Light-emitting substrate and display panel

Abstract

The utility model provides a light-emitting substrate and a display panel, the light-emitting substrate comprises a driving backboard and a plurality of LED chips bound on the driving backboard, a gap is arranged between adjacent LED chips, a dimming layer is arranged at one side, far away from the driving backboard, of the LED chips, light emitted by the LED chips passes through the dimming layer and then converges towards the central axis of the LED chips, and the light emitted by the LED chips passes through the driving backboard and then converges towards the central axis of the LED chips. The problem that a light mixing area is generated due to the fact that light emitted by a certain LED chip irradiates the adjacent LED chip is avoided, the light leakage phenomenon is avoided, and the problem that the light leakage phenomenon exists in an existing mini LED display panel is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of display, in particular to a light-emitting substrate and a display panel. Background Art

[0002] Compared with OLED (Organic Light emitting Display), miniLED (mini Light Emitting Diode) has the advantages of higher stability and brightness as an inorganic LED. For a mini LED display panel, due to the relatively small distance between mini LED chips, a light mixing area is likely to be generated between the mini LED chips, and light leakage occurs. Summary of the Utility Model

[0003] The utility model provides a light-emitting substrate and a display panel to alleviate the technical problem of light leakage in the existing mini LED display panel.

[0004] To solve the above problems, the technical solutions provided by the utility model are as follows:

[0005] An embodiment of the utility model provides a light-emitting substrate, which includes:

[0006] A driving backplane;

[0007] A plurality of LED chips, bonded to the driving backplane, and there is a gap between adjacent LED chips; and

[0008] A dimming layer, disposed on a side of the LED chip away from the driving backplane;

[0009] Wherein, the light emitted by the LED chip converges towards the central axis of the LED chip after passing through the dimming layer.

[0010] In the light-emitting substrate provided by the embodiment of the utility model, the dimming layer includes a plurality of first openings penetrating through the dimming layer, and each first opening corresponds to at least one LED chip.

[0011] In the light-emitting substrate provided by the embodiment of the utility model, each first opening corresponds to one LED chip, and the shape of the first opening matches the shape of the LED chip.

[0012] In the light-emitting substrate provided by the embodiment of the utility model, each first opening corresponds to three LED chips, and the three LED chips include a first color LED chip, a second color LED chip, and a third color LED chip.

[0013] In the light-emitting substrate provided by the embodiment of the present utility model, the light-adjusting layer further includes a plurality of light-adjusting parts, the first opening is located between adjacent light-adjusting parts, and the light-adjusting parts are arranged corresponding to the gaps between the LED chips.

[0014] In the light-emitting substrate provided by the embodiment of the present utility model, the size of the light-adjusting part is smaller than the size of the gap between the LED chips.

[0015] In the light-emitting substrate provided by the embodiment of the present utility model, a blocking part is arranged in the gap between the LED chips, and the light-adjusting part is arranged corresponding to the blocking part.

[0016] In the light-emitting substrate provided by the embodiment of the present utility model, the height of the blocking part is greater than or equal to the height of the LED chip.

[0017] In the light-emitting substrate provided by the embodiment of the present utility model, the shape of the first opening includes one of a square hole, a circular hole, and a special-shaped hole.

[0018] The embodiment of the present utility model further provides a display panel, which includes a color filter substrate and the light-emitting substrate of any one of the foregoing embodiments, and the color filter substrate is arranged in the light-emitting direction of the light-emitting substrate.

[0019] The beneficial effects of the present utility model are as follows: In the light-emitting substrate and the display panel provided by the present utility model, the light-emitting substrate includes a driving backplane and a plurality of LED chips bonded to the driving backplane. There is a gap between adjacent LED chips. The light-adjusting layer is arranged on the side of the LED chips away from the driving backplane. After the light emitted by the LED chips passes through the light-adjusting layer, it converges towards the central axis of the LED chips, so as to avoid the light emitted by a certain LED chip from irradiating the adjacent LED chip and causing a light mixing area, thereby avoiding the phenomenon of light leakage, and solving the problem of light leakage in the existing mini-LED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic optical path diagram of the light-emitting substrate provided by the embodiment of the present utility model.

[0022] Figure 2 For Figure 1 The top view structural diagram of the light-adjusting layer in

[0023] Figure 3 This is a schematic cross-sectional structure diagram of a light-emitting substrate provided by an embodiment of the present invention.

