Chip ejecting device
By designing a chip feeding device including a chip feeding roller, a plurality of chip feeding heads and a feed driving assembly, the problem of low chip feeding efficiency in the prior art is solved, and efficient chip feeding is achieved.
Patent Information
- Application Number
- CN202422448708.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The prior art is difficult to efficiently load chips, which limits the packaging efficiency of the chip.
A chip feeding device is provided, including a chip feeding roller, a plurality of chip feeding heads and a feed driving assembly. The chip feeding roller is driven to rotate through the feeding drive assembly. The multiple chip feeding heads are arranged on the chip feeding roller for lifting the chip adsorption head on the loading roller.
It realizes efficient pushing of the chip adsorption head and improves the chip loading efficiency.
Smart Images
Figure CN222980487U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of chip packaging equipment, and more specifically, to a chip lifting device. Background Art
[0002] With the rapid development of wireless communication technology, the application fields of radio frequency (RF) chips and antennas have been continuously expanding, covering multiple industries such as mobile communication, Internet of Things, automotive electronics, and medical devices. RF chips are also widely used in logistics, warehousing, inventory management, and access control. For example, RF chips can be combined with RFID tags for item tracking and identification, enabling data reading without contact. Due to the extremely wide application range and large application volume of RF chips, higher requirements are also put forward for the packaging efficiency of RF chips.
[0003] In the prior art, during the packaging process of chips and antennas, generally, three steps of antenna preparation, chip bonding, and lamination need to be carried out separately. Among them, antenna preparation refers to the process of manufacturing an antenna on a substrate through an etching process or a die-cutting process. Chip bonding is the process of physically connecting an RF chip and an antenna. Lamination is the process of re-layout and recombination of the bonded chip and antenna in a specific layout manner. When packaging chips by separately performing the three steps of antenna preparation, chip bonding, and lamination, chip feeding is required during the chip packaging process. It is difficult for the prior art to efficiently feed chips, which limits the packaging efficiency of chips. Summary of the Utility Model
[0004] The purpose of the present application is to provide a chip lifting device, which solves the technical problem of difficult efficient feeding of chips and achieves the technical effect of efficient feeding of chips.
[0005] A chip lifting device provided by an embodiment of the present application includes a chip lifting roller, a plurality of chip lifting heads, and a lifting driving component. The lifting driving component is used to drive the chip lifting roller to rotate. The plurality of chip lifting heads are arranged on the chip lifting roller. The chip lifting roller is arranged in the feeding roller cavity of a feeding roller. The chip lifting heads are used to lift the chip suction heads on the feeding roller for sucking chips.
[0006] In a possible implementation manner, it further includes a central shaft and a lifting support. The lifting support is fixedly connected to the central shaft. The central shaft is used to support the feeding roller. The chip lifting roller is rotationally connected to the lifting support through the lifting driving component. The chip lifting roller is eccentrically arranged in the feeding roller cavity.
[0007] In another possible implementation manner, a plurality of chip lifting head groups are arranged along the length direction on the chip lifting roller. Each chip lifting head group includes a plurality of chip lifting heads evenly arranged along the circumferential direction of the chip lifting roller.
[0008] In another possible implementation, multiple chip ejector head groups are evenly arranged along the length direction of the chip ejector roller.
[0009] In another possible implementation, each chip ejector head group includes 4 to 8 chip ejector heads.
[0010] In another possible implementation, each chip ejector head group includes 6 chip ejector heads.
[0011] In another possible implementation, the chip ejector head ejects materials through electromagnetic drive or pneumatic drive.
[0012] In another possible implementation, it further includes an ejector control component. The ejector control component is electrically connected to the ejector drive component. The ejector control component is used to control the rotation angle of the ejector drive component, and the ejector control component is also used to control the lifting state of each chip ejector head group or each chip ejector head.
[0013] In another possible implementation, the cross-section of the lifting end of the chip ejector head is circular, and the diameter of the lifting end of the chip ejector head is 1 mm to 3 mm.
[0014] In another possible implementation, the distance between adjacent chip ejector head groups is 20 mm to 50 mm.
