Optical sensor packaging structure

Abstract

An optical sensor packaging structure includes a substrate having a groove; the photosensitive chip is arranged in the groove, and the surface, provided with a photosensitive area, of the photosensitive chip faces the opening of the groove; the light-transmitting cover plate is arranged on the surface of the substrate and located above the opening, the light-transmitting cover plate corresponds to the light-sensing area of the light-sensing chip in the direction perpendicular to the surface of the substrate, and the space between the light-transmitting cover plate and the light-sensing chip is a non-closed space. According to the optical sensor packaging structure provided by the embodiment of the utility model, the photosensitive chip is embedded in the substrate, so that the overall thickness of the optical sensor packaging structure is reduced, and the thinning requirement of the optical sensor packaging structure is realized; moreover, a non-closed space is formed between the light-transmitting cover plate and the photosensitive chip, so that no air pressure difference is generated on the two sides of the transparent cover plate when the optical sensor packaging structure works, the photosensitive accuracy and the imaging quality of the photosensitive chip can be ensured, and the reliability of the optical sensor packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to an optical sensor packaging structure. Background Art

[0002] An optical sensor is a semiconductor device that can sense external light and convert it into electrical signals. Packaging an optical sensor can form an optical sensor packaging structure. The optical sensor packaging structure is commonly used in various electronic terminals, such as cameras, smart phones, digital cameras, automotive imaging systems, toys and other electronic devices.

[0003] At present, in the packaging process of optical sensor packaging structure, a transparent glass sheet is usually placed above the chip, and a cavity is formed on the substrate using plastic packaging technology. The plastic packaging material wraps the remaining components and exposes the photosensitive area of ​​the photosensitive chip. A transparent glass sheet is mounted on the plastic packaging cavity to protect the photosensitive area of ​​the photosensitive chip to ensure the normal operation of the photosensitive chip. However, with the development of device miniaturization, the thickness of this packaging structure is relatively large and cannot meet the needs of miniaturization; the junction between the transparent glass sheet and the cavity is sealed by bonding glue, and the strength of the bonding glue is relatively low. The internal and external air pressure difference when the product is working will cause the transparent glass sheet to fall off or be damaged. In addition, when performing the packaging process, the bonding glue will overflow and contaminate the chip functional area, affecting the reliability of the optical sensor packaging structure.

[0004] Therefore, providing a thin and highly reliable optical sensor packaging structure has become one of the current research focuses. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a thin optical sensor packaging structure with high reliability.

[0006] In order to solve the above problems, the utility model provides an optical sensor packaging structure, which includes: a substrate, the substrate having a groove; a photosensitive chip, arranged in the groove, and the photosensitive chip has a photosensitive area on one side facing the opening of the groove; a transparent cover plate, arranged on the surface of the substrate and located above the opening, in the direction perpendicular to the surface of the substrate, the transparent cover plate corresponds to the photosensitive area of ​​the photosensitive chip, and the space between the transparent cover plate and the photosensitive chip is a non-enclosed space.

[0007] In one embodiment, one end of the light-transmitting cover plate is fixed to the surface of the substrate through an adhesive layer, and the other end is suspended in the air, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

[0008] In one embodiment, the two opposite ends of the light-transmitting cover plate are fixed to the surface of the substrate by an adhesive layer, and there is an air gap between the edge of the light-transmitting cover plate and the substrate, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

[0009] In one embodiment, in a direction perpendicular to the surface of the substrate, a side of the photosensitive chip having the photosensitive area is lower than the surface of the substrate.

[0010] In one embodiment, within the groove, a portion of the photosensitive chip is embedded in a side wall of the groove.

[0011] In one embodiment, the region where the photosensitive chip is embedded in the side wall of the groove has a functional pad, and the functional pad is interconnected with the pad of the substrate through a conductive line.

[0012] In one embodiment, the conductive circuit includes: a first connecting section penetrating the substrate to the functional pad, an extending section located on the surface of the substrate, and a second connecting section connected to the pad of the substrate.

