Multi-channel temperature and vibration composite acquisition card device

Abstract

The utility model belongs to the technical field of data acquisition, and discloses a multichannel temperature and vibration composite acquisition card device which comprises a power supply module, an IEPE conditioning acquisition module, an RTD conditioning acquisition module, a data acquisition FPGA module and an SOM controller. The multichannel temperature and vibration composite acquisition card device solves the problems of phase synchronization and channel crosstalk of an acquisition board. By adopting a synchronous acquisition mode, all requirements of vibration state monitoring are met, and the phase relation of each measuring point at the same moment can be associated. And during acquisition, acquisition card channel switching is not carried out, so that the problem of inaccurate data acquisition caused by signal crosstalk close to an acquisition channel is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of data acquisition, and particularly relates to a multi-channel temperature and vibration composite acquisition card device. Background Art

[0002] An acquisition card device is a device that receives the bearing vibration and temperature state signals transmitted by the sensors connected thereto, performs analog-to-digital conversion on the received vibration and temperature signals, and finally outputs them to other devices.

[0003] The existing 16-channel vibration and 16-channel temperature composite acquisition card device adopts a polling acquisition method, which cannot meet all the requirements of vibration state monitoring and cannot associate the phase relationships of each measuring point at the same moment. Moreover, during polling, signal crosstalk between adjacent acquisition channels will occur when switching the acquisition card channels, resulting in inaccurate acquisition data.

[0004] In view of the problems existing in the prior art, it is particularly important to develop a brand-new acquisition card device. Summary of the Utility Model

[0005] The utility model aims at the above-mentioned existing technical problems and develops a multi-channel temperature and vibration composite acquisition card device.

[0006] The technical solution of the utility model is as follows:

[0007] A multi-channel temperature and vibration composite acquisition card device includes a power supply module 101, an IEPE (current excitation voltage output) conditioning acquisition module 102, an RTD (resistance temperature detector) conditioning acquisition module 103, a data acquisition FPGA (field programmable gate array) module 104, and a SOM (system on a chip) controller 105, as Figure 1 shown. The power supply module 101 is connected to an external power supply 10 and is also connected to the IEPE conditioning acquisition module 102, the RTD conditioning acquisition module 103, the data acquisition FPGA module 104, and the SOM controller 105 to provide power for other modules; the IEPE conditioning acquisition module 102 is connected to an IEPE sensor 30; the RTD conditioning acquisition module 103 is connected to a Pt1000 / Pt100 sensor 40; the data acquisition FPGA module 104 is respectively connected to the IEPE acquisition conditioning acquisition module 102 and the RTD conditioning acquisition module 103; the SOM controller 105 is connected to the data acquisition FPGA module 104 and is connected to an external controller 20.

[0008] The beneficial effects of the utility model are as follows:

[0009] The multi-channel temperature and vibration composite acquisition card device of the utility model solves the problems of phase synchronization and channel crosstalk existing in the acquisition board.

[0010] By adopting the synchronous acquisition method, all requirements for vibration state monitoring are met, and the phase relationship between each measuring point at the same moment can be associated. Moreover, during the acquisition process, no switching of the acquisition card channels is performed, thus solving the problem of signal crosstalk between adjacent acquisition channels and ensuring the accuracy of the acquired data. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is the structural block diagram of the multi-channel temperature and vibration composite acquisition card device;

[0012] Figure 2 is the schematic diagram of the IEPE conditioning acquisition module 102;

[0013] Figure 3 is the schematic diagram of the RTD conditioning acquisition module 103;

[0014] Figure 4 is the schematic diagram of the data acquisition FPGA module 104;

[0015] Figure 5 is the schematic diagram of the SOM controller 105.

[0016] In the figure: 101 power supply module, 102 IEPE conditioning acquisition module, 103 RTD conditioning acquisition module, 104 data acquisition FPGA module, 105 SOM controller, 10 external power supply, 20 external controller, 30 IEPE sensor, 40 Pt1000 / Pt100 sensor, 50 power supply module, 60 channel acquisition module, 201 power supply interface, 202 boost circuit, 203 input interface, 204 IEPE power supply circuit, 205 output interface, 206 amplifier circuit, 207 IEPE, 301 constant current source, 302 channel switching, 303 operational amplifier, 401 A / D conversion circuit, 402 digital isolation circuit, 403 FPGA, 501 ARM processor, 502 FPGA interface, 503 display interface, 504 hard disk, 505 memory. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to further explain the technical solution of the present invention, the present invention will be elaborated in detail below through specific embodiments.

