Ultrasonic fingerprint identification device and electronic equipment for fingerprint identification

Abstract

The utility model relates to the field of electronics, in particular to the field of fingerprint recognition, and particularly relates to an ultrasonic fingerprint recognition device and electronic equipment for fingerprint recognition. The ultrasonic fingerprint identification device is installed in the electronic equipment and comprises an ultrasonic sensor and a circuit board. The ultrasonic sensor is attached to the back face of the first groove structure, the front face of the first groove structure is formed by recessing the outer frame of the electronic equipment, on one hand, ultrasonic waves are high in penetrating power and can penetrate through the outer frame of the electronic equipment easily, and therefore the ultrasonic wave signal strength is high, and the fingerprint recognition accuracy is high; the ultrasonic fingerprint identification device is arranged on the back surface of the first groove structure formed by recessing the outer frame of the electronic equipment, and the first groove structure can guide a user to find the position of a pressed finger more quickly.

Description

Technical Field

[0001] This application relates to the field of fingerprint recognition, and in particular, to an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. Background Art

[0002] With the development of intelligent devices, fingerprint recognition has become one of the functions of most intelligent devices. The installation positions of the side fingerprint solution and the traditional front and back fingerprint solutions are different. Currently, the mainstream front fingerprint recognition terminals adopt optical or ultrasonic fingerprint solutions, and the back fingerprint recognition terminals adopt capacitive fingerprint solutions. For terminals with side fingerprint recognition functions, their fingerprint recognition devices are arranged on the side of the middle frame of the intelligent device.

[0003] Currently, the side fingerprint solution mainly adopts the capacitive fingerprint solution. However, when the cover plate above the capacitive fingerprint module is relatively thick, the penetration performance of the capacitive fingerprint solution is poor, resulting in weak signal strength and reduced recognition accuracy. Utility Model Content

[0004] In view of the problem of low recognition accuracy of side fingerprints in the prior art, the embodiments of this application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition.

[0005] In a first aspect of the embodiments of this application, an ultrasonic fingerprint recognition device is provided, which is installed in an electronic device. The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board;

[0006] The circuit board is electrically connected to the processing unit of the electronic device;

[0007] The ultrasonic sensor is configured to transmit an ultrasonic signal and receive the ultrasonic signal that is reflected and passes through the outer frame of the electronic device, and is further configured to convert the received ultrasonic signal into an electrical signal and send the electrical signal to the processing unit through the circuit board;

[0008] The ultrasonic sensor is attached to the back surface of the first groove structure, and the front surface of the first groove structure is formed by the recess of the outer frame of the electronic device.

[0009] In addition, in combination with the first aspect, in an implementation manner of the first aspect, the ultrasonic sensor includes an acoustic layer and a silicon wafer layer, and the silicon wafer layer is connected to the acoustic layer;

[0010] The ultrasonic sensor further includes an adhesive layer, and the acoustic layer or the silicon wafer layer is attached to the back surface of the first groove structure through the adhesive layer. The adhesive layer is copper foil glue;

[0011] The front surface of the first groove structure provides a pressing surface for contacting with the user's finger; there is no air gap between the first groove structure and the outer frame;

[0012] The ultrasonic fingerprint recognition device further includes a first fixing part, and the circuit board is fixed to the outer frame through the first fixing part. The first fixing part is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer;

[0013] One end of the silicon wafer layer is connected to the circuit board through a bonding wire. The first fixing part is used to support the circuit board so that the electrical connection area of the circuit board and the electrical connection area of the silicon wafer layer are at the same height; or,

[0014] One end of the silicon wafer layer is connected to the circuit board through ACF glue.

[0015] In addition, in combination with the first aspect, in an implementation manner of the first aspect, a second groove structure is formed on the back surface of the first groove structure for accommodating at least a part of the ultrasonic sensor.

[0016] In addition, in combination with the first aspect, in an implementation manner of the first aspect, the depth of the second groove structure is less than or equal to the thickness of the ultrasonic sensor; the bottom area of the second groove structure is greater than or equal to the area of the ultrasonic sensor.

