Chip test carrier

Abstract

The utility model discloses a chip testing carrier, which relates to the technical field of chip testing, and is characterized in that the chip testing carrier comprises a carrier body, the carrier body is provided with a cavity, the cavity is internally provided with an isolation plate, the isolation plate is provided with a plurality of placing tables for placing chip bodies, the placing tables are hollow cylinders, and the chip bodies are arranged on the placing tables. A groove used for placing a chip body is formed in the placing table, a fixing mechanism used for fixing the chip body is arranged in the groove, an ejection mechanism used for ejecting the chip body out of the fixing mechanism is arranged in the placing table, and the fixing mechanism comprises four sets of clamping assemblies symmetrically arranged in the groove; each clamping assembly comprises a first spring arranged in the corresponding groove, and the ejection mechanism comprises an adsorption column arranged in the center of the placement table, so that through arrangement of the heat dissipation holes and a plurality of small fans, a chip can be effectively cooled in the chip testing process, and the situation that the temperature of the chip is too high, and the accuracy of chip testing is affected is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more specifically, it relates to a chip testing carrier. Background Art

[0002] A chip, also known as a microcircuit or integrated circuit (IC), is a technology that miniaturizes and integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) on a semiconductor material. The manufacturing of chips involves complex semiconductor processes, mainly including photolithography, etching, thin film deposition, doping, and chemical mechanical planarization, etc. Among them, photolithography technology is particularly crucial for precisely defining the positions and connections of components on a silicon wafer. With the development of technology, the integration of chips has been continuously improved, from small-scale integrated circuits (SSI) to very large-scale integrated circuits (VLSI) and even ultra-large-scale integrated circuits (ULSI). Hundreds of thousands or even millions of transistors can be accommodated on a square millimeter of a chip. This progress not only increases the functions of the chips but also significantly reduces the unit cost.

[0003] With the development of semiconductor technology, the performance and complexity of chips have been continuously increasing, and the requirements for testing accuracy and efficiency have also become higher and higher. Existing chip testing carriers often have problems such as poor heat dissipation effect and weak compatibility, which limit the testing efficiency and accuracy. In addition, after the chip testing is completed, it is difficult to take the chip out of the carrier, which causes certain trouble to the staff.

[0004] Therefore, in order to solve the above technical problems, this application proposes a chip testing carrier. Summary of the Invention

[0005] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a chip testing carrier.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A chip testing carrier, including a carrier body, a cavity is opened in the carrier body, an isolation plate is arranged in the cavity, a plurality of placement platforms for placing chip bodies are arranged on the isolation plate, the placement platforms are hollow cylindrical, grooves for placing chip bodies are opened on the placement platforms, a fixing mechanism for fixing the chip bodies is arranged in the grooves, and an ejecting mechanism for ejecting the chip bodies from the fixing mechanism is arranged in the placement platforms;

[0007] The fixing mechanism includes four groups of clamping components symmetrically arranged in the grooves, and a single clamping component includes a first spring arranged in the groove;

[0008] The ejecting mechanism includes an adsorption column arranged at the center of the placement platform, and a moving frame is arranged at the end of the adsorption column.

[0009] Further, one end of the first spring is disposed on the placement table, and the other end is provided with a fixing plate. A limiting groove is formed at the bottom of the fixing plate, and a sliding track is disposed in the limiting groove.

[0010] Further, a rack is disposed in the moving frame. One end of a second spring for ejecting the moving frame is disposed at the bottom of the moving frame, and the other end of the second spring is connected to the bottom of the placement table.

[0011] Further, the rack is engaged with a gear. One end of a connecting column is disposed at the center of the gear axis, and the other end of the connecting column is disposed on the inner wall of the placement table.

[0012] Further, a control assembly for controlling the movement of the moving frame is disposed on one side of the moving frame.

[0013] Further, the control assembly includes a sliding groove formed on one side of the placement table. A sliding column is slidably connected in the sliding groove. One end of the sliding column facing the moving frame is provided with one end of a mounting column. The other end of the mounting column is provided with a mounting disc. A third spring is sleeved outside the mounting column. One end of the third spring is disposed on the inner wall of the placement table, and the other end is disposed on the mounting disc. A limiting column is disposed on one side of the mounting disc. A card slot adapted to the shape of the limiting column is formed on the moving frame.

[0014] Further, a plurality of heat dissipation holes are formed in the isolation plate. A plurality of small fans for heat dissipation are disposed below the heat dissipation holes. The small fans are disposed at the inner bottom of the carrier body.