[0018] As Figure 1 shown, the present invention discloses a multi-channel temperature and vibration composite acquisition card device, including a power supply module 101, an IEPE (current excitation voltage output) conditioning acquisition module 102, an RTD (resistance temperature detector) conditioning acquisition module 103, a data acquisition FPGA (field programmable gate array) module 104, and a SOM (system on a chip) controller 105, as Figure 1As shown in the figure. The power supply module 101 is connected to the external power supply 10 and is also connected to the IEPE conditioning and acquisition module 102, the RTD conditioning and acquisition module 103, the data acquisition FPGA module 104, and the SOM controller 105, providing power for other modules; the IEPE conditioning and acquisition module 102 is connected to the IEPE sensor 30; the RTD conditioning and acquisition module 103 is connected to the Pt1000 / Pt100 sensor 40; the data acquisition FPGA module 104 is respectively connected to the IEPE conditioning and acquisition module 102 and the RTD conditioning and acquisition module 103; the SOM controller 105 is connected to the data acquisition FPGA module 104 and is connected to the external controller 20.

[0019] The described power supply module 101 converts the input of the external power supply 10 into various analog and digital power supply voltages required inside the system. The analog power supply adopts a low-noise isolation design, thus ensuring a high signal-to-noise ratio of the acquisition module.

[0020] The composition of the described IEPE conditioning and acquisition module 102 is shown in Figure 2 , and it includes a power supply module 50 and a channel acquisition module 60; the power supply module 50 includes a power supply interface 201 and a boost circuit 202, and the channel acquisition module 60 includes an input interface 203, an IEPE power supply circuit 204, an output interface 205, and an amplification circuit 206; the power supply interface 201 inside the power supply module 50 is externally connected to a power supply device, inputting the power supply voltage to the boost circuit 202, and the boost circuit 202 boosts the power supply voltage to the working voltage required inside the channel acquisition module 60 and outputs it to the IEPE power supply circuit 204 and the amplification circuit 206. The IEPE power supply circuit 204, as a constant current source, provides stable working conditions for the IEPE 207 through the input interface 203. The amplification circuit 206 obtains the input signal of the IEPE 207 through the input interface 203, and after amplification, outputs it from the output interface 205.

[0021] The composition of the described RTD conditioning and acquisition module 103 is shown in Figure 3 , and it includes a constant current source 301, a channel switch 302, and an operational amplifier 303. The constant current source 301 provides a constant current excitation for the Pt (platinum resistance) 1000 / Pt100 sensor 40 through the channel switch 302. At the same time, the channel switch 302 receives the output voltage of the Pt (platinum resistance) 1000 / Pt100 sensor 40, passes it through the operational amplifier 303, and sends the result to the data acquisition FPGA module 104.

[0022] The described data acquisition FPGA module 104 mainly completes the data acquisition timing of 16 channels of RTD and 16 channels of IEPE. At the same time, it receives the results of multiple A / D conversions, and through data format arrangement and communication protocol encapsulation, realizes data interaction with the SOM controller 105; the composition of the data acquisition FPGA module 104 is shown in Figure 4, including an A / D conversion circuit 401, a digital isolation circuit 402, and an FPGA 403. The data sent by the IEPE conditioning and acquisition module 102 and the RTD conditioning and acquisition module 103 enters the A / D conversion circuit 401, then passes through the digital isolation circuit 402, and enters the FPGA 403 to interact with the SOM controller 105 for data.

[0023] The SOM controller 105 is the core part of the system, which completes the data and instruction interaction with the external controller 20, and at the same time controls the working parameters and working modes of the IEPE conditioning and acquisition module 102 and the RTD conditioning and acquisition module 103. In addition, with its high-performance FPGA and rich function libraries, online data algorithm processing can be achieved. The composition of the SOM controller 105 is shown in Figure 5 , including an ARM processor 501, an FPGA interface 502, a display interface 503, a hard disk 504, and a memory 505. The external controller 20 issues instructions, which are transmitted to the ARM processor 501 and the FPGA interface 502 through the display interface 503. The ARM processor 501 issues instructions to the FPGA interface 502. The FPGA interface 502 receives the data transmitted from the data acquisition FPGA module 104 and transmits it to the ARM processor 501 for processing. The result is sent to the display interface 503 and output to the external controller 20 for display. The FPGA interface 502 will also transmit some processed results to the display interface 503. At the same time, during the above process, the ARM processor 501 needs to access the memory 505, and the data is stored in the hard disk 504.