[0017] In addition, in combination with the first aspect, in an implementation manner of the first aspect, the acoustic layer is attached to the inside of the second groove structure, and the acoustic layer is arranged between the silicon wafer layer and the first groove structure; or

[0018] The silicon wafer layer is attached to the inside of the second groove structure, and the silicon wafer layer is arranged between the acoustic layer and the first groove structure.

[0019] In addition, in combination with the first aspect, in an implementation manner of the first aspect, the back surface of the first groove structure is flat;

[0020] The ultrasonic sensor is attached to the back surface of the first groove structure, including:

[0021] The acoustic layer is attached to the back surface of the first groove structure, and the acoustic layer is arranged between the silicon wafer layer and the first groove structure; or

[0022] The silicon wafer layer is attached to the back surface of the first groove structure, and the silicon wafer layer is arranged between the acoustic layer and the first groove structure.

[0023] In addition, in combination with the first aspect, in an implementation manner of the first aspect, the first groove structure is made of the same material as the outer frame, and the outer frame is plastic or metal;

[0024] The first groove structure is formed by recessing the outer frame of the electronic device through integral molding, or

[0025] The first groove structure is a physical button, and the front surface of the first groove structure is used to provide a pressing surface of the physical button.

[0026] In addition, in combination with the first aspect, in one implementation manner of the first aspect, the outer frame and the first groove structure are made of different materials, and the outer frame is made of plastic or metal;

[0027] The first groove structure is a physical button, and the front surface of the first groove structure is used to provide the pressing surface of the physical button.

[0028] In addition, in combination with the first aspect, in one implementation manner of the first aspect, the depth of the first groove structure is not less than 0.5 mm and not greater than 2 mm.

[0029] In addition, in combination with the first aspect, in one implementation manner of the first aspect, the front surface of the first groove structure is a plane, and the front surface of the first groove structure is perpendicular to the display screen of the electronic device;

[0030] A silk screen is provided on the front surface of the first groove, and the silk screen is a fingerprint pattern;

[0031] The first groove structure has two side surfaces, and the two side surfaces are respectively two opposite side surfaces along the outer frame;

[0032] The two side surfaces of the first groove structure form a chamfer structure; or

[0033] The two side surfaces of the first groove structure are side surfaces perpendicular to the front surface of the first groove structure.

[0034] The second aspect of the embodiments of the present application provides an electronic device for fingerprint recognition, including the ultrasonic fingerprint recognition device and the outer frame in any one of the first aspects.

[0035] Compared with the prior art, the beneficial effects of the embodiments of the present application are as follows: The embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. On the one hand, because the ultrasonic wave has strong penetration and is relatively easy to penetrate the outer frame of the electronic device, therefore, the ultrasonic signal strength is high and the fingerprint recognition accuracy is high. In addition, by arranging the ultrasonic fingerprint recognition device on the back surface of the first groove structure formed by recessing the outer frame of the electronic device, the first groove structure can guide the user to find the position of pressing the finger more quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0037] Figure 1 It is a schematic cross-sectional view of the ultrasonic fingerprint recognition device in the embodiment of the present application;

[0038] Figure 2 It is a schematic cross-sectional view of the ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0039] Figure 3 It is a schematic cross-sectional view of the outer frame of the electronic device according to an embodiment of the present application;

[0040] Figure 4 It is for an ultrasonic fingerprint recognition device according to an embodiment of the present application installed in Figure 3 The schematic cross-sectional view of the outer frame of the electronic device shown;

[0041] Figure 5 It is for another ultrasonic fingerprint recognition device according to an embodiment of the present application installed in Figure 3 The schematic cross-sectional view of the outer frame of the electronic device shown;

[0042] Figure 6 It is a schematic cross-sectional view of another outer frame of the electronic device according to an embodiment of the present application;

[0043] Figure 7 It is for an ultrasonic fingerprint recognition device according to an embodiment of the present application installed in Figure 6 The schematic cross-sectional view of the outer frame of the electronic device shown;