[0013] In one embodiment, the soldering pad of the substrate is located inside the substrate, and the second connecting section penetrates the substrate to the soldering pad of the substrate; or, the soldering pad of the substrate is located on the surface of the substrate, and the second connecting section is located on the surface of the substrate and covers the soldering pad of the substrate.

[0014] In one embodiment, an insulating layer covers the conductive circuit on the surface of the substrate, one end of the light-transmitting cover is fixed to the surface of the substrate through an adhesive layer, and the other end is fixed to the surface of the insulating layer, and there is an air gap between the edge of the light-transmitting cover and the substrate, so that the space between the light-transmitting cover and the photosensitive chip is a non-enclosed space.

[0015] In one embodiment, the conductive line extends within the substrate to interconnect the functional pads with pads of the substrate.

[0016] In one embodiment, a functional pad is provided on one side of the photosensitive chip facing the opening of the groove, an isolation layer covers the area where the functional pad is located, and the functional pad is interconnected with the pad of the substrate through a conductive line that penetrates the isolation layer.

[0017] In one embodiment, one end of the light-transmitting cover plate is fixed to the surface of the substrate through an adhesive layer, and the other end is fixed to the surface of the isolation layer, and there is an air gap between the edge of the light-transmitting cover plate and the substrate, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

[0018] In one embodiment, in a direction perpendicular to the surface of the substrate, the projection of the light-transmitting cover plate on the substrate covers the projection of the photosensitive area of ​​the photosensitive chip on the substrate.

[0019] In the optical sensor packaging structure provided by the embodiment of the utility model, the photosensitive chip is arranged in the groove of the substrate, that is, the photosensitive chip is embedded in the substrate, which reduces the overall thickness of the optical sensor packaging structure and realizes the demand for thinning the optical sensor packaging structure; and, the transparent cover plate is arranged on the substrate, which can form a non-enclosed space between the transparent cover plate and the photosensitive chip. When the optical sensor packaging structure is working, no air pressure difference will be generated on both sides of the transparent cover plate, which can ensure the photosensitivity accuracy and imaging quality of the photosensitive chip and improve the reliability of the optical sensor packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a cross-sectional schematic diagram of an optical sensor packaging structure provided by the first embodiment of the utility model;

[0022] Figure 2 is a cross-sectional schematic diagram of an optical sensor packaging structure provided by a second embodiment of the present utility model;

[0023] Figure 3 is a cross-sectional schematic diagram of an optical sensor packaging structure provided by a third embodiment of the present utility model;

[0024] Figure 4 It is a cross-sectional schematic diagram of an optical sensor packaging structure provided by the fourth embodiment of the present utility model. DETAILED DESCRIPTION

[0025] The specific implementation of the optical sensor packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0026] Figure 1 is a cross-sectional schematic diagram of the optical sensor packaging structure provided by the first embodiment of the utility model, please refer to Figure 1The optical sensor packaging structure includes: a substrate 100, wherein the substrate 100 has a groove 110; a photosensitive chip 120, which is arranged in the groove 110, and the photosensitive chip 120 has a photosensitive area 121 on one side facing the opening of the groove 110; a transparent cover plate 130, which is arranged on the surface of the substrate 100 and is located above the opening. In the direction perpendicular to the surface of the substrate 100, the transparent cover plate 130 corresponds to the photosensitive area 121 of the photosensitive chip 120, and the space 140 between the transparent cover plate 130 and the photosensitive chip 120 is a non-enclosed space.

[0027] In the optical sensor packaging structure provided by the embodiment of the utility model, the photosensitive chip 120 is arranged in the groove 110 of the substrate 100, that is, the photosensitive chip 120 is embedded in the substrate 100, which reduces the overall thickness of the optical sensor packaging structure and realizes the demand for thinning the optical sensor packaging structure; and the transparent cover plate 130 is arranged on the substrate 100, and a non-enclosed space can be formed between the transparent cover plate 130 and the photosensitive chip 120. When the optical sensor packaging structure is working, no air pressure difference will be generated on both sides of the transparent cover plate, which can ensure the photosensitivity accuracy and imaging quality of the photosensitive chip 120, and improve the reliability of the optical sensor packaging structure.

