PCB (Printed Circuit Board) transfer device

Abstract

The utility model discloses a PCB (printed circuit board) transfer device, which comprises a front transmission device, a stacking device, a rear transmission device and a buffer assembly which are sequentially arranged along a first direction, and the stacking device comprises a storage assembly and a driving assembly. The storage assembly comprises multiple layers of cache regions and is used for containing PCBs. The driving assembly is used for driving the storage assembly to move, so that the cache region is aligned with or separated from the front conveying device and the rear conveying device. The buffering assembly comprises a plurality of adjusting rollers. The multiple adjusting rollers are arranged at the tail end of the front conveying device. A first conical part and a second conical part are arranged at the two ends of each adjusting roller respectively. The inclined face of the first conical part and the inclined face of the second conical part are oppositely arranged and can form a transmission space. The PCB is driven by inertia of rotation of the multiple adjusting rollers and under the inclined guiding effect of the multiple conical parts, so that the extending direction of the PCB is adjusted to be the same as the conveying direction.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, and particularly relates to a PCB board transfer device. Background Art

[0002] A PCB is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. During the processing process, a conveying device is required to convey it to complete the processing process.

[0003] In the prior art, for a PCB board conveying device capable of stacking and storing, when the PCB board is transported over a long distance, there will be a certain position offset. During subsequent stacking, storing, and transmission, it may cause the PCB board to jam, affecting the overall yield. In addition, when the PCB board is stacked and stored, there is a lack of a buffer component, and it is in direct mechanical contact with the storage component, which may cause scratches on the bottom of the PCB board. Summary of the Utility Model

[0004] To overcome the above-mentioned drawbacks, the purpose of the utility model is to provide a PCB board transfer device to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is a PCB board transfer device, including:

[0006] A front transfer device, a stacking storage device, and a rear transfer device, which are arranged in sequence along a first direction and are used to transfer the PCB board along the first direction.

[0007] The stacking storage device includes a storage component and a driving component. The storage component includes multiple buffer areas arranged at intervals along a second direction and is used to place the PCB board. The driving component is used to drive the storage component to move along the second direction so that the buffer area is aligned with or separated from the front transfer device and the rear transfer device.

[0008] A buffer component, including a plurality of adjusting roller wheels. The plurality of adjusting roller wheels are arranged at the end of the front transfer device. Each adjusting roller wheel extends along a third direction, and a first tapered portion and a second tapered portion are respectively arranged at both ends. The first direction, the second direction, and the third direction are perpendicular to each other. The inclined surfaces of the first tapered portion and the second tapered portion are arranged opposite to each other and can form a transmission space.

[0009] The PCB board transfer device provided by the present utility model stacks and stores the PCB boards on the transmission line through the setting of a stacking device, and multiple PCB boards can be stored in the multi-layer buffer area. In addition, in the present application, at the end of the pre-transmission device, that is, at the position before the PCB board enters the stacking device, multiple adjusting rollers are provided. A bearing space is formed by the first tapered portion and the second tapered portion at both ends of each adjusting roller. For a PCB board whose extending direction is the same as the transmission direction, when it reaches the multiple adjusting rollers, the PCB board abuts against the first tapered portion and the second tapered portion, and continues to be transmitted as the adjusting roller rotates, and finally enters the stacking device; for a PCB board whose extending direction is inclined to the transmission direction, when it reaches the multiple adjusting rollers, one end of the PCB board is at a high position in a certain tapered portion, and the other end is at a low position in another tapered portion. Under the inertial drive of the rotation of the multiple adjusting rollers and the inclined guiding action of the multiple tapered portions, the PCB board is adjusted to have an extending direction the same as the transmission direction.

[0010] In some embodiments, the multiple adjusting rollers are synchronously driven to rotate by the pre-transmission device. The first tapered portion and the second tapered portion have the same size, both extend along the third direction, and are oppositely arranged. The first tapered portion is provided with a first step portion away from the second tapered portion, and the second tapered portion is provided with a second step portion away from the first tapered portion.

[0011] Adopting the above technical solution, the multiple adjusting rollers are synchronously driven with the pre-transmission device, that is, their transmission speeds are the same. If the transmission speed of the adjusting rollers is less than the transmission speed of the pre-transmission device, PCB board stacking may occur, resulting in safety problems; if the transmission speed of the adjusting rollers is greater than the transmission speed of the pre-transmission device, the contact time between the PCB board and the tapered portion will be reduced, affecting the position calibration of the PCB board.