[0015] Compared with the prior art, the present utility model has the following beneficial effects:

[0016] 1. In the present utility model, by providing heat dissipation holes and a plurality of small fans, the chip can be effectively cooled during the chip testing process, preventing the chip temperature from being too high and affecting the accuracy of chip testing, and solving the problem of poor heat dissipation of the existing carrier in the background art;

[0017] 2. In the present utility model, by providing a control assembly and an adsorption column, the adsorption column can adsorb the chip on the surface. By pulling the sliding column, the limiting column is separated from the card slot, and then the second spring ejects the adsorption column, thereby ejecting the chip from the fixing mechanism. The advantage of this is that after the test is completed, the chip can be very easily taken out from the fixing mechanism, improving the working efficiency, and solving the problem that it is troublesome for the staff to take out the chip from the carrier in the background art. Description of the Drawings

[0018] The accompanying drawings described herein are used to provide a further understanding of the present utility model and form a part of this application. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0019] Figure 1 is a schematic structural diagram of the present utility model;

[0020] Figure 2 is a schematic structural diagram of the adsorption column in the present utility model;

[0021] Figure 3 is a schematic structural diagram of the small fan in the present utility model;

[0022] Figure 4 is a schematic structural diagram of the ejection mechanism in the present utility model;

[0023] Figure 5 is an enlarged schematic structural diagram of A in the present utility model;

[0024] Figure 6 is an enlarged schematic structural diagram of B in the present utility model.

[0025] 1, carrier body; 2, isolation plate; 3, chip body; 4, placement table; 41, adsorption column; 42, moving frame; 43, rack; 44, gear; 45, connecting column; 46, second spring; 47, card slot; 48, limiting column; 49, mounting plate; 410, sliding groove; 411, sliding column; 412, third spring; 413, mounting column; 5, first spring; 6, fixing plate; 7, small fan; 8, heat dissipation hole; 9, sliding track. Detailed implementation manners

[0026] As Figures 1-5 shown, the present utility model provides a chip test carrier, including a carrier body 1. The carrier body 1 is provided with a cavity. An isolation plate 2 is arranged in the cavity. A plurality of heat dissipation holes 8 are opened on the isolation plate 2. A plurality of small fans 7 for heat dissipation are arranged below the heat dissipation holes 8. The small fans 7 are arranged at the inner bottom of the carrier body 1. A plurality of placement tables 4 for placing the chip body 3 are arranged on the isolation plate 2. The placement table 4 is in a hollow cylindrical shape. A groove for placing the chip body 3 is opened on the placement table 4. A fixing mechanism for fixing the chip body 3 is arranged in the groove. An ejection mechanism for ejecting the chip body 3 from the fixing mechanism is arranged in the placement table 4;

[0027] The fixing mechanism includes four groups of clamping components symmetrically arranged in the groove. A single clamping component includes a first spring 5 arranged in the groove. One end of the first spring 5 is arranged on the placement table 4, and the other end is provided with a fixing plate 6. A limiting groove is opened at the bottom of the fixing plate 6, and a sliding track 9 is arranged in the limiting groove. The function of setting the fixing component here is to fix the position of the chip body 3 to prevent its position deviation from causing test errors.

[0028] The ejecting mechanism includes an adsorption column 41 arranged at the center of the placement table 4. A moving frame 42 is arranged at the end of the adsorption column 41. A rack 43 is arranged in the moving frame 42. One end of a second spring 46 for ejecting the moving frame 42 is arranged at the bottom of the moving frame 42, and the other end of the second spring 46 is connected to the bottom of the placement table 4. The rack 43 is meshed with a gear 44. One end of a connecting column 45 is arranged at the axis center of the gear 44, and the other end of the connecting column 45 is arranged on the inner wall of the placement table 4. The function of setting the ejecting mechanism here is to take out the chip body 3 from the carrier body 1.

[0029] A control component for controlling the movement of the moving frame 42 is arranged on one side of the moving frame 42. The control component includes a sliding groove 410 opened on one side of the placement table 4. A sliding column 411 is slidably connected in the sliding groove 410. One end of an installation column 413 is arranged at the end of the sliding column 411 facing the moving frame 42. The other end of the installation column 413 is provided with an installation disc 49. A third spring 412 is sleeved outside the installation column 413. One end of the third spring 412 is arranged on the inner wall of the placement table 4, and the other end is arranged on the installation disc 49. A limiting column 48 is arranged on one side of the installation disc 49, and a card slot 47 with a shape adapted to the limiting column 48 is opened on the moving frame 42.