[0024] Figure 4 This is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention. Detailed implementation manners

[0025] The descriptions of the following embodiments refer to the attached drawings, which are used to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for explaining and understanding the present invention, rather than for limiting the present invention. In the drawings, similar units are denoted by the same reference numerals. In the drawings, for clear understanding and easy description, the heights of some layers and regions are exaggerated. That is, the sizes and heights of each component shown in the drawings are arbitrarily shown, but the present invention is not limited thereto.

[0026] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic optical path diagram of a light-emitting substrate provided by an embodiment of the present invention. Figure 2 is Figure 1 a top-view structure diagram of the light-dimming layer in Figure 1 . Referring to

[0027] The LED chip 20 includes a mini LED chip. The mini LED chip is usually first fabricated on a transfer substrate and then transferred onto the driving backplane 10 and bonded to the driving backplane 10. A pixel driving circuit (not shown in the figure) is provided on the driving backplane 10. Each LED chip 20 can be electrically connected to a pixel driving circuit correspondingly, so that each LED chip 20 can emit light independently.

[0028] The dimming layer 30 includes a plurality of first openings 31 penetrating the dimming layer 30, and the first openings 31 on the dimming layer 30 can be formed by punching holes in the dimming layer 30. Each of the first openings 31 corresponds to at least one of the LED chips 20, so as to avoid the influence of the dimming layer 30 on the light emission of the LED chips 20, reduce the light loss of the LED chips 20, and improve the light extraction efficiency of the LED chips 20.

[0029] Optionally, each of the first openings 31 corresponds to three of the LED chips 20. The three LED chips 20 include a first-color LED chip 21, a second-color LED chip 22, and a third-color LED chip 23. The first-color LED chip 21 can emit red light, the second-color LED chip 22 can emit green light, and the third-color LED chip 23 can emit blue light. Thus, the light-emitting substrate 100 can emit light of three primary colors, red, green, and blue, to achieve full-color display.

[0030] The dimming layer 30 further includes a plurality of dimming portions 32. The first openings 31 are located between adjacent dimming portions 32, and the dimming portions 32 are disposed corresponding to the gaps 201 between the LED chips 20. The size of the dimming portion 32 is smaller than the size of the gap 201 between the LED chips 20, that is, the orthographic projection of the dimming portion 32 on the driving backplane 10 falls within the orthographic projection of the gap 201 between the LED chips 20 on the driving backplane 10, so as to avoid the influence of the dimming portion 32 on the light emission of the LED chips 20. Wherein, the size of the dimming portion 32 refers to the thickness between two adjacent first openings 31 in a direction parallel to the plane where the driving backplane 10 is located. Correspondingly, the size of the gap 201 between the LED chips 20 refers to the spacing distance between two adjacent LED chips 20.

[0031] The light emitted by the LED chips 20 includes large-angle light A. When the large-angle light A irradiates the dimming portion 32 of the dimming layer 30, the dimming portion 32 will change the transmission direction of the large-angle light A, so that after the large-angle light A passes through the dimming portion 32, it exits as exit light A'. The exit light A' converges towards the central axis P-P' of the corresponding LED chip 20, so as to avoid the light emitted by the LED chips 20 from irradiating the adjacent LED chips 20 and causing a light mixing area, thereby avoiding the occurrence of light leakage, and solving the problem of light leakage in the existing mini-LED display panel. Wherein, the central axis P-P' of the LED chip 20 refers to a straight line perpendicular to the driving backplane 10 and located at the center of the LED chip 20.

[0032] Optionally, the shape of the first opening 31 includes one of a square hole, a circular hole, and a special-shaped hole, but the present invention is not limited thereto. The shape of the first opening 31 of the present invention can be determined according to the specifications of the LED chip 20. In this embodiment, the first opening 31 is taken as an example of a circle for illustration, as Figure 2 shown.

[0033] In one embodiment, please refer to Figures 1 to 3 , Figure 3 which is a schematic cross-sectional structure diagram of a light-emitting substrate provided by an embodiment of the present invention. Different from the above embodiment, in the light-emitting substrate 101 of this embodiment, each first opening 31 corresponds to one LED chip 20, and the shape of the first opening 31 matches the shape of the LED chip 20 to further affect the light emission between adjacent LED chips 20, thereby further improving the light leakage problem.

