Bluetooth tag and electronic equipment

Abstract

The utility model provides a Bluetooth tag and electronic equipment, and belongs to the technical field of Bluetooth, and the Bluetooth tag comprises a first base material layer, a radio frequency module layer, a second base material layer and a Bluetooth module layer. The radio frequency module layer is arranged on the surface of the first base material layer. The second base material layer is arranged on the surface, back to the first base material layer, of the radio frequency module layer. The Bluetooth module layer is arranged on the surface, opposite to the radio frequency module layer, of the second base material layer. And the Bluetooth module layer and the radio frequency module layer are connected through a via hole formed in the second base material layer. The first base material layer, the radio frequency module layer, the second base material layer and the Bluetooth module layer are stacked layer by layer to form a stacked structure, so that layer-by-layer batch production is facilitated. Moreover, through the Bluetooth tag provided by the invention, near-field and far-field dual detection and checking of the articles can be realized, the articles can be accurately classified, loaded and the like without losing the articles, and a broadcasting mode can be started to continuously broadcast information such as temperature and battery voltage of the tag to the outside.

Description

Technical Field

[0001] The present application belongs to the field of Bluetooth technology, and in particular, relates to a Bluetooth tag and an electronic device. Background Art

[0002] In the fields of logistics and supply chain management, inventory management, access control systems, traffic management, animal tracking, and library management, radio frequency identification technology (RFID) or barcode technology is attached to keys, wallets, luggage, and other items to manage and track the items. The reader or barcode gun at the site identification point identifies and reports information, which is a near-field detection method.

[0003] However, after the managed and tracked items leave the site identification point, there is no way to perform subsequent inspections and verifications to determine whether they have been correctly classified and loaded, which can make the items easily lost. Utility Model Content

[0004] The purpose of the present application is to provide a Bluetooth tag and an electronic device, which is intended to solve the problem that when the managed and tracked items leave the site identification location, the items are easily lost due to the inability to perform subsequent detection and verification using traditional radio frequency identification technology or barcode technology.

[0005] The present application provides a Bluetooth tag, comprising:

[0006] a first substrate layer;

[0007] A radio frequency module layer is disposed on the surface of the first substrate layer;

[0008] A second substrate layer is disposed on a surface of the RF module layer facing away from the first substrate layer;

[0009] The Bluetooth module layer is arranged on a surface of the second substrate layer facing away from the radio frequency module layer, and the Bluetooth module layer is connected to the radio frequency module layer through via holes arranged in the second substrate layer.

[0010] In one embodiment, the Bluetooth tag further includes:

[0011] The power supply module layer is arranged on the surface of the Bluetooth module layer which is opposite to the second substrate layer.

[0012] In one embodiment, the Bluetooth module layer includes:

[0013] Bluetooth antenna;

[0014] A Bluetooth micro-control module is connected to the Bluetooth antenna and the power supply module layer respectively;

[0015] The passive crystal oscillator module is connected to the Bluetooth microcontroller module.

[0016] In one embodiment, the radio frequency module layer includes:

[0017] RF antenna;

[0018] The near field communication module is connected to the radio frequency antenna and the Bluetooth micro-control module respectively.

[0019] In one embodiment, the Bluetooth microcontroller module is respectively connected to the Bluetooth antenna and the passive crystal oscillator module through a Bluetooth circuit connection structure, and the Bluetooth antenna and the Bluetooth circuit connection structure are etched on the surface of the second substrate layer facing away from the RF module layer.

[0020] In one embodiment, the near field communication module is connected to the radio frequency antenna via a radio frequency circuit connection structure, and the radio frequency antenna and the radio frequency circuit connection structure are etched and disposed on the surface of the first substrate layer.

[0021] In one embodiment, the first substrate layer is a first polyethylene terephthalate plastic substrate layer, and the radio frequency module layer is disposed on a surface of the first polyethylene terephthalate plastic substrate layer.

[0022] In one embodiment, the second substrate layer is a second polyethylene terephthalate plastic substrate layer, the radio frequency module layer is arranged between the first polyethylene terephthalate plastic substrate layer and the second polyethylene terephthalate plastic substrate layer, and the Bluetooth module layer is arranged on the surface of the second polyethylene terephthalate plastic substrate layer facing away from the radio frequency module layer.