[0044] Figure 8 It is for another ultrasonic fingerprint recognition device according to an embodiment of the present application installed in Figure 6 The schematic cross-sectional view of the outer frame of the electronic device shown;

[0045] Figure 9 It is a schematic cross-sectional view of another outer frame of the electronic device in which an ultrasonic fingerprint recognition device according to an embodiment of the present application is installed. Detailed implementation manners

[0046] To make the objectives, technical solutions and advantages of the present application clearer, the following will use examples to elaborate on some embodiments of the present application in detail with reference to the accompanying drawings. However, those of ordinary skill in the art can understand that in each example, many technical details are provided to help readers better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.

[0047] The basic principle of ultrasonic in-screen fingerprint recognition is as follows: The ultrasonic sensor is installed under the screen. The ultrasonic waves it emits pass through the screen and reach the surface of the finger, and the finger fingerprint reflects the ultrasonic waves. Since the valleys and ridges of the fingerprint reflect ultrasonic waves differently, the reflected echo passes through the screen and is received by the ultrasonic sensor. The fingerprint image can be obtained according to the difference in the echo.

[0048] An embodiment of the present application provides an ultrasonic fingerprint recognition device. Figure 1 FIG. Figure 1 is a schematic cross-sectional view of the ultrasonic fingerprint recognition device provided by the embodiment of the present application. The ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The circuit board 102 is electrically connected to the processing unit of the electronic device. The ultrasonic sensor 101 is configured to transmit an ultrasonic signal and receive the ultrasonic signal that is reflected and transmitted through the outer frame of the electronic device, and is further configured to convert the received ultrasonic signal into an electrical signal and send the electrical signal to the processing unit of the electronic device through the circuit board 102. In this embodiment, the ultrasonic sensor 101 and the circuit board 102 are electrically connected through a bonding wire 103.

[0049] Compared with Figure 1 the ultrasonic sensor shown in FIG. Figure 1 , in this embodiment, a bonding wire may not be used to connect the circuit board and the ultrasonic sensor. As shown in Figure 2 FIG. Figure 2 , the ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The pad portion 12 of the ultrasonic sensor 101 is electrically connected to a flexible circuit board 102, and the flexible circuit board 102 is used to connect to an external circuit. In this embodiment, the electrical connection area of the flexible circuit board 102 also includes pads. The pad portion 12 of the ultrasonic sensor 101 and the electrical connection area of the flexible circuit board 102 can be electrically connected through a conductive adhesive 1031. Optionally, the pad portion 12 of the ultrasonic sensor 101 and the electrical connection area of the flexible circuit board 102 are electrically connected by using an ACF (Anisotropic Conductive Film) adhesive 1031 through an ACF pressing process. The ultrasonic sensor 101 and the flexible circuit board 102 are bonded through the ACF adhesive 1031 to make electrical conduction. At the same time, the ACF adhesive 1031 itself has adhesiveness, so that the ultrasonic sensor 101 and the flexible circuit board 102 are bonded together. Using Figure 1 the bonding wire scheme in FIG. Figure 1 is easy to process and has good structural stability, while using the ACF adhesive scheme does not need to consider the problem of bonding wire fixation.

[0050] In the above embodiment, the circuit board is electrically connected to the processing unit in the electronic device. The circuit board includes a flexible circuit board, and the circuit board is configured to transmit an electrical signal to the processing unit of the electronic device. The processing unit performs fingerprint recognition and anti-counterfeiting recognition according to the electrical signal.