[0028] The substrate 100 may be an existing ceramic substrate, or a lead frame, or a laminated substrate, or a MIS (Molded Interconnect System) plastic package interconnect substrate, or a redistribution stacking layer, etc., and has a relatively flat upper surface and a lower surface, and an electrically conductive circuit layer is provided between the upper surface and the lower surface. In this embodiment, the groove 110 extends from the upper surface of the substrate 100 to the inside of the substrate 100.

[0029] The photosensitive chip 120 is used to sense external light and convert it into an electrical signal. Specifically, a surface of the photosensitive chip 120 has a photosensitive area 121. The photosensitive area 121 senses external light, converts it into an electrical signal, and transmits it to the substrate 100 through the circuit of the photosensitive chip 120. In this embodiment, the photosensitive chip 120 has a side of the photosensitive area 121 facing the opening of the groove 110, so that external light can be incident on the photosensitive area 121 without being blocked by the substrate 100. The side of the photosensitive chip 120 facing away from the photosensitive area 121 is in contact with the bottom of the groove 110.

[0030] In some embodiments, in a direction perpendicular to the surface of the substrate 100, such as Figure 1In the Z direction, the side of the photosensitive chip 120 with the photosensitive area 121 is lower than the surface of the substrate 100, the depth of the groove 110 is greater than the thickness of the photosensitive chip 120, and there is a distance between the side of the photosensitive chip 120 with the photosensitive area 121 and the surface of the substrate 100, so that there is a gap between the transparent cover plate 130 and the side of the photosensitive chip 120 with the photosensitive area 121 to provide a transmission cavity for the transmission of external light. In some embodiments, in the groove 110, a part of the photosensitive chip 120 is embedded in the side wall of the groove 110, that is, a part of the photosensitive chip 120 is covered by the substrate 100, so that the photosensitive chip 120 can be fixed. In this embodiment, all the outer edges of the photosensitive chip 120 are covered by the substrate 100, and in other embodiments, part of the outer edges of the photosensitive chip 120 are covered by the substrate 100. It is understandable that the photosensitive area 121 of the photosensitive chip 120 is not covered by the substrate 100, so that the photosensitive chip 120 can be fixed without affecting the function of the photosensitive area 121. In some embodiments, the step of preparing the optical sensor packaging structure includes: in the process of manufacturing the substrate 100, as the substrate manufacturing process proceeds, the photosensitive chip 120 is buried inside the substrate 100, wherein the photosensitive area 121 of the photosensitive chip 120 is not covered by the substrate 100, then in the final optical sensor packaging structure, part or all of the outer edge of the photosensitive chip 120 is covered by the substrate 100.

[0031] In some embodiments, the area where the photosensitive chip 120 is embedded in the side wall of the groove 110 has a functional pad 122, and the functional pad 122 is interconnected with the pad 101 of the substrate 100 through a conductive line 150. The functional pad 122 is embedded in the substrate 100 and electrically connected, realizing optoelectronic integration, reducing the package size, reducing power consumption, and improving reliability, and is suitable for high-density integrated packaging, and can achieve good optoelectronic signal transmission.

[0032] In some embodiments, the conductive circuit 150 extends in the substrate 100 to interconnect the functional pad 122 with the pad 101 of the substrate 100. For example, in one embodiment, the pad 101 of the substrate 100 is located on the upper surface of the substrate 100, and the functional pad 122 is located on the upper surface of the photosensitive chip 120, then the conductive circuit 150 may be distributed between the upper surface of the photosensitive chip 120 and the upper surface of the substrate 100 to electrically connect the pad 101 of the substrate 100 with the functional pad 122 of the photosensitive chip 120.