[0023] In one embodiment, the power supply module layer is disposed on the surface of the Bluetooth module layer facing away from the second polyethylene terephthalate plastic substrate layer by printing.

[0024] The present application provides an electronic device, comprising the Bluetooth tag described in any one of the above embodiments.

[0025] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0026] The first substrate layer has a first surface and a second surface that are arranged oppositely. The radio frequency module layer is arranged on the first surface of the first substrate layer. The radio frequency module layer has a first surface and a second surface that are arranged oppositely. The second substrate layer is arranged on the surface of the radio frequency module layer that is opposite to the first substrate layer, which can also be understood as the second substrate layer is arranged on the first surface of the radio frequency module layer, and the second surface of the radio frequency module layer is arranged on the first surface of the first substrate layer. The second substrate layer has a first surface and a second surface that are arranged oppositely. The Bluetooth module layer is arranged on the surface of the second substrate layer that is opposite to the radio frequency module layer, which can also be understood as the Bluetooth module layer is arranged on the first surface of the second substrate layer, and the second surface of the second substrate layer is arranged on the first surface of the radio frequency module layer. The first substrate layer, the radio frequency module layer, the second substrate layer and the Bluetooth module layer are stacked layer by layer to form a stacked structure, which is more conducive to layer-by-layer mass production.

[0027] The RF module layer is used to realize the contactless automatic identification function, and realizes the automatic identification of stationary or moving objects to be identified by using the RF signal and its spatial coupling transmission characteristics. Near-field detection can be realized through the RF module layer. The Bluetooth module layer is used to establish a Bluetooth connection with devices that support Bluetooth functions (such as mobile phones and tablets) through the transmission and reception of Bluetooth signals, and realize functions such as Bluetooth broadcasting, device search, data exchange, and alarm prompts. The working frequency band of the Bluetooth module layer is 2.4GHz, which can realize far-field detection. When the managed and tracked items leave the near-field site identification (it can also be understood as leaving the RF reader), the Bluetooth module layer of far-field detection can be used to perform long-distance detection after leaving the RF reader, and then it can be checked whether the items are correctly classified, loaded, etc., without causing the loss of items. It solves the problem that the items are easily lost due to the inability to perform post-detection and verification using traditional RFID technology or barcode technology, and can locate and track items in a timely manner.

[0028] Further, the Bluetooth module layer and the radio frequency module layer are connected through the vias provided by the second substrate layer, which can be understood as the Bluetooth module layer and the radio frequency module layer being electrically connected, so that the interaction between signals can be realized. When the radio frequency module layer is sensed by a reader or a mobile phone / handheld device, the sensing signal is sent to the Bluetooth module layer. After the Bluetooth module layer receives the signal, it turns on the broadcast mode and continuously broadcasts the temperature of the tag, the battery voltage of the tag and other information to the outside. Therefore, the Bluetooth tag provided by this application can realize the double detection and verification of the near field and the far field of the item, and can accurately classify and load the items without causing the loss of items. It can also promptly inform the user of the temperature, battery voltage and other information of the tag, so as to facilitate the user to perform subsequent manipulation and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the cross-sectional structure of the Bluetooth tag provided for this application;

[0030] Figure 2 A schematic diagram of the three-dimensional structure of the Bluetooth tag provided for this application;

[0031] Figure 3 A schematic diagram of the circuit connection structure of the Bluetooth module layer provided in this application;

[0032] Figure 4 A schematic diagram of the circuit connection structure of the RF module layer provided in this application;

[0033] Figure 5 A schematic diagram of the connection structure between the RF module layer and the Bluetooth module layer provided in this application;

[0034] Figure 6 Provided for this application Figure 5 The equivalent circuit diagram shown;

[0035] Figure 7 The equivalent circuit diagram of the reader / writer corresponding to the RF module layer provided in this application when activated;

[0036] Figure 8 The equivalent circuit diagram of the RF module layer provided in this application when it is activated;