[0015] The beneficial effects of the embodiments of the present application compared with the prior art are as follows:
[0016] The embodiments of the present application provide a chip ejector device. The chip ejector device includes a chip ejector roller, multiple chip ejector heads, and an ejector drive component. The ejector drive component is used to drive the chip ejector roller to rotate. The multiple chip ejector heads are arranged on the chip ejector roller. The chip ejector roller is arranged in the loading roller cavity of the loading roller. The chip ejector head is used to lift the chip adsorption head on the loading roller for adsorbing chips. The chip ejector device in the embodiments of the present application can efficiently lift the chip adsorption head, improving the chip loading efficiency. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0018] Figure 1 It is a front view structural schematic diagram of a chip ejector device provided by an embodiment of the present application;
[0019] Figure 2 is Figure 1 a partial structural schematic diagram of part A of a chip topping device in
[0020] Figure 3 a schematic diagram of the working state of a chip topping device provided by an embodiment of the present application;
[0021] Figure 4 a structural schematic diagram of the working state of a chip topping device provided by an embodiment of the present application;
[0022] Figure 5 a side view structural schematic diagram of a chip topping device provided by an embodiment of the present application;
[0023] In the figure, 301 is the chip; 31 is the loading roller; 31a is the loading roller cavity; 311 is the chip suction head; 311a is the air guide hole; 311b is the air inlet; 311c is the air outlet; 311d is the suction port; 312 is the through hole; 33 is the chip topping device; 33a is the chip topping head group; 331 is the chip topping roller; 332 is the chip topping head; 333 is the topping driving component; 35 is the central axis; 334 is the topping support. Detailed implementation manners
[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0025] It should be noted that when a component or structure is referred to as "fixed to" or "arranged on" another component or structure, it can be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as "connected to" another component or structure, it can be directly connected to the other component or structure or indirectly connected to the other component or structure.
[0026] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.
[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.
[0028] During the process of packaging a chip, it is necessary to load the chip onto the device. However, it is difficult to efficiently load the chip in the prior art, which limits the packaging efficiency of the chip.
[0029] For the above reasons, the embodiment of this application provides a chip ejecting device. The chip ejecting device includes a chip ejecting roller, a plurality of chip ejecting heads, and an ejecting driving component. The ejecting driving component is used to drive the chip ejecting roller to rotate. The plurality of chip ejecting heads are arranged on the chip ejecting roller. The chip ejecting roller is arranged in the loading roller cavity of a loading roller. The chip ejecting heads are used to eject the chip suction head on the loading roller for sucking the chip. The chip ejecting device in the embodiment of this application can efficiently eject the chip suction head, improving the chip loading efficiency.
[0030] In some scenarios, a chip ejecting device in the embodiment of this application can be applied to eject the chip suction head for loading an RFID chip. The chip suction head is used for loading the chip, which can improve the chip loading efficiency.
[0031] The following specifically describes a chip ejecting device provided by the embodiment of this application with specific examples.
[0032] Figure 1 FIG. is a front view structural schematic diagram of a chip ejecting device provided by the embodiment of this application. As Figure 1 shown, this chip ejecting device 33 includes a chip ejecting roller 331, a plurality of chip ejecting heads 332, and an ejecting driving component 333. The ejecting driving component 333 is used to drive the chip ejecting roller 331 to rotate. The plurality of chip ejecting heads 332 are arranged on the chip ejecting roller 331. The chip ejecting roller 331 is arranged in the loading roller cavity 31a of a loading roller 31. The chip ejecting heads 332 are used to eject the chip suction head 311 on the loading roller 31 for sucking the chip.
[0033] As Figure 1 shown, in terms of structure, this chip ejecting device 33 includes a chip ejecting roller 331, a plurality of chip ejecting heads 332, and an ejecting driving component 333. The ejecting driving component 333 is used to drive the chip ejecting roller 331 to rotate so as to load the chip during the rotation of the chip ejecting roller 331.
[0034] Figure 2 For Figure 1Schematic diagram of a partial structure at position A of a chip ejecting device, as Figure 2 shown, in terms of structure, multiple chip ejecting heads 332 are provided on the chip ejecting roller 331, and during the process of the chip ejecting roller 331 being driven to rotate by the ejecting driving assembly 333, chip loading can be carried out through the chip ejecting heads 332.
[0035] During operation, the chip ejecting roller 331 is arranged in the loading roller cavity 31a of the loading roller 31. The chip ejecting roller 331 can operate within the loading roller cavity 31a of the loading roller 31. The chip ejecting head 332 is used to lift the chip adsorption head 311 for adsorbing chips on the loading roller 31, and thus chip ejecting can be carried out by driving the movement of the chip adsorption head 311.
[0036] Figure 3 Schematic diagram of the working state of a chip ejecting device provided by an embodiment of the present application, as Figure 3 shown, an air guide hole 311a is provided inside the chip adsorption head 311. The air inlet 311b and the air outlet 311c of the air guide hole 311a are both arranged on the side of the chip adsorption head 311, and the air guide hole 311a extends to the end of the chip adsorption head 311 to form an adsorption port 311d, and the adsorption port 311d is used to adsorb the chip 301.
[0037] During operation, when the chip adsorption head 311 slides to the adsorption state within the through hole 312, the air inlet 311b is blocked by the side wall of the through hole 312, and the air outlet 311c slides out of the through hole 312. The adsorption port 311d adsorbs the chip 301 through negative pressure. When the chip adsorption head 311 slides to the pressure relief state within the through hole 312, the air inlet 311b slides out of the through hole 312 for pressure relief, the air outlet 311c is blocked by the side wall of the through hole 312, and the adsorption port 311d releases the chip 301 to achieve adsorption and loading of the chip.