[0012] In some embodiments, the storage component includes a first side plate and a second side plate spaced along the third direction. The first side plate supports the multi-layer component along the third direction, and the second side plate is provided with the multi-layer support component corresponding to the position of the first side plate. Each layer of the support components corresponding to each other along the third direction can form the buffer area.

[0013] In some embodiments, each layer of the support component includes multiple material supporting brackets. The multiple material supporting brackets are spaced along the first direction. Each material supporting bracket includes an extending section that extends along the third direction and is used to carry the PCB board.

[0014] With the above technical solution, the multi-layer buffer area is formed by multi-layer support components correspondingly arranged inside the first side plate and the second side plate. Each layer of the buffer area supports the PCB board through a plurality of material supporting brackets at both ends along the third direction. After the PCB board is stored in the topmost buffer area, the driving component drives the first side plate and the second side plate to move upward, so that the next layer of the buffer area corresponds to the front transfer device and the rear transfer device, and the PCB board is transferred. And so on, until the multi-layer buffer area is filled or emptied.

[0015] In some embodiments, the buffer component further includes an elastic abutting component. The elastic abutting component is arranged above the multi-layer support component and includes a plurality of elastic guide columns. The plurality of elastic guide columns are arranged at intervals along the first direction. Each elastic guide column extends along the third direction and is arranged between adjacent material supporting brackets.

[0016] With the above technical solution, the elastic abutting component is used to buffer the placement of the PCB board into the buffer area. The elastic abutting component is arranged above the multi-layer support component. After the PCB board enters the stacking device, it is supported by the elastic guide columns. Subsequently, the driving component drives the first side plate and the second side plate to move upward, and a plurality of material supporting brackets contact the PCB board and continue to lift it upward.

[0017] In some embodiments, along the first direction, the front transfer device, the rear transfer device, and the elastic abutting component are located on the same transfer plane.

[0018] In some embodiments, the driving component includes a telescopic cylinder, a first fixing plate, a second fixing plate, and a plurality of telescopic guide columns. The second fixing plate and the first fixing plate are sequentially arranged at intervals along the second direction below the storage component. The telescopic cylinder is arranged at the bottom of the first fixing plate and is connected to the second fixing plate through a telescopic end. The plurality of telescopic guide columns extend along the second direction and are respectively connected to the first side plate and the first fixing plate, and the second side plate and the first fixing plate, and are used to drive the first side plate and the second side plate to move up and down relative to the second fixing plate through the telescopic movement of the telescopic cylinder.

[0019] In some embodiments, each adjusting roller includes a plurality of rubber rings. The plurality of rubber rings protrude at intervals along the third direction between the first conical portion and the second conical portion.

[0020] With the above technical solution, the rubber rings protrude at intervals between the first conical portion and the second conical portion and are used for elastic protection of the PCB board. Description of the Drawings

[0021] Figure 1This is a schematic structural diagram of an embodiment of a PCB board transfer device of the present utility model;

[0022] In the figure:

[0023] 1 - PCB board transfer device; 20 - front transfer device; 21 - rear transfer device; 3 - stacking device; 30 - storage component; 31 - first side plate; 32 - second side plate; 33 - support component; 34 - material supporting bracket; 35 - extension section; 4 - buffer component; 40 - adjusting roller; 41 - first conical part; 42 - first step part; 43 - second conical part; 44 - rubber ring; 45 - elastic abutting component; 46 - elastic guide post; 5 - driving component; 50 - telescopic cylinder; 51 - first fixing plate; 52 - second fixing plate; 53 - telescopic guide post. Specific embodiments

[0024] The following elaborates on the preferred embodiments of the present utility model in conjunction with the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making the protection scope of the present utility model more clearly defined.

[0025] Refer to Figure 1 , Figure 1 which shows a schematic structural diagram of a PCB board transfer device 1 provided by an embodiment of the present utility model.

[0026] As Figure 1 shown, the technical solution adopted by the present utility model is a PCB board transfer device 1, including a front transfer device 20, a stacking device 3, a rear transfer device 21, and a buffer component 4, wherein:

[0027] The front transfer device 20, the stacking device 3, and the rear transfer device 21 are arranged in sequence along the first direction ( Figure 1 shown as the X direction in

[0028] ), and are used for transferring the PCB board along the first direction. Figure 1 The stacking device 3 includes a storage component 30 and a driving component 5. The storage component 30 includes multiple buffer areas arranged at intervals along the second direction (

[0029] shown as the Z direction in Figure 1It extends along the Y direction as shown in the figure, with a first tapered portion 41 and a second tapered portion 43 provided at both ends respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The inclined surfaces of the first tapered portion 41 and the second tapered portion 43 are arranged opposite to each other and can form a transmission space.