[0037] Fig. 9 A schematic diagram of the structure of the Bluetooth antenna and the radio frequency antenna in the Bluetooth tag provided in this application;

[0038] Fig.10 A schematic top view of a mass-produced Bluetooth tag provided for this application. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0041] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] See also Figure 1 and Figure 2 The present application provides a Bluetooth tag 100, which includes a first substrate layer 10, a radio frequency module layer 20, a second substrate layer 30, and a Bluetooth module layer 40. The radio frequency module layer 20 is disposed on a surface of the first substrate layer 10. The second substrate layer 30 is disposed on a surface of the radio frequency module layer 20 that is opposite to the first substrate layer 10. The Bluetooth module layer 40 is disposed on a surface of the second substrate layer 30 that is opposite to the radio frequency module layer 20. The Bluetooth module layer 40 is connected to the radio frequency module layer 20 through a via disposed in the second substrate layer 30.

[0044] In this embodiment, the first substrate layer 10 has a first surface and a second surface that are arranged oppositely. The RF module layer 20 is arranged on the first surface of the first substrate layer 10. The RF module layer 20 has a first surface and a second surface that are arranged oppositely. The second substrate layer 30 is arranged on the surface of the RF module layer 20 that is opposite to the first substrate layer 10, which can also be understood as the second substrate layer 30 is arranged on the first surface of the RF module layer 20, and the second surface of the RF module layer 20 is arranged on the first surface of the first substrate layer 10. The second substrate layer 30 has a first surface and a second surface that are arranged oppositely. The Bluetooth module layer 40 is arranged on the surface of the second substrate layer 30 that is opposite to the RF module layer 20, which can also be understood as the Bluetooth module layer 40 is arranged on the first surface of the second substrate layer 30, and the second surface of the second substrate layer 30 is arranged on the first surface of the RF module layer 20. The first substrate layer 10, the RF module layer 20, the second substrate layer 30 and the Bluetooth module layer 40 are stacked layer by layer to form a stacked structure, which is more conducive to layer-by-layer batch production.

[0045] The radio frequency module layer 20 is used to realize the contactless automatic identification function, and uses the radio frequency signal and its spatial coupling transmission characteristics to realize the rapid identification of short-range communication, so as to be able to quickly inventory the items in the near field, thereby realizing the rapid inventory of logistics. Near-field detection can be realized through the radio frequency module layer 20. The Bluetooth module layer 40 is used to establish a Bluetooth connection with a device that supports Bluetooth function (such as a mobile phone, a tablet computer) through the transmission and reception of Bluetooth signals, and realize functions such as Bluetooth broadcasting, device search, data exchange, and alarm prompts. The operating frequency band of the Bluetooth module layer 40 is 2.4GHz, which can realize far-field detection. After the managed and tracked items leave the near-field site identification (it can also be understood as leaving the radio frequency reader), the Bluetooth module layer 40 of the far-field detection can be used to perform long-distance detection after leaving the radio frequency reader, so as to verify whether the items are correctly classified, loaded, etc., and the items will not be lost, which solves the problem that the items are easily lost due to the inability to perform post-detection and verification using traditional radio frequency identification technology or barcode technology, and can locate and track the items in time.

[0046] Furthermore, the Bluetooth module layer 40 is connected to the radio frequency module layer 20 through the vias provided by the second substrate layer 30, which can be understood as the Bluetooth module layer 40 being electrically connected to the radio frequency module layer 20, so that the interaction between signals can be realized. When the radio frequency module layer 20 is sensed by a reader or a mobile phone / handheld device, the sensing signal is sent to the Bluetooth module layer 40. After receiving the signal, the Bluetooth module layer 40 turns on the broadcast mode and continuously broadcasts information such as the temperature of the tag and the battery voltage of the tag to the user. Therefore, the Bluetooth tag 100 provided by the present application can realize the double detection and verification of the near field and far field of the item, and can accurately classify and load the items without causing the loss of the items. The Bluetooth tag 100 provided by the present application can also promptly inform the user of the relevant information of the item, so that the user can perform subsequent manipulation and processing conveniently.