[0051] Figure 3It is a schematic cross-sectional view of the outer frame of the electronic device provided by the embodiment of the present application. The electronic device has four outer frames, which are composed of two opposite long outer frames and two opposite short outer frames. The outer frame 300 of the electronic device is recessed towards the inside of the electronic device to form a first groove structure 305. The mobile phone frames 3000 and 3001 are the short outer frames of the mobile phone, and the outer frame 300 of the mobile phone is one of the long outer frames of the mobile phone (the other long outer frame opposite to the long outer frame 300 is not shown). As Figure 3 shown, the front surface 3052 of the first groove structure 305 is formed by the outer frame 300 of the electronic device being recessed. As Figure 4 shown, the ultrasonic sensor 301 is attached to the back surface 3051 of the first groove structure 305. The ultrasonic fingerprint recognition device includes the ultrasonic sensor 301 and the circuit board 302. The ultrasonic sensor 301 includes an adhesive layer 304. The ultrasonic sensor 301 is attached to the back surface 3051 of the first groove structure 305 through its adhesive layer 304. Since the first groove structure 305 is formed by the outer frame of the electronic device being recessed, it can play a role in reminding the user of the position where the finger presses. The user can find the position of fingerprint collection by touch. In this embodiment, the first groove structure 305 can be a square groove.

[0052] Figure 4 shown, the ultrasonic sensor shown is installed on the middle frame using a back-attachment scheme. The silicon wafer layer 3011 is attached to the back surface 3051 of the first groove structure 305 through the adhesive layer 304, and the silicon wafer layer 3011 is electrically connected to the circuit board 302 through the bonding wire 303. In this embodiment, the circuit board 302 can also be fixed to the outer frame 300 by using a first fixing part 309. The first fixing part 309 is attached to the back surface of the outer frame 300 to fix the circuit board 302, and the front surface 3052 of the first groove structure 305 is used to provide a pressing surface.

[0053] It should be noted that the ultrasonic sensor can also be installed on the back surface of the first groove structure 305 by using a front-attachment scheme as Figure 5 shown, that is, the acoustic layer 3012 is attached to the back surface 3051 of the first groove structure 305 through the adhesive layer 304, and the acoustic layer 3012 is disposed between the silicon wafer layer 3011 and the first groove structure 305. As Figures 3 to 5 shown, the back surface 3051 of the first groove structure 305 is flat. The front surface 3052 of the first groove structure 305 is formed by the outer frame of the long side of the electronic device being recessed. The back surface 3051 of the first groove structure 305 is flat, and there is no need to dig a groove to accommodate the ultrasonic sensor. In this way, the outer frame can maintain a certain thickness, so that the strength of the outer frame is higher. When the back surface of the first groove structure is flat, the ultrasonic sensor can be attached to the back surface of the first groove structure by using a front-attachment or back-attachment scheme.

[0054] The front - attaching solution: As Figure 5 shown, the acoustic layer 3012 is attached to the back surface of the first groove structure 305 through the bonding layer 304. Among them, the ultrasonic fingerprint recognition device further includes a first fixing part 309. The first fixing part 309 is attached to the back surface of the outer frame 300 to fix the circuit board 302. The front surface 3052 of the first groove structure 305 is used to provide a pressing surface. In this embodiment, the acoustic layer 3012 is disposed between the silicon wafer layer 3011 and the first groove structure 305. The first fixing part 309 also has a certain height such that the circuit board 302 and the silicon wafer layer 3011 are at the same level. The first fixing part 309 is used to support the circuit board 302 so that the circuit board 302 is electrically connected to the silicon wafer layer 3011. One end of the silicon wafer layer is connected to the circuit board through a bonding wire. The first fixing part is used to support the circuit board so that the electrical connection area of the circuit board and the electrical connection area of the silicon wafer layer are at the same height to facilitate connection through the bonding wire 303.

[0055] In this embodiment, the ultrasonic sensor can be attached to the back surface of the first groove structure through a front - attaching or back - attaching solution (not limited to copper - foil glue, double - sided tape, thermosetting glue) via a bonding layer. That is, in this solution, the bonding layer 304 can be glue materials such as copper - foil glue, double - sided tape, thermosetting glue. Since copper - foil glue can achieve better acoustic impedance matching, the bonding layer can preferably be copper - foil glue. The copper - foil glue includes a copper - foil layer and glue layers disposed on the upper and lower surfaces of the copper - foil layer.

[0056] In this embodiment, compared with the back - attaching solution, in the front - attaching solution, the distance between the acoustic layer and the finger is closer. Therefore, the fingerprint data collected using the front - attaching solution is more accurate.