[0024] The working principle is as follows: As Figure 1 shown, the power supply module 101 introduces the external power supply 10, converts it into the power supplies required by each module, and provides power for each module. The IEPE conditioning and acquisition module 102 and the RTD conditioning and acquisition module 103 respectively provide constant current excitation for the IEPE sensor 30 and the Pt1000 / Pt100 sensor 40, and at the same time respectively receive the analog outputs of the IEPE sensor 30 and the Pt1000 / Pt100 sensor 40, and use the ADC to convert the analog signal into a digital signal. The data acquisition FPGA module 104 completes the acquisition timing of the IEPE conditioning and acquisition module 102 and the RTD conditioning and acquisition module 103 and receives the results of the ADC conversion. The SOM controller 105 sets the working modules and working parameters, sends them to the data acquisition FPGA module 104, and receives the results output by the data acquisition FPGA module 104. According to the instructions given by the external controller 20, the SMO controller 105 outputs the results to the external controller 20.

[0025] In the system, the data acquisition FPGA module 104 is used to complete the timing control related to ADC data acquisition. At the same time, the multi-channel ADC data is preprocessed and then output to the SOM controller 105 through a standard data interface, realizing the modularization and standardization of the data acquisition function.

Claims

1. A multi-channel temperature and vibration composite acquisition card device, characterized in that: The multi-channel temperature and vibration composite acquisition card device comprises a power supply module (101), an IEPE conditioning acquisition module (102), an RTD conditioning acquisition module (103), a data acquisition FPGA module (104) and a SOM controller (105). The power supply module (101) is connected to an external power supply (10), and is also connected to the IEPE conditioning acquisition module (102), the RTD conditioning acquisition module (103), the data acquisition FPGA module (104) and the SOM controller (105) to provide power. The IEPE conditioning acquisition module (102) is connected to an IEPE sensor (30). The IEPE conditioning and acquisition module (102) provides a constant current excitation for the IEPE sensor (30), receives the analog output of the IEPE sensor (30), and sends the result to the data acquisition FPGA module (104); the RTD conditioning and acquisition module (103) is connected to the Pt1000 / Pt100 sensor (40); the data acquisition FPGA module (104) is connected to the IEPE conditioning and acquisition module (102) and the RTD conditioning and acquisition module (103) respectively; the SOM controller (105) is connected to the data acquisition FPGA module (104) and is connected to the external controller (20).

2. The multi-channel temperature and vibration composite acquisition card device according to claim 1, characterized in that: The IEPE conditioning and acquisition module (102) comprises a power supply module (50) and a channel acquisition module (60); the power supply module (50) comprises a power supply interface (201) and a boost circuit (202); the channel acquisition module (60) comprises an input interface (203), an IEPE power supply circuit (204), an output interface (205) and an amplifier circuit (206); the power supply interface (201) in the power supply module (50) is externally connected to a power supply device, and a power supply voltage is input to the boost circuit (202); the boost circuit (202) boosts the power supply voltage to a required working voltage in the channel acquisition module (60), and outputs the voltage to the IEPE power supply circuit (204) and the amplifier circuit (206); the IEPE power supply circuit (204) acts as a constant current source to provide a stable working condition for the IEPE 207 via the input interface (203); the amplifier circuit (206) obtains an input signal of the IEPE 207 via the input interface (203), and outputs the signal from the output interface (205) after amplification.

3. The multi-channel temperature and vibration composite acquisition card device according to claim 1, characterized in that: The RTD conditioning acquisition module (103) comprises a constant current source (301), a channel switch (302) and an operational amplifier (303). The constant current source (301) provides constant current excitation for the Pt1000 / Pt100 sensor (40) via the channel switch (302). Meanwhile, the channel switch (302) receives the output voltage of the Pt1000 / Pt100 sensor (40), passes through the operational amplifier (303) and sends the result to the data acquisition FPGA module (104).

Images