[0030] For the PCB board transfer device 1 provided in this application, by setting the stacking device 3, the PCB boards on the transmission line are stacked and stored, and multiple PCB boards can be stored in the multi-layer buffer area. In addition, at the end of the pre-transmission device 20 in this application, that is, at the position before the PCB board enters the stacking device 3, multiple adjusting rollers 40 are provided. The first tapered portion 41 and the second tapered portion 43 at both ends of each adjusting roller 40 form a bearing space. For the PCB board whose extending direction is the same as the transmission direction, when it reaches the multiple adjusting rollers 40, the PCB board abuts against the first tapered portion 41 and the second tapered portion 43, and continues to be transmitted as the adjusting roller 40 rotates, and finally enters the stacking device 3; for the PCB board whose extending direction is inclined to the transmission direction, when it reaches the multiple adjusting rollers 40, one end of the PCB board is at a high position in a certain tapered portion, and the other end is at a low position in the other tapered portion. Under the inertial drive of the rotation of the multiple adjusting rollers 40 and the inclined guiding action of the multiple tapered portions, the PCB board is adjusted so that its extending direction is the same as the transmission direction.

[0031] In some embodiments, referring to Figure 1 , the multiple adjusting rollers 40 are synchronously driven to rotate by the pre-transmission device 20. The first tapered portion 41 and the second tapered portion 43 have the same size, both extend along the third direction, and are arranged opposite to each other. The first tapered portion 41 is provided with a first step portion 42 away from the second tapered portion 43, and the second tapered portion 43 is provided with a second step portion away from the first tapered portion 41.

[0032] Exemplarily, the multiple adjusting rollers 40 are synchronously driven with the pre-transmission device 20, that is, their transmission speeds are the same. If the transmission speed of the adjusting roller 40 is less than the transmission speed of the pre-transmission device 20, PCB board stacking may occur, resulting in safety problems; if the transmission speed of the adjusting roller 40 is greater than the transmission speed of the pre-transmission device 20, the contact time between the PCB board and the tapered portion will be reduced, affecting the position calibration of the PCB board.

[0033] In some embodiments, referring to Figure 1 , the storage component 30 includes a first side plate 31 and a second side plate 32 arranged at intervals along the third direction. The first side plate 31 supports the multi-layer support component 33 along the third direction, and the second side plate 32 is provided with a multi-layer support component 33 corresponding to the position of the first side plate 31. Each layer of support component 33 corresponding to the position along the third direction can form a buffer area.

[0034] In some embodiments, referring to Figure 1, each layer of the support assembly 33 includes a plurality of material supporting brackets 34. The plurality of material supporting brackets 34 are arranged at intervals in the first direction. Each material supporting bracket 34 includes an extending section 35, and the extending section 35 extends in the third direction for carrying the PCB board.

[0035] Exemplarily, the multi-layer buffer area is formed by the multi-layer support assemblies 33 correspondingly arranged within the first side plate 31 and the second side plate 32. Each layer of the buffer area supports the PCB board through a plurality of material supporting brackets 34 at both ends in the third direction. After the PCB board is stored in the topmost buffer area, the driving assembly 5 drives the first side plate 31 and the second side plate 32 to move upward, so that the next layer of the buffer area corresponds to the front transfer device 20 and the rear transfer device 21 for the transfer of the PCB board, and so on, to fill or empty the multi-layer buffer area.

[0036] In some embodiments, referring to Figure 1 , the buffer assembly 4 further includes an elastic abutting assembly 45. The elastic abutting assembly 45 is arranged above the multi-layer support assembly 33 and includes a plurality of elastic guide columns 46. The plurality of elastic guide columns 46 are arranged at intervals in the first direction. Each elastic guide column 46 extends in the third direction and is arranged between adjacent material supporting brackets 34.

[0037] Exemplarily, the elastic abutting assembly 45 is used to buffer the placement of the PCB board into the buffer area. The elastic abutting assembly 45 is arranged above the multi-layer support assembly 33. After the PCB board enters the stacking device 3, it is supported by the elastic guide columns 46. Subsequently, the driving assembly 5 drives the first side plate 31 and the second side plate 32 to move upward, and the plurality of material supporting brackets 34 come into contact with the PCB board and continue to lift it upward.

[0038] In some embodiments, along the first direction, the front transfer device 20, the rear transfer device 21, and the elastic abutting assembly 45 are located on the same transfer plane.