[0057] Based on the content disclosed in the above - mentioned embodiment, in this embodiment, Figure 6 is a schematic cross - sectional view of another outer frame of the electronic device provided by the embodiment of the present application. A second groove structure 307 is formed on the back surface 3051 of the first groove structure 305 to accommodate at least a part of the ultrasonic sensor 301. At least a part of the ultrasonic sensor 301 is disposed inside the second groove structure 307. On the one hand, it is beneficial to improve space utilization. On the other hand, it reduces the distance between the ultrasonic sensor and the pressing surface and can perform fingerprint recognition more accurately.

[0058] In this embodiment, the depth h2 of the second groove structure 307 may be equal to or less than the thickness of the ultrasonic sensor. The second groove structure 307 is specifically formed for installing the ultrasonic sensor 301, and its shape and size are suitable for placing the ultrasonic sensor. The depth of the second groove structure 307 may be equal to the thickness of the ultrasonic sensor to facilitate just accommodating the ultrasonic sensor, or the depth of the second groove structure 307 may be less than the thickness of the ultrasonic sensor to facilitate accommodating part of the ultrasonic sensor. And because the depth of the second groove structure 307 is small, the frame has a certain thickness and will not be too thin due to the existence of the first groove structure and the second groove structure. In some embodiments, the depth of the second groove structure 307 may be greater than the thickness of the ultrasonic sensor so that the ultrasonic sensor can be entirely disposed inside the second groove structure. Additionally, there is still space inside the second groove structure to accommodate other related components.

[0059] In addition, the depth h1 of the first groove structure is greater than the depth h2 of the second groove structure so that the user can better find the fingerprint recognition position by touch. Additionally, the second groove structure is not too deep to affect the strength of the outer frame. The common part 308 of the first groove structure 305 and the second groove structure 307 is a part of the frame, and it has a certain thickness to play a role in protecting the ultrasonic sensor.

[0060] In this embodiment, the bottom area of the second groove structure 307 is greater than or equal to the area of the ultrasonic sensor so that the ultrasonic sensor can be attached to the bottom surface of the second groove structure.

[0061] The attachment of the ultrasonic sensor 301 to the back surface 3051 of the first groove structure 305 includes two structures:

[0062] Positive attachment scheme: As Figure 7 shown, the acoustic layer 3012 is attached to the back surface 3051 of the first groove structure 305 through the bonding layer 304, that is, the acoustic layer 3012 is attached to the front surface 3072 of the second groove structure 307 through the bonding layer 304. One end of the silicon wafer layer 3011 is electrically connected to the circuit board 302 through the bonding wire 303, and the acoustic layer 3012 is disposed between the silicon wafer layer 3011 and the first groove structure 305. In this embodiment, the front surface 3072 of the second groove structure 307 is the back surface 3051 of the first groove structure 305.

[0063] Back attachment scheme: As Figure 8 shown, the silicon wafer layer 3011 is attached to the back surface 3051 of the first groove structure 305 through the bonding layer 304. One end of the silicon wafer layer 3011 is electrically connected to the circuit board 302 through the bonding wire 303, and the silicon wafer layer 3011 is disposed between the acoustic layer 3012 and the first groove structure 305.

[0064] In this embodiment, compared with the back - sticking scheme, the distance between the acoustic layer and the finger in the front - sticking scheme is closer. Therefore, the fingerprint data collected using the front - sticking scheme is more accurate. In addition, since the second groove structure is used to accommodate the ultrasonic fingerprint sensor, the distance between the ultrasonic fingerprint sensor and the fingerprint acquisition surface is reduced, which can significantly improve the accuracy of fingerprint acquisition.

[0065] Based on the content disclosed in the above - mentioned embodiment, in this embodiment, the front surface 3052 of the first groove structure 305 provides a pressing surface for contacting the user's finger. In order to improve the waterproof level of the electronic device, there is no air gap between the first groove structure and the outer frame.