[0034] It should be noted that in addition to the front light emission of each LED chip 20, there is also side light emission, and the side light emission will cause light crosstalk between adjacent LED chips 20. Among them, the front light emission of the LED chip 20 refers to the light emitted from the light-emitting surface of the LED chip 20 facing the dimming layer 30, and the side light emission of the LED chip 20 refers to the light emitted from the opposite light-emitting surfaces of two adjacent LED chips 20.

[0035] To avoid the side light crosstalk problem of the LED chip 20, a blocking portion 40 is provided in the gap 201 between the LED chips 20, and the dimming portion 32 is correspondingly arranged with the blocking portion 40. The material of the blocking portion 40 includes at least one of light-shielding materials such as black glue, gray glue, and black ink. By preparing the light-shielding material in the interval between the LED chips 20, the light-shielding material can block part of the side light emission of the LED chip 20 and prevent the side light emission from entering the adjacent LED chip 20, thereby avoiding the side light crosstalk phenomenon of the LED chip 20 and improving the light-emitting effect of the light-emitting substrate 101.

[0036] There are various processes for preparing the light-shielding material in the interval between the LED chips 20. For example, the ink jet print (IJP) process can be used to print the light-shielding material in the interval between the LED chips 20. However, due to process limitations, the width L3 of the blocking portion 40 will be smaller than the interval distance L4 between the LED chips 20. Or the pressing glue process can also be used to directly extrude the light-shielding material in the interval between the LED chips 20, so that the light-shielding material can fill the interval between the LED chips 20, and the width of the blocking portion 40 is equal to the distance of the gap 201 between the LED chips 20.

[0037] The height of the blocking portion 40 may be equal to or slightly greater than the height of the LED chip 20. When the height of the blocking portion 40 is slightly greater than the height of the LED chip 20, the side-emitted light of the LED chip 20 can be better blocked, avoiding the side light crosstalk of the LED chip 20.

[0038] It should be noted that the width of the blocking portion 40 refers to the thickness of the blocking portion 40 between two adjacent LED chips 20 in the direction parallel to the plane where the driving backplane 10 is located. The height of the blocking portion 40 refers to the distance that the blocking portion 40 extends beyond the driving backplane 10 in the direction perpendicular to the plane where the driving backplane 10 is located. Correspondingly, the height of the LED chip 20 refers to the distance that the LED chip 20 extends beyond the driving backplane 10 in the direction perpendicular to the plane where the driving backplane 10 is located.

[0039] Optionally, the light-emitting substrate 101 further includes a packaging layer 50 covering between the blocking portion 40 and the LED chip 20. The material of the packaging layer 50 includes transparent packaging adhesives such as OC glue. The better the light transmittance of the transparent packaging adhesive, the smaller the light loss of the emitted light of the LED chip 20. The packaging layer 50 can balance the step difference to provide a flat surface, and at the same time can also protect the LED chip 20 on the driving backplane 10 to block water, oxygen, etc. For other descriptions, please refer to the above embodiments and will not be elaborated here.

[0040] In one embodiment, the present invention further provides a display panel. Refer to Figures 1 to 4 , Figure 4 which is a schematic cross-sectional structure diagram of a display panel 1000 provided by an embodiment of the present invention. Refer to Figure 4 , the display panel 1000 includes a color filter substrate 200 and a light-emitting substrate 101 of one of the foregoing embodiments. The color filter substrate 200 is disposed in the light-emitting direction of the light-emitting substrate 101. The color filter substrate 200 can be aligned and bonded to the light-emitting substrate 101 through a transparent optical glue 70. At the same time, the transparent optical glue 70 can also be filled in the first opening 31 of the dimming layer 30 to flatten the surface of the dimming layer 30.

[0041] The color filter substrate 200 has a color filter layer 60. The color filter layer 60 includes a light-shielding layer 61. The light-shielding layer 61 is provided with a second opening 611 at a position corresponding to the LED chip 20, and the second opening 611 corresponds to the first opening 31. The color filter substrate 200 further includes a quantum dot color filter 62 located within the second opening 611. The material of the light-shielding layer 61 includes a black matrix, and the light-shielding layer 61 is correspondingly arranged with respect to the gap 201 between it and the LED chip 20. The light-shielding layer 61 is used to block the ineffective light of the LED chip 20 (i.e., the light that makes no contribution to the light output of the light-emitting substrate 100), further preventing light leakage of the display substrate.