[0033] In some embodiments, the conductive circuit 150 is partially located inside the substrate 100 and partially located on the surface of the substrate 100. Figure 1 , the conductive circuit 150 includes: a first connection section 151 that runs through the substrate 100 to the functional pad 122, an extension section 152 located on the surface of the substrate 100, and a second connection section 153 connected to the pad 101 of the substrate 100. The first connection section 151 is located in the substrate 100, and is used to connect to the functional pad 122 of the photosensitive chip 120; the extension section 152 is located on the surface of the substrate 100 and is connected to the first connection section 151, and is used to fan out the first connection section 151; the second connection section 153 is connected to the extension section 152, thereby realizing the interconnection between the functional pad 122 and the pad 101 of the substrate 100. In this embodiment, the pad 101 of the substrate 100 is located on the surface of the substrate 100, and the second connection section 153 is located on the surface of the substrate 100 and covers the pad 101 of the substrate 100. In other embodiments, the soldering pad 101 of the substrate 100 is located inside the substrate 100. If the second connecting section 153 is located on the surface of the substrate 100, it cannot be connected to the soldering pad 101 of the substrate 100. When the soldering pad 101 of the substrate 100 is located inside the substrate 100, the second connecting section 153 penetrates the substrate 100 to the soldering pad 101 of the substrate 100.

[0034] The light-transmitting cover plate 130 is a light-transmitting isolation plate. External light passes through the light-transmitting cover plate 130 and enters the light-sensing area 121 of the light-sensing chip 120. In some embodiments, the light-transmitting cover plate 130 is a light-transmitting glass plate. The light-transmitting cover plate 130 is disposed on the surface of the substrate 100 and is located above the opening of the groove 110, in a direction perpendicular to the surface of the substrate 100 (e.g., Figure 1 In the Z direction), the transparent cover plate 130 corresponds to the photosensitive area 121 of the photosensitive chip 120, so that external light passes through the transparent cover plate 130 and is incident on the photosensitive area 121 of the photosensitive chip 120.

[0035] In some embodiments, in a direction perpendicular to the surface of the substrate 100 (eg Figure 1In the Z direction), the projection of the light-transmitting cover 130 on the substrate 100 covers the projection of the photosensitive area 121 of the photosensitive chip 120 on the substrate 100, that is, the light-transmitting cover 130 corresponds to the photosensitive area 121 of the photosensitive chip 120, and the area of ​​the light-transmitting cover 130 is larger than the area of ​​the photosensitive area 121 of the photosensitive chip 120, so as to increase the intensity of the external light received by the photosensitive area 121 of the photosensitive chip 120, thereby improving the sensitivity and reliability of the optical sensor packaging structure.

[0036] The outer peripheral edge of the transparent cover plate 130 is not entirely in contact with the surface of the substrate 100, but only a partial section is in contact with the surface of the substrate 100, while the other partial section is not in contact with the substrate 100, so that the transparent cover plate 130 can be supported by the substrate 100 and have an air gap 160 between the substrate 100, thereby making the space 140 between the transparent cover plate 130 and the photosensitive chip 120 a non-enclosed space, so that when the optical sensor packaging structure is working, no air pressure difference will be generated on both sides of the transparent cover plate, thereby ensuring the photosensitivity accuracy and imaging quality of the photosensitive chip 120, and improving the reliability of the optical sensor packaging structure.

[0037] In this example, see Figure 1 , one end of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through an adhesive layer, and the other end is suspended in the air, so that the space 140 between the light-transmitting cover plate 130 and the photosensitive chip 120 is a non-enclosed space. Specifically, one end of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through an adhesive layer 170, that is, a portion of the edge of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 170 to achieve the fixation of the light-transmitting cover plate 130, and the other end of the light-transmitting cover plate 130 is suspended in the air, so that there is an air gap 160 between the light-transmitting cover plate 130 and the substrate 100, thereby making the space 140 between the light-transmitting cover plate 130 and the photosensitive chip 120 a non-enclosed space.

[0038] In other embodiments, the light-transmitting cover plate 130 may also be connected to the substrate 100 in other forms, so that the space 140 between the light-transmitting cover plate 130 and the photosensitive chip 120 is a non-enclosed space.

