Novel display screen IC area heat dissipation structure

Abstract

The utility model relates to a novel display screen IC area heat dissipation structure which comprises a display screen (1), a shell (2) arranged on the display screen (1) and a glass cover plate (3) arranged on the display screen (1), an IC area (4) is arranged on one side of the display screen (1), a heat conduction film (5) connected with the shell (2) is arranged on the IC area (4), the shell (2) is a metal shell, and the heat conduction film (5) is connected with the shell (2). The IC is connected with the backlight shell (2) through the heat conduction film (5), and the backlight shell (2) is made of metal materials, so that heat of the IC is transmitted to the shell (2) through the heat conduction film (5), and heat around the IC area (4) is reduced; a layer of heat insulation film (6) is pasted on the heat conduction film (5), heat conducted by the IC is isolated through the heat insulation film (6) and cannot be conducted to the cover plate, and therefore the temperature of the touch area and the IC position of the cover plate is consistent with that of other areas, and the temperature is uniform.

Description

Technical Field

[0001] The utility model belongs to the technical field of vehicle-mounted display screens, and specifically relates to a novel display screen IC zone heat dissipation structure. Background Art

[0002] The current development trend of vehicle-mounted display screens is large screens and high brightness. In summer, due to the high ambient temperature, high brightness of the display screen, and high heat generation, the display screen feels very hot after it is turned on. The temperature rise of the display screen is mainly composed of two parts: the temperature rise caused by the heat of the display backlight LED and the temperature rise caused by the power of the display IC. For conventional displays, the heat dissipation of the backlight LED is dissipated through the backlight shell, but the heat in the IC area will be directly conducted to the cover plate, causing the temperature rise of the IC area to be about 3 degrees higher than other areas of the display screen.

[0003] The patent number is 202111353009.7, and a public specification published on December 12, 2023 discloses a display screen heat dissipation assembly, a display screen, and a control method for the display screen heat dissipation assembly. The display screen heat dissipation assembly includes a mounting seat, a light source assembly, and a heat dissipation adjustment structure, wherein the mounting seat forms a mounting cavity with an opening at one end, and the light source assembly is arranged in the mounting cavity. The light source assembly has a relative light-emitting surface and a heat dissipation surface, and the light-emitting surface is arranged corresponding to the open end of the mounting seat. A heat dissipation cavity is formed between the light source assembly and the mounting seat, and a heat dissipation port is provided on the side wall of the heat dissipation cavity. The heat dissipation adjustment structure includes a heat dissipation cover movably arranged at the heat dissipation port, and a driving assembly arranged on the mounting seat. The driving assembly drives the heat dissipation cover to open or close the heat dissipation port. The heat dissipation port is opened or closed by the movement of the heat dissipation cover, which can not only ensure the heat dissipation of the display screen, but also prevent impurities from entering the display screen, thereby effectively protecting the electrical components in the display screen and improving the service life of the display screen.

[0004] In the prior art, the heat dissipation structure is relatively large and is not suitable for vehicle-mounted display screens. In addition, the vehicle-mounted display screens have poor heat dissipation effect on the IC area and cannot meet the heat dissipation requirements of the core area. Utility Model Content

[0005] The utility model aims to provide a novel display screen IC zone heat dissipation structure which has good IC zone heat dissipation effect.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a new display screen IC zone heat dissipation structure, including a display screen, a shell arranged on the display screen and a glass cover plate arranged on the display screen, the IC zone is arranged on one side of the display screen, and a cooling structure connected to the shell is provided on the IC zone, and the shell is a metal shell.

[0007] The cooling structure is a heat-conducting film arranged on the IC area, and the heat-conducting film is connected to the housing.

[0008] The thermal conductive film covers the IC area, and the thermal conductive film is attached to the surface of the IC area.

[0009] A flat plate is provided on the side of the shell, and the heat-conducting film is attached to the flat plate.

[0010] The glass cover plate is pressed onto the surface of the display screen, and the heat conductive film is arranged between the glass cover plate and the IC area.

[0011] The glass cover plate is provided with a heat insulation film.

[0012] The thermal insulation film is arranged between the thermal conductive film and the glass cover plate, and the thermal insulation film covers the portion of the thermal conductive film attached to the IC area.

[0013] The technical effect of the utility model is as follows: the IC is connected to the backlight housing through a heat-conducting film with a back adhesive, and the back adhesive can conduct heat. Since the backlight housing is made of metal material, the heat of the IC is transferred to the housing through the heat-conducting film, thereby reducing the heat around the IC area; a layer of heat-insulating film is pasted on the heat-conducting film, so that the heat conducted by the IC is isolated by the heat-insulating film and cannot be conducted to the cover plate, so that in the touch area of ​​the cover plate, the temperature of the IC position is consistent with other areas, and the temperature is uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] This specification includes the following drawings, which show the following contents:

[0015] Figure 1 This is a schematic diagram of the structure of a new type of display screen IC area heat dissipation structure of the utility model;

[0016] Figure 2 for Figure 1 Schematic diagram of the heat dissipation structure of a new type of display IC area heat dissipation structure.