[0038] In terms of structure, a first limiting structure 311e and a second limiting structure 311f are respectively provided at both ends of the chip adsorption head 311, and the first limiting structure 311e and the second limiting structure 311f are used to limit the sliding stroke of the chip adsorption head 311 within the through hole 312.
[0039] The beneficial effects brought by the above implementation method are that during the process of the ejecting driving assembly driving the chip ejecting roller to rotate, chip loading is carried out through the chip ejecting head, and the chip ejecting head drives the movement of the chip adsorption head to carry out chip loading, improving the chip loading efficiency.
[0040] In some implementations, the chip ejector device of the present invention further includes a central shaft 35 and an ejector bracket 334. The ejector bracket 334 is fixedly connected to the central shaft 35. The central shaft 35 is used to support the loading roller 31. The chip ejector roller 331 is rotatably connected to the ejector bracket 334 through an ejector driving assembly 333. The chip ejector roller 331 is eccentrically arranged in the loading roller cavity 31a.
[0041] As Figure 1 shown, in terms of structure, the ejector bracket 334 is fixedly connected to the central shaft 35. The central shaft 35 is used to support the loading roller 31. A chip suction head 311 is provided on the loading roller 31, so that when the central shaft 35 fixes the loading roller 31, the ejector bracket 334 can be fixed through the central shaft 35 at the same time.
[0042] As Figure 1 shown, the chip ejector roller 331 of the present invention is rotatably connected to the ejector bracket 334 through an ejector driving assembly 333, so that the chip ejector roller 331 can be installed.
[0043] As Figure 1 shown, the chip ejector roller 331 is eccentrically arranged in the loading roller cavity 31a, and then the chip on the loading roller 31 can be lifted by the chip ejector roller 331 approaching the loading roller 31 to the chip suction head 311.
[0044] Figure 4 FIG. is a schematic structural diagram of the working state of a chip ejector device provided by an embodiment of the present application. As Figure 4 shown, the chip ejector roller 331 is eccentrically arranged in the loading roller cavity 31a to lift and load the chip suction head 311.
[0045] The beneficial effects brought by the above-mentioned implementation are that the central shaft can fix the chip ejector roller through the ejector bracket, and at the same time, the loading roller can be fixed through the central shaft.
[0046] The beneficial effects brought by the above-mentioned implementation also lie in that the chip ejector roller is eccentrically arranged in the loading roller cavity, which can reduce the volume of the chip ejector roller, improve the compactness of the device, and reduce the production cost of the device.
[0047] In some implementations, a plurality of chip ejector head groups 33a are arranged along the length direction on the chip ejector roller 331. Each chip ejector head group 33a includes a plurality of chip ejector heads 332 evenly arranged along the circumferential direction of the chip ejector roller 331.
[0048] As Figure 1 and Figure 2As shown in the figure, in terms of structure, a plurality of chip ejector head groups 33a are arranged along the length direction on the chip ejector roller 331. Each chip ejector head group 33a is a working unit for lifting the chip suction head. Each chip ejector head group 33a includes a plurality of chip ejector heads 332 evenly arranged along the circumferential direction of the chip ejector roller 331. The plurality of chip ejector heads 332 of each chip ejector head group 33a can take turns to lift the chip suction head.
[0049] The beneficial effect brought by the above implementation manner is that a plurality of chip ejector head groups are arranged along the length direction on the chip ejector roller, and the plurality of chip ejector heads of each chip ejector head group can take turns to lift the chip suction head, improving the chip lifting efficiency.
[0050] In some implementation manners, a plurality of chip ejector head groups 33a are evenly arranged along the length direction of the chip ejector roller 331.
[0051] As Figure 1 shown in the figure, in terms of structure, a plurality of chip ejector head groups 33a are evenly arranged along the length direction of the chip ejector roller 331, so that the plurality of chip ejector head groups 33a can move horizontally to lift multiple columns of chip suction heads.
[0052] The beneficial effect brought by the above implementation manner is that a plurality of chip ejector head groups can move horizontally to lift multiple columns of chip suction heads.
[0053] In some implementation manners, each chip ejector head group 33a includes 4 to 8 chip ejector heads 332.
[0054] Figure 5 This is a schematic side view structure diagram of a chip ejector device provided by an embodiment of the present application. As Figure 5 shown in the figure, in terms of structure, each chip ejector head group 33a includes 4 to 8 chip ejector heads 332, and the plurality of chip ejector heads 332 of the chip ejector head group 33a can cooperate with each other to lift the chip suction head.
[0055] In some implementation manners, each chip ejector head group 33a includes 6 chip ejector heads 332.