[0039] For example, Figure 2As shown, it is a cross-sectional schematic diagram of the optical sensor packaging structure provided by the second embodiment of the utility model. In the second embodiment, the opposite ends of the transparent cover plate 130 are fixed to the surface of the substrate 100 through the adhesive layer 200, and there is an air gap (not shown in the figure) between the edge of the transparent cover plate 130 and the substrate 100, so that the space 140 between the transparent cover plate 130 and the photosensitive chip 120 is a non-enclosed space. Specifically, the opposite ends of the transparent cover plate 130 are fixed to the surface of the substrate 100 through the adhesive layer 200, that is, a part of the edge of the transparent cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 200 to achieve the fixation of the transparent cover plate 130, and an air gap is formed between the edge of the transparent cover plate 130 that is not fixed on the substrate 100 and the substrate 100, thereby making the space 140 between the transparent cover plate 130 and the photosensitive chip 120 a non-enclosed space.

[0040] For example, Figure 3 As shown, it is a cross-sectional schematic diagram of the optical sensor packaging structure provided by the second embodiment of the utility model. In the third embodiment, the insulating layer 310 covers the conductive circuit 150 on the surface of the substrate 100, one end of the transparent cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 300, and the other end is fixed to the surface of the insulating layer 310, and there is an air gap (not shown in the figure) between the edge of the transparent cover plate 130 and the substrate 100, so that the space 140 between the transparent cover plate 130 and the photosensitive chip 120 is a non-enclosed space. In this embodiment, the extension section 152 and the second connecting section 153 of the conductive circuit 150 are located on the surface of the substrate 100, and the insulating layer 310 covers the extension section 152 and the second connecting section 153 of the conductive circuit 150 to protect the conductive circuit 150. In this embodiment, the insulating layer 310 also covers the substrate 100 below the transparent cover plate 130. One end of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 300, and the other end of the light-transmitting cover plate 130 is fixed to the surface of the insulating layer 310, that is, a portion of the edge of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 and the surface of the insulating layer 310 to achieve the fixation of the light-transmitting cover plate 130; an air gap is formed between the edge of the light-transmitting cover plate 130 that is not fixed to the substrate 100 and the insulating layer 310 and the substrate 100, so that the space 140 between the light-transmitting cover plate 130 and the photosensitive chip 120 is a non-enclosed space. In some embodiments, the light-transmitting cover plate 130 can also be fixed to the surface of the insulating layer 310 through an adhesive layer.

[0041] In the above embodiment, the outer edge of the photosensitive chip 120 facing the opening of the groove 110 is covered by the substrate 100. In other embodiments, the outer edge of the photosensitive chip 120 facing the opening of the groove 110 is not covered by the substrate 100. Figure 4 , which is a cross-sectional schematic diagram of an optical sensor packaging structure provided by the fourth embodiment of the utility model. In this embodiment, the functional pad 122 is provided on the side of the photosensitive chip 120 facing the opening of the groove 110, and the isolation layer 400 covers the area where the functional pad 122 is located. The functional pad 122 is interconnected with the pad 101 of the substrate 100 through the conductive line 150 that penetrates the isolation layer 400. The material of the isolation layer 400 is an insulating material, which is used to protect the functional pad 122 and the conductive line 150, and further fix the photosensitive chip 120. In some embodiments, the steps of preparing the optical sensor packaging structure include: after forming the substrate 100, forming a groove 110 in the substrate 100; placing the photosensitive chip 120 in the groove 110, covering the area where the functional pad 122 is located with insulating material to form the isolation layer 400; forming the conductive line 150; and providing the transparent cover plate 130.

[0042] In this embodiment, one end of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 170, and the other end is suspended, so that the space between the light-transmitting cover plate 130 and the photosensitive chip 120 is a non-enclosed space. In other embodiments, one end of the light-transmitting cover plate 130 is fixed to the surface of the substrate 100 through the adhesive layer 170, and the other end is fixed to the surface of the isolation layer 400, and there is an air gap between the edge of the light-transmitting cover plate 130 and the substrate 100, so that the space between the light-transmitting cover plate 130 and the photosensitive chip 120 is a non-enclosed space.

[0043] In some embodiments, an insulating layer may be further provided, the insulating layer covering the surface of the isolation layer 400 and the conductive circuit 150 on the surface of the substrate 100 , so as to protect the conductive circuit 150 .

