test adapter board 220. The test adapter board 220 is used to transfer the communication between the chip to be tested and the test board. The test socket 210 can be replaced. Different test sockets 210 are matched according to different sizes of chips to be tested. A test slot is set on the test socket 210. The test slot is used to place the chip to be tested. Therefore, the size of the test slot is consistent with the size of the chip to be tested, so that the chip to be tested just matches the test slot.
[0035] Generally speaking, a single test board has a small number of interfaces and cannot meet the testing requirements of small batch R&D samples. Therefore, in other embodiments, the test module 200 also includes a test expansion board 230, one end of the test expansion board 230 is connected to the test board, and the other end is connected to the test adapter board 220. The test expansion board 230 can add additional functions or interfaces on the basis of the original test board to meet the testing requirements. The test expansion board 230 is installed on the upper surface of the shell. Specifically, the test expansion board 230 is snapped into the upper surface of the shell, and the test expansion board 230 can be connected to the shell by a snap buckle to facilitate installation or disassembly.
[0036] In some embodiments, the test module 200 includes a test socket base 240, which is arranged between the test socket 210 and the test adapter board 220. In an embodiment of the present application, a test socket 210 has two test slots. If multiple chips to be tested need to be tested, multiple test sockets 210 need to be used. At this time, the multiple test sockets 210 will be stored in a relatively scattered and difficult to manage manner. Therefore, the test socket base 240 is used to integrate the multiple test sockets 210 together. Specifically, the test socket base 240 is provided with multiple fixed slots, and the multiple test sockets 210 are respectively placed on the multiple fixed slots to fix the test sockets 210.
[0037] refer to Figure 2 The driving member 500 is installed on the test bench 300. The driving member 500 is connected to the pressure plate 400. The pressure plate 400 is used to press the chip to be tested. The pressure plate 400 is located above the test module 200, so that the driving member 500 can drive the pressure plate 400 to approach or move away from the chip to be tested to press or release the chip to be tested. In the embodiment of the present application, one pressure plate 400 corresponds to one vertical column of the test socket 210.
[0038] refer to Figure 4A plurality of pressing parts 410 are provided on the side of the pressing plate 400 facing the test module 200, and the pressing parts 410 correspond to the test slots one by one. When the pressing plate 400 moves, the pressing parts 410 can abut against the chip to be tested, thereby pressing the chip to be tested tightly. In order to prevent the chip to be tested from being adsorbed on the pressing parts 410 and bringing out the chip to be tested when the pressing parts 410 abut against the chip to be tested, the embodiment of the present application is further provided with a buffer 420, that is, the buffer 420 is installed on the side of the pressing parts 410 facing the test module 200. Specifically, when the pressing parts 410 are in a state of abutting against the chip to be tested, if the pressing parts 410 move in a direction away from the chip to be tested, the buffer 420 can bounce the chip to be tested away to prevent the chip to be tested from sticking to the pressing parts 410.
[0039] In some embodiments, two driving members 500 are used to control a pressing plate 400. The connection method is that one driving member 500 is connected to one end of the pressing plate 400, and the other driving member 500 is connected to the other end of the pressing plate 400. The two driving members 500 act together on one pressing plate 400, so that the movement of the pressing plate 400 is more stable.
[0040] The driving member 500 includes a first cylinder and a second cylinder. The first cylinder can drive the pressing plate 400 to move back and forth in a first direction, and the second cylinder can drive the pressing plate 400 to move in a second direction. The first direction is perpendicular to the second direction, wherein the first direction is a vertical direction, i.e., a direction perpendicular to the horizontal plane where the pressing plate 400 is located, and the second direction is a horizontal direction. In actual operation, when the chip to be tested needs to be pressed, the second cylinder drives the pressing plate 400 to move in a horizontal direction so that the pressing plate 400 is aligned with the chip to be tested in a vertical direction, and the first cylinder drives the pressing plate 400 to move in a vertical direction so that the pressing plate 400 can be against the chip to be tested. After the test board has finished testing the chip to be tested, the first cylinder drives the pressing plate 400 to move in a vertical direction away from the pressing plate 400, and the second cylinder drives the pressing plate 400 to move in a horizontal direction so that the pressing plate 400 is staggered from the test slot for easy loading and unloading.