[0047] In one embodiment, the Bluetooth tag 100 further includes a power supply module layer 50 . The power supply module layer 50 is disposed on a surface of the Bluetooth module layer 40 that is opposite to the second substrate layer 30 .

[0048] In this embodiment, the Bluetooth module layer 40 is arranged between the power module layer 50 and the second substrate layer 30. The power module layer 50 is printed on the surface of the Bluetooth module layer 40 facing away from the second substrate layer 30 through a printing process. It can also be understood that the Bluetooth module layer 40 has a first surface and a second surface arranged oppositely, and the second substrate layer 30 has a first surface and a second surface arranged oppositely. The first surface of the Bluetooth module layer 40 is provided with the power module layer 50. The second surface of the Bluetooth module layer 40 is located on the first surface of the second substrate layer 30. The first substrate layer 10, the radio frequency module layer 20, the second substrate layer 30, the Bluetooth module layer 40 and the power module layer 50 are stacked. Through the stacking arrangement between the first substrate layer 10, the radio frequency module layer 20, the second substrate layer 30, the Bluetooth module layer 40 and the power module layer 50, the Bluetooth tag 100 can be made more integrated, saving the space of the entire product and improving the integrity of the product, and compared with the external battery produced separately in the traditional structure, it has the advantages of low cost and can be printed and produced on a large scale.

[0049] See also Figure 3 In one embodiment, the Bluetooth module layer 40 includes a Bluetooth antenna 410, a Bluetooth microcontroller module 420, and a passive crystal oscillator module 430. The Bluetooth microcontroller module 420 is connected to the Bluetooth antenna 410 and the power supply module layer 50, respectively. The passive crystal oscillator module 430 is connected to the Bluetooth microcontroller module 420.

[0050] In this embodiment, the Bluetooth antenna 410 includes a Bluetooth antenna in the 2.4 GHz frequency band. The Bluetooth antenna 410 is connected to the RF_TX pin of the Bluetooth microcontroller module 420. The Bluetooth microcontroller module 420 includes a microcontroller unit (MCU), which integrates a central processing unit, a memory, a timer / counter, an input / output interface (I / O interface), etc. on a chip, and has the advantages of small size, low power consumption, low cost, and strong control function. The OUT pin of the passive crystal oscillator module 430 is connected to the XO_N pin of the Bluetooth microcontroller module 420. The IN pin of the passive crystal oscillator module 430 is connected to the XO_P pin of the Bluetooth microcontroller module 420. The passive crystal oscillator module 430 includes a passive crystal oscillator, which can provide a working cycle, and can also be understood as providing a clock signal. The clock signal generated by the passive crystal oscillator module 430 controls the execution of instructions and the processing of data. At the same time, the small size of the passive crystal oscillator module 430 helps to realize the miniaturization and integration of electronic equipment, so that the integration of the Bluetooth tag 100 is higher. The small amount of components including the Bluetooth antenna 410, the Bluetooth microcontroller module 420 and the passive crystal oscillator module 430 in the Bluetooth module layer 40 provided in the present application can solve the problem of complex structure caused by the need to rely on a large number of components when implementing traditional Bluetooth functions. The Bluetooth receiving and transmitting functions can be realized with a minimum of components, further making the Bluetooth tag 100 lighter and thinner as a whole.

[0051] See also Figure 4 In one embodiment, the RF module layer 20 includes a RF antenna 210 and a near field communication module 220. The near field communication module 220 is connected to the RF antenna 210 and the Bluetooth micro control module 420 respectively.

[0052] In this embodiment, the radio frequency antenna 210 is used to transmit radio frequency signals between the tag and the reader. The NFC IN1 pin and the NFC IN2 pin of the near field communication module 220 are respectively connected to the two ends of the radio frequency antenna 210. The NFC ON pin of the communication module 220 is connected to the GPIO1 pin of the Bluetooth microcontroller module 420. The near field communication module 220 includes a near field communication chip (NearField Communication, NFC), which can store data, encrypt and secure, and communicate interactively, and has the advantages of small size, low power consumption and high sensitivity.