[0039] In some embodiments, referring to Figure 1 , the driving assembly 5 includes a telescopic cylinder 50, a first fixing plate 51, a second fixing plate 52, and a plurality of telescopic guide columns 53. The second fixing plate 52 and the first fixing plate 51 are sequentially arranged at intervals in the second direction below the storage assembly 30. The telescopic cylinder 50 is arranged at the bottom of the first fixing plate 51 and is connected to the second fixing plate 52 through its telescopic end. The plurality of telescopic guide columns 53 extend in the second direction and are respectively connected to the first side plate 31 and the first fixing plate 51, and the second side plate 32 and the first fixing plate 51, for driving the first side plate 31 and the second side plate 32 to move up and down relative to the second fixing plate 52 through the telescopic movement of the telescopic cylinder 50 via the plurality of telescopic guide columns 53.

[0040] In some embodiments, referring to Figure 1, each adjusting roller 4040 includes a plurality of rubber rings 44. The plurality of rubber rings 44 are spaced and protruded between the first tapered portion 41 and the second tapered portion 43 along the third direction.

[0041] Exemplarily, the rubber rings 44 are spaced and protruded between the first tapered portion 41 and the second tapered portion 43 for elastically protecting the PCB board.

[0042] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it. However, the protection scope of the present invention cannot be limited thereby. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A PCB board transfer device, characterized in that: include: The front transmission device, the stacking device and the rear transmission device are sequentially arranged along a first direction, and are used to transmit the PCB board along the first direction; The stacking device comprises a storage component and a driving component; the storage component comprises a plurality of buffer areas spaced apart along a second direction for placing the PCB board; the driving component is used to drive the storage component to move along the second direction so that the buffer area is aligned with or separated from the front transmission device and the rear transmission device; The buffer assembly comprises a plurality of adjustment rollers; the plurality of adjustment rollers are arranged at the end of the front transmission device; each of the adjustment rollers extends along a third direction, and a first conical portion and a second conical portion are respectively provided at both ends, and the first direction, the second direction and the third direction are perpendicular to each other; the inclined surface of the first conical portion and the inclined surface of the second conical portion are arranged opposite to each other and can form a transmission space.

2. The PCB board transfer device according to claim 1, characterized in that: The multiple adjustment rollers are synchronously driven to rotate by the front transmission device; the first conical portion and the second conical portion have the same size, both extend along the third direction, and are arranged opposite to each other; the first conical portion is provided with a first step portion away from the second conical portion, and the second conical portion is provided with a second step portion away from the first conical portion.

3. The PCB board transfer device according to claim 1, characterized in that: The storage assembly includes a first side plate and a second side plate spaced apart along the third direction; the first side plate is provided with a multi-layer support assembly along the third direction, and the second side plate is provided with a multi-layer support assembly corresponding to the position of the first side plate, and each layer of the support assembly corresponding to the position along the third direction can form the cache area.

4. The PCB board transfer device according to claim 3, characterized in that: Each layer of the support assembly includes a plurality of support brackets; the plurality of support brackets are arranged at intervals along the first direction; each of the support brackets includes an extending section, the extending section extends along the third direction and is used to carry the PCB board.

5. The PCB board transfer device according to claim 4, characterized in that: The buffer assembly also includes an elastic abutment assembly; the elastic abutment assembly is arranged above the multi-layer support assembly, and includes a plurality of elastic guide columns; the plurality of elastic guide columns are arranged at intervals along the first direction, each of the elastic guide columns extends along the third direction, and is arranged between adjacent material support brackets.

6. The PCB board transfer device according to claim 5, characterized in that: Along the first direction, the front transmission device, the rear transmission device and the elastic abutment assembly are located on the same transmission plane.

7. The PCB board transfer device according to claim 5, characterized in that: The driving assembly includes a telescopic cylinder, a first fixed plate, a second fixed plate and a plurality of telescopic guide columns; the second fixed plate and the first fixed plate are arranged in sequence below the storage assembly along the second direction; the telescopic cylinder is arranged at the bottom of the first fixed plate and is connected to the second fixed plate through a telescopic end; the plurality of telescopic guide columns extend along the second direction, respectively connecting the first side plate and the first fixed plate, the second side plate and the first fixed plate, and are used to drive the first side plate and the second side plate to perform lifting and lowering movements relative to the second fixed plate through the telescopic movement of the telescopic cylinder and the plurality of telescopic guide columns.

8. The PCB board transfer device according to claim 5, characterized in that: Each of the adjustment rollers includes a plurality of rubber rings; the plurality of rubber rings are protruded and arranged between the first tapered portion and the second tapered portion at intervals along the third direction.

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