[0056] As Figure 5 shown in the figure, each chip ejector head group 33a includes 6 chip ejector heads 332, and the 6 chip ejector heads 332 can take turns to lift the chip suction head for chip feeding.
[0057] In some implementation manners, the chip ejector head 332 ejects the material by electromagnetic drive or by pneumatic drive.
[0058] As Figure 3As shown, in terms of structure, the chip ejector head 332 ejects the chip through electromagnetic drive or pneumatic drive, enabling the chip ejector head 332 to be lifted and lowered through electromagnetic control, thus achieving the lifting of the chip ejector head 332 on the chip suction head; at the same time, the chip ejector head 332 can eject the chip through pneumatic drive, realizing the lifting process of the suction head through pneumatic control.
[0059] The beneficial effect brought by the above implementation method is that the chip ejector head ejects the chip through electromagnetic drive or pneumatic drive, facilitating the control of the working state of the chip suction head.
[0060] In some implementation methods, the chip ejector device further includes an ejector control component, which is electrically connected to the ejector drive component 333. The ejector control component is used to control the rotation angle of the ejector drive component 333, and the ejector control component is also used to control the lifting state of each chip ejector head group 33a or each chip ejector head 332.
[0061] In terms of structure, the ejector control component is electrically connected to the ejector drive component 333. The ejector control component is used to control the rotation angle of the ejector drive component 333, and the ejector control component is also used to control the lifting state of each chip ejector head group 33a or each chip ejector head 332. Furthermore, it can control the ejector drive component 333 to eject the chip suction head through the preset chip ejector head 332 at a specific rotation angle, improving the chip ejection effect.
[0062] The beneficial effect brought by the above implementation method is that it can control the ejector drive component to eject the chip suction head through the preset chip ejector head at a specific rotation angle, improving the control effect of chip ejection and loading.
[0063] In some implementation methods, the cross-section of the lifting end of the chip ejector head 332 is circular, and the diameter of the lifting end of the chip ejector head 332 is 1 mm to 3 mm.
[0064] In terms of structure, the cross-section of the lifting end of the chip ejector head 332 is circular, making it convenient for the chip ejector head 332 to cooperate with the chip suction head to eject the chip suction head.
[0065] In terms of structure, the diameter of the lifting end of the chip ejector head 332 is 1 mm to 3 mm, which can cooperate with the lifting end of the chip suction head.
[0066] In some implementation methods, the distance between adjacent chip ejector head groups 33a is 20 mm to 50 mm.
[0067] Structurally, the spacing between adjacent chip ejector head groups 33a is 20 mm to 50 mm, and the distance between adjacent chip ejector head groups 33a can be designed according to the actual chip loading requirements.
[0068] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A chip ejection device, characterized in that: The chip lifting device includes a chip lifting roller, multiple chip lifting heads and a lifting drive assembly. The lifting drive assembly is used to drive the chip lifting roller to rotate. Multiple chip lifting heads are arranged on the chip lifting roller. The chip lifting roller is arranged in the loading roller cavity of the loading roller. The chip lifting head is used to lift the chip adsorption head on the loading roller for adsorbing the chip.
2. The chip lifting device according to claim 1, characterized in that: It also includes a central shaft and a material ejection bracket, the material ejection bracket is fixedly connected to the central shaft, the central shaft is used to support a feeding roller, the chip material ejection roller is rotatably connected to the material ejection bracket through a material ejection drive assembly, and the chip material ejection roller is eccentrically arranged in the feeding roller cavity.
3. The chip lifting device according to claim 2, characterized in that: A plurality of chip lifting head groups are arranged on the chip lifting roller along the length direction, and each chip lifting head group includes a plurality of chip lifting heads evenly arranged along the circumference of the chip lifting roller.
4. The chip lifting device according to claim 3, characterized in that: A plurality of chip ejecting head groups are evenly arranged along the length direction of the chip ejecting roller.
5. The chip lifting device according to claim 4, characterized in that: Each chip lift head group includes 4 to 8 chip lift heads.
6. The chip lifting device according to claim 5, characterized in that: Each chip ejection head group includes 6 chip ejection heads.
7. The chip lifting device according to claim 6, characterized in that: The chip ejecting head is driven by electromagnetic or air pressure.
8. The chip ejection device according to claim 7, characterized in that: It also includes a material ejection control component, which is electrically connected to the material ejection drive component. The material ejection control component is used to control the rotation angle of the material ejection drive component. The material ejection control component is also used to control the ejection state of each chip ejection head group or each chip ejection head.
9. The chip lifting device according to claim 8, characterized in that: The cross section of the lifting end of the chip lifting head is circular, and the diameter of the lifting end of the chip lifting head is 1mm to 3mm.
10. The chip lifting device according to claim 9, characterized in that: The spacing between adjacent chip ejector head groups is 20 mm to 50 mm.