[0053] See also Figure 5 and Figure 6 In the circuit, the near field communication module 220 can be equivalent to a transistor Q1, which is initially in a closed state. The RF antenna 210 can be equivalent to an energy storage inductor L1. The equivalent circuit is as follows: Figure 6As shown. The GPIO of the Bluetooth microcontroller module 420 has its own pull-up or pull-down resistor R1, which is at a high / low level when powered on. The near-field communication module 220 is connected to the Bluetooth microcontroller module 420 through an input or output pin (General Purpose Input Output, GPIO), which can be configured as input or output by the user as needed. When configured as an input, the GPIO pin can detect the state of an external signal (for example, a high level or a low level). As an output, the pin can be programmed to output a high level or a low level, thereby driving an external device. The GPIO allows interaction and control between the near-field communication module 220 and the Bluetooth microcontroller module 420. The equivalent circuit diagram when the RFID reader is activated is shown in FIG. Figure 7 shown.

[0054] See also Figure 8 When the near field communication module 220 (also understood as an RFID chip) is sensed by a reader or a mobile phone / handheld device, it is equivalent to turning on the control level of the transistor Q1, and the level of the GPIO will be pulled low or high. The Bluetooth micro-control module 420 receives the changes in the high and low level signals, and then turns on the broadcast mode, continuously broadcasting the temperature of the tag, the battery voltage of the tag and other information to the outside world.

[0055] The Bluetooth antenna 410 and the RF antenna 210 in the Bluetooth tag 100 provided by the present application realize the dual antenna function, and can receive and send Bluetooth signals and RF signals of different frequency bands. In addition, the two components of the Bluetooth microcontroller module 420 and the near field communication module 220 in the Bluetooth tag 100 provided by the present application can realize the Bluetooth function and the RFID function in a limited size space, so that the occupied space size is reduced and the cost is reduced.

[0056] In one embodiment, the first substrate layer 10 is a first polyethylene terephthalate plastic substrate layer. The radio frequency module layer 20 is disposed on the surface of the first polyethylene terephthalate plastic substrate layer.

[0057] In this embodiment, polyethylene terephthalate (PET) has advantages in mechanical properties, optical properties, chemical resistance, processing properties, and environmental performance. The RF circuit connection structure 230 and the RF antenna 210 of the RF module layer 20 can be etched on the surface of the first PET substrate layer.

[0058] In one embodiment, the second substrate layer 30 is a second polyethylene terephthalate plastic substrate layer. The RF module layer 20 is disposed between the first polyethylene terephthalate plastic substrate layer and the second polyethylene terephthalate plastic substrate layer. The Bluetooth module layer 40 is disposed on the surface of the second polyethylene terephthalate plastic substrate layer facing away from the RF module layer 20.

[0059] In this embodiment, the Bluetooth circuit connection structure 440 of the Bluetooth module layer 40 and the Bluetooth antenna 410 can be etched on the surface of the second polyethylene terephthalate plastic substrate layer (that is, the second substrate layer 30) facing away from the RF module layer 20. The connection between the etched Bluetooth module layer 40 and the RF module layer 20 can be connected through the via prepared on the second polyethylene terephthalate plastic substrate layer (that is, the second substrate layer 30).

[0060] See also Fig. 9 In one embodiment, the Bluetooth microcontroller module 420 is connected to the Bluetooth antenna 410 and the passive crystal oscillator module 430 respectively through the Bluetooth circuit connection structure 440. The Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 are etched and disposed on the surface of the second substrate layer 30 facing away from the RF module layer 20.

[0061] In this embodiment, etching includes processes such as aluminum etching or copper etching. The Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 are arranged on the surface of the second substrate layer 30 facing away from the radio frequency module layer 20 through an etching process. The Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 are etched and arranged on the surface of the second substrate layer 30 facing away from the radio frequency module layer 20, which can make the Bluetooth tag 100 low-cost and mass-produced. Through the hot pressing process, the Bluetooth microcontroller module 420 and the passive crystal oscillator module 430 are hot-pressed on the etched Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 using a conductive packaging process, thereby realizing circuit connection, replacing the traditional welding method between components, and having the advantages of enhancing material bonding strength, high-precision molding, and improving production efficiency.