[0030] Working principle: The staff place several chip bodies 3 in the fixing mechanism and put them into the fixing plate 6. The first spring 5 is compressed, thereby fixing the position of the chip body 3. While pressing down the chip body 3, the adsorption column 41 is pressed to move downward. The adsorption column 41 drives the moving frame 42 to move downward. Furthermore, the rack 43 in the moving frame 42 drives the gear 44 meshed with it to rotate, so that the card slot 47 on the moving frame 42 moves downward accordingly. Since the limit post 48 is on the side of the moving frame 42 at the initial state and the third spring 412 is in a compressed state at this time, when the limit post 48 moves to the card slot 47, the third spring 412 resumes deformation, and then drives the limit post 48 on the mounting plate 49 to enter the card slot 47. The sliding post 411 slides in the sliding slot 410, so that the movement of the moving frame 42 is restricted. The second spring 46 below the moving frame 42 is compressed, and then the testing work is carried out. The small blower 7 at the bottom inside the carrier body 1 blows air out from the heat dissipation holes 8 on the isolation plate 2, thereby cooling the chip and preventing its service life from being affected by high temperature during the testing process. After the testing is completed, pull the sliding post 411 outwards. Since the limit post 48 does not restrict the movement of the moving frame 42 in the card slot 47, the second spring 46 resumes deformation, and then ejects the chip, facilitating the staff to take out the chip.

[0031] The above is only the preferred embodiment of the present invention, and does not impose any form of limitation on the present invention; any ordinary technician in the industry can smoothly implement the present invention according to the illustrations in the specification and the above description; however, any slight changes, modifications and equivalent variations made by those skilled in the art within the scope of the technical solution of the present invention by using the technical content disclosed above are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications and variations made to the above embodiments based on the essential technology of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A chip testing carrier, comprising a carrier body (1), characterized in that: The carrier body (1) is provided with a cavity, an isolation plate (2) is arranged in the cavity, a plurality of placement platforms (4) for placing the chip body (3) are arranged on the isolation plate (2), the placement platform (4) is in the shape of a hollow cylinder, a groove for placing the chip body (3) is arranged on the placement platform (4), a fixing mechanism for fixing the chip body (3) is arranged in the groove, and an ejection mechanism for ejecting the chip body (3) from the fixing mechanism is arranged in the placement platform (4); The fixing mechanism comprises four groups of clamping components symmetrically arranged in the groove, and each of the clamping components comprises a first spring (5) arranged on the inner wall of the groove; The ejection mechanism comprises an adsorption column (41) arranged at the center of the placement platform (4), and a movable frame (42) is arranged at the end of the adsorption column (41).

2. A chip testing carrier according to claim 1, characterized in that: One end of the first spring (5) is arranged on the placement table (4), and the other end is provided with a fixing plate (6). A limiting groove is provided at the bottom of the fixing plate (6), and a sliding track (9) is provided in the limiting groove.

3. A chip testing carrier according to claim 1, characterized in that: A rack (43) is arranged inside the movable frame (42), one end of a second spring (46) for bouncing the movable frame (42) is arranged at the bottom of the movable frame (42), and the other end of the second spring (46) is connected to the bottom of the placement table (4).

4. A chip testing carrier according to claim 3, characterized in that: The rack (43) is meshedly connected with a gear (44), one end of a connecting column (45) is arranged at the axis of the gear (44), and the other end of the connecting column (45) is arranged on the inner wall of the placement platform (4).

5. The chip testing carrier according to claim 1, characterized in that: A control component for controlling the movement of the moving frame (42) is arranged on one side of the moving frame (42).

6. A chip testing carrier according to claim 5, characterized in that: The control component comprises a sliding groove (410) provided on one side of the placement platform (4), a sliding column (411) being slidably connected in the sliding groove (410), one end of the sliding column (411) being provided with an end of a mounting column (413) facing the moving frame (42), the other end of the mounting column (413) being provided with a mounting plate (49), a third spring (412) being sleeved on the outer side of the mounting column (413), one end of the third spring (412) being provided on the inner wall of the placement platform (4), and the other end being provided on the mounting plate (49), a limiting column (48) being provided on one side of the mounting plate (49), and a slot (47) matching the shape of the limiting column (48) being provided on the moving frame (42).

7. The chip testing carrier according to claim 1, characterized in that: The isolation plate (2) is provided with a plurality of heat dissipation holes (8), a plurality of small fans (7) for heat dissipation are arranged below the heat dissipation holes (8), and the small fans (7) are arranged at the inner bottom of the carrier body (1).

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