[0044] The optical sensor packaging structure of the utility model embeds the photosensitive chip 120 into the substrate 100, reducing the overall thickness of the packaging device. The photosensitive area 121 of the photosensitive chip 120 is exposed to realize the photosensitive function. The functional pad 122 is buried in the substrate 100 and realizes electrical connection, realizing optoelectronic integration, reducing the package size, reducing power consumption, and improving reliability. It is suitable for high-density integrated packaging and can realize good optoelectronic signal transmission. In the optical sensor packaging structure of the utility model, there is no closed space between the transparent cover plate 130 and the photosensitive chip 120, and no pressure difference will be generated, which can ensure the photosensitivity accuracy and imaging quality of the photosensitive chip 120.

[0045] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0046] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An optical sensor packaging structure, characterized in that: include: A substrate having a groove; A photosensitive chip is disposed in the groove, and a side of the photosensitive chip having a photosensitive area faces the opening of the groove; A light-transmitting cover plate is arranged on the surface of the substrate and is located above the opening. In a direction perpendicular to the surface of the substrate, the light-transmitting cover plate corresponds to the photosensitive area of ​​the photosensitive chip, and the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

2. The optical sensor packaging structure according to claim 1, characterized in that: One end of the light-transmitting cover plate is fixed to the surface of the substrate through an adhesive layer, and the other end is suspended in the air, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

3. The optical sensor packaging structure according to claim 1, characterized in that: The opposite ends of the light-transmitting cover plate are fixed to the surface of the substrate through an adhesive layer, and there is an air gap between the edge of the light-transmitting cover plate and the substrate, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

4. The optical sensor packaging structure according to claim 1, characterized in that: In a direction perpendicular to the surface of the substrate, a side of the photosensitive chip having a photosensitive area is lower than the surface of the substrate.

5. The optical sensor packaging structure according to claim 4, characterized in that: In the groove, a portion of the photosensitive chip is embedded in the side wall of the groove.

6. The optical sensor packaging structure according to claim 5, characterized in that: The area where the photosensitive chip is embedded in the side wall of the groove has a functional pad, and the functional pad is interconnected with the pad of the substrate through a conductive line.

7. The optical sensor packaging structure according to claim 6, characterized in that: The conductive circuit includes: a first connection section that passes through the substrate to the functional pad, an extension section located on the surface of the substrate, and a second connection section that is connected to the pad of the substrate.

8. The optical sensor packaging structure according to claim 7, characterized in that: The soldering pad of the substrate is located inside the substrate, and the second connecting section penetrates the substrate to the soldering pad of the substrate; or, the soldering pad of the substrate is located on the surface of the substrate, and the second connecting section is located on the surface of the substrate and covers the soldering pad of the substrate.

9. The optical sensor packaging structure according to claim 7, characterized in that: An insulating layer covers the conductive circuit on the surface of the substrate, one end of the light-transmitting cover is fixed to the surface of the substrate through an adhesive layer, and the other end is fixed to the surface of the insulating layer, and there is an air gap between the edge of the light-transmitting cover and the substrate, so that the space between the light-transmitting cover and the photosensitive chip is a non-enclosed space.

10. The optical sensor packaging structure according to claim 6, characterized in that: The conductive traces extend within the substrate to interconnect the functional pads with pads of the substrate.

11. The optical sensor packaging structure according to claim 4, characterized in that: A functional pad is provided on one side of the photosensitive chip facing the opening of the groove, an isolation layer covers the area where the functional pad is located, and the functional pad is interconnected with the pad of the substrate via a conductive line that penetrates the isolation layer.

12. The optical sensor packaging structure according to claim 11, characterized in that: One end of the light-transmitting cover plate is fixed to the surface of the substrate through an adhesive layer, and the other end is fixed to the surface of the isolation layer, and there is an air gap between the edge of the light-transmitting cover plate and the substrate, so that the space between the light-transmitting cover plate and the photosensitive chip is a non-enclosed space.

13. The optical sensor packaging structure according to claim 1, characterized in that: In a direction perpendicular to the surface of the substrate, the projection of the light-transmitting cover plate on the substrate covers the projection of the photosensitive area of ​​the photosensitive chip on the substrate.

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