[0066] In order to prevent water vapor from entering the ultrasonic sensor and thus affecting fingerprint recognition, and at the same time to save process steps and facilitate processing, the first groove structure is formed by recessing the outer frame of the electronic device through integral molding. The first groove structure and the outer frame are made of the same material for easy processing, and the outer frame is plastic or metal.

[0067] Based on the content disclosed in the above - mentioned embodiment, in this embodiment, the materials of the outer frame and the first groove structure can be different. When the outer frame is plastic, the first groove structure is metal, or when the first groove structure is metal, the outer frame is plastic. Since the materials of the first groove structure and the outer frame are different, this can enable users to easily distinguish the position of the first groove structure with the naked eye, so as to play a role in reminding users of the pressing position. In this embodiment, the outer frame can be made of plastic, hardware, glass, ceramic, etc. The surface of the outer frame can be processed by processes such as vacuum plating, vacuum matte, spraying, and material polishing.

[0068] Based on the content disclosed in the above - mentioned embodiment, in this embodiment, as Figure 3 and Figure 6 shown, the depth h1 of the first groove structure is not less than 0.5 mm and not more than 2 mm. Setting the depth of the first groove structure between 0.5 mm and 2 mm can not only prevent the strength of the outer frame from being reduced due to the too - deep depth of the first groove structure, but also prevent the fingerprint acquisition position from being difficult for users to detect due to the too - shallow depth of the first groove structure.

[0069] Based on the content disclosed in the above - mentioned embodiment, in this embodiment, as Figure 4 shown, the front surface 3052 of the first groove structure 305 is a plane, and the front surface 3052 is perpendicular to the display screen of the electronic device. The first groove structure has two opposite side surfaces, and the two side surfaces are respectively along two opposite side surfaces of the outer frame. The two side surfaces 3055 and 3056 can be vertical side surfaces, that is, the two side surfaces 3055 and 3056 are perpendicular to the front surface 3052 of the first groove structure, and the first groove structure 305 is a cubic groove.

[0070] Based on the content disclosed in the above embodiments, in this embodiment, Figure 9 is a schematic cross-sectional view of another outer frame of the electronic device where the ultrasonic fingerprint recognition device is installed. As Figure 9 shown, the first groove structure forms a chamfer structure on the frame of the electronic device. That is to say, two opposite side surfaces 3053 and 3054 of the first groove structure form a chamfer structure, that is, a chamfer structure is formed on two opposite side surfaces 3053 and 3054 of the first groove structure along the outer frame. When the front surface 3052 of the first groove structure 305 is a plane, it is more conducive to the acquisition of fingerprint recognition signals. When chamfer structures are formed on two opposite side surfaces 3053 and 3054 of the first groove structure 305 along the outer frame, the stains at the chamfers are easier to clean.

[0071] The ultrasonic fingerprint recognition device further includes a reinforcing member for fixing the ultrasonic sensor. The acoustic layer or the silicon wafer layer is fixed to the reinforcing member through a fixing layer, and the reinforcing member can be a steel plate.

[0072] Based on the content disclosed in the above embodiments, in this embodiment, a silk screen is provided on the front surface of the first groove structure, and the silk screen is a fingerprint pattern to facilitate the user to quickly locate the fingerprint acquisition area and further improve the user experience.

[0073] Based on the content disclosed in the above embodiments, in this embodiment, the first groove structure can also be a physical button, and the front surface of the first groove structure is used to provide the pressing surface of the physical button. As Figure 4 shown, a button module can be provided below the fingerprint sensor to implement the function of the physical button. As Figure 7 shown, the ultrasonic sensor can be entirely arranged in the second groove structure. The depth of the second groove structure is greater than the thickness of the ultrasonic sensor. A button module can also be provided below the ultrasonic sensor, and the button module can also be arranged in the second groove structure, that is, the depth of the second groove structure is greater than or equal to the sum of the thickness of the ultrasonic sensor and the thickness of the button module.

[0074] Based on the content disclosed in the above embodiments, this embodiment further provides an electronic device for fingerprint recognition. For example, it includes the ultrasonic fingerprint recognition device and the outer frame in the above embodiments.