[0062] The Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 are etched on the surface of the second substrate layer 30 facing away from the RF module layer 20, and a tiny integrated circuit circuit can be etched, so that the entire Bluetooth module layer 40 and the second substrate layer 30 are more compact and the overall thickness is reduced. Furthermore, compared with traditional Bluetooth tags, the Bluetooth tag 100 provided in this application is thinner and more convenient to use, and can be attached to the surface of an item like a courier label.

[0063] Furthermore, the Bluetooth microcontroller module 420 and the passive crystal oscillator module 430 are hot-pressed on the etched Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 using the conductive packaging process, so that the Bluetooth microcontroller module 420, the passive crystal oscillator module 430, the Bluetooth antenna 410 and the Bluetooth circuit connection structure 440 are arranged on the same film layer, which is conducive to the layer-by-layer arrangement of the Bluetooth tag 100 provided by the present application, and can be automatically mass-produced by RFID-compatible production equipment. Therefore, compared with traditional Bluetooth tags, the layer-by-layer stacking arrangement of the Bluetooth tag 100 provided by the present application makes the overall thickness thinner and the cost lower, which is more conducive to the automatic production of RFID-compatible production equipment.

[0064] In one embodiment, the NFC module 220 is connected to the RF antenna 210 via the RF circuit connection structure 230 . The RF antenna 210 and the RF circuit connection structure 230 are etched and disposed on the surface of the first substrate layer 10 .

[0065] In this embodiment, etching includes processes such as aluminum etching or copper etching. The RF antenna 210 and the RF circuit connection structure 230 are etched and arranged on the surface of the first substrate layer 10, which can make the Bluetooth tag 100 low-cost and mass-produced. Through the hot pressing process, the near field communication module 220 is hot-pressed on the etched RF antenna 210 and the RF circuit connection structure 230 using the conductive packaging process, and the circuit connection is realized, which replaces the traditional welding method between components, and has the advantages of enhancing material bonding strength, high-precision molding, and improving production efficiency.

[0066] The RF antenna 210 and the RF circuit connection structure 230 are etched on the surface of the first substrate layer 10, and a tiny integrated circuit circuit can be etched, so that the entire RF module layer 20 and the first substrate layer 10 are more compact and the overall thickness is reduced. Furthermore, compared with traditional Bluetooth tags, the Bluetooth tag 100 provided in this application is thinner and more convenient to use, and can be attached to the surface of an item like a courier label.

[0067] Furthermore, the near field communication module 220 is hot pressed onto the etched RF antenna 210 and the RF circuit connection structure 230 using a conductive packaging process, so that the RF antenna 210, the near field communication module 220 and the RF circuit connection structure 230 are arranged on the same film layer, which is conducive to the layer-by-layer arrangement of the Bluetooth tag 100 provided by the present application, and can be automatically mass-produced by RFID-compatible production equipment. Therefore, compared with traditional Bluetooth tags, the layer-by-layer stacking arrangement of the Bluetooth tag 100 provided by the present application makes the overall thickness thinner and the cost lower, which is more conducive to the automatic production of RFID-compatible production equipment.

[0068] In one embodiment, the power module layer 50 is directly printed on the first surface of the Bluetooth module layer 40 by conductive glue to form a printed battery, which avoids the problems of large weight and volume, low portability and high safety risks of external batteries produced separately in traditional structures, and can be mass-produced, so that the size of the entire Bluetooth tag 100 is lighter and thinner. Through the power module layer 50 provided by the present application, the Bluetooth tag 100 has stronger flexibility and customizability, can be set according to different product shapes and sizes, can be applied to various irregular devices and surfaces, and better meet the actual needs of users.

[0069] See also Fig.10 The Bluetooth tag 100 provided in the present application has, from bottom to top, a radio frequency module layer 20 arranged on the surface of the first substrate layer 10, a second substrate layer 30 arranged on the surface of the radio frequency module layer 20 facing away from the first substrate layer 10, a Bluetooth module layer 40 arranged on the surface of the second substrate layer 30 facing away from the radio frequency module layer 20, and a power supply module layer 50 arranged on the surface of the Bluetooth module layer 40 facing away from the second substrate layer 30, forming a five-layer composite stacked structure of the first substrate layer 10, the radio frequency module layer 20, the second substrate layer 30, the Bluetooth module layer 40 and the power supply module layer 50, which is conducive to layer-by-layer batch production to form a plurality of Bluetooth tags 100.