[0042] The quantum dot color filter 62 is correspondingly arranged with respect to the LED chip 20. The quantum dot color filter 62 includes a red quantum dot color filter 621, a green quantum dot color filter 622, and a blue quantum dot color filter 623. Of course, the quantum dot color filter 62 may not include the blue quantum dot color filter 623, and only the transparent optical glue needs to be filled in the second opening 611 corresponding to the blue quantum dot color filter 623. The red quantum dot color filter 621 and the green quantum dot color filter 622 are made of red quantum dot material and green quantum dot material respectively. The particle size of the green quantum dots is smaller, and the particle size of the red quantum dots is larger. The red quantum dots emit red light when excited by light, and the green quantum dots emit green light when excited by light. Quantum dot materials have advantages such as high luminous efficiency, high color purity, and wide color gamut. Therefore, using quantum dot materials as color filters can provide a more vivid color display for the display panel 1000100.

[0043] At this time, the LED chip 20 can be an LED chip 20 of the same color, such as a blue LED chip 20, for emitting blue light. The blue LED chip 20 is easier to manufacture, and the energy of blue light is high, making it easier to excite the red quantum dot material and the green quantum dot material to emit red light and green light respectively, and it is easier to achieve full-color display. The blue light emitted by the LED chip 20 is converted into red light after passing through the red quantum dot color filter 621, and the blue light emitted by the LED chip 20 is converted into green light after passing through the green quantum dot color filter 622. The blue light emitted by the LED chip 20 can directly pass through the second opening 611 provided with the transparent optical glue. In this way, the blue light emitted by the LED chip 20 can emit red, green, and blue primary colors of light after passing through the color filter substrate 200 to achieve full-color display.

[0044] According to the above embodiments, it can be known that:

[0045] In a light-emitting substrate and a display panel provided by the present utility model, the light-emitting substrate includes a driving backplane and a plurality of LED chips bonded to the driving backplane. There is a gap between adjacent LED chips. A dimming layer is disposed on a side of the LED chips away from the driving backplane. After the light emitted by the LED chips passes through the dimming layer, it converges toward the central axis of the LED chips, so as to prevent the light emitted by a certain LED chip from irradiating an adjacent LED chip and causing a light mixing area, thereby avoiding the occurrence of light leakage phenomenon, and solving the problem of light leakage in the existing mini-LED display panel.

[0046] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0047] The embodiments of the present utility model have been introduced in detail above. Specific examples are used herein to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present utility model; those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A light-emitting substrate, characterized in that, comprising: a driving backplane; a plurality of LED chips, bonded to the driving backplane, and having a gap between adjacent LED chips; and a dimming layer, disposed on a side of the LED chips away from the driving backplane, the dimming layer includes a plurality of first openings penetrating through the dimming layer, each of the first openings corresponds to three of the LED chips, the dimming layer further includes a plurality of dimming portions, the first openings are located between adjacent dimming portions, the dimming portions are disposed corresponding to the gaps between the LED chips, and a size of the dimming portions is smaller than a size of the gaps between the LED chips, a projection of the dimming portions on the driving backplane falls within a range of a projection of the gaps between the LED chips on the driving backplane; wherein, when large-angle light emitted by the LED chips passes through the dimming layer, the dimming portions are configured to change a transmission direction of the large-angle light, so that the large-angle light converges toward a central axis of the LED chips.

2. The light-emitting substrate according to claim 1, characterized in that, each of the first openings corresponding to three of the LED chips includes a first-color LED chip, a second-color LED chip, and a third-color LED chip.

3. The light-emitting substrate according to claim 1, characterized in that, a blocking portion is disposed in the gaps between the LED chips, and the dimming portions are disposed corresponding to the blocking portions.

4. The light-emitting substrate according to claim 3, characterized in that, a height of the blocking portion is greater than or equal to a height of the LED chips.

5. The light-emitting substrate according to claim 1, characterized in that, a shape of the first openings includes one of a square hole, a circular hole, and a special-shaped hole.

6. A display panel, characterized in that, comprising a color filter substrate and the light-emitting substrate according to any one of claims 1 to 5, the color filter substrate is disposed in a light-emitting direction of the light-emitting substrate.

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