[0041] Reference Figure 3 The chip testing equipment also includes a display device 600, which is connected to the test board. The display device 600 is used to display the status of the test socket 210 and the chip to be tested. Further, the display device 600 can display the chip status on each test socket 210, such as whether there is a chip to be tested on each test socket 210, and whether the chip to be tested on the test socket 210 has been tested. The operator can load and unload the chip according to the information displayed on the display device 600.
[0042] In some embodiments, the display device 600 is placed in the first accommodation space and can be disposed on the left, right, front or rear of the test module 200 according to actual needs.
[0043] In order to facilitate the operator to turn on the driver 500, a switch is also provided on the chip testing equipment. The switch is installed on the test bench 300 and is close to the display device 600. The switch is connected to the driver 500. The switch can control the opening and closing of the driver 500. When the operator operates the test module 200, the status of the test socket 210 and the chip to be tested can be observed through the display device 600, and the operation of the driver 500 can be controlled by the switch.
[0044] In other embodiments, two driving members 500 acting together on the same pressure plate 400 correspond to a group of switches, and the group of switches includes a first switch 700 and a second switch 800. The first switch 700 controls the opening and closing of the first cylinder in the two driving members 500 to control the pressure plate 400 to move in the vertical direction. The second switch 800 controls the opening and closing of the second cylinder in the two driving members 500 to control the pressure plate 400 to move in the horizontal direction.
[0045] The chip testing equipment according to the embodiment of the present application has at least the following beneficial effects: the test box 100 is placed in the first accommodating space in the test table 300, the test module 200 is installed on the upper surface of the test box 100, the test module 200 can place the chip to be tested, the pressure plate 400 is located above the test module 200 and is connected to the driving member 500, the driving member 500 can drive the pressure plate 400 to approach or move away from the chip to be tested to tighten or loosen the chip to be tested. The structure of the present application is simple, and the connection or disassembly method is portable. It is suitable for testing small batches of R&D samples, can improve the testing efficiency of small batches of R&D samples, and save time.
[0046] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
Claims
1. Chip testing equipment, characterized in that: include: A test bench, wherein the test bench has a first accommodating space and a first opening; A test box, the test box is placed in the first accommodating space, and the upper surface of the test box faces the first opening; A test module, the test module is installed on the upper surface of the test box, the test module is partially exposed from the first opening, and the test module can be used to place a chip to be tested; A pressing plate, the pressing plate is located above the test module; A driving member is installed on the test bench, the driving member is connected to the pressing plate, and the driving member can drive the pressing plate to approach or move away from the chip to be tested, so as to press or loosen the chip to be tested.
2. The chip testing device according to claim 1, characterized in that: The test box comprises a shell and a test board. The shell has a second accommodating space inside. The test board is installed on the shell and is located in the second accommodating space.
3. The chip testing device according to claim 2, characterized in that: The test module comprises a test socket and a test adapter board, wherein the test socket is connected to the test board via the test adapter board, and the test socket is provided with a test slot, and the test slot is used for placing a chip to be tested.
4. The chip testing device according to claim 3, characterized in that: The test module includes a test expansion board, which is mounted on the upper surface of the shell. One end of the test expansion board is connected to the test board, and the other end is connected to the test adapter board.
5. The chip testing device according to claim 3, characterized in that: The test module comprises a test socket base, wherein the test socket base is arranged between the test socket and the test adapter plate, and the test socket base is provided with a plurality of fixing grooves, and a plurality of the test sockets are respectively placed on the plurality of fixing grooves.
6. The chip testing device according to claim 3, characterized in that: A plurality of pressing parts are arranged on the side of the pressing plate facing the test module, and the pressing parts correspond to the test slots one by one.
7. The chip testing device according to claim 1, characterized in that: The driving member includes a first cylinder and a second cylinder, the first cylinder can drive the pressing plate to move back and forth in a first direction, and the second cylinder can drive the pressing plate to move back and forth in a second direction, and the first direction is perpendicular to the second direction.
8. The chip testing device according to claim 1, characterized in that: It comprises two driving members, one of which is connected to one end of the pressing plate, and the other driving member is connected to the other end of the pressing plate.
9. The chip testing device according to claim 3, characterized in that: It also includes a display device, which is connected to the test board and is used to display the status of the test socket and the chip to be tested.
10. The chip testing device according to claim 1, characterized in that: It also includes a switch, which is installed on the test bench and connected to the driving member, and the switch can control the opening and closing of the driving member.