[0070] The present application provides an electronic device, including the Bluetooth tag 100 in any one of the above embodiments.

[0071] In this embodiment, the electronic device may be a logistics tracking device, an asset management device, a pet tracker, a luggage tag, a smart key chain, or a personnel positioning device. The logistics tracking device can be used to track the location and status of goods during transportation. The asset management device can be used to manage and track valuable equipment and office assets. The pet tracker can help locate the location of the pet. The luggage tag can facilitate passengers to track their luggage in places such as airports. The smart key chain can prevent the loss of keys, or the location of the keys can be found through devices such as mobile phones. The personnel positioning device can locate and manage employees in some specific work environments.

[0072] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0073] In the above embodiments, the description of each embodiment has its own emphasis. For the parts that are not described or recorded in detail in a certain embodiment, please refer to the relevant description of other embodiments. The division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0074] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0075] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A Bluetooth tag, characterized in that: include: A first substrate layer (10); A radio frequency module layer (20) is disposed on the surface of the first substrate layer (10); A second substrate layer (30) is disposed on a surface of the radio frequency module layer (20) that is opposite to the first substrate layer (10); The Bluetooth module layer (40) is arranged on a surface of the second substrate layer (30) facing away from the radio frequency module layer (20), and the Bluetooth module layer (40) is connected to the radio frequency module layer (20) through a via hole arranged in the second substrate layer (30).

2. The Bluetooth tag according to claim 1, characterized in that: The Bluetooth tag also includes: The power supply module layer (50) is arranged on a surface of the Bluetooth module layer (40) that is opposite to the second substrate layer (30).

3. The Bluetooth tag according to claim 2, wherein: The Bluetooth module layer (40) comprises: Bluetooth antenna (410); A Bluetooth micro-control module (420) is connected to the Bluetooth antenna (410) and the power supply module layer (50) respectively; The passive crystal oscillator module (430) is connected to the Bluetooth micro-control module (420).

4. The Bluetooth tag according to claim 3, characterized in that: The radio frequency module layer (20) comprises: A radio frequency antenna (210); The near field communication module (220) is connected to the radio frequency antenna (210) and the Bluetooth micro-control module (420) respectively.

5. The Bluetooth tag according to claim 3, characterized in that: The Bluetooth microcontroller module (420) is respectively connected to the Bluetooth antenna (410) and the passive crystal oscillator module (430) via a Bluetooth circuit connection structure (440); the Bluetooth antenna (410) and the Bluetooth circuit connection structure (440) are etched and arranged on a surface of the second substrate layer (30) that is opposite to the radio frequency module layer (20).

6. The Bluetooth tag according to claim 4, characterized in that: The near field communication module (220) is connected to the radio frequency antenna (210) via a radio frequency circuit connection structure (230), and the radio frequency antenna (210) and the radio frequency circuit connection structure (230) are etched and arranged on the surface of the first substrate layer (10).

7. The Bluetooth tag according to claim 1, wherein: The first substrate layer (10) is a first polyethylene terephthalate plastic substrate layer, and the radio frequency module layer (20) is arranged on the surface of the first polyethylene terephthalate plastic substrate layer.

8. The Bluetooth tag according to claim 7, wherein: The second substrate layer (30) is a second polyethylene terephthalate plastic substrate layer, the radio frequency module layer (20) is arranged between the first polyethylene terephthalate plastic substrate layer and the second polyethylene terephthalate plastic substrate layer, and the Bluetooth module layer (40) is arranged on the surface of the second polyethylene terephthalate plastic substrate layer that is opposite to the radio frequency module layer (20).

9. The Bluetooth tag according to claim 2, wherein: The power supply module layer (50) is arranged on the surface of the Bluetooth module layer (40) facing away from the second substrate layer (30) by printing.

10. An electronic device, characterized in that: The method comprises the Bluetooth tag as claimed in any one of claims 1 to 9.

Images