[0017] The markings in the figure are: 1. display screen; 2. shell; 3. glass cover; 4. IC area; 5. thermal conductive film; 6. thermal insulation film; 7. flat panel. DETAILED DESCRIPTION

[0018] The following is a further detailed description of the specific implementation methods of the utility model by describing the embodiments with reference to the accompanying drawings, with the aim of helping those skilled in the art to have a more complete, accurate and in-depth understanding of the utility model concept and technical solution of the utility model and facilitating its implementation.

[0019] See also Figure 1-2A novel display IC zone heat dissipation structure includes a display screen 1, a shell 2 arranged on the display screen 1 and a glass cover plate 3 arranged on the display screen 1, an IC zone 4 is arranged on one side of the display screen 1, and a cooling structure connected to the shell 2 is provided on the IC zone 4, and the shell 2 is a metal shell; through the cooling structure covering the IC zone 4, the heat of the IC zone 4 can be effectively conducted away to achieve the purpose of heat dissipation.

[0020] The cooling structure is a heat-conducting film 5 arranged on the IC area 4, and the heat-conducting film 5 is connected to the shell 2; the IC is connected to the backlight shell 2 through the heat-conducting film 5 with a back adhesive, and the back adhesive can conduct heat. Since the backlight shell 2 is made of metal material, the heat of the IC is transferred to the shell 2 through the heat-conducting film 5, thereby reducing the heat around the IC area 4.

[0021] The heat-conducting film 5 covers the IC area 4 , and the heat-conducting film 5 is attached to the surface of the IC area 4 ; the heat-conducting film 5 and the IC area 4 are tightly attached together, which is beneficial to improving the efficiency of heat dissipation.

[0022] A flat plate 7 is provided on the side of the housing 2, and the heat-conducting film 5 is attached to the flat plate 7; the contact area between the heat-conducting film 5 and the housing 2 is increased, and the heat dissipation efficiency is effectively improved.

[0023] The glass cover plate 3 is pressed onto the surface of the display screen 1, and the thermal conductive film 5 is arranged between the glass cover plate 3 and the IC area 4; the thermal conductive film 5 is pressed onto the IC area 4 using the glass cover plate 3, so that the thermal conductive film 55 can always maintain a close fit with the IC area 4, and can effectively maintain heat dissipation for a long time.

[0024] A heat-insulating film 6 is provided on the glass cover plate 3; a layer of heat-insulating film 6 is pasted on the heat-conducting film 5, so that the heat conducted by the IC is isolated by the heat-insulating film 6, so that it cannot be conducted to the glass cover plate 3, so that in the touch area of ​​the glass cover plate 3, the temperature of the IC area 4 is consistent with that of other areas, and the temperature is uniform.

[0025] The heat-insulating film 6 is disposed between the heat-conducting film 5 and the glass cover plate 3 , and covers the portion of the heat-conducting film 5 attached to the IC area 4 , so as to prevent the heat of the heat-conducting film 5 from being transferred to the glass cover plate 3 .

[0026] The technical effect of the utility model is as follows: the IC is connected to the backlight housing 2 through the heat-conductive film 5 with adhesive backing, which can conduct heat. Since the backlight housing 2 is made of metal material, the heat of the IC is transferred to the housing 2 through the heat-conductive film 5, thereby reducing the heat around the IC area 4; a layer of heat-insulating film 6 is pasted on the heat-conductive film 5, so that the heat conducted by the IC is isolated by the heat-insulating film 6, so that it cannot be conducted to the cover plate, so that in the touch area of ​​the cover plate, the temperature of the IC position is consistent with other areas, and the temperature is uniform.

[0027] The above is an exemplary description of the utility model in conjunction with the accompanying drawings. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model; or the above concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A novel display screen IC zone heat dissipation structure, comprising a display screen (1), a housing (2) arranged on the display screen (1), and a glass cover plate (3) arranged on the display screen (1), characterized in that: The IC area (4) is arranged on one side of the display screen (1); a cooling structure connected to the shell (2) is provided on the IC area (4); and the shell (2) is a metal shell.

2. According to claim 1, a novel display IC area heat dissipation structure is characterized in that: The cooling structure is a heat-conducting film (5) arranged on the IC area (4), and the heat-conducting film (5) is connected to the housing (2).

3. A novel display IC area heat dissipation structure according to claim 2, characterized in that: The thermally conductive film (5) covers the IC region (4), and the thermally conductive film (5) is adhered to the surface of the IC region (4).

4. A novel display IC area heat dissipation structure according to claim 2, characterized in that: A flat plate (7) is provided on the side of the housing (2), and the heat-conducting film (5) is attached to the flat plate (7).

5. The novel display IC area heat dissipation structure according to claim 2 is characterized in that: The glass cover plate (3) is pressed onto the surface of the display screen (1), and the heat-conducting film (5) is arranged between the glass cover plate (3) and the IC area (4).

6. A novel display IC area heat dissipation structure according to claim 2 or 5, characterized in that: A heat insulation film (6) is provided on the glass cover plate (3).

7. A novel display IC zone heat dissipation structure according to claim 6, characterized in that: The thermal insulation film (6) is arranged between the thermal conductive film (5) and the glass cover plate (3), and the thermal insulation film (6) covers the portion of the thermal conductive film (5) that is attached to the IC area (4).

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