[0075] It should be understood that in the embodiments of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A. B can also be determined according to A and / or other information.

[0076] In addition, the term "and / or" in this document is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent three cases: A exists alone, both A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects before and after are in an "or" relationship.

[0077] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed in this document can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0078] Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0079] In several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be in an electrical, mechanical, or other form.

[0080] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0081] In addition, the functional units in each embodiment of this application can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0082] When the above-mentioned functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of this application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0083] As described above, the above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of changes or substitutions, which should all be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. An ultrasonic fingerprint recognition device installed in an electronic device, characterized in that: The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board; The circuit board is electrically connected to the processing unit of the electronic device; The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the outer frame of the electronic device, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board; The ultrasonic sensor is attached to the back side of the first groove structure, and the front side of the first groove structure is formed by being recessed into the outer frame of the electronic device.

2. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; The ultrasonic sensor further includes an adhesive layer, the acoustic layer or the silicon sheet layer is attached to the back side of the first groove structure through the adhesive layer, and the adhesive layer is copper foil adhesive; The front side of the first groove structure provides a pressing surface for contacting a user's finger; there is no air gap between the first groove structure and the outer frame; The ultrasonic fingerprint recognition device further includes a first fixing portion, through which the circuit board is fixed to the outer frame, and the first fixing portion is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; One end of the silicon wafer layer is connected to the circuit board through a binding wire, and the first fixing portion is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or, One end of the silicon wafer layer is connected to the circuit board through ACF glue.

3. The ultrasonic fingerprint recognition device according to claim 2, characterized in that: A second groove structure is formed on the back side of the first groove structure for accommodating at least a portion of the ultrasonic sensor.

4. The ultrasonic fingerprint recognition device according to claim 3, characterized in that: The depth of the second groove structure is less than or equal to the thickness of the ultrasonic sensor; and the bottom area of ​​the second groove structure is greater than or equal to the area of ​​the ultrasonic sensor.

5. The ultrasonic fingerprint recognition device according to claim 3, characterized in that: The acoustic layer is attached to the inside of the second groove structure, and the acoustic layer is arranged between the silicon sheet layer and the first groove structure; or The silicon sheet layer is attached to the inside of the second groove structure, and the silicon sheet layer is arranged between the acoustic layer and the first groove structure.

6. The ultrasonic fingerprint recognition device according to claim 2, characterized in that: The back surface of the first groove structure is flat; The ultrasonic sensor attached to the back side of the first groove structure includes: The acoustic layer is attached to the back side of the first groove structure, and the acoustic layer is arranged between the silicon wafer layer and the first groove structure; or The silicon sheet layer is attached to the back side of the first groove structure, and the silicon sheet layer is arranged between the acoustic layer and the first groove structure.

7. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The first groove structure is made of the same material as the outer frame, and the outer frame is made of plastic or metal; The first groove structure is formed by the outer frame of the electronic device being recessed through integral molding, or The first groove structure is a physical key, and the front side of the first groove structure is used to provide a pressing surface for the physical key.

8. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The outer frame is made of a different material from that of the first groove structure, and the outer frame is made of plastic or metal; The first groove structure is a physical key, and the front side of the first groove structure is used to provide a pressing surface for the physical key.

9. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The depth of the first groove structure is not less than 0.5 mm and not more than 2 mm.

10. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The front side of the first groove structure is a plane, and the front side of the first groove structure is perpendicular to the display screen of the electronic device; The front side of the first groove is provided with a silk screen, and the silk screen is a fingerprint pattern; The first groove structure has two side surfaces, and the two side surfaces are two opposite side surfaces along the outer frame; The two side surfaces of the first groove structure form chamfered structures; or The two side surfaces of the first groove structure are side surfaces perpendicular to the front surface of the first groove structure.

11. An electronic device for fingerprint recognition, characterized in that: It comprises the ultrasonic fingerprint recognition device according to any one of claims 1 to 10 